CN120835643A - 微发光二极管芯片 - Google Patents

微发光二极管芯片

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Publication number
CN120835643A
CN120835643A CN202510629820.5A CN202510629820A CN120835643A CN 120835643 A CN120835643 A CN 120835643A CN 202510629820 A CN202510629820 A CN 202510629820A CN 120835643 A CN120835643 A CN 120835643A
Authority
CN
China
Prior art keywords
light emitting
micro
conductive layer
emitting diode
diode chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202510629820.5A
Other languages
English (en)
Chinese (zh)
Inventor
李起鸣
刘德帅
祝元坤
方安乐
郭剑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Xianyao Display Technology Co ltd
Original Assignee
Shanghai Xianyao Display Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Xianyao Display Technology Co ltd filed Critical Shanghai Xianyao Display Technology Co ltd
Publication of CN120835643A publication Critical patent/CN120835643A/zh
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/821Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/811Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
    • H10H20/812Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/814Bodies having reflecting means, e.g. semiconductor Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/816Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/816Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
    • H10H20/8162Current-blocking structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841Reflective coatings, e.g. dielectric Bragg reflectors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30Active-matrix LED displays
    • H10H29/32Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/30Active-matrix LED displays
    • H10H29/37Pixel-defining structures, e.g. banks between the LEDs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/853Encapsulations characterised by their shape
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80Constructional details
    • H10H29/832Electrodes
    • H10H29/8322Electrodes characterised by their materials
    • H10H29/8325Reflective materials

Landscapes

  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
CN202510629820.5A 2020-12-28 2021-12-27 微发光二极管芯片 Pending CN120835643A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202063131128P 2020-12-28 2020-12-28
US63/131,128 2020-12-28
PCT/IB2021/062348 WO2022144752A1 (en) 2020-12-28 2021-12-27 Micro-led structure and micro-led chip including same
CN202180087689.4A CN116783717A (zh) 2020-12-28 2021-12-27 微发光二极管结构及包括该结构的微发光二极管芯片

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202180087689.4A Division CN116783717A (zh) 2020-12-28 2021-12-27 微发光二极管结构及包括该结构的微发光二极管芯片

Publications (1)

Publication Number Publication Date
CN120835643A true CN120835643A (zh) 2025-10-24

Family

ID=82117726

Family Applications (9)

Application Number Title Priority Date Filing Date
CN202510629820.5A Pending CN120835643A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
CN202510630281.7A Pending CN120568940A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
CN202510626742.3A Pending CN120475827A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
CN202510619036.6A Pending CN120456682A (zh) 2020-12-28 2021-12-27 微发光二极管结构
CN202510627784.9A Pending CN120435127A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
CN202180087689.4A Pending CN116783717A (zh) 2020-12-28 2021-12-27 微发光二极管结构及包括该结构的微发光二极管芯片
CN202510627972.1A Pending CN120435128A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
CN202510634659.0A Pending CN120730895A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
CN202510620369.0A Pending CN120456683A (zh) 2020-12-28 2021-12-27 微发光二极管芯片

Family Applications After (8)

Application Number Title Priority Date Filing Date
CN202510630281.7A Pending CN120568940A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
CN202510626742.3A Pending CN120475827A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
CN202510619036.6A Pending CN120456682A (zh) 2020-12-28 2021-12-27 微发光二极管结构
CN202510627784.9A Pending CN120435127A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
CN202180087689.4A Pending CN116783717A (zh) 2020-12-28 2021-12-27 微发光二极管结构及包括该结构的微发光二极管芯片
CN202510627972.1A Pending CN120435128A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
CN202510634659.0A Pending CN120730895A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
CN202510620369.0A Pending CN120456683A (zh) 2020-12-28 2021-12-27 微发光二极管芯片

Country Status (7)

Country Link
US (40) US12382749B2 (https=)
EP (9) EP4572577A2 (https=)
JP (34) JP2024501945A (https=)
KR (34) KR20240169723A (https=)
CN (9) CN120835643A (https=)
TW (13) TW202512546A (https=)
WO (1) WO2022144752A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202512546A (zh) * 2020-12-28 2025-03-16 大陸商上海顯耀顯示科技有限公司 微發光二極體結構及包括該結構之微發光二極體晶片
CN118057629A (zh) * 2022-11-21 2024-05-21 泉州三安半导体科技有限公司 垂直型发光二极管及发光装置
WO2025194417A1 (en) * 2024-03-21 2025-09-25 Jade Bird Display (shanghai) Limited Micro led array
CN121126993B (zh) * 2025-11-17 2026-04-21 上海显耀显示科技股份有限公司 发光二极管芯片

