WO2023203894A1 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
WO2023203894A1
WO2023203894A1 PCT/JP2023/008033 JP2023008033W WO2023203894A1 WO 2023203894 A1 WO2023203894 A1 WO 2023203894A1 JP 2023008033 W JP2023008033 W JP 2023008033W WO 2023203894 A1 WO2023203894 A1 WO 2023203894A1
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WO
WIPO (PCT)
Prior art keywords
trench
floating
gate
gate trench
outer peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/008033
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English (en)
French (fr)
Japanese (ja)
Inventor
匡胤 油谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
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Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP2024516119A priority Critical patent/JPWO2023203894A1/ja
Priority to CN202380034667.0A priority patent/CN119054085A/zh
Publication of WO2023203894A1 publication Critical patent/WO2023203894A1/ja
Priority to US18/918,253 priority patent/US20250040223A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66—Vertical DMOS [VDMOS] FETs
    • H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66—Vertical DMOS [VDMOS] FETs
    • H10D30/665—Vertical DMOS [VDMOS] FETs having edge termination structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/112—Constructional design considerations for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layers, e.g. by using channel stoppers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126—Top-view geometrical layouts of the regions or the junctions
    • H10D62/127—Top-view geometrical layouts of the regions or the junctions of cellular field-effect devices, e.g. multicellular DMOS transistors or IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/111—Field plates
    • H10D64/117—Recessed field plates, e.g. trench field plates or buried field plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251—Source or drain electrodes for field-effect devices
    • H10D64/252—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
    • H10D64/2527—Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices for vertical devices wherein the source or drain electrodes are recessed in semiconductor bodies

Definitions

  • the present disclosure relates to a semiconductor device.
  • Patent Document 1 discloses a semiconductor device having a trench gate type MOSFET (Metal-Oxide-Semiconductor Field-Effect-Transistor) as a basic structure.
  • the semiconductor device includes an active region set in a region covered with a source electrode, a gate trench formed in the active region, and a polysilicon gate embedded in the gate trench.
  • MOSFET Metal-Oxide-Semiconductor Field-Effect-Transistor
  • a semiconductor device includes a semiconductor layer, a gate trench formed in the semiconductor layer, an insulating layer formed on the semiconductor layer, and a semiconductor device embedded in the gate trench via the insulating layer.
  • a gate electrode formed on the insulating layer and a gate wiring electrically connected to the gate electrode, the semiconductor layer including an outer peripheral region including an outer edge of the semiconductor layer in a plan view
  • the gate trench includes a first outer circumferential gate trench portion provided in the outer circumferential region and a second outer circumferential gate trench portion provided outward from the first outer circumferential gate trench portion, and Among them, a first floating trench formed in a region between the first outer circumferential gate trench part and the second outer circumferential gate trench part, and a first floating trench embedded in the first floating trench via the insulating layer and electrically A floating electrode in a floating state.
  • a semiconductor device includes a semiconductor layer, a gate trench formed in the semiconductor layer, an insulating layer formed on the semiconductor layer, and a semiconductor device embedded in the gate trench via the insulating layer.
  • a gate electrode formed on the insulating layer and electrically connected to the gate electrode; a plurality of protective trenches formed in the semiconductor layer; a protective electrode embedded in the semiconductor layer, the semiconductor layer includes an outer edge of the semiconductor layer in plan view and includes an outer peripheral region in which the protective trench is arranged, and the gate trench is arranged in the outer peripheral region.
  • a first floating trench and a second floating trench formed in a region of the semiconductor layer between the outer gate trench and the protective trench; a trench; a first floating electrode embedded in the first floating trench via the insulating layer and electrically floating; a first floating electrode embedded in the second floating trench via the insulating layer and electrically floating; a second floating electrode in a floating state, and the first floating trench is disposed closer to the second floating trench than the outer peripheral gate trench portion.
  • the occurrence of the walk-in phenomenon can be suppressed.
  • FIG. 1 is a schematic plan view of an exemplary semiconductor device according to the first embodiment.
  • FIG. 2 is a schematic plan view for explaining a metal layer of the semiconductor device shown in FIG.
  • FIG. 3 is a schematic plan view for explaining the structure formed in the semiconductor layer of the semiconductor device shown in FIG.
  • FIG. 4 is a partially enlarged view of the area indicated by F4 in FIG.
  • FIG. 5 is a schematic cross-sectional view of the semiconductor device taken along line F5-F5 in FIG.
  • FIG. 6 is a schematic cross-sectional view of the semiconductor device taken along line F6-F6 in FIG.
  • FIG. 7 is a partially enlarged view of the area indicated by F7 in FIG.
  • FIG. 8 is a partially enlarged view of the range indicated by F8 in FIG.
  • FIG. 1 is a schematic plan view of an exemplary semiconductor device according to the first embodiment.
  • FIG. 2 is a schematic plan view for explaining a metal layer of the semiconductor device shown in FIG.
  • FIG. 3 is a
  • FIG. 9 is a graph showing the relationship between the distance between the second floating trench and the protective trench and the drain-source breakdown voltage.
  • FIG. 10 is a graph showing the relationship between the distance between the first outer gate trench portion and the first floating trench and the drain-source breakdown voltage.
  • FIG. 11 is a graph showing the relationship between the distance between the second outer gate trench portion and the first floating trench and the drain-source breakdown voltage.
