CN119054085A - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
- Publication number
- CN119054085A CN119054085A CN202380034667.0A CN202380034667A CN119054085A CN 119054085 A CN119054085 A CN 119054085A CN 202380034667 A CN202380034667 A CN 202380034667A CN 119054085 A CN119054085 A CN 119054085A
- Authority
- CN
- China
- Prior art keywords
- trench
- floating
- groove
- protection
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
- H10D30/66—Vertical DMOS [VDMOS] FETs
- H10D30/665—Vertical DMOS [VDMOS] FETs having edge termination structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/112—Constructional design considerations for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layers, e.g. by using channel stoppers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
- H10D62/126—Top-view geometrical layouts of the regions or the junctions
- H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
- H10D64/117—Recessed field plates, e.g. trench field plates or buried field plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/252—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
- H10D64/2527—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices for vertical devices wherein the source or drain electrodes are recessed in semiconductor bodies
Landscapes
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-070179 | 2022-04-21 | ||
| JP2022070179 | 2022-04-21 | ||
| PCT/JP2023/008033 WO2023203894A1 (ja) | 2022-04-21 | 2023-03-03 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119054085A true CN119054085A (zh) | 2024-11-29 |
Family
ID=88419774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380034667.0A Pending CN119054085A (zh) | 2022-04-21 | 2023-03-03 | 半导体装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250040223A1 (https=) |
| JP (1) | JPWO2023203894A1 (https=) |
| CN (1) | CN119054085A (https=) |
| WO (1) | WO2023203894A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025173150A1 (ja) * | 2024-02-15 | 2025-08-21 | 三菱電機株式会社 | 半導体装置及び半導体装置の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5422930B2 (ja) * | 2008-06-30 | 2014-02-19 | 株式会社デンソー | 半導体装置 |
| US8519477B2 (en) * | 2009-11-20 | 2013-08-27 | Force Mos Technology Co., Ltd. | Trench MOSFET with trenched floating gates and trenched channel stop gates in termination |
| JP2019117867A (ja) * | 2017-12-27 | 2019-07-18 | 株式会社東芝 | 半導体装置 |
| JP7223543B2 (ja) * | 2018-10-05 | 2023-02-16 | ローム株式会社 | 半導体装置 |
| US11004969B2 (en) * | 2019-10-07 | 2021-05-11 | Nami MOS CO., LTD. | Trench MOSFETs having dummy cells for avalanche capability improvement |
-
2023
- 2023-03-03 CN CN202380034667.0A patent/CN119054085A/zh active Pending
- 2023-03-03 WO PCT/JP2023/008033 patent/WO2023203894A1/ja not_active Ceased
- 2023-03-03 JP JP2024516119A patent/JPWO2023203894A1/ja active Pending
-
2024
- 2024-10-17 US US18/918,253 patent/US20250040223A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2023203894A1 (https=) | 2023-10-26 |
| WO2023203894A1 (ja) | 2023-10-26 |
| US20250040223A1 (en) | 2025-01-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |