CN1199324C - 用于使显示屏通道与电路进行电连接的弹簧连接件 - Google Patents
用于使显示屏通道与电路进行电连接的弹簧连接件 Download PDFInfo
- Publication number
- CN1199324C CN1199324C CN01137613.9A CN01137613A CN1199324C CN 1199324 C CN1199324 C CN 1199324C CN 01137613 A CN01137613 A CN 01137613A CN 1199324 C CN1199324 C CN 1199324C
- Authority
- CN
- China
- Prior art keywords
- display screen
- plastic film
- circuit
- sheet metal
- spring fastenings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002985 plastic film Substances 0.000 claims abstract description 28
- 229920006255 plastic film Polymers 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 8
- 239000011888 foil Substances 0.000 abstract 3
- 239000011521 glass Substances 0.000 description 12
- 210000001364 upper extremity Anatomy 0.000 description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
- H01R4/48185—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar adapted for axial insertion of a wire end
- H01R4/4819—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar adapted for axial insertion of a wire end the spring shape allowing insertion of the conductor end when the spring is unbiased
- H01R4/4821—Single-blade spring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
- H01R4/484—Spring housing details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Liquid Crystal (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0012509A FR2814858B1 (fr) | 2000-10-02 | 2000-10-02 | Connecteur a ressort pour la connexion electrique de pistes d'un ecran d'affichage avec un circuit electrique |
FR0012509 | 2000-10-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1346165A CN1346165A (zh) | 2002-04-24 |
CN1199324C true CN1199324C (zh) | 2005-04-27 |
Family
ID=8854877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN01137613.9A Expired - Fee Related CN1199324C (zh) | 2000-10-02 | 2001-09-30 | 用于使显示屏通道与电路进行电连接的弹簧连接件 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6692263B2 (zh) |
EP (1) | EP1193802B1 (zh) |
JP (1) | JP2002182581A (zh) |
CN (1) | CN1199324C (zh) |
AT (1) | ATE352892T1 (zh) |
DE (1) | DE60126216T2 (zh) |
ES (1) | ES2281401T3 (zh) |
FR (1) | FR2814858B1 (zh) |
PT (1) | PT1193802E (zh) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3757923B2 (ja) * | 2002-09-20 | 2006-03-22 | セイコーエプソン株式会社 | 電子機器 |
US7244125B2 (en) * | 2003-12-08 | 2007-07-17 | Neoconix, Inc. | Connector for making electrical contact at semiconductor scales |
US20100167561A1 (en) * | 2003-04-11 | 2010-07-01 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
US20070020960A1 (en) * | 2003-04-11 | 2007-01-25 | Williams John D | Contact grid array system |
US7114961B2 (en) * | 2003-04-11 | 2006-10-03 | Neoconix, Inc. | Electrical connector on a flexible carrier |
US7628617B2 (en) * | 2003-06-11 | 2009-12-08 | Neoconix, Inc. | Structure and process for a contact grid array formed in a circuitized substrate |
US20050120553A1 (en) * | 2003-12-08 | 2005-06-09 | Brown Dirk D. | Method for forming MEMS grid array connector |
US7113408B2 (en) * | 2003-06-11 | 2006-09-26 | Neoconix, Inc. | Contact grid array formed on a printed circuit board |
US7597561B2 (en) * | 2003-04-11 | 2009-10-06 | Neoconix, Inc. | Method and system for batch forming spring elements in three dimensions |
US7056131B1 (en) * | 2003-04-11 | 2006-06-06 | Neoconix, Inc. | Contact grid array system |
US7758351B2 (en) * | 2003-04-11 | 2010-07-20 | Neoconix, Inc. | Method and system for batch manufacturing of spring elements |
US8584353B2 (en) * | 2003-04-11 | 2013-11-19 | Neoconix, Inc. | Method for fabricating a contact grid array |
US20050034890A1 (en) * | 2003-08-15 | 2005-02-17 | Ted Ju | Electronic conducting element |
