WO2022144752A1 - Micro-led structure and micro-led chip including same - Google Patents

Micro-led structure and micro-led chip including same Download PDF

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Publication number
WO2022144752A1
WO2022144752A1 PCT/IB2021/062348 IB2021062348W WO2022144752A1 WO 2022144752 A1 WO2022144752 A1 WO 2022144752A1 IB 2021062348 W IB2021062348 W IB 2021062348W WO 2022144752 A1 WO2022144752 A1 WO 2022144752A1
Authority
WO
WIPO (PCT)
Prior art keywords
micro
type conductive
conductive layer
light emitting
emitting layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/IB2021/062348
Other languages
English (en)
French (fr)
Inventor
Yuankun ZHU
Deshuai LIU
Anle Fang
Qiming Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jade Bird Display Shanghai Ltd
Original Assignee
Jade Bird Display Shanghai Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jade Bird Display Shanghai Ltd filed Critical Jade Bird Display Shanghai Ltd
Priority to EP25172075.1A priority Critical patent/EP4577008A2/en
Priority to EP21914832.7A priority patent/EP4268288A4/en
Priority to KR1020247039091A priority patent/KR20240171172A/ko
Priority to KR1020247039331A priority patent/KR20240171181A/ko
Priority to KR1020247039984A priority patent/KR20240172264A/ko
Priority to CN202510626742.3A priority patent/CN120475827A/zh
Priority to KR1020247039495A priority patent/KR20240172253A/ko
Priority to KR1020247040483A priority patent/KR20250002781A/ko
Priority to EP25172752.5A priority patent/EP4577009A2/en
Priority to KR1020247038944A priority patent/KR20240172229A/ko
Priority to KR1020247039492A priority patent/KR20240172252A/ko
Priority to KR1020247038797A priority patent/KR20240168476A/ko
Priority to CN202510627784.9A priority patent/CN120435127A/zh
Priority to KR1020237021925A priority patent/KR20230123982A/ko
Priority to KR1020247038945A priority patent/KR20240168480A/ko
Priority to KR1020247040636A priority patent/KR20250005493A/ko
Priority to CN202510630281.7A priority patent/CN120568940A/zh
Priority to KR1020247038946A priority patent/KR20240172230A/ko
Priority to KR1020247039089A priority patent/KR20240171170A/ko
Priority to KR1020247038600A priority patent/KR20240169725A/ko
Priority to JP2023538870A priority patent/JP2024501945A/ja
Priority to KR1020247040633A priority patent/KR20250005490A/ko
Priority to KR1020247040635A priority patent/KR20250005492A/ko
Priority to EP25172729.3A priority patent/EP4572577A2/en
Priority to KR1020247039493A priority patent/KR20240171183A/ko
Priority to KR1020247038798A priority patent/KR20240169728A/ko
Priority to KR1020247038598A priority patent/KR20240169723A/ko
Priority to KR1020247038599A priority patent/KR20240169724A/ko
Priority to KR1020247039494A priority patent/KR20240171184A/ko
Priority to KR1020247039090A priority patent/KR20240171171A/ko
Priority to CN202510619036.6A priority patent/CN120456682A/zh
Priority to EP25170480.5A priority patent/EP4577003A2/en
Priority to CN202510620369.0A priority patent/CN120456683A/zh
Priority to KR1020247040634A priority patent/KR20250005491A/ko
Priority to KR1020247040143A priority patent/KR20250005455A/ko
Priority to CN202510634659.0A priority patent/CN120730895A/zh
Priority to KR1020247039330A priority patent/KR20240171180A/ko
Priority to CN202510629820.5A priority patent/CN120835643A/zh
Priority to EP25171345.9A priority patent/EP4568454A2/en
Priority to KR1020247039983A priority patent/KR20240172263A/ko
Priority to EP25170716.2A priority patent/EP4572576A2/en
Priority to KR1020247038509A priority patent/KR20240167455A/ko
Priority to KR1020247039329A priority patent/KR20240174118A/ko
Priority to KR1020247038511A priority patent/KR20240167456A/ko
Priority to CN202510627972.1A priority patent/CN120435128A/zh
Priority to EP25170332.8A priority patent/EP4572570A2/en
Priority to KR1020247038510A priority patent/KR20240166612A/ko
Priority to CN202180087689.4A priority patent/CN116783717A/zh
Priority to KR1020247038796A priority patent/KR20240167953A/ko
Priority to KR1020247039328A priority patent/KR20240174117A/ko
Priority to KR1020247040144A priority patent/KR20250005456A/ko
Priority to KR1020247038597A priority patent/KR20240169722A/ko
Priority to EP25170676.8A priority patent/EP4572575A2/en
Publication of WO2022144752A1 publication Critical patent/WO2022144752A1/en
Anticipated expiration legal-status Critical
Priority to JP2024206104A priority patent/JP2025037949A/ja
Priority to JP2024206117A priority patent/JP2025041624A/ja
Priority to JP2024206080A priority patent/JP2025037939A/ja
Priority to JP2024206086A priority patent/JP2025060598A/ja
Priority to JP2024206122A priority patent/JP2025037956A/ja
Priority to JP2024206118A priority patent/JP2025041625A/ja
Priority to JP2024206124A priority patent/JP2025037958A/ja
Priority to JP2024206127A priority patent/JP2025037961A/ja
Priority to JP2024206109A priority patent/JP2025041623A/ja
Priority to JP2024206106A priority patent/JP2025037951A/ja
Priority to JP2024206087A priority patent/JP2025060599A/ja
Priority to JP2024206121A priority patent/JP2025037955A/ja
Priority to JP2024206082A priority patent/JP2025037941A/ja
Priority to JP2024206125A priority patent/JP2025037959A/ja
Priority to JP2024206107A priority patent/JP2025037952A/ja
Priority to JP2024206119A priority patent/JP2025037953A/ja
Priority to JP2024206108A priority patent/JP2025041622A/ja
Priority to JP2024206126A priority patent/JP2025037960A/ja
Priority to JP2024206123A priority patent/JP2025037957A/ja
Priority to JP2024206102A priority patent/JP2025041621A/ja
Priority to JP2024206085A priority patent/JP2025037943A/ja
Priority to JP2024206081A priority patent/JP2025037940A/ja
Priority to JP2024206083A priority patent/JP2025037942A/ja
Priority to JP2024206105A priority patent/JP2025037950A/ja
Priority to JP2024206099A priority patent/JP2025037945A/ja
Priority to JP2024206100A priority patent/JP2025037946A/ja
Priority to JP2024206120A priority patent/JP2025037954A/ja
Priority to JP2024206078A priority patent/JP2025041617A/ja
Priority to JP2024206101A priority patent/JP2025037947A/ja
Priority to JP2024206103A priority patent/JP2025037948A/ja
Priority to JP2024206088A priority patent/JP2025037944A/ja
Priority to JP2024206084A priority patent/JP2025041619A/ja
Priority to JP2024206079A priority patent/JP2025041618A/ja
Ceased legal-status Critical Current

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Definitions

  • the present disclosure relates to a micro-LED structure and a micro-LED chip including the micro-LED structure.
  • a micro-light emitting diode is a device that emits light using an electric signal and has a size on the order of micrometers or even smaller.
  • the micro-LED can be driven at a low voltage such that it is widely implemented in small-sized optical elements.
  • the micro-LED has been developed as an illuminating light source by increasing its efficiency.
  • a micro- LED structure includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer.
  • the light emitting layer extends along a horizontal level away from a top edge of the first type conductive layer and a bottom edge of the second type conductive layer, such that an edge of the light emitting layer does not contact the top edge of the first type conductive layer and the bottom edge of the second type conductive layer.
  • the bottom edge of the second type conductive layer is aligned with the top edge of the first type conductive layer.
  • a micro- LED structure includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer.
  • the light emitting layer extrudes along a horizontal level away from a top edge of the first type conductive layer and a bottom edge of the second type conductive layer, such that an edge of the light emitting layer does not contact the top edge of the first type conductive layer and the bottom edge of the second type conductive layer.
  • a profile of the second type conductive layer perpendicularly projected on a top surface of the first type conductive layer is surrounded by the top edge of the first type conductive layer.
  • a micro- LED structure includes a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer.
  • the light emitting layer extends along a horizontal level away from a top edge of the first type conductive layer and a bottom edge of the second type conductive layer, such that an edge of the light emitting layer does not contact the top edge of the first type conductive layer and the bottom edge of the second type conductive layer.
  • a profile of the first type conductive layer perpendicularly projected on a bottom surface of the second type conductive layer is surrounded by the bottom edge of the second type conductive layer.
  • a microLED structure includes a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer.
  • the light emitting layer extends along a horizontal level from an edge of the first type conductive layer.
  • An edge of the light emitting layer is aligned with an edge of the second type conductive layer.
  • the edge of the second type conductive layer extends along the horizontal level away from the edge of the first type conductive layer.
  • a microLED structure includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer.
  • the light emitting layer extends along a horizontal level from an edge of the second type conductive layer.
  • An edge of the light emitting layer is aligned with an edge of the first type conductive layer.
  • the edge of the first type conductive layer extends along the horizontal level away from the edge of the second type conductive layer.
  • a microLED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. An isolation structure is formed between adjacent micro-LEDs, at least a portion of the isolation structure being formed in the light emitting layer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole chip, the multiple micro-LEDs sharing the light emitting layer. An isolation structure is formed between adjacent micro-LEDs, at least a portion of the isolation structure being formed in the light emitting layer. A top surface of the isolation structure is aligned with a top of the light emitting layer, and a bottom surface of the isolation structure is under the light emitting layer.
  • a microLED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a top surface of the isolation structure is aligned with a top of the light emitting layer, and a bottom surface of the isolation structure is above a bottom surface of the bottom spacer and is under the light emitting layer.
  • a micro- LED chip includes multiple micro-LEDs.
  • at least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer.
  • the light emitting layer is continuously formed on the whole chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro- LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a top surface of the isolation structure is aligned with a top of the light emitting layer, and a bottom surface under the bottom spacer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further comprises: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a top surface of the isolation structure is aligned with a top of the light emitting layer, and a bottom surface of the isolation structure is aligned with a bottom surface of the bottom spacer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes an isolation structure formed between adjacent micro-LEDs, at least a portion of the isolation structure being formed in the light emitting layer. A top surface of the isolation structure is above the light emitting layer. A bottom surface of the isolation structure is aligned with a bottom of the light emitting layer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a bottom surface of the isolation structure is aligned with a bottom surface of the light emitting layer, and a top surface of the isolation structure is above the light emitting layer and under the top surface of the top spacer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a bottom surface of the isolation structure is aligned with a bottom surface of the light emitting layer, and a top surface of the isolation structure is aligned with a top surface of the top spacer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a bottom surface of the isolation structure is aligned with a bottom surface of the light emitting layer, and a top surface of the isolation structure is above the top spacer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. An isolation structure is formed between adjacent micro-LEDs, at least a portion of the isolation structure being formed in the light emitting layer. A top surface of the isolation structure is above the light emitting layer, and a bottom surface of the isolation structure is under the light emitting layer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a top surface of the isolation structure is above the light emitting layer and under a top surface of the top spacer, and a bottom surface of the isolation structure is under a bottom of the light emitting layer.
  • a microLED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a top surface of the isolation structure is above the light emitting layer and under a top surface of the top spacer, and a bottom surface of the isolation structure is under a bottom of the light emitting layer, and above a bottom surface of the bottom spacer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a top surface of the isolation structure is above the light emitting layer and under a top surface of the top spacer, and a bottom surface of the isolation structure aligned with a bottom surface of the bottom spacer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a top surface of the isolation structure is above the light emitting layer and under a top surface of the top spacer, and a bottom surface of the isolation structure is under the bottom spacer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a bottom surface of the isolation structure is under the light emitting layer, and above a bottom surface of the bottom spacer, and a top surface of the isolation structure is aligned with a top surface of the top spacer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, and the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a bottom surface of the isolation structure is under the light emitting layer, and above a bottom surface of the bottom spacer, and a top surface of the isolation structure is above the top spacer.
  • a microLED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, and the multiple micro-LEDs sharing the light emitting layer.
  • An isolation structure is formed between adjacent micro-LEDs, at least a portion of the isolation structure being formed in the light emitting layer. A bottom surface of the isolation structure is aligned with a bottom of the light emitting layer, and a top surface of the isolation structure is aligned with a top surface of the light emitting layer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, and the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a bottom surface of the isolation structure is aligned with a bottom surface of the bottom spacer, and a top surface of the isolation structure is aligned with a top surface of the top spacer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a top surface of the isolation structure is aligned with a top surface of the top spacer, and a bottom surface of the isolation structure is under the bottom spacer.
  • a microLED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a bottom surface of the isolation structure is aligned with a bottom surface of the bottom spacer, and a top surface of the isolation structure is above the top spacer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer.
  • the micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer, wherein an edge of the top spacer is aligned with an edge of the light emitting layer, and an edge of the bottom spacer is aligned with the edge of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs, wherein at least a portion of the isolation structure is formed in the light emitting layer, a bottom surface of the isolation structure is under the bottom spacer, and a top surface of the isolation structure is above the top spacer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. A bottom edge of the second type conductive layer is aligned with a top edge of the first type conductive layer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. A profile of the second type conductive layer perpendicularly projected on a top surface of the first type conductive layer is surrounded by an edge of the first type conductive layer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. A profile of the first type conductive layer perpendicularly projected on a bottom surface of the second type conductive layer is surrounded by an edge of the second type conductive layer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer, at least one part of the light emitting layer being formed between adjacent micro-LEDs. the micro-LED chip further comprises a metal layer formed on the light emitting layer between the adjacent micro-LEDs.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer.
  • the light emitting layer extends along a horizontal level from a top edge of the first type conductive layer and from a bottom edge of the second type conductive layer, such that an edge of the light emitting layer does not contact the top edge of the first type conductive layer and the bottom edge of the second type conductive layer, and the bottom edge of the second type conductive layer is aligned with the top edge of the first type conductive layer.
  • the micro- LED chip further includes a metal layer formed on the light emitting layer between adjacent micro-LEDs.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer.
  • the light emitting layer extends along a horizontal level from a top edge of the first type conductive layer and a bottom edge of the second type conductive layer, such that an edge of the light emitting layer does not contact the top edge of the first type conductive layer and the bottom edge of the second type conductive layer, and a profile of the second type conductive layer perpendicularly projected on a top surface of the first type conductive layer is surrounded by an edge of the first type conductive layer.
  • the micro-LED chip further includes a metal layer formed on a portion of the light emitting layer that extends from the top edge of the first type conductive layer.
  • a micro- LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer.
  • the light emitting layer extends along a horizontal level from a top edge of the first type conductive layer and a bottom edge of the second type conductive layer, such that an edge of the light emitting layer does not touch the top edge of the first type conductive layer and the bottom edge of the second type conductive layer.
  • the micro-LED chip further includes a metal layer formed on a portion of the light emitting layer that extends from the second type conductive layer.
  • FIG. 1 A is a cross-sectional view of a micro-LED structure, according to a first embodiment of the present disclosure.
  • FIG. 1 B is a cross-sectional view of a micro-LED structure, according to a first variation of the first embodiment of the present disclosure.
  • FIG. 1 C is a cross-sectional view of a micro-LED structure, according to a second variation of the first embodiment of the present disclosure.
  • FIG. 1 D is a cross-sectional view of a micro-LED structure, according to a third variation of the first embodiment of the present disclosure.
  • FIG. 2A is a cross-sectional view of a micro-LED structure, according to a second embodiment of the present disclosure.
  • FIG. 2B is a cross-sectional view of a micro-LED structure, according to a first variation of the second embodiment of the present disclosure.
  • FIG. 2C is a cross-sectional view of a micro-LED structure, according to a second variation of the second embodiment of the present disclosure.
  • FIG. 2D is a cross-sectional view of a micro-LED structure, according to a third variation of the second embodiment of the present disclosure.
  • FIG. 3A is a cross-sectional view of a micro-LED structure, according to a third embodiment of the present disclosure.
  • FIG. 3B is a cross-sectional view of a micro-LED structure, according to a first variation of the third embodiment of the present disclosure.
  • FIG. 3C is a cross-sectional view of a micro-LED structure, according to a second variation of the third embodiment of the present disclosure.
  • FIG. 3D is a cross-sectional view of a micro-LED structure, according to a third variation of the third embodiment of the present disclosure.
  • FIG. 4A is a cross-sectional view of a micro-LED structure, according to a fourth embodiment of the present disclosure.
  • FIG. 4B is a cross-sectional view of a micro-LED structure, according to a first variation of the fourth embodiment of the present disclosure.
  • FIG. 4C is a cross-sectional view of a micro-LED structure, according to a second variation of the fourth embodiment of the present disclosure.
  • FIG. 4D is a cross-sectional view of a micro-LED structure, according to a third variation of the fourth embodiment of the present disclosure.
  • FIG. 5A is a cross-sectional view of a micro-LED structure, according to a fifth embodiment of the present disclosure.
  • FIG. 5B is a cross-sectional view of a micro-LED structure, according to a first variation of the fifth embodiment of the present disclosure.
  • FIG. 5C is a cross-sectional view of a micro-LED structure, according to a second variation of the fifth embodiment of the present disclosure.
  • FIG. 5D is a cross-sectional view of a micro-LED structure, according to a third variation of the fifth embodiment of the present disclosure.
  • FIG. 6A is a cross-sectional view of a micro-LED chip, according to a sixth embodiment of the present disclosure.
  • FIG. 6B is a cross-sectional view of a micro-LED chip, according to a first variation of the sixth embodiment of the present disclosure.
  • FIG. 6C is a cross-sectional view of a micro-LED chip, according to a second variation of the sixth embodiment of the present disclosure.
  • FIG. 6D is a cross-sectional view of a micro-LED chip, according to a third variation of the sixth embodiment of the present disclosure.
  • FIG. 6E is a cross-sectional view of a micro-LED chip, according to a fourth variation of the sixth embodiment of the present disclosure.
  • FIG. 6F is a cross-sectional view of a micro-LED chip, according to a fifth variation of the sixth embodiment of the present disclosure.
  • FIG. 7 is a cross-sectional view of a micro-LED chip, according to a seventh embodiment of the present disclosure.
  • FIG. 8A is a cross-sectional view of a micro-LED chip, according to an eighth embodiment of the present disclosure.
  • FIG. 8B is a cross-sectional view of a micro-LED chip, according to a first variation of the eighth embodiment of the present disclosure.
  • FIG. 8C is a cross-sectional view of a micro-LED chip, according to a second variation of the eighth embodiment of the present disclosure.
  • FIG. 9A is a cross-sectional view of a micro-LED chip, according to a ninth embodiment of the present disclosure.
  • FIG. 9B is a cross-sectional view of a micro-LED chip, according to a first variation of the ninth embodiment of the present disclosure.
  • FIG. 9C is a cross-sectional view of a micro-LED chip, according to a second variation of the seventh embodiment of the present disclosure.
  • FIG. 10A is a cross-sectional view of a micro-LED chip, according to a tenth embodiment of the present disclosure.
  • FIG. 10B is a cross-sectional view of a micro-LED chip, according to a first variation of the tenth embodiment of the present disclosure.
  • FIG. 10C is a cross-sectional view of a micro-LED chip, according to a second variation of the tenth embodiment of the present disclosure.
  • FIG. 11 A is a cross-sectional view of a micro-LED chip, according to an eleventh embodiment of the present disclosure.
  • FIG. 11 B is a cross-sectional view of a micro-LED chip, according to a first variation of the eleventh embodiment of the present disclosure.
  • FIG. 11 C is a cross-sectional view of a micro-LED chip, according to a second variation of the eleventh embodiment of the present disclosure.
  • FIG. 11 D is a cross-sectional view of a micro-LED chip, according to a third variation of the eleventh embodiment of the present disclosure.
  • FIG. 12A is a cross-sectional view of a micro-LED chip, according to a twelfth embodiment of the present disclosure.
  • FIG. 12B is a cross-sectional view of a micro-LED chip, according to a first variation of the twelfth embodiment of the present disclosure.
  • FIG. 12C is a cross-sectional view of a micro-LED chip, according to a second variation of the twelfth embodiment of the present disclosure.
  • FIG. 12D is a cross-sectional view of a micro-LED chip, according to a third variation of the twelfth embodiment of the present disclosure.
  • FIG. 13A is a cross-sectional view of a micro-LED chip, according to a thirteenth embodiment of the present disclosure.
  • FIG. 13B is a cross-sectional view of a micro-LED chip, according to a variation of the thirteenth embodiment of the present disclosure.
  • FIG. 14A is a cross-sectional view of a micro-LED chip, according to a fourteenth embodiment of the present disclosure.
  • FIG. 14B is a cross-sectional view of a micro-LED chip, according to a variation of the fourteenth embodiment of the present disclosure.
  • FIG. 15A is a cross-sectional view of a micro-LED chip, according to a fifteenth embodiment of the present disclosure.
  • FIG. 15B is a cross-sectional view of a micro-LED chip, according to a variation of the fifteenth embodiment of the present disclosure.
  • FIG. 16A is a cross-sectional view of a micro-LED chip, according to a sixteenth embodiment of the present disclosure.
  • FIG. 16B is a cross-sectional view of a micro-LED chip, according to a variation of the sixteenth embodiment of the present disclosure.
  • FIG. 17A is a cross-sectional view of a micro-LED chip, according to a seventeenth embodiment of the present disclosure.
  • FIG. 17B is a cross-sectional view of a micro-LED chip, according to a variation of the seventeenth embodiment of the present disclosure.
  • FIG. 18 is a cross-sectional view of a micro-LED structure, according to a comparative example.
  • relative spatial position such as “front,” “back,” “upper,” “lower,” “above,” “below,” and so forth, are used for explanatory purposes in describing the relationship between a unit or feature depicted in a drawing and another unit or feature therein.
  • Terms indicating relative spatial position may refer to positions other than those depicted in the drawings when a device is being used or operated. For example, if a device shown in a drawing is flipped over, a unit which is described as being positioned “below” or “under” another unit or feature will be located “above” the other unit or feature. Therefore, the illustrative term “below” may include positions both above and below.
  • a device may be oriented in other ways (rotated 90 degrees or facing another direction), and descriptive terms that appear in the text and are related to space should be interpreted accordingly.
  • a component or layer When a component or layer is said to be “above” another member or layer or “connected to” another member or layer, it may be directly above the other member or layer or directly connected to the other member or layer, or there may be an intermediate component or layer.
  • FIG. 1 A is a cross-sectional view of a micro-light emitting diode (micro-LED) structure 1000, according to a first embodiment of the present disclosure.
  • the micro-LED structure 1000 includes a first type conductive layer 101 , a second type conductive layer 102 stacked on the first type conductive layer 101 , and a light emitting layer 103 formed between the first type conductive layer 101 and the second type conductive layer 102.
  • the light emitting layer 103 extends along a horizontal level away from a top edge 101 a of the first type conductive layer 101 and a bottom edge 102a of the second type conductive layer 102, such that an edge 103a of the light emitting layer 103 and does not contact the top edge 101 a of the first type conductive layer 101 and the bottom edge 102a of the second type conductive layer 102.
  • the bottom edge 102a of the second type conductive layer 102 is aligned with the top edge 101 a of the first type conductive layer 101 .
  • the first type conductive layer 101 and the second type conductive layer 102 may be any type of conductive layers.
  • the first type conductive layer 101 may be an n-type conductive semiconductor containing one or more n-type dopants
  • the second type conductive layer 102 may be a p-type conductive semiconductor layer containing one or more p-type dopants.
  • the first type conductive layer 101 may be a p-type conductive semiconductor
  • the second type conductive layer 102 may be an n-type conductive semiconductor layer.
  • a top area of the first type conductive layer 101 is larger than a bottom area of the first type conductive layer 101.
  • a top area of the second type conductive layer 102 is smaller than a bottom area of the second type conductive layer 102.
  • the light emitting layer 103 may have a quantum well structure in which quantum well layers and barrier layers are alternately stacked.
  • the light emitting layer 103 may include one pair of quantum well layers and a barrier layer interposed between the quantum well layers.
  • the light emitting layer 103 may include multiple pairs of quantum well layers and a barrier layer interposed between adjacent quantum well layers.
  • the quantum well layers are made of, for example, GaAs, AIGaAs, InGaAs, GaAsP, AIGalnP, GalnAsP, GalnP, AllnP, GaP, InP, or the like.
  • the barrier layers are formed of, for example, GaAs, AIGaAs, InGaAs, GaAsP, AIGalnP, GalnAsP, GalnP, AllnP, GaP, InP, or the like.
  • the micro-LED structure 1000 also includes a top spacer 107 formed on a top surface 103b of the light emitting layer 103, and a bottom spacer 108 formed on a bottom surface 103c of the light emitting layer 103.
  • the top spacer 107 and the bottom spacer 108 may be made of GaAs, AIGaAs, InGaAs, GaAsP, AIGalnP, GalnAsP, GalnP, AllnP, GaP, InP or the like.
  • the top spacer 107 and the bottom spacer 108 are configured to control the carrier injection efficiency to improve the performance and reliability of the micro-LED.
  • An edge 107a of the top spacer 107 and an edge 108a of the bottom spacer 108 are aligned with the edge 103a of the light emitting layer 103.
  • the micro-LED structure 1000 further includes a reflective structure 104 surrounding the first type conductive layer 101 .
  • the reflective structure 104 is attached on a sidewall surface 101 b of the first type conductive layer 101 .
  • the reflective structure 104 on the sidewall of the first type conductive layer 101 is inclined relative to a surface 110a of a substrate 110.
  • An inclined angle of the reflective structure 104 is approximately 30° to approximately 75° relative to the surface 110a of the substrate 110.
  • the reflective structure 104 on the sidewall surface 101 b of the first type conductive layer 101 is made of an ODR (omnidirectional reflector) structure or a DBR (distributed bragg reflection) structure.
  • the reflective structure 104 is configured to focus light on the second type conductive layer 102.
  • the micro-LED structure 1000 further includes a bottom connection structure 105 formed under the first type conductive layer 101 , and electrically connected with the first type conductive layer 101 .
  • the bottom connection structure 105 may be formed of electrically conductive material, such as, for example, metal.
  • the bottom connection structure 105 may be reflective.
  • the micro-LED structure 1000 further includes the substrate 110 under the first type conductive layer 101 , and is electrically connected with the bottom connection structure 105 by a connecting pad 106 in the substrate 110.
  • the substrate 110 may be made of one of more of the materials from the lll-V groups, such as, for example, GaN.
  • the substrate 110 may include an IC circuit.
  • the connecting pad 106 may be made of conductive materials, such as, for example, Cu.
  • the micro-LED structure 1000 further includes an isolation layer 109 surrounding the first type conductive layer 101 and under the light emitting layer 103.
  • the isolation layer 109 may be made of a light absorption material which includes, for example, impurity doped SiO 2 or Si 3 N 4 .
  • the micro-LED structure 1000 further includes a microlens 111 formed on the second type conductive layer 102 and on a top surface of 107b the top spacer 107.
  • the microlens 111 is configured to converge light emitted by the light emitting layer 103.
  • FIG. 1 B is a cross-sectional view of a micro-LED structure 1001 , according to a first variation of the first embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 1 B differs from the embodiment illustrated in FIG. 1A in that the sidewall surface 101b of the first type conductive layer 101 is curved, and a reflective structure 1041 is formed on the sidewall surface 101 b of the first type conductive layer 101 has a curved surface 104a. Except for the reflective structure 1041 , the components of the micro-LED structure 1001 illustrated in FIG. 1 B are the same as the components of the micro-LED structure 1000 illustrated in FIG. 1 A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 1 C is a cross-sectional view of a micro-LED structure 1002, according to a second variation of the first embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 1 C differs from the embodiment illustrated in FIG. 1A in that a reflective structure 1042 is attached on a bottom surface 101c of the first type conductive layer 101.
  • the reflective structure 1042 is electrically conductive.
  • the bottom connection structure 105 is formed at the bottom of the reflective structure 1042, and is electrically connected with the reflective structure 1042.
  • the reflective structure 1042 on the bottom surface 101c of the first type conductive layer 101 may be made of metal. Except for the reflective structure 1042, the components of the micro-LED structure 1002 illustrated in FIG. 1C are the same as the components of the micro- LED structure 1000 illustrated in FIG. 1 A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 1 D is a cross-sectional view of a micro-LED structure 1003, according to a third variation of the first embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 1 D differs from the embodiment illustrated in FIG. 1 A in that a reflective structure 1043 is attached on both of the sidewall surface 101b and the bottom surface 101c of the first type conductive layer 101 .
  • the reflective structure 1043 is electrically conductive.
  • the bottom connection structure 105 is formed at the bottom of the reflective structure 1043, and is electrically connected with the reflective structure 1043. Except for the reflective structure 1043, the components of the micro-LED structure 1003 illustrated in FIG. 1 D are the same as the components of the micro-LED structure 1000 illustrated in FIG. 1 A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 2A is a cross-sectional view of a micro-LED structure 2000, according to a second embodiment of the present disclosure.
  • the second embodiment illustrated in FIG. 2A differs from the first embodiment illustrated in FIG. 1 A in that the bottom edge 102a of the second type conductive layer 102 is not aligned with the top edge 101a of the first type conductive layer 101. Instead, a profile of the second type conductive layer 102 perpendicularly projected on the top surface 101 d of the first type conductive layer 101 is surrounded by the top edge 101 a of the first type conductive layer 101.
  • the components of the micro-LED structure 2000 of the second embodiment illustrated in FIG. 2A are the same as the components of the micro-LED structure 1000 of the first embodiment illustrated in FIG. 1 A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 2B is a cross-sectional view of a micro-LED structure 2001 , according to a first variation of the second embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 2B differs from the embodiment illustrated in FIG. 2A in that the sidewall surface 101 b of the first type conductive layer 101 is curved, and the reflective structure 1041 is formed on the sidewall surface 101 b of the first type conductive layer 101 has the curved surface 104a. Except for the reflective structure 1041 , the components of the micro-LED structure 2001 illustrated in FIG. 2B are the same as the components of the micro-LED structure 2000 illustrated in FIG. 2A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 2C is a cross-sectional view of a micro-LED structure 2002, according to a second variation of the second embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 2C differs from the embodiment illustrated in FIG. 2A in that the reflective structure 1042 is attached on the bottom surface 101c of the first type conductive layer 101 .
  • the reflective structure 1042 is electrically conductive.
  • the bottom connection structure 105 is formed at the bottom of the reflective structure 1042, and is electrically connected with the bottom of the reflective structure 1042.
  • the reflective structure 1042 on the bottom surface 101c of the first type conductive layer 101 may be made of metal. Except for the reflective structure 1042, the components of the micro-LED structure 2002 illustrated in FIG. 2C are the same as the components of the micro-LED structure 2000 illustrated in FIG. 2A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 2D is a cross-sectional view of a micro-LED structure 2003, according to a third variation of the second embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 2D differs from the embodiment illustrated in FIG. 2A in that the reflective structure 1043 is attached on both of the sidewall surface 101 b and the bottom surface 101c of the first type conductive layer 101 .
  • the reflective structure 1043 is electrically conductive.
  • the bottom connection structure 105 is formed at the bottom of the reflective structure 1043, and is electrically connected with the reflective structure 1043. Except for the reflective structure 1043, the components of the micro-LED structure 2003 illustrated in FIG. 2D are the same as the components of the micro-LED structure 2000 illustrated in FIG. 2A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 3A is a cross-sectional view of a micro-LED structure 3000, according to a third embodiment of the present disclosure.
  • the third embodiment illustrated in FIG. 3A differs from the first embodiment illustrated in FIG. 1A in that the bottom edge 102a of the second type conductive layer 102 is not aligned with the top edge 101a of the first type conductive layer 101 . Instead, a profile of the first type conductive layer 101 perpendicularly projected on a bottom surface 102b of the second type conductive layer 102 is surrounded by the bottom edge 102a of the second type conductive layer 102.
  • the components of the micro-LED structure 3000 of the third embodiment illustrated in FIG. 3A are the same as the components of the micro-LED structure 1000 of the first embodiment illustrated in FIG. 1A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 3B is a cross-sectional view of a micro-LED structure 3001 , according to a first variation of the third embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 3B differs from the embodiment illustrated in FIG. 3A in that the sidewall surface 101b of the first type conductive layer 101 is curved, and the reflective structure 1041 is formed on the sidewall surface 101 b of the first type conductive layer 101 has the curved surface 104a. Except for the reflective structure 104, the components of the micro-LED structure 3001 illustrated in FIG. 3B are the same as the components of the micro-LED structure 3000 illustrated in FIG. 3A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 3C is a cross-sectional view of a micro-LED structure 3002, according to a second variation of the third embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 3C differs from the embodiment illustrated in FIG. 3A in that the reflective structure 1042 is attached on the bottom surface 101c of the first type conductive layer 101.
  • the reflective structure 1042 is electrically conductive.
  • the bottom connection structure 105 is formed at the bottom of the reflective structure 1042, and is electrically connected with the bottom of the reflective structure 1042.
  • the reflective structure 1042 on the bottom surface 101c of the first type conductive layer 101 may be made of metal. Except for the reflective structure 1042, the components of the micro-LED structure 3002 illustrated in FIG. 3C are the same as the components of the micro-LED structure 3000 illustrated in FIG. 3A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 3D is a cross-sectional view of a micro-LED structure 3003, according to a third variation of the third embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 3D differs from the embodiment illustrated in FIG. 3A in that the reflective structure 1043 is attached on both of the sidewall surface 101b and the bottom surface 101c of the first type conductive layer 101.
  • the reflective structure 1043 is electrically conductive.
  • the bottom connection structure 105 is formed at the bottom of the reflective structure 1043, and is electrically connected with the reflective structure 1043.
  • the components of the micro-LED structure 3003 illustrated in FIG. 3D are the same as the components of the micro-LED structure 3000 illustrated in FIG. 3A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 4A is a cross-sectional view of a micro-LED structure 4000, according to a fourth embodiment of the present disclosure.
  • the fourth embodiment illustrated in FIG. 4A differs from the third embodiment illustrated in FIG. 3A in that the light emitting layer 103 extends along a horizontal level away from the top edge 101a of the first type conductive layer 101 , and the edge 103a of the light emitting layer 103 is aligned with the bottom edge 102a of the second type conductive layer 102.
  • the micro-LED structure 4000 further includes a top isolation layer 114 surrounding the light emitting layer 103.
  • the top isolation layer 114 may be made of one or more electrical insulating dielectric materials, such as, for example, SiO 2 , Si 3 N 4 , AI 2 O 3 , TiO 2 , HfO 2 , AIN or the like.
  • the top isolation layer 114 is configured to isolate the micro-LED structure 4000 from an adjacent micro-LED structure (not shown).
  • the microlens 111 is formed on the second type conductive layer 102 and on a top surface 114a of the isolation layer 114.
  • the other components of the micro-LED structure 4000 of the fourth embodiment illustrated in FIG. 4A are the same as the components of the micro- LED structure 3000 of the first embodiment illustrated in FIG. 3A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 4B is a cross-sectional view of a micro-LED structure 4001 , according to a first variation of the fourth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 4B differs from the embodiment illustrated in FIG. 4A in that the sidewall surface 101b of the first type conductive layer 101 is curved, and the reflective structure 1041 is formed on the sidewall surface 101 b of the first type conductive layer 101 and has the curved surface 104a. Except for the reflective structure 1041 , the components of the micro-LED structure 4001 illustrated in FIG. 4B are the same as the components of the micro-LED structure 4000 illustrated in FIG. 4A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 4C is a cross-sectional view of a micro-LED structure 4002, according to a second variation of the fourth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 4C differs from the embodiment illustrated in FIG. 4A in that the reflective structure 1042 is attached on the bottom surface 101c of the first type conductive layer 101 .
  • the reflective structure 1042 is electrically conductive.
  • the bottom connection structure 105 is formed at the bottom of the reflective structure 1042, and is electrically connected with the bottom of the reflective structure 1042.
  • the reflective structure 1042 on the bottom surface 101c of the first type conductive layer 101 may be made of metal. Except for the reflective structure 1042, the components of the micro-LED structure 4002 illustrated in FIG. 4C are the same as the components of the micro-LED structure 4000 illustrated in FIG. 4A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 4D is a cross-sectional view of a micro-LED structure 4003, according to a third variation of the fourth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 4D differs from the embodiment illustrated in FIG. 4A in that the reflective structure 1043 is attached on both of the sidewall surface 101b and the bottom surface 101c of the first type conductive layer 101.
  • the reflective structure 1043 is electrically conductive.
  • the bottom connection structure 105 is formed at the bottom of the reflective structure 1043, and is electrically connected with the reflective structure 1043.
  • the components of the micro-LED structure 4003 illustrated in FIG. 4D are the same as the components of the micro-LED structure 4000 illustrated in FIG. 4A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 5A is a cross-sectional view of a micro-LED structure 5000, according to a fifth embodiment of the present disclosure.
  • the fifth embodiment illustrated in FIG. 5A differs from the second embodiment illustrated in FIG. 2A in that the light emitting layer 103 extends along a horizontal level from the bottom edge 102a of the second type conductive layer 102, and the edge 103a of the light emitting layer 103 is aligned with the top edge 101 a of the first type conductive layer 101 .
  • the micro-LED structure 4000 further includes the top isolation layer 114 surrounding the light emitting layer 103.
  • the microlens 111 is formed on the second type conductive layer 102 and on the top surface 114a of the isolation layer 114.
  • the other components of the micro-LED structure 5000 of the fourth embodiment illustrated in FIG. 5A are the same as the components of the micro-LED structure 2000 of the second embodiment illustrated in FIG. 2A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 5B is a cross-sectional view of a micro-LED structure 5001 , according to a first variation of the fifth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 5B differs from the embodiment illustrated in FIG. 5A in that the sidewall surface 101b of the first type conductive layer 101 is curved, and the reflective structure 1041 formed on the sidewall surface 101 b of the first type conductive layer 101 has the curved surface 104a. Except for the reflective structure 1041 , the components of the micro-LED structure 5001 illustrated in FIG. 5B are the same as the components of the micro-LED structure 5000 illustrated in FIG. 5A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 5C is a cross-sectional view of a micro-LED structure 5002, according to a second variation of the fifth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 5C differs from the embodiment illustrated in FIG. 5A in that the reflective structure 1042 is attached on the bottom surface 101c of the first type conductive layer 101.
  • the reflective structure 1042 is electrically conductive.
  • the bottom connection structure 105 is formed at the bottom of the reflective structure 1042, and is electrically connected with the bottom of the reflective structure 1042.
  • the reflective structure 1042 on the bottom surface 101c of the first type conductive layer 101 is made of metal. Except for the reflective structure 1042, the components of the micro-LED structure 5002 illustrated in FIG. 5C are the same as the components of the micro-LED structure 5000 illustrated in FIG. 5A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 5D is a cross-sectional view of a micro-LED structure 5003, according to a third variation of the fifth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 5D differs from the embodiment illustrated in FIG. 5A in that the reflective structure 1043 is attached both on the sidewall surface 101b and the bottom surface 101c of the first type conductive layer 101.
  • the reflective structure 1043 is electrically conductive.
