CN119234184A - 感光性树脂组合物、感光性树脂膜、多层印刷布线板及半导体封装、以及多层印刷布线板的制造方法 - Google Patents

感光性树脂组合物、感光性树脂膜、多层印刷布线板及半导体封装、以及多层印刷布线板的制造方法 Download PDF

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Publication number
CN119234184A
CN119234184A CN202380037457.7A CN202380037457A CN119234184A CN 119234184 A CN119234184 A CN 119234184A CN 202380037457 A CN202380037457 A CN 202380037457A CN 119234184 A CN119234184 A CN 119234184A
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CN
China
Prior art keywords
photosensitive resin
resin composition
component
composition according
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380037457.7A
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English (en)
Chinese (zh)
Inventor
今野忧子
片木秀行
山田薰平
野尻刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN119234184A publication Critical patent/CN119234184A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
CN202380037457.7A 2023-03-08 2023-03-08 感光性树脂组合物、感光性树脂膜、多层印刷布线板及半导体封装、以及多层印刷布线板的制造方法 Pending CN119234184A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/008746 WO2024185060A1 (ja) 2023-03-08 2023-03-08 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法

Publications (1)

Publication Number Publication Date
CN119234184A true CN119234184A (zh) 2024-12-31

Family

ID=92674326

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380037457.7A Pending CN119234184A (zh) 2023-03-08 2023-03-08 感光性树脂组合物、感光性树脂膜、多层印刷布线板及半导体封装、以及多层印刷布线板的制造方法

Country Status (4)

Country Link
JP (1) JPWO2024185060A1 (https=)
KR (1) KR20250151361A (https=)
CN (1) CN119234184A (https=)
WO (1) WO2024185060A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121343052A (zh) * 2025-12-19 2026-01-16 湖南初源新材料股份有限公司 一种碱可溶性树脂及其制备方法、感光干膜抗蚀剂

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0745194B2 (ja) * 1988-10-26 1995-05-17 松下電工株式会社 光硬化性樹脂および三次元形状の形成方法
JP3290296B2 (ja) 1994-05-13 2002-06-10 太陽インキ製造株式会社 多層プリント配線板及びその製造方法
JP5217069B2 (ja) * 2001-08-23 2013-06-19 東レ株式会社 感光性セラミックス組成物及びセラミックス基板
JP2008107511A (ja) * 2006-10-25 2008-05-08 Kaneka Corp 硬化性組成物
JP5441542B2 (ja) * 2009-07-22 2014-03-12 富士フイルム株式会社 ポジ型感光性樹脂組成物、硬化膜、層間絶縁膜、有機ｅｌ表示装置、及び液晶表示装置
JP2011048195A (ja) * 2009-08-27 2011-03-10 Asahi Glass Co Ltd 光学素子隔壁形成用感光性組成物、これを用いたブラックマトリックスおよびその製造方法、並びにカラーフィルタオンアレイの製造方法
JP2011075786A (ja) * 2009-09-30 2011-04-14 Sekisui Chem Co Ltd 感光性組成物
JP5539429B2 (ja) * 2012-03-19 2014-07-02 富士フイルム株式会社 着色感光性組成物、カラーフィルタ、カラーフィルタの製造方法、および液晶表示装置
CN105467752A (zh) * 2014-06-23 2016-04-06 太阳油墨（苏州）有限公司 用于制造印刷电路板的光固化性热固化性树脂组合物、干膜、固化物、及印刷电路板
JP7018168B2 (ja) 2015-12-22 2022-02-10 昭和電工マテリアルズ株式会社 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及びプリント配線板の製造方法
JP6701324B2 (ja) * 2016-04-06 2020-05-27 富士フイルム株式会社 組成物、膜、硬化膜、光学センサおよび膜の製造方法
WO2020241596A1 (ja) * 2019-05-31 2020-12-03 昭和電工マテリアルズ株式会社 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法
JP7354664B2 (ja) * 2019-08-14 2023-10-03 株式会社レゾナック 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法
JPWO2022265030A1 (https=) * 2021-06-18 2022-12-22

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121343052A (zh) * 2025-12-19 2026-01-16 湖南初源新材料股份有限公司 一种碱可溶性树脂及其制备方法、感光干膜抗蚀剂
CN121343052B (zh) * 2025-12-19 2026-03-20 湖南初源新材料股份有限公司 一种碱可溶性树脂及其制备方法、感光干膜抗蚀剂

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Publication number Publication date
KR20250151361A (ko) 2025-10-21
WO2024185060A1 (ja) 2024-09-12
JPWO2024185060A1 (https=) 2024-09-12

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