CN1198288C - 片状正温度系数热敏电阻的制造方法 - Google Patents
片状正温度系数热敏电阻的制造方法 Download PDFInfo
- Publication number
- CN1198288C CN1198288C CN99801092.8A CN99801092A CN1198288C CN 1198288 C CN1198288 C CN 1198288C CN 99801092 A CN99801092 A CN 99801092A CN 1198288 C CN1198288 C CN 1198288C
- Authority
- CN
- China
- Prior art keywords
- thin slice
- forms
- electroplating
- manufacture method
- chip thermistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 133
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 86
- 238000009713 electroplating Methods 0.000 claims abstract description 87
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 78
- 239000002184 metal Substances 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 238000007747 plating Methods 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 25
- 238000000576 coating method Methods 0.000 claims description 45
- 239000011248 coating agent Substances 0.000 claims description 44
- 230000015572 biosynthetic process Effects 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 24
- 238000007493 shaping process Methods 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 10
- 239000002322 conducting polymer Substances 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract 2
- 230000008018 melting Effects 0.000 abstract 2
- 230000001681 protective effect Effects 0.000 abstract 2
- 239000011888 foil Substances 0.000 abstract 1
- 238000000059 patterning Methods 0.000 abstract 1
- 238000007781 pre-processing Methods 0.000 abstract 1
- 238000003856 thermoforming Methods 0.000 abstract 1
- 238000009740 moulding (composite fabrication) Methods 0.000 description 46
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 30
- 230000000694 effects Effects 0.000 description 15
- 229910052759 nickel Inorganic materials 0.000 description 15
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229920001903 high density polyethylene Polymers 0.000 description 8
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- 230000002950 deficient Effects 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 230000004087 circulation Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 235000014698 Brassica juncea var multisecta Nutrition 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000251184 Rajiformes Species 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
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- 239000011505 plaster Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49085—Thermally variable
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49099—Coating resistive material on a base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49787—Obtaining plural composite product pieces from preassembled workpieces
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
Claims (40)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP192543/1998 | 1998-07-08 | ||
JP19254398 | 1998-07-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1273674A CN1273674A (zh) | 2000-11-15 |
CN1198288C true CN1198288C (zh) | 2005-04-20 |
Family
ID=16293036
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN99801092.8A Expired - Lifetime CN1198288C (zh) | 1998-07-08 | 1999-07-07 | 片状正温度系数热敏电阻的制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6481094B1 (zh) |
EP (1) | EP1030316B1 (zh) |
CN (1) | CN1198288C (zh) |
DE (1) | DE69935963T2 (zh) |
TW (1) | TW445462B (zh) |
WO (1) | WO2000003402A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005259823A (ja) | 2004-03-09 | 2005-09-22 | Tdk Corp | 有機ptcサーミスタ及びその製造方法 |
FR2891958B1 (fr) * | 2005-10-11 | 2008-08-01 | Schneider Electric Ind Sas | Dispositif limiteur de courant, disjoncteur comportant un tel dispositif, et procede limiteur de courant |
US8716633B2 (en) * | 2009-10-13 | 2014-05-06 | Uniplatek Co., Ltd. | Method for manufacturing PTC device and system for preventing overheating of planar heaters using the same |
US9261407B2 (en) * | 2009-11-02 | 2016-02-16 | Eric M. Lawson | Thermometer for determining the temperature of an animal's ear drum and method of using the same |