  • the bottom connection structure 105 is formed at the bottom of the reflective structure 1043, and is electrically connected with the reflective structure 1043. Except for the reflective structure 1042, the components of the micro-LED structure 5003 illustrated in FIG. 5D are the same as the components of the micro-LED structure 5000 illustrated in FIG. 5A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 6A is a cross-sectional view of a micro-LED chip 6000, according to a sixth embodiment of the present disclosure.
  • the micro-LED chip 6000 may include multiple microLEDs. At least one of the micro-LEDs included in the micro-LED chip 6000 may have any one of the micro-LED structures 1000, 1001 , . . . 3003 described above.
  • the micro-LED chip 6000 includes two micro-LEDs 610 and 620. Each one of the micro-LEDs 610 and 620 includes the micro-LED structure 1000 described in the first embodiment illustrated in FIG. 1 A.
  • the micro-LEDs 610 and 620 in FIG. 6A are also referred to as micro-LEDs 610(1000) and 620(1000).
  • each one of the micro-LEDs 610(1000) and 620(1000) includes the first type conductive layer 101 , the second type conductive layer 102 stacked on the first type conductive layer 101 , and the light emitting layer 103 formed between the first type conductive layer 101 and the second type conductive layer 102.
  • the light emitting layer 103 is continuously formed on the whole micro-LED chip 6000.
  • the first and second micro-LEDs 610(1000) and 620(1000) share the light emitting layer 103.
  • the light emitting layer 103 extends along a horizontal level away from the top edge 101a of the first type conductive layer 101 and the bottom edge 102a of the second type conductive layer 102, such that the edge 103a of the light emitting layer 103 does not contact the top edge 101 a of the first type conductive layer 101 and the bottom edge 102a of the second type conductive layer 102.
  • the bottom edge 102a of the second type conductive layer 102 is aligned with the top edge 101a of the first type conductive layer 101.
  • each one of the micro-LEDs 610(1000) and 620(1000) also includes the top spacer 107 formed on the top surface 103b of the light emitting layer 103, and the bottom spacer 108 formed on the bottom surface 103c of the light emitting layer 103.
  • Both of the top spacer 107 and the bottom spacer 108 are continuously formed on the whole micro-LED chip 6000, and are shared by the first and second micro-LEDs 610(1000) and 620(1000).
  • the edge 107a of the top spacer 107 is aligned with the edge 103a of the light emitting layer 103.
  • the edge 108a of the bottom spacer 108 is aligned with the edge 103a of the light emitting layer 103.
  • each one of the micro-LEDs 610(1000) and 620(1000) also includes the reflective structure 104 surrounding the first type conductive layer 101 , the bottom connection structure 105 formed under the first type conductive layer 101 , the connecting pad 106 formed in the substrate 110, the isolation layer 109 surrounding the first type conductive layer 101 and under the light emitting layer 103, the substrate 110 under the first type conductive layer 101 and electrically connected with the bottom connection structure 105 by the connecting pad 106, and the microlens 111 formed on the second type conductive layer 102 and on the top surface of 107b the top spacer 107.
  • the components of the first and second micro-LEDs 610(1000) and 620(1000) of the sixth embodiment illustrated in FIG. 6A are the same as the components of the micro-LED structure 1000 of the first embodiment illustrated in FIG. 1 A. Therefore, detailed descriptions of these components are not repeated.
  • FIG. 6B is a cross-sectional view of a micro-LED chip 6001 , according to a first variation of the sixth embodiment of the present disclosure.
  • the first variation of the sixth embodiment illustrated in FIG. 6B differs from the sixth embodiment illustrated in FIG. 6A in that each one of the micro-LEDs 610 and 620 in the micro-LED chip 6001 includes the micro-LED structure 1001 described in the first variation of the first embodiment illustrated in FIG. 1 B. Therefore, the micro-LEDs 610 and 620 in FIG. 6B are also referred to as micro-LEDs 610(1001 ) and 620(1001).
  • the sidewall surface 101b of the first type conductive layer 101 is curved, and the reflective structure 1041 formed on the sidewall surface 101b of the first type conductive layer 101 has the curved surface 104a. Except for the reflective structure 1041 , the components of the micro-LED chip 6001 illustrated in FIG. 6B are the same as the components of the micro-LED chip 6000 illustrated in FIG. 6A, and therefore detailed descriptions of these components are not repeated. [0154] Second Variation of Sixth Embodiment
  • FIG. 6C is a cross-sectional view of a micro-LED chip 6002, according to a second variation of the sixth embodiment of the present disclosure.
  • the second variation of the sixth embodiment illustrated in FIG. 6C differs from the sixth embodiment illustrated in FIG. 6A in that each one of the micro-LEDs 610 and 620 in the micro-LED chip 6002 includes the micro- LED structure 1002 described in the second variation of the first embodiment illustrated in FIG. 1 C. Therefore, the micro-LEDs 610 and 620 in FIG. 6C are referred to as micro-LEDs 610(1002) and 620(1002).
  • the reflective structure 1042 is attached on the bottom surface 101c of the first type conductive layer 101 .
  • the reflective structure 1042 is electrically conductive.
  • the bottom connection structure 105 is formed at the bottom of the reflective structure 1042, and is electrically connected with the bottom of the reflective structure 1042.
  • the reflective structure 1042 on the bottom surface 101c of the first type conductive layer 01 may be made of metal. Except for the reflective structure 1042, the components of the micro-LED chip 6002 illustrated in FIG. 6C are the same as the components of the micro-LED chip 6000 illustrated in FIG. 6A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 6D is a cross-sectional view of a micro-LED chip 6003, according to a third variation of the sixth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 6D differs from the embodiment illustrated in FIG. 6A in that each one of the micro-LEDs 610 and 620 in the micro-LED chip 6003 includes the micro-LED structure 1003 described in the third variation of the first embodiment illustrated in FIG. 1 D. Therefore, the micro-LEDs 610 and 620 in FIG. 6C are referred to as micro-LEDs 610(1003) and 620(1003).
  • the reflective structure 1043 is attached both on the sidewall surface 101b and the bottom surface 101c of the first type conductive layer 101.
  • the reflective structure 1043 is electrically conductive.
  • the bottom connection structure 105 is formed at the bottom of the reflective structure 1043, and is electrically connected with the reflective structure 1043. Except for the reflective structure 1043, the components of the micro-LED chip 6003 illustrated in FIG. 6D are the same as the components of the micro-LED chip 6000 illustrated in FIG. 6A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 6E is a cross-sectional view of a micro-LED chip 6004, according to a fourth variation of the sixth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 6E differs from the embodiment illustrated in FIG. 6A in that each one of the micro-LEDs 610 and 620 in the micro-LED chip 6004 includes the micro-LED structure 2000 described in the second embodiment illustrated in FIG. 2A. Therefore, the micro-LEDs 610 and 620 in FIG. 6E are referred to as micro-LEDs 610(2000) and 620(2000).
  • the bottom edge 102a of the second type conductive layer 102 is not aligned with the top edge 101a of the first type conductive layer 101 . Instead, a profile of the second type conductive layer 102 perpendicularly projected on the top surface 101d of the first type conductive layer 101 is surrounded by the top edge 101a of the first type conductive layer 101.
  • the components of the micro-LED chip 6004 of the embodiment illustrated in FIG. 6E are the same as the components of the micro-LED chip 6000 of the embodiment illustrated in FIG. 6A, and therefore detailed descriptions of these components are not repeated.
  • each of the micro-LEDs 610 and 620 in the micro-LED chip 6004 includes the micro-LED structure 2000 described in the second embodiment illustrated in FIG. 2A.
  • each of the micro-LEDs 610 and 620 in the micro-LED chip 6004 may include the micro-LED structure 2001 , 2002, or 2003 described in the first, second, or third variation of the second embodiment illustrated in FIG. 2B, 2C, or 2D, respectively.
  • FIG. 6F is a cross-sectional view of a micro-LED chip 6005, according to a fifth variation of the sixth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 6F differs from the embodiment illustrated in FIG. 6A in that each one of the micro-LEDs 610 and 620 in the micro-LED chip 6005 includes the micro-LED structure 3000 described in the second embodiment illustrated in FIG. 3A. Therefore, the micro-LEDs 610 and 620 in FIG. 6F are referred to as micro-LEDs 610(3000) and 620(3000).
  • the bottom edge 102a of the second type conductive layer 102 is not aligned with the top edge 101a of the first type conductive layer 101 . Instead, a profile of the first type conductive layer 101 perpendicularly projected on the bottom surface 102b of the second type conductive layer 102 is surrounded by the bottom edge 102a of the second type conductive layer 102.
  • the components of the micro-LED chip 6005 of the embodiment illustrated in FIG. 6F are the same as the components of micro-LED chip 6000 of the embodiment illustrated in FIG. 6A, and therefore detailed descriptions of these components are not repeated.
  • each of the micro-LEDs 610 and 620 in the micro-LED chip 6005 includes the micro-LED structure 3000 described in the third embodiment illustrated in FIG. 3A.
  • each of the micro-LEDs 610 and 620 in the micro-LED chip 6005 may include the micro-LED structure 3001 , 3002, or 3003 described in the first, second, or third variation of the third embodiment illustrated in FIG. 3B, 3C, or 3D, respectively.
  • FIG. 7 is a cross-sectional view of a micro-LED chip 7000, according to a seventh embodiment of the present disclosure.
  • the micro-LED chip 7000 may include multiple micro-LEDs. At least one of the micro-LEDs included in the micro-LED chip 7000 may have any one of the micro-LED structures 1000, 1001 , . . . 3003 described above.
  • the micro-LED chip 7000 illustrated in FIG. 7 differs from the micro-LED chip 6000 illustrated in FIG. 6A in that the micro-LED chip 7000 further includes an isolation structure 112 formed between adjacent micro-LEDs 610(1000) and 620(1000).
  • the isolation structure 112 may be made of a light absorption material, which may be a dielectric material including, for example, impurity doped SiO 2 or Si 3 N 4 . In other embodiments, the isolation structure 112 may be made of a reflective material such as, for example, metal.