TWM259337U (en) * | 2003-11-21 | 2005-03-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US20050227510A1 (en) * | 2004-04-09 | 2005-10-13 | Brown Dirk D | Small array contact with precision working range |
US7347698B2 (en) * | 2004-03-19 | 2008-03-25 | Neoconix, Inc. | Deep drawn electrical contacts and method for making |
US20050205988A1 (en) * | 2004-03-19 | 2005-09-22 | Epic Technology Inc. | Die package with higher useable die contact pad area |
US7025601B2 (en) * | 2004-03-19 | 2006-04-11 | Neoconix, Inc. | Interposer and method for making same |
WO2005091998A2 (en) * | 2004-03-19 | 2005-10-06 | Neoconix, Inc. | Electrical connector in a flexible host |
US7090503B2 (en) * | 2004-03-19 | 2006-08-15 | Neoconix, Inc. | Interposer with compliant pins |
US20060000642A1 (en) * | 2004-07-01 | 2006-01-05 | Epic Technology Inc. | Interposer with compliant pins |
US7354276B2 (en) * | 2004-07-20 | 2008-04-08 | Neoconix, Inc. | Interposer with compliant pins |
KR100608830B1 (ko) * | 2004-11-09 | 2006-08-09 | 엘지전자 주식회사 | 접지스프링핑거를 구비한 이동통신 단말기 |
SG122836A1 (en) * | 2004-11-29 | 2006-06-29 | Fci Asia Technology Pte Ltd | Compression connector |
US20070050738A1 (en) * | 2005-08-31 | 2007-03-01 | Dittmann Larry E | Customer designed interposer |
US7357644B2 (en) * | 2005-12-12 | 2008-04-15 | Neoconix, Inc. | Connector having staggered contact architecture for enhanced working range |
CN101547548B (zh) * | 2008-03-26 | 2012-10-17 | 深圳富泰宏精密工业有限公司 | 弹片结构及应用该弹片结构的电子装置 |
CN201199555Y (zh) * | 2008-04-28 | 2009-02-25 | 鸿富锦精密工业(深圳)有限公司 | 插针 |
IT1400227B1 (it) * | 2010-04-15 | 2013-05-24 | Astra Srl | Molla di contatto per contatto di sicurezza e contatto di sicurezza comprendente tale molla |
CN101841092B (zh) * | 2010-04-16 | 2013-08-07 | 中兴通讯股份有限公司 | 一种金属簧片 |
DE102011114936B4 (de) * | 2011-10-06 | 2018-01-04 | Wago Verwaltungsgesellschaft Mbh | Elektronikmodul und Kontaktelement hierzu |
US8641428B2 (en) | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
US9680273B2 (en) | 2013-03-15 | 2017-06-13 | Neoconix, Inc | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it |
JP6016244B2 (ja) * | 2013-06-11 | 2016-10-26 | 日本航空電子工業株式会社 | コネクタ |
CN106410517B (zh) * | 2015-07-29 | 2019-04-26 | 富士康(昆山)电脑接插件有限公司 | 电连接器及其组合 |
CN107135292A (zh) * | 2017-06-30 | 2017-09-05 | 努比亚技术有限公司 | 两段式可拆卸弹片及移动终端 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4245876A (en) * | 1976-02-06 | 1981-01-20 | Amp Incorporated | Laminated connector |
US4738625A (en) * | 1986-09-29 | 1988-04-19 | Bell Telephone Laboratories, Inc. | Electrical connectors for circuit panels |
JP2576592B2 (ja) * | 1988-05-20 | 1997-01-29 | 日本電装株式会社 | コネクタ |
US5259770A (en) * | 1992-03-19 | 1993-11-09 | Amp Incorporated | Impedance controlled elastomeric connector |
US5199882A (en) * | 1992-03-19 | 1993-04-06 | Amp Incorporated | Elastomeric wire to pad connector |
US5273439A (en) * | 1993-03-11 | 1993-12-28 | Storage Technology Corporation | Thermally conductive elastomeric interposer connection system |
US5436744A (en) * | 1993-09-03 | 1995-07-25 | Motorola Inc. | Flexible liquid crystal display with integrated driver circuit and display electrodes formed on opposite sides of folded substrate |
JP3643640B2 (ja) * | 1995-06-05 | 2005-04-27 | 株式会社東芝 | 表示装置及びこれに使用されるicチップ |
US5766023A (en) * | 1995-08-04 | 1998-06-16 | Framatome Connectors Usa Inc. | Electrical connector with high speed and high density contact strip |
US5938455A (en) * | 1996-05-15 | 1999-08-17 | Ford Motor Company | Three-dimensional molded circuit board having interlocking connections |
CN1186856C (zh) * | 1997-03-18 | 2005-01-26 | 罗姆股份有限公司 | 接插件 |
JP2001110488A (ja) * | 1999-08-04 | 2001-04-20 | Japan Aviation Electronics Industry Ltd | 基板間接続用コネクタ構造 |