CN102161245B (zh) * | 2010-02-16 | 2014-10-22 | (株)优暖福乐 | 正温度系数器件制造方法及平面发热体防过热系统 |
TWI411188B (zh) * | 2010-09-29 | 2013-10-01 | Polytronics Technology Corp | 過電流保護裝置 |
KR101422926B1 (ko) * | 2012-10-26 | 2014-07-23 | 삼성전기주식회사 | 적층 칩 전자부품 및 그 실장 기판 |
CN106098633B (zh) * | 2016-06-30 | 2019-05-21 | 广州兴森快捷电路科技有限公司 | 一种封装基板及其制作方法 |
CN106455296A (zh) * | 2016-10-17 | 2017-02-22 | 上海长园维安电子线路保护有限公司 | 电路保护组件 |
CN108922702A (zh) * | 2018-05-24 | 2018-11-30 | 江苏时瑞电子科技有限公司 | 一种氧化锌压敏电阻器的电极生产工艺 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4426633A (en) * | 1981-04-15 | 1984-01-17 | Raychem Corporation | Devices containing PTC conductive polymer compositions |
JPS6110203A (ja) * | 1984-06-25 | 1986-01-17 | 株式会社村田製作所 | 有機正特性サ−ミスタ |
US4766409A (en) * | 1985-11-25 | 1988-08-23 | Murata Manufacturing Co., Ltd. | Thermistor having a positive temperature coefficient of resistance |
USH415H (en) * | 1987-04-27 | 1988-01-05 | The United States Of America As Represented By The Secretary Of The Navy | Multilayer PTCR thermistor |
CA2002319C (en) * | 1988-11-07 | 1995-04-04 | Yasuaki Matsuda | Positive-temperature-coefficient heating device and process for fabricating the same |
AU637370B2 (en) * | 1989-05-18 | 1993-05-27 | Fujikura Ltd. | Ptc thermistor and manufacturing method for the same |
AU638476B2 (en) * | 1989-09-05 | 1993-07-01 | Honeywell Inc. | Apparatus for providing a universal interface to a process control system |
JP2833242B2 (ja) * | 1991-03-12 | 1998-12-09 | 株式会社村田製作所 | Ntcサーミスタ素子 |
JPH04346409A (ja) * | 1991-05-24 | 1992-12-02 | Rohm Co Ltd | 積層セラミックコンデンサ及びチップヒューズ |
US5166656A (en) * | 1992-02-28 | 1992-11-24 | Avx Corporation | Thin film surface mount fuses |
US5488348A (en) * | 1993-03-09 | 1996-01-30 | Murata Manufacturing Co., Ltd. | PTC thermistor |
AU692471B2 (en) * | 1993-09-15 | 1998-06-11 | Raychem Corporation | Electrical assembly comprising a ptc resistive element |
WO1995031816A1 (en) * | 1994-05-16 | 1995-11-23 | Raychem Corporation | Electrical devices comprising a ptc resistive element |
TW298653B (zh) * | 1995-02-28 | 1997-02-21 | Yunichica Kk | |
JPH09199302A (ja) * | 1996-01-23 | 1997-07-31 | Matsushita Electric Ind Co Ltd | チップ型ptcサーミスタおよびその製造方法 |
NZ334700A (en) * | 1996-08-20 | 1999-07-29 | Moore Business Forms Inc | Proofing system utilizing dynamic pdf technology for the interface for templated printing |
DE69734323T2 (de) * | 1996-12-26 | 2006-03-16 | Matsushita Electric Industrial Co., Ltd., Kadoma | Ptc thermistor und verfahren zur herstellung |
US5963416A (en) * | 1997-10-07 | 1999-10-05 | Taiyo Yuden Co., Ltd. | Electronic device with outer electrodes and a circuit module having the electronic device |
-
1999
- 1999-07-07 US US09/508,062 patent/US6481094B1/en not_active Expired - Lifetime
- 1999-07-07 TW TW088111545A patent/TW445462B/zh not_active IP Right Cessation
- 1999-07-07 EP EP99929725A patent/EP1030316B1/en not_active Expired - Lifetime
- 1999-07-07 DE DE69935963T patent/DE69935963T2/de not_active Expired - Lifetime
- 1999-07-07 CN CN99801092.8A patent/CN1198288C/zh not_active Expired - Lifetime
- 1999-07-07 WO PCT/JP1999/003660 patent/WO2000003402A1/ja active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
DE69935963D1 (de) | 2007-06-14 |
WO2000003402A1 (fr) | 2000-01-20 |
CN1273674A (zh) | 2000-11-15 |
DE69935963T2 (de) | 2007-09-06 |
TW445462B (en) | 2001-07-11 |
EP1030316A1 (en) | 2000-08-23 |
US6481094B1 (en) | 2002-11-19 |
EP1030316B1 (en) | 2007-05-02 |
EP1030316A4 (en) | 2004-12-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO., L Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. Effective date: 20150505 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: 201202 PUDONG NEW AREA, SHANGHAI |
|
TR01 | Transfer of patent right |
Effective date of registration: 20150505 Address after: Seven road 201202 Shanghai Pudong New Area Shiwan No. 1001 Patentee after: Shanghai Changyuan Wayon Circuit Protection Co., Ltd. Address before: Japan's Osaka kamato City Patentee before: Matsushita Electric Industrial Co., Ltd. |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20050420 |