  • the isolation structure 112 is configured to electrically isolate the adjacent micro-LEDs 610(1000) and 620(1000) from each other.
  • At least a portion of the isolation structure 112 is formed in the light emitting layer 103.
  • a top surface 112a of the isolation structure 112 is aligned with the top surface 103b of the light emitting layer 103
  • a bottom surface 112b of the isolation structure 112 is aligned with the bottom surface 103c of the light emitting layer 103.
  • the isolation structure 112 may be formed surrounding at least one of the micro- LEDs 610(1000) and 620(1000). Additionally or alternatively, at least a portion of the isolation structure 112 may be formed in the top spacer 107 or the bottom spacer 108.
  • the components of the micro-LED chip 7000 of the embodiment illustrated in FIG. 7 are the same as the components of the micro-LED chip 6000 of the embodiment illustrated in FIG. 6A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 8A is a cross-sectional view of a micro-LED chip 8000, according to an eighth embodiment of the present disclosure.
  • the micro-LED chip 8000 illustrated in FIG. 8A differs from the micro-LED chip 7000 illustrated in FIG. 7 in that the bottom surface 112b of the isolation structure 112 is below the light emitting layer 103. More specifically, as illustrated in FIG. 8A, the bottom surface 112b of the isolation structure 112 is below the bottom surface 103c of the light emitting layer 103 and above the bottom surface 108b of the bottom spacer 108. Except for the isolation structure 112, the components of the micro-LED chip 8000 illustrated in FIG. 8A are the same as the components of the micro-LED chip 7000 illustrated in FIG. 7, and therefore detailed descriptions of these components are not repeated.
  • FIG. 8B is a cross-sectional view of a micro-LED chip 8001 , according to a first variation of the eighth embodiment of the present disclosure.
  • the micro-LED chip 8001 illustrated in FIG. 8B differs from the micro-LED chip 8000 illustrated in FIG. 8A in that the bottom surface 112b of the isolation structure 112 is aligned with the bottom surface 108b of the bottom spacer 108. Except for the isolation structure 112, the components of the micro-LED chip 8001 illustrated in FIG. 8B are the same as the components of the micro-LED chip 8000 illustrated in FIG. 8A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 8C is a cross-sectional view of a micro-LED chip 8002, according to a second variation of the eighth embodiment of the present disclosure.
  • the micro-LED chip 8002 illustrated in FIG. 8C differs from the micro-LED chip 8000 illustrated in FIG. 8A in that the bottom surface 112b of the isolation structure 112 is below the bottom surface 108b of the bottom spacer 108 and is disposed in the isolation layer 109. Except for the isolation structure 112, the components of the micro-LED chip 8002 illustrated in FIG. 8C are the same as the components of the micro-LED chip 8000 illustrated in FIG. 8A, and therefore detailed descriptions of these components are not repeated.
  • an area of the top surface 112a of the isolation structure 112 is equal to an area of the bottom surface 112b of the isolation structure 112.
  • the area of the top surface 112a of the isolation structure 112 may be larger or smaller than the area of the bottom surface 112b of the isolation structure 112.
  • a cross-sectional area of the isolation structure 112 at an interface between the light emitting layer 103 and the bottom spacer 108, or at the bottom surface 108b of the bottom spacer 108 may be larger than the area of the bottom surface 112b of the isolation structure 112.
  • FIG. 9A is a cross-sectional view of a micro-LED chip 9000, according to a ninth embodiment of the present disclosure.
  • the micro-LED chip 9000 illustrated in FIG. 9A differs from the micro-LED chip 7000 illustrated in FIG. 7 in that the top surface 112a of the isolation structure 112 is above the light emitting layer 103. More specifically, as illustrated in FIG. 9A, the top surface 112a of the isolation structure 112 is above the top surface 103b of the light emitting layer 103 and below the top surface 107b of the top spacer 107. Except for the isolation structure 112, the components of the micro-LED chip 9000 illustrated in FIG. 9A are the same as the components of the micro-LED chip 7000 illustrated in FIG. 7, and therefore detailed descriptions of these components are not repeated.
  • FIG. 9B is a cross-sectional view of a micro-LED chip 9001 , according to a first variation of the ninth embodiment of the present disclosure.
  • the micro-LED chip 9001 illustrated in FIG. 9B differs from the micro-LED chip 9000 illustrated in FIG. 9A in that the top surface 112a of the isolation structure 112 is aligned with the top surface 107b of the top spacer 107. Except for the isolation structure 112, the components of the micro-LED chip 9001 illustrated in FIG. 9B are the same as the components of the micro-LED chip 9000 illustrated in FIG. 9A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 9C is a cross-sectional view of a micro-LED chip 9002, according to a second variation of the ninth embodiment of the present disclosure.
  • the micro-LED chip 9002 illustrated in FIG. 9C differs from the micro-LED chip 9000 illustrated in FIG. 9A in that the top surface 112a of the isolation structure 112 is above the top surface 107b of the top spacer 107 and between adjacent second type conductive layers 102. Except for the isolation structure 112, the components of the micro-LED chip 9002 illustrated in FIG. 9C are the same as the components of the micro-LED chip 9000 illustrated in FIG. 9A, and therefore detailed descriptions of these components are not repeated.
  • the area of the top surface 112a of the isolation structure 112 is equal to the area of the bottom surface 112b of the isolation structure 112.
  • the area of the top surface 112a of the isolation structure 112 may be larger or smaller than the area of the bottom surface 112b of the isolation structure 112.
  • a cross-sectional area of the isolation structure 112 at the top surface 103b of the light emitting layer 103 or at the top surface 107b of the top spacer 107 may be larger than the area of the bottom surface 112b of the isolation structure 112.
  • FIG. 10A is a cross-sectional view of a micro-LED chip 10000, according to a tenth embodiment of the present disclosure.
  • the micro-LED chip 10000 illustrated in FIG. 10A differs from the micro-LED chip 7000 illustrated in FIG. 7 in that the top surface 112a of the isolation structure 112 is above the light emitting layer 103, and the bottom surface 112b of the isolation structure 112 is below the light emitting layer 103. More specifically, as illustrated in FIG.
  • the top surface 112a of the isolation structure 112 is above the top surface 103b of the light emitting layer 103 and below the top surface 107b of the top spacer 107, and the bottom surface 112b of the isolation structure 112 is below the bottom surface 103c of the light emitting layer 103 and above the bottom surface 108b of the bottom spacer 108.
  • the components of the micro-LED chip 10000 illustrated in FIG. 10A are the same as the components of the micro-LED chip 7000 illustrated in FIG. 7, and therefore detailed descriptions of these components are not repeated.
  • FIG. 10B is a cross-sectional view of a micro-LED chip 10001 , according to a first variation of the tenth embodiment of the present disclosure.
  • the micro-LED chip 10001 illustrated in FIG. 10B differs from the micro-LED chip 10000 illustrated in FIG. 10A in that the bottom surface 112b of the isolation structure 112 is aligned with the bottom surface 108b of the bottom spacer 108. Except for the isolation structure 112, the components of the micro-LED chip 10001 illustrated in FIG. 10B are the same as the components of the micro-LED chip 10000 illustrated in FIG. 10A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 10C is a cross-sectional view of a micro-LED chip 10002, according to a second variation of the tenth embodiment of the present disclosure.
  • the micro-LED chip 10002illustrated in FIG. 10C differs from the micro-LED chip 10000 illustrated in FIG. 10A in that the bottom surface 112b of the isolation structure 112 is below the bottom surface 108b of the bottom spacer 108 and is disposed in the isolation layer 109. Except for the isolation structure 112, the components of the micro-LED chip 10002 illustrated in FIG. 10C are the same as the components of the micro-LED chip 10000 illustrated in FIG. 10A, and therefore detailed descriptions of these components are not repeated.
  • the area of the top surface 112a of the isolation structure 112 is equal to the area of the bottom surface 112b of the isolation structure 112.
  • the area of the top surface 112a of the isolation structure 112 may be larger or smaller than the area of the bottom surface 112b of the isolation structure 112.
  • a cross-sectional area of the isolation structure 112 at the bottom surface 103c of the light emitting layer 103 or at the bottom surface 108b of the bottom spacer 108 may be larger than the area of the bottom surface 112b of the isolation structure 112.
  • FIG. 11A is a cross-sectional view of a micro-LED chip 11000, according to an eleventh embodiment of the present disclosure.
  • the micro-LED chip 11000 illustrated in FIG. 11A differs from the micro-LED chip 7000 illustrated in FIG. 7 in that the top surface 112a of the isolation structure 112 is aligned with the top surface 107b of the top spacer 107, and the bottom surface 112b of the isolation structure 112 is below the light emitting layer 103. More specifically, in the embodiment illustrated in FIG. 11 A, the bottom surface 112b of the isolation structure 112 is below the bottom surface 103c of the light emitting layer 103 and above the bottom surface 108b of the bottom spacer 108. Except for the isolation structure 112, the components of the micro-LED chip 11000 illustrated in FIG. 11A are the same as the components of the micro-LED chip 7000 illustrated in FIG. 7, and therefore detailed descriptions of these components are not repeated.
  • FIG. 11 B is a cross-sectional view of a micro-LED chip 11001 , according to a first variation of the eleventh embodiment of the present disclosure.
  • the micro-LED chip 11001 illustrated in FIG. 11 B differs from the micro-LED chip 11000 illustrated in FIG. 11 A in that the bottom surface 112b of the isolation structure 112 is aligned with the bottom surface 108b of the bottom spacer 108. Except for the isolation structure 112, the components of the micro-LED chip 11001 illustrated in FIG. 11 A are the same as the components of the micro-LED chip 11000 illustrated in FIG. 11 A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 11 C is a cross-sectional view of a micro-LED chip 11002, according to a second variation of the eleventh embodiment of the present disclosure.
  • the micro-LED chip 11002 illustrated in FIG. 11 C differs from the micro-LED chip 11000 illustrated in FIG. 11 A in that the bottom surface 112b of the isolation structure 112 is below the bottom surface 108b of the bottom spacer 108 and is disposed in the isolation layer 109. Except for the isolation structure 112, the components of the micro-LED chip 11002 illustrated in FIG. 11 C are the same as the components of the micro-LED chip 11000 illustrated in FIG. 11 A, and therefore detailed descriptions of these components are not repeated.