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7525248B1 (en) * 2005-01-26 2009-04-28 Ac Led Lighting, L.L.C. Light emitting diode lamp
DE102005033005A1 (de) 2005-07-14 2007-01-18 Osram Opto Semiconductors Gmbh Optoelektronischer Chip
US20070045638A1 (en) * 2005-08-24 2007-03-01 Lumileds Lighting U.S., Llc III-nitride light emitting device with double heterostructure light emitting region
JP4997621B2 (ja) 2005-09-05 2012-08-08 パナソニック株式会社 半導体発光素子およびそれを用いた照明装置
US20090032799A1 (en) * 2007-06-12 2009-02-05 Siphoton, Inc Light emitting device
KR101497953B1 (ko) * 2008-10-01 2015-03-05 삼성전자 주식회사 광추출 효율이 향상된 발광 소자, 이를 포함하는 발광 장치, 상기 발광 소자 및 발광 장치의 제조 방법
JP5257231B2 (ja) * 2009-05-13 2013-08-07 ソニー株式会社 発光ダイオードおよびその製造方法
JP5320270B2 (ja) * 2009-11-25 2013-10-23 株式会社沖データ 表示パネルの製造方法
CN202523712U (zh) 2012-03-14 2012-11-07 贵州大学 阵列式真彩发光二极管芯片
CN102931303A (zh) 2012-10-22 2013-02-13 合肥彩虹蓝光科技有限公司 外延结构及其生长方法
US8941111B2 (en) * 2012-12-21 2015-01-27 Invensas Corporation Non-crystalline inorganic light emitting diode
JP2015133293A (ja) * 2014-01-15 2015-07-23 株式会社ジャパンディスプレイ 表示装置
US9153944B2 (en) * 2014-02-05 2015-10-06 Epistar Corporation Light-emitting array
KR102150819B1 (ko) * 2015-12-22 2020-09-01 애플 인크. 비방사 재결합을 완화하기 위한 led 측벽 프로세싱
EP3428977A4 (en) * 2016-03-08 2019-10-02 ALPAD Corporation Light-emitting semiconducting element and method for producing the same
US10304375B2 (en) * 2016-09-23 2019-05-28 Hong Kong Beida Jade Bird Display Limited Micro display panels with integrated micro-reflectors
CN109923468A (zh) * 2016-12-05 2019-06-21 歌尔股份有限公司 微激光二极管显示装置和电子设备
CN207637833U (zh) 2017-02-17 2018-07-20 首尔伟傲世有限公司 具有侧面反射层的发光二极管
US10693042B2 (en) * 2017-11-23 2020-06-23 Lg Display Co., Ltd. Light-emitting device and display device using the same
US10892297B2 (en) * 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting diode (LED) stack for a display
US10957820B2 (en) 2017-12-21 2021-03-23 Lumileds Llc Monolithic, segmented light emitting diode array
KR102136579B1 (ko) 2018-07-27 2020-07-22 서울대학교산학협력단 표시 장치
EP3836234A4 (en) * 2018-08-10 2022-05-04 Lin, Hong-Cheng DIODE DEVICE, DISPLAY PANEL AND FLEXIBLE DISPLAY
US11056611B2 (en) 2018-09-11 2021-07-06 Facebook Technologies, Llc Mesa formation for wafer-to-wafer bonding
CN109411583B (zh) 2018-11-01 2020-12-04 京东方科技集团股份有限公司 发光单元及其制造方法、显示装置
KR102668034B1 (ko) * 2018-11-14 2024-05-23 서울대학교산학협력단 표시 장치
KR102794156B1 (ko) * 2019-01-09 2025-04-14 삼성디스플레이 주식회사 유기 전계 발광 소자 및 이를 포함하는 표시 장치
CN121815845A (zh) * 2019-01-29 2026-04-07 奥斯兰姆奥普托半导体股份有限两合公司 微型发光二极管、微型发光二极管装置、显示器及其方法
US11271143B2 (en) * 2019-01-29 2022-03-08 Osram Opto Semiconductors Gmbh μ-LED, μ-LED device, display and method for the same
JP7366552B2 (ja) 2019-02-06 2023-10-23 日東電工株式会社 粘着剤層付き反射防止フィルム、自発光型表示装置およびその製造方法
JPWO2020194388A1 (https=) * 2019-03-22 2020-10-01
JP6858899B2 (ja) 2019-03-26 2021-04-14 Dowaエレクトロニクス株式会社 点光源型発光ダイオード及びその製造方法
US11158761B2 (en) * 2019-05-07 2021-10-26 Facebook Technologies, Llc Bonding methods for light emitting diodes
DE112020002375A5 (de) 2019-05-14 2022-01-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches bauelement, pixel, displayanordnung und verfahren
CN110164900B (zh) 2019-05-29 2021-04-02 京东方科技集团股份有限公司 LED芯片及其制备方法、芯片晶圆、Micro-LED显示装置
US12224304B2 (en) * 2020-04-09 2025-02-11 Raysolve Optoelectronics (Suzhou) Company Limited Light emitting diode structure with individual fuctionable LED units and method for manufacturing the same
US11417703B2 (en) * 2020-08-31 2022-08-16 Hong Kong Beida Jade Bird Display Limited Double color micro LED display panel
TW202512546A (zh) * 2020-12-28 2025-03-16 大陸商上海顯耀顯示科技有限公司 微發光二極體結構及包括該結構之微發光二極體晶片
US11569414B2 (en) * 2021-02-17 2023-01-31 Meta Platforms Technologies, Llc Self-aligned ITO DBR based p-contact for small pitch micro-LED
US12300774B2 (en) * 2022-02-25 2025-05-13 Meta Platforms Technologies, Llc Microdisplay architecture with light extraction efficiency enhancement
US12148869B2 (en) * 2022-03-24 2024-11-19 Meta Platforms Technologies, Llc Guided light extraction in trenches
WO2023182503A1 (ja) * 2022-03-24 2023-09-28 株式会社 東芝 処理システム、処理装置、処理方法、プログラム、及び記憶媒体
US20230352466A1 (en) * 2022-04-28 2023-11-02 Meta Platforms Technologies, Llc Stepped micro-lens on micro-led
CN116153962B (zh) * 2023-04-17 2023-07-21 诺视科技(苏州)有限公司 像素单元及其制作方法、微显示屏、像素级分立器件

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CN120568940A (zh) 2025-08-29
KR20240171170A (ko) 2024-12-06
US20220209054A1 (en) 2022-06-30
US12183849B2 (en) 2024-12-31
TW202517107A (zh) 2025-04-16
JP2025041625A (ja) 2025-03-26
US12300761B2 (en) 2025-05-13
JP2025041621A (ja) 2025-03-26
US20220209051A1 (en) 2022-06-30
US20220208837A1 (en) 2022-06-30
KR20250002781A (ko) 2025-01-07
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