CN120513703A - 氧化物半导体膜、薄膜晶体管及电子设备 - Google Patents

氧化物半导体膜、薄膜晶体管及电子设备

Info

Publication number
CN120513703A
CN120513703A CN202380086602.0A CN202380086602A CN120513703A CN 120513703 A CN120513703 A CN 120513703A CN 202380086602 A CN202380086602 A CN 202380086602A CN 120513703 A CN120513703 A CN 120513703A
Authority
CN
China
Prior art keywords
oxide semiconductor
semiconductor film
film
peak
oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380086602.0A
Other languages
English (en)
Chinese (zh)
Inventor
渡壁创
津吹将志
佐佐木俊成
田丸尊也
望月真里奈
小野寺凉
渡部将弘
佐佐木大地
川岛绘美
霍间勇辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemitsu Kosan Co Ltd
Japan Display Inc
Original Assignee
Idemitsu Kosan Co Ltd
Japan Display Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Kosan Co Ltd, Japan Display Inc filed Critical Idemitsu Kosan Co Ltd
Publication of CN120513703A publication Critical patent/CN120513703A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6723Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device having light shields
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/875Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being semiconductor metal oxide, e.g. InGaZnO
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/691Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates 

Landscapes

  • Thin Film Transistor (AREA)
CN202380086602.0A 2023-01-19 2023-12-22 氧化物半导体膜、薄膜晶体管及电子设备 Pending CN120513703A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-006862 2023-01-19
JP2023006862 2023-01-19
PCT/JP2023/046219 WO2024154544A1 (ja) 2023-01-19 2023-12-22 酸化物半導体膜、薄膜トランジスタ、および電子機器

Publications (1)

Publication Number Publication Date
CN120513703A true CN120513703A (zh) 2025-08-19

Family

ID=91955834

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380086602.0A Pending CN120513703A (zh) 2023-01-19 2023-12-22 氧化物半导体膜、薄膜晶体管及电子设备

Country Status (7)

Country Link
US (1) US20260006848A1 (https=)
JP (1) JPWO2024154544A1 (https=)
KR (1) KR20250110870A (https=)
CN (1) CN120513703A (https=)
DE (1) DE112023004843T5 (https=)
TW (1) TW202445878A (https=)
WO (1) WO2024154544A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120091026A (ko) * 2009-09-30 2012-08-17 이데미쓰 고산 가부시키가이샤 In-Ga-Zn-O계 산화물 소결체
US8871565B2 (en) 2010-09-13 2014-10-28 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5189674B2 (ja) * 2010-12-28 2013-04-24 出光興産株式会社 酸化物半導体薄膜層を有する積層構造、積層構造の製造方法、薄膜トランジスタ及び表示装置
JP6143423B2 (ja) * 2012-04-16 2017-06-07 株式会社半導体エネルギー研究所 半導体装置の製造方法
EP2880690B1 (en) 2012-08-03 2019-02-27 Semiconductor Energy Laboratory Co. Ltd. Semiconductor device with oxide semiconductor stacked film
TWI761605B (zh) 2012-09-14 2022-04-21 日商半導體能源研究所股份有限公司 半導體裝置及其製造方法
KR102220279B1 (ko) 2012-10-19 2021-02-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체막을 포함하는 다층막 및 반도체 장치의 제작 방법
US9425217B2 (en) 2013-09-23 2016-08-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN109121438B (zh) 2016-02-12 2022-02-18 株式会社半导体能源研究所 半导体装置以及包括该半导体装置的显示装置
KR102492209B1 (ko) * 2016-05-19 2023-01-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 복합 산화물 반도체 및 트랜지스터
CN110718468B (zh) * 2019-09-26 2022-08-02 深圳大学 一种钐掺杂的金属氧化物薄膜晶体管及其制备方法和应用

Also Published As

Publication number Publication date
US20260006848A1 (en) 2026-01-01
KR20250110870A (ko) 2025-07-21
JPWO2024154544A1 (https=) 2024-07-25
DE112023004843T5 (de) 2025-09-11
TW202445878A (zh) 2024-11-16
WO2024154544A1 (ja) 2024-07-25

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