  • the area of the top surface 112a of the isolation structure 112 is equal to the area of the bottom surface 112b of the isolation structure 112.
  • the area of the top surface 112a of the isolation structure 112 may be larger or smaller than the area of the bottom surface 112b of the isolation structure 112.
  • a cross-sectional area of the isolation structure 112 at the bottom surface 103c of the light emitting layer 103 or the bottom surface 108b of the bottom spacer 108 may be larger than the area of the bottom surface 112b of the isolation structure 112.
  • FIG. 11 D is a cross-sectional view of a micro-LED chip 11003, according to a third variation of the eleventh embodiment of the present disclosure.
  • the micro-LED chip 11003 illustrated in FIG. 11 D differs from the micro-LED chip 11001 illustrated in FIG. 11 B in that the area of the top surface 112a of the isolation structure 112 is larger than an area of the bottom surface 112b of the isolation structure 112. Except for the isolation structure 112, the components of the micro-LED chip 11003 illustrated in FIG. 11 D are the same as the components of the micro-LED chip 11001 illustrated in FIG. 11 B, and therefore detailed descriptions of these components are not repeated.
  • FIG. 12A is a cross-sectional view of a micro-LED chip 12000, according to a twelfth embodiment of the present disclosure.
  • the micro-LED chip 12000 illustrated in FIG. 12A differs from the micro-LED chip 7000 illustrated in FIG. 7 in that the top surface 112a of the isolation structure 112 is above the top surface 107b of the top spacer 107 and between adjacent second type conductive layers 102, and the bottom surface 112b of the isolation structure 112 is below the light emitting layer 103. More specifically, in the embodiment illustrated in FIG. 12A, the bottom surface 112b of the isolation structure 112 is below the bottom surface 103c of the light emitting layer 103 and above the bottom surface 108b of the bottom spacer 108. Except for the isolation structure 112, the components of the micro-LED chip 12000 illustrated in FIG. 12A are the same as the components of the micro-LED chip 7000 illustrated in FIG. 7, and therefore detailed descriptions of these components are not repeated.
  • FIG. 12B is a cross-sectional view of a micro-LED chip 12001 , according to a first variation of the twelfth embodiment of the present disclosure.
  • the micro-LED chip 12001 illustrated in FIG. 12B differs from the micro-LED chip 12000 illustrated in FIG. 12A in that the bottom surface 112b of the isolation structure 112 is aligned with the bottom surface 108b of the bottom spacer 108. Except for the isolation structure 112, the components of the micro-LED chip 12001 illustrated in FIG. 12B are the same as the components of the micro-LED chip 12000 illustrated in FIG. 12A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 12C is a cross-sectional view of a micro-LED chip 12002, according to a second variation of the twelfth embodiment of the present disclosure.
  • the micro-LED chip 12002 illustrated in FIG. 12C differs from the micro-LED chip 12000 illustrated in FIG. 12A in that the bottom surface 112b of the isolation structure 112 is below the bottom surface 108b of the bottom spacer 108 and disposed in the isolation layer 109. Except for the isolation structure 112, the components of the micro-LED chip 12002 illustrated in FIG. 12C are the same as the components of the micro-LED chip 12000 illustrated in FIG. 12A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 12D is a cross-sectional view of a micro-LED chip 12003, according to a third variation of the twelfth embodiment of the present disclosure.
  • the micro-LED chip 12003 illustrated in FIG. 12D differs from the micro-LED chip 12002 illustrated in FIG. 12C in that the area of the top surface 112a of the isolation structure 112 is smaller than the area of the bottom surface 112b of the isolation structure 112, and a cross-sectional area 112c of the isolation structure 112 at the bottom surface 103c of the light emitting layer 103 is larger than the area of the bottom surface 112b of the isolation structure 112.
  • the components of the micro-LED chip 12003 illustrated in FIG. 12D are the same as the components of the micro-LED chip 12002 illustrated in FIG. 12C, and therefore detailed descriptions of these components are not repeated.
  • FIG. 13A is a cross-sectional view of a micro-LED chip 13000, according to a thirteenth embodiment of the present disclosure.
  • the micro-LED chip 13000 may include multiple micro-LEDs. At least one of the micro-LEDs included in the micro-LED chip 13000 may have any one of the micro-LED structures 1000, 1001 , . . . 3003 described above.
  • the micro-LED chip 13000 illustrated in FIG. 13A differs from the micro-LED chip 6000 illustrated in FIG. 6A in that the micro-LED chip 13000 further includes a metal layer 113 formed over the light emitting layer 103 between adjacent micro-LEDs 610(1000) and 620(1000).
  • the metal layer 113 is formed over the top surface 103b of the light emitting layer 103 and does not contact the first type conductive layer 101 or the second type conductive layer 102. More specifically, in the embodiment illustrated in FIG. 13A, the top spacer 107 is formed on top of the light emitting layer 103, and the metal layer 113 is formed on the top surface 107b of the top spacer 107.
  • a lateral dimensional value d1 of the metal layer 113 is not more than a distance d2 between the edge 103a of the light emitting layer 103 and the top edge 101a of the first type conductive layer 101 , or the lateral dimensional value d1 of the metal layer 113 is not more than a distance d3 between the edge 103a of the light emitting layer 103 and the bottom edge 102a of the second type conductive layer 102.
  • the lateral dimensional value d1 of the metal layer 113 may be from approximately 2 nm to approximately 10 urn.
  • a center point of the metal layer 113 may be aligned with a center point between the adjacent micro-LEDs 610(1000) and 620(1000). Alternatively, in some embodiments, the center point of the metal layer 113 is closer to one of the adjacent micro-LEDs 610(1000) and 620(1000) than the other one of the micro-LEDs 610(1000) and 620(1000).
  • the metal layer 113 may include a high work function metal material having a work function that matches the work function of a material of the light emitting layer 103.
  • the high work function metal material may include at least one of gold, platinum, palladium, beryllium, cobalt, nickel, or tungsten.
  • FIG. 13B is a cross-sectional view of a micro-LED chip 13001 , according to a variation of the thirteenth embodiment of the present disclosure.
  • the micro-LED chip 13001 illustrated in FIG. 13B differs from the micro-LED chip 13000 illustrated in FIG. 13A in that the micro-LED chip 13001 includes multiple metal layers 113 formed on the top surface 107b of the top spacer 107 and between adjacent micro-LEDs 610(1000) and 620(1000).
  • the metal layers 113 are arranged in parallel along the top surface 103b of the light emitting layer 103.
  • the number of the metal layers 113 may be more than three.
  • each of the micro-LEDs 610 and 620 includes the micro-LED structure 1000 described in the first embodiment illustrated in FIG. 1 A.
  • each of the micro-LEDs 610 and 620 may include any one of the micro-LED structures 1001 , 1002, and 1003 described in the first, second, and third variations of the first embodiment illustrated in FIGS. 1 B, 1 C, and 1 D, respectively.
  • FIG. 14A is a cross-sectional view of a micro-LED chip 14000, according to a fourteenth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 14A differs from the embodiment illustrated in FIG. 13A in that micro-LED chip 14000 includes two micro-LEDs 610(2000) and 620(2000), and each one of the micro-LEDs 610(2000) and 620(2000) includes the micro-LED structure 2000 described in the second embodiment illustrated in FIG. 2A.
  • the other components of the micro-LED chip 14000 of the embodiment illustrated in FIG. 14A are the same as the components of the micro-LED chip 13000 of the embodiment illustrated in FIG. 13A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 14B is a cross-sectional view of a micro-LED chip 14001 , according to a variation of the fourteenth embodiment of the present disclosure.
  • the micro-LED chip 14001 illustrated in FIG. 14B differs from the micro-LED chip 14000 illustrated in FIG. 14A in that the micro-LED chip 14001 includes multiple metal layers 113 formed on the top surface 107b of the top spacer 107 and between adjacent micro-LEDs 610(2000) and 620(2000).
  • the other components of the micro-LED chip 14001 of the embodiment illustrated in FIG. 14B are the same as the components of the micro-LED chip 13000 of the embodiment illustrated in FIG. 13A, and therefore detailed descriptions of these components are not repeated.
  • each of the micro-LEDs 610 and 620 includes the micro-LED structure 2000 described in the second embodiment illustrated in FIG. 2A.
  • each of the micro-LEDs 610 and 620 may include any one of the micro-LED structures 2001 , 2002, and 2003 described in the first, second, and third variations of the second embodiment illustrated in FIGS. 2B, 2C, and 2D, respectively.
  • FIG. 15A is a cross-sectional view of a micro-LED chip 15000, according to a fifteenth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 15A differs from the embodiment illustrated in FIG. 13A in that micro-LED chip 15000 includes two micro- LEDs 610(3000) and 620(3000), and each one of the micro-LEDs 610(3000) and 620(3000) includes the micro-LED structure 3000 described in the second embodiment illustrated in FIG. 3A.
  • the other components of the micro-LED chip 15000 of the embodiment illustrated in FIG. 15A are the same as the components of the micro-LED chip 13000 of the embodiment illustrated in FIG. 13A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 15B is a cross-sectional view of a micro-LED chip 15001 , according to a variation of the fifteenth embodiment of the present disclosure.
  • the micro-LED chip 15001 illustrated in FIG. 15B differs from the micro-LED chip 15000 illustrated in FIG. 15A in that the micro-LED chip 15001 includes multiple metal layers 113 formed on the top surface 107b of the top spacer 107 and between adjacent micro-LEDs 610(3000) and 620(3000).
  • the components of the micro-LED chip 15001 of the embodiment illustrated in FIG. 15B are the same as the components of the micro-LED chip 13000 of the embodiment illustrated in FIG. 13A, and therefore detailed descriptions of these components are not repeated.
