CN119768918A - Ic桥、ic模块及ic模块的制造方法 - Google Patents

Ic桥、ic模块及ic模块的制造方法 Download PDF

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Publication number
CN119768918A
CN119768918A CN202280099550.6A CN202280099550A CN119768918A CN 119768918 A CN119768918 A CN 119768918A CN 202280099550 A CN202280099550 A CN 202280099550A CN 119768918 A CN119768918 A CN 119768918A
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CN
China
Prior art keywords
module
bridge
chip
wiring
resin layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280099550.6A
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English (en)
Chinese (zh)
Inventor
尾谷一彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ultramemory Inc
Original Assignee
Ultramemory Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ultramemory Inc filed Critical Ultramemory Inc
Publication of CN119768918A publication Critical patent/CN119768918A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

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  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202280099550.6A 2022-09-09 2022-09-09 Ic桥、ic模块及ic模块的制造方法 Pending CN119768918A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/033933 WO2024053103A1 (ja) 2022-09-09 2022-09-09 Ｉｃブリッジ、ｉｃモジュールおよびｉｃモジュールの製造方法

Publications (1)

Publication Number Publication Date
CN119768918A true CN119768918A (zh) 2025-04-04

Family

ID=90192211

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280099550.6A Pending CN119768918A (zh) 2022-09-09 2022-09-09 Ic桥、ic模块及ic模块的制造方法

Country Status (3)

Country Link
JP (1) JPWO2024053103A1 (https=)
CN (1) CN119768918A (https=)
WO (1) WO2024053103A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007287801A (ja) * 2006-04-13 2007-11-01 Sony Corp 電気・光混載三次元半導体モジュール及びハイブリット回路装置並びに携帯型電話機
JP2011044654A (ja) * 2009-08-24 2011-03-03 Shinko Electric Ind Co Ltd 半導体装置
US9236366B2 (en) * 2012-12-20 2016-01-12 Intel Corporation High density organic bridge device and method
US9542522B2 (en) * 2014-09-19 2017-01-10 Intel Corporation Interconnect routing configurations and associated techniques
JP6473595B2 (ja) * 2014-10-10 2019-02-20 イビデン株式会社 多層配線板及びその製造方法
US10833052B2 (en) * 2016-10-06 2020-11-10 Micron Technology, Inc. Microelectronic package utilizing embedded bridge through-silicon-via interconnect component and related methods
US10651126B2 (en) * 2017-12-08 2020-05-12 Applied Materials, Inc. Methods and apparatus for wafer-level die bridge
US10867978B2 (en) * 2018-12-11 2020-12-15 Advanced Micro Devices, Inc. Integrated circuit module with integrated discrete devices
US11296032B2 (en) * 2020-05-28 2022-04-05 Taiwan Semiconductor Manufacturing Company Limited Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same
US11482497B2 (en) * 2021-01-14 2022-10-25 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure including a first die and a second die and a bridge die and method of forming the package structure

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Publication number Publication date
WO2024053103A1 (ja) 2024-03-14
JPWO2024053103A1 (https=) 2024-03-14

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