-
2000
- 2000-10-02 FR FR0012509A patent/FR2814858B1/fr not_active Expired - Fee Related
-
2001
- 2001-09-19 DE DE60126216T patent/DE60126216T2/de not_active Expired - Lifetime
- 2001-09-19 AT AT01402403T patent/ATE352892T1/de not_active IP Right Cessation
- 2001-09-19 ES ES01402403T patent/ES2281401T3/es not_active Expired - Lifetime
- 2001-09-19 EP EP01402403A patent/EP1193802B1/fr not_active Expired - Lifetime
- 2001-09-19 PT PT01402403T patent/PT1193802E/pt unknown
- 2001-09-30 CN CN01137613.9A patent/CN1199324C/zh not_active Expired - Fee Related
- 2001-10-01 US US09/965,888 patent/US6692263B2/en not_active Expired - Fee Related
- 2001-10-01 JP JP2001305549A patent/JP2002182581A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
ES2281401T3 (es) | 2007-10-01 |
EP1193802B1 (fr) | 2007-01-24 |
FR2814858A1 (fr) | 2002-04-05 |
US20020039849A1 (en) | 2002-04-04 |
ATE352892T1 (de) | 2007-02-15 |
DE60126216D1 (de) | 2007-03-15 |
US6692263B2 (en) | 2004-02-17 |
DE60126216T2 (de) | 2007-11-08 |
PT1193802E (pt) | 2007-05-31 |
FR2814858B1 (fr) | 2002-12-20 |
JP2002182581A (ja) | 2002-06-26 |
EP1193802A1 (fr) | 2002-04-03 |
CN1346165A (zh) | 2002-04-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: T& A MOBILE PHONE LTD. Free format text: FORMER OWNER: ALCATEL CORP. Effective date: 20060428 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20060428 Address after: Hongkong, China Patentee after: T&A Mobile Phone Co.,Ltd. Address before: Paris France Patentee before: ALCATEL |
|
ASS | Succession or assignment of patent right |
Owner name: IPG ELECTRONIC 504 CO., LTD. Free format text: FORMER OWNER: TCT MOBILE CO., LTD. Effective date: 20091023 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: TCT MOBILE CO., LTD. Free format text: FORMER NAME: T+ A MOBILE PHONES CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Hongkong, China Patentee after: TCT mobile Ltd. Address before: Hongkong, China Patentee before: T&A Mobile Phone Co.,Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20091023 Address after: Channel Islands Patentee after: TCL & Alcatel Mobile Phones Ltd. Address before: Hongkong, China Patentee before: TCT mobile Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: DRNC HOLDINGS, INC. Free format text: FORMER OWNER: Z124 COMPANY Effective date: 20140605 Owner name: WEICHUANGLI INNOVATION DEVELOPMENT CO., LTD. Free format text: FORMER OWNER: IPG ELECTRONICS 504 LIMITED Effective date: 20140605 |
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C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: IMERJ LTD. Free format text: FORMER NAME: WEICHUANGLI INNOVATION DEVELOPMENT CO., LTD. Owner name: Z124 COMPANY Free format text: FORMER NAME: IMERJ LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Grand Cayman, Cayman Islands Patentee after: ImerJ Ltd. Address before: Grand Cayman, Cayman Islands Patentee before: Flextronics Innovation Development Co.,Ltd. Address after: Grand Cayman, Cayman Islands Patentee after: Z124 Co. Address before: Grand Cayman, Cayman Islands Patentee before: ImerJ Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20140605 Address after: Grand Cayman, Cayman Islands Patentee after: Flextronics Innovation Development Co.,Ltd. Address before: Channel Islands Patentee before: TCL & Alcatel Mobile Phones Ltd. Effective date of registration: 20140605 Address after: Delaware Patentee after: TAG-COMM Inc. Address before: Grand Cayman, Cayman Islands Patentee before: Z124 Co. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050427 Termination date: 20180930 |
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CF01 | Termination of patent right due to non-payment of annual fee |