  • each of the micro-LEDs 610 and 620 includes the micro-LED structure 3000 described in the third embodiment illustrated in FIG. 3A.
  • each of the micro-LEDs 610 and 620 may include any one of the micro-LED structures 3001 , 3002, and 3003 described in the first, second, and third variations of the third embodiment illustrated in FIGS. 3B, 3C, and 3D, respectively.
  • FIG. 16A is a cross-sectional view of a micro-LED chip 16000, according to a sixteenth embodiment of the present disclosure.
  • the micro-LED chip 16000 may include multiple micro-LEDs. At least one of the micro-LEDs included in the micro-LED chip 16000 may have any one of the micro-LED structures 4000, 4001 , . . . 5003 described above.
  • the micro-LED chip 16000 includes two micro-LEDs 610(4000) and 620(4000). Each one of the micro-LEDs 610(4000) and 620(4000) includes the micro-LED structure 4000 described in the fourth embodiment illustrated in FIG. 4A.
  • each one of the micro-LEDs 610(4000) and 620(4000) includes the first type conductive layer 101 , the second type conductive layer 102 stacked on the first type conductive layer 101 , and the light emitting layer 103 formed between the first type conductive layer 101 and the second type conductive layer 102.
  • the profile of the first type conductive layer 101 perpendicularly projected on the bottom surface 102b of the second type conductive layer 102 is surrounded by the bottom edge 102a of the second type conductive layer 102.
  • the light emitting layer 103 extends along a horizontal level away from the top edge 101 a of the first type conductive layer 101 and the edge 103a of the light emitting layer 103 is aligned with the bottom edge 102a of the second type conductive layer 102.
  • Each one of the micro-LEDs 610(4000) and 620(4000) further includes the top spacer 107 formed on the light emitting layer 103 and the bottom spacer formed under the light emitting layer 103. Both of the edge 107a of the top spacer 107 and the edge 108a of the bottom spacer 108 are aligned with the edge 103a of the light emitting layer 103, which is aligned with the bottom edge 102a of the second type conductive layer 102.
  • the micro-LED chip 16000 further includes the top isolation layer 114 surrounding the light emitting layer 103, and the microlens 111 formed on the second type conductive layer 102 and on a top surface 114a of the isolation layer 114. [0237] Except that the edge 103a of the light emitting layer 103, the edge 107a of the top spacer 107, and the edge 108a of the bottom spacer 108 are aligned with the bottom edge 102a of the second type conductive layer 102, the components of the micro-LED chip 16000 illustrated in FIG. 16A are the same as the components of micro-LED chip 6005 illustrated in FIG. 6F, and therefore detailed descriptions of these components are not repeated.
  • FIG. 16B is a cross-sectional view of a micro-LED chip 16001 , according to a variation of the sixteenth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 16B differs from the embodiment illustrated in FIG. 16A in that the micro-LED chip 16001 further includes the metal layer 113 formed on the top surface 114a of the isolation layer 114 and between adjacent micro-LEDs 610(4000) and 620(4000). In the embodiment illustrated in FIG. 16B, there is only one metal layer 113 between micro-LEDs 610(4000) and 620(4000).
  • micro-LED chip 16001 illustrated in FIG. 16B are the same as the components of the micro-LED chip 16000 illustrated in FIG. 16A, and therefore detailed descriptions of these components are not repeated.
  • each of the micro-LEDs 610 and 620 includes the micro-LED structure 4000 described in the fourth embodiment illustrated in FIG. 4A.
  • each of the micro-LEDs 610 and 620 may include any one of the micro-LED structures 4001 , 4002, and 4003 described in the first, second, and third variations of the fourth embodiment illustrated in FIGS. 4B, 4C, and 4D, respectively.
  • FIG. 17A is a cross-sectional view of a micro-LED chip 17000, according to a seventeenth embodiment of the present disclosure.
  • the micro-LED chip 17000 includes two micro-LEDs 610(5000) and 620(5000). Each one of the micro-LEDs 610(5000) and 620(5000) includes the micro-LED structure 5000 described in the fifth embodiment illustrated in FIG. 5A.
  • the micro-LED chip 17000 differs from the micro-LED chip 16000 in that a profile of the second type conductive layer 102 perpendicularly projected on the top surface 101 d of the first type conductive layer 101 is surrounded by the top edge 101 a of the first type conductive layer 101.
  • the edge 103a of the light emitting layer 103, the edge 107a of the top spacer 107, and the edge 108a of the bottom spacer 108 are aligned with the top edge 101 a of the first type conductive layer 101.
  • the micro-LED chip 17000 further includes the top isolation layer 114 surrounding the light emitting layer 103.
  • the microlens 111 is formed on the second type conductive layer 102 and on the top surface 114a of the isolation layer 114.
  • the other components of the micro-LED chip 17000 of the fourth embodiment illustrated in FIG. 17A are the same as the components of the micro-LED chip 16000 of the second embodiment illustrated in FIG. 16A, and therefore detailed descriptions of these components are not repeated.
  • FIG. 17B is a cross-sectional view of a micro-LED chip 17001 , according to a variation of the seventeenth embodiment of the present disclosure.
  • the embodiment illustrated in FIG. 17B differs from the embodiment illustrated in FIG. 17A in that that the micro-LED chip 17001 further includes the metal layer 113 formed on the top surface 114a of the isolation layer 114 and between adjacent micro-LEDs 610(5000) and 620(5000).
  • the metal layer 113 formed on the top surface 114a of the isolation layer 114 and between adjacent micro-LEDs 610(5000) and 620(5000).
  • micro-LED chip 17001 illustrated in FIG. 17B are the same as the components of the micro-LED chip 17000 illustrated in FIG. 17A, and therefore detailed descriptions of these components are not repeated.
  • each of the micro-LEDs 610 and 620 includes the micro-LED structure 5000 described in the fifth embodiment illustrated in FIG. 5A.
  • each of the micro-LEDs 610 and 620 may include any one of the micro-LED structures 5001 , 5002, and 5003 described in the first, second, and third variations of the fifth embodiment illustrated in FIGS. 5B, 5C, and 5D, respectively.
  • FIG. 18 is a cross-sectional view of a micro-LED structure 1 , according to a comparative example.
  • the micro-LED structure 1 in the comparative example illustrated in FIG. 18 differs from the micro-LED structure 1000 of the first embodiment illustrated in FIG. 1 A in that the light emitting layer 103 does not extend along the horizontal level away from the top edge 101 a of the first type conductive layer 101 and the bottom edge 102a of the second type conductive layer 102. Instead, in the comparative example, the edge 103a of the light emitting layer 103 is aligned with both of the top edge 101a of the first type conductive layer 101 and the bottom edge 102a of the second type conductive layer 102.
  • the light emitting layer 103 may include multiple pairs of quantum well layers.
  • the number of multi-quantum well (MQW) pairs in the light emitting layer 103 is related to exposed sidewall area of the light emitting layer 103 which is generated by, for example, inductively coupled plasma etching.
  • the sidewall of the light emitting layer 103 is aligned with the edges 101 a and 102a of the first type conductive layer 101 and the second type conductive layer 102.
  • large surface recombination carrier loss may occur in the micro-LED between the first type conductive layer 101 and the second type conductive layer 102, negatively impacting the light emission efficiency of the micro-LED.
  • the light emitting layer 103 extends away from the top edge 101a of the first type conductive layer 101 and the bottom edge 102a of the second type conductive layer 102, such that the edge 103a of the light emitting layer 103 does not contact the top edge 101a of the first type conductive layer 101 and the bottom edge 102a of the second type conductive layer 102.
  • surface recombination carrier loss may not occur in the micro-LED between the first type conductive layer 101 and the second type conductive layer 102. Consequently, light emission efficiency of the micro-LED will be improved.

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PCT/IB2021/062348 2020-12-28 2021-12-27 Micro-led structure and micro-led chip including same Ceased WO2022144752A1 (en)

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EP25172075.1A EP4577008A2 (en) 2020-12-28 2021-12-27 Micro-led structure and micro-led chip including same
EP21914832.7A EP4268288A4 (en) 2020-12-28 2021-12-27 MICRO-LED STRUCTURE AND MICRO-LED CHIP COMPRISING SAME
KR1020247039091A KR20240171172A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
KR1020247039331A KR20240171181A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
KR1020247039984A KR20240172264A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
CN202510626742.3A CN120475827A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
KR1020247039495A KR20240172253A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
KR1020247040483A KR20250002781A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
EP25172752.5A EP4577009A2 (en) 2020-12-28 2021-12-27 Micro-led structure and micro-led chip including same
KR1020247038944A KR20240172229A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
KR1020247039492A KR20240172252A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
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KR1020247039089A KR20240171170A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
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JP2023538870A JP2024501945A (ja) 2020-12-28 2021-12-27 マイクロｌｅｄ構造体及びそれを含むマイクロｌｅｄチップ
KR1020247040633A KR20250005490A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
KR1020247040635A KR20250005492A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
EP25172729.3A EP4572577A2 (en) 2020-12-28 2021-12-27 Micro-led structure and micro-led chip including same
KR1020247039493A KR20240171183A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
KR1020247038798A KR20240169728A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
KR1020247038598A KR20240169723A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
KR1020247038599A KR20240169724A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
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CN202510619036.6A CN120456682A (zh) 2020-12-28 2021-12-27 微发光二极管结构
EP25170480.5A EP4577003A2 (en) 2020-12-28 2021-12-27 Micro-led structure and micro-led chip including same
CN202510620369.0A CN120456683A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
KR1020247040634A KR20250005491A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
KR1020247040143A KR20250005455A (ko) 2020-12-28 2021-12-27 마이크로-led 구조 및 이를 포함하는 마이크로-led 칩
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CN202510629820.5A CN120835643A (zh) 2020-12-28 2021-12-27 微发光二极管芯片
EP25171345.9A EP4568454A2 (en) 2020-12-28 2021-12-27 Micro-led structure and micro-led chip including same
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EP25170716.2A EP4572576A2 (en) 2020-12-28 2021-12-27 Micro-led structure and micro-led chip including same
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