JPWO2024053103A1 - - Google Patents
Info
- Publication number
- JPWO2024053103A1 JPWO2024053103A1 JP2024545411A JP2024545411A JPWO2024053103A1 JP WO2024053103 A1 JPWO2024053103 A1 JP WO2024053103A1 JP 2024545411 A JP2024545411 A JP 2024545411A JP 2024545411 A JP2024545411 A JP 2024545411A JP WO2024053103 A1 JPWO2024053103 A1 JP WO2024053103A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/033933 WO2024053103A1 (ja) | 2022-09-09 | 2022-09-09 | Ｉｃブリッジ、ｉｃモジュールおよびｉｃモジュールの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024053103A1 true JPWO2024053103A1 (https=) | 2024-03-14 |
Family
ID=90192211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024545411A Pending JPWO2024053103A1 (https=) | 2022-09-09 | 2022-09-09 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024053103A1 (https=) |
| CN (1) | CN119768918A (https=) |
| WO (1) | WO2024053103A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014140022A (ja) * | 2012-12-20 | 2014-07-31 | Intel Corp | 高密度有機ブリッジデバイスおよび方法 |
| JP2016063218A (ja) * | 2014-09-19 | 2016-04-25 | インテル コーポレイション | 相互接続ルーティング構成及び関連技術 |
| JP2016081961A (ja) * | 2014-10-10 | 2016-05-16 | イビデン株式会社 | 多層配線板及びその製造方法 |
| US20180102311A1 (en) * | 2016-10-06 | 2018-04-12 | Micron Technology, Inc. | Semiconductor package utilizing embedded bridge through-silicon-via interconnect component |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007287801A (ja) * | 2006-04-13 | 2007-11-01 | Sony Corp | 電気・光混載三次元半導体モジュール及びハイブリット回路装置並びに携帯型電話機 |
| JP2011044654A (ja) * | 2009-08-24 | 2011-03-03 | Shinko Electric Ind Co Ltd | 半導体装置 |
| US10651126B2 (en) * | 2017-12-08 | 2020-05-12 | Applied Materials, Inc. | Methods and apparatus for wafer-level die bridge |
| US10867978B2 (en) * | 2018-12-11 | 2020-12-15 | Advanced Micro Devices, Inc. | Integrated circuit module with integrated discrete devices |
| US11296032B2 (en) * | 2020-05-28 | 2022-04-05 | Taiwan Semiconductor Manufacturing Company Limited | Silicon interposer including through-silicon via structures with enhanced overlay tolerance and methods of forming the same |
| US11482497B2 (en) * | 2021-01-14 | 2022-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure including a first die and a second die and a bridge die and method of forming the package structure |
-
2022
- 2022-09-09 JP JP2024545411A patent/JPWO2024053103A1/ja active Pending
- 2022-09-09 WO PCT/JP2022/033933 patent/WO2024053103A1/ja not_active Ceased
- 2022-09-09 CN CN202280099550.6A patent/CN119768918A/zh active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014140022A (ja) * | 2012-12-20 | 2014-07-31 | Intel Corp | 高密度有機ブリッジデバイスおよび方法 |
| JP2016063218A (ja) * | 2014-09-19 | 2016-04-25 | インテル コーポレイション | 相互接続ルーティング構成及び関連技術 |
| JP2016081961A (ja) * | 2014-10-10 | 2016-05-16 | イビデン株式会社 | 多層配線板及びその製造方法 |
| US20180102311A1 (en) * | 2016-10-06 | 2018-04-12 | Micron Technology, Inc. | Semiconductor package utilizing embedded bridge through-silicon-via interconnect component |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024053103A1 (ja) | 2024-03-14 |
| CN119768918A (zh) | 2025-04-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250218 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20251202 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20260421 |