CN119136980A - 树脂膜、印刷线路板和半导体封装体 - Google Patents

树脂膜、印刷线路板和半导体封装体 Download PDF

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Publication number
CN119136980A
CN119136980A CN202380037547.6A CN202380037547A CN119136980A CN 119136980 A CN119136980 A CN 119136980A CN 202380037547 A CN202380037547 A CN 202380037547A CN 119136980 A CN119136980 A CN 119136980A
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resin
group
mass
resin film
resin composition
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Chinese (zh)
Inventor
池谷卓二
葛冈广喜
岛田颂太
小竹智彦
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Resonac Corp
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Resonac Corp
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
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    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
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    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
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    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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    • C09D153/00—Coating compositions based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
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    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
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    • H05K1/032—Organic insulating material consisting of one material
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    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
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    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
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    • H05K1/0313—Organic insulating material
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    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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  • Chemical & Material Sciences (AREA)
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  • Polymers & Plastics (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
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CN202380037547.6A 2022-12-28 2023-12-25 树脂膜、印刷线路板和半导体封装体 Pending CN119136980A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022212326 2022-12-28
JP2022-212326 2022-12-28
PCT/JP2023/046418 WO2024143273A1 (ja) 2022-12-28 2023-12-25 樹脂フィルム、プリント配線板及び半導体パッケージ

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CN119136980A true CN119136980A (zh) 2024-12-13

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CN202380037547.6A Pending CN119136980A (zh) 2022-12-28 2023-12-25 树脂膜、印刷线路板和半导体封装体

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US (1) US20250297110A1 (https=)
JP (1) JPWO2024143273A1 (https=)
KR (1) KR20250130789A (https=)
CN (1) CN119136980A (https=)
TW (1) TW202438311A (https=)
WO (1) WO2024143273A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6295708B2 (ja) * 2013-02-20 2018-03-20 日立化成株式会社 樹脂組成物、めっきプロセス用プライマー層、支持体付きめっきプロセス用プライマー層、硬化後めっきプロセス用プライマー層、配線板用積層板、配線板用積層板の製造方法、多層配線板、及び多層配線板の製造方法
JP6301173B2 (ja) * 2014-03-28 2018-03-28 新日鉄住金化学株式会社 硬化性樹脂組成物、その硬化物、複合材料
JP6570259B2 (ja) * 2015-02-11 2019-09-04 ナミックス株式会社 樹脂組成物、絶縁フィルム、および半導体装置
JP2018012747A (ja) 2016-07-19 2018-01-25 日立化成株式会社 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法
KR102601823B1 (ko) * 2017-12-28 2023-11-14 파나소닉 아이피 매니지먼트 가부시키가이샤 수지 조성물, 프리프레그, 수지 부착 필름, 수지 부착 금속박, 금속 클래드 적층판, 및 배선판
JP7020332B2 (ja) * 2018-07-26 2022-02-16 味の素株式会社 樹脂組成物
JP7555694B2 (ja) * 2019-02-08 2024-09-25 味の素株式会社 樹脂組成物
TWI853957B (zh) * 2019-07-12 2024-09-01 日商味之素股份有限公司 樹脂組成物
JP7354664B2 (ja) * 2019-08-14 2023-10-03 株式会社レゾナック 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法
JP2022076777A (ja) * 2020-11-10 2022-05-20 リンテック株式会社 硬化性樹脂組成物、金属張積層板およびその製造方法
JP7774963B2 (ja) * 2021-01-14 2025-11-25 味の素株式会社 樹脂組成物
JP7666047B2 (ja) * 2021-03-22 2025-04-22 味の素株式会社 樹脂シート

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WO2024143273A1 (ja) 2024-07-04
KR20250130789A (ko) 2025-09-02
US20250297110A1 (en) 2025-09-25

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