  • FIG. 12 is a partial enlarged view of a schematic planar structure formed in a semiconductor layer of a semiconductor device of a comparative example.
  • FIG. 13 is a graph showing the IV characteristics of a semiconductor device of a comparative example.
  • FIG. 14 is a graph showing the IV characteristics of the semiconductor device of the first embodiment.
  • FIG. 12 is a partial enlarged view of a schematic planar structure formed in a semiconductor layer of a semiconductor device of a comparative example.
  • FIG. 13 is a graph showing the IV characteristics of a semiconductor device of a comparative example.
  • FIG. 14 is a
  • FIG. 15 is a partial enlarged view of a schematic planar structure formed in a semiconductor layer of a semiconductor device according to a second embodiment.
  • FIG. 16 is a schematic cross-sectional view of the semiconductor device taken along line F16-F16 in FIG. 15.
  • FIG. 17 is a partially enlarged view of the range indicated by F17 in FIG. 16.
  • FIG. 18 is a graph showing the relationship between the distance between the first floating trench and the second floating trench and the drain-source breakdown voltage.
  • FIG. 19 is a graph showing the relationship between the distance between the outer peripheral gate trench portion and the first floating trench and the drain-source breakdown voltage.
  • FIG. 20 is a graph showing the IV characteristics of the semiconductor device of the second embodiment.
  • FIGS. 1 to 3 are schematic plan views of a semiconductor device 10 according to the first embodiment. 2 and 3, some components of the semiconductor device 10 of FIG. 1 are transparently shown. More specifically, FIG. 2 is a schematic plan view of the semiconductor device 10 in which a passivation layer 12, which will be described later from FIG. 1, is transparently shown. FIG. 3 is a schematic plan view of the semiconductor device 10 in which the metal layer 18 (source wiring 20, gate wiring 22, and outer peripheral electrode 24), which will be described later from FIG. 2, is transparently shown. Note that, in order to facilitate understanding, the metal layer 18 is shown by a broken line in FIG. Furthermore, in FIGS. 1 to 3, a first floating trench 52A and a second floating trench 52B, which will be described later, are omitted to facilitate understanding of the drawings.
  • planar view refers to viewing the semiconductor device 10 in the Z-axis direction of the mutually orthogonal XYZ axes shown in FIG. Unless explicitly stated otherwise, “planar view” refers to viewing the semiconductor device 10 from above along the Z-axis.
  • the semiconductor device 10 may have a rectangular shape in plan view.
  • the semiconductor device 10 can have a rectangular parallelepiped shape, for example.
  • the semiconductor device 10 may be formed into a flat plate shape with the Z-axis direction being the thickness direction.
  • Semiconductor device 10 may include passivation layer 12 .
  • Passivation layer 12 may be comprised of any material capable of protecting underlying structures.
  • the passivation layer 12 may be formed of a silicon nitride film (SiN).
  • Passivation layer 12 may include pad openings 14,16. Note that the constituent material of the passivation layer 12 can be changed arbitrarily.
  • the passivation layer 12 may be formed of a silicon oxide film (SiO 2 ).
  • the passivation layer 12 may be configured with a laminated structure of a SiN film and a SiO 2 film.
  • the semiconductor device 10 can further include a metal layer 18.
  • Passivation layer 12 at least partially covers metal layer 18 .
  • the metal layer 18 is formed of at least one of titanium (Ti), nickel (Ni), gold (Au), silver (Ag), copper (Cu), aluminum (Al), Cu alloy, and Al alloy. be able to.
  • metal layer 18 may be formed of an AlCu alloy.
  • the metal layer 18 can include a source wiring 20, a gate wiring 22, and an outer peripheral electrode 24.
  • the source wiring 20, the gate wiring 22, and the outer peripheral electrode 24 are spaced apart from each other.
  • the gate wiring 22 is separated from the source wiring 20 and surrounds the source wiring 20.
  • the outer peripheral electrode 24 is spaced apart from the gate wiring 22 and surrounds the gate wiring 22. Further details of the source wiring 20, gate wiring 22, and outer peripheral electrode 24 will be described later with reference to FIG. 2.
  • the pad opening 14 can at least partially expose the source wiring 20. Furthermore, the pad opening 16 can at least partially expose the gate wiring 22. Pad openings 14 and 16 may be provided to enable external connections to source wiring 20 and gate wiring 22, respectively. On the other hand, the outer peripheral electrode 24 may be completely covered with the passivation layer 12.
  • the configuration (eg, position, shape, size, number, etc.) of the pad openings 14 and 16 can be determined as appropriate depending on, for example, the design and usage of the semiconductor device 10, and is not limited to the example shown in FIG. 1.
  • the semiconductor device 10 can include a semiconductor layer 26.
  • Metal layer 18 is formed on semiconductor layer 26.
  • the semiconductor layer 26 includes a first surface 26A and a second surface 26B opposite to the first surface 26A (see FIG. 5).
  • the Z-axis direction shown in FIG. 2 corresponds to a direction perpendicular to the first surface 26A and the second surface 26B of the semiconductor layer 26.
  • the semiconductor layer 26 can be formed of at least one of silicon (Si), silicon carbide (SiC), and gallium nitride (GaN).
  • the semiconductor layer 26 may be made of Si, for example.
  • the second surface 26B of the semiconductor layer 26 includes two sides 26X1 and 26X2 extending along the X-axis direction and two sides 26Y1 and 26Y2 extending along the Y-axis direction.
  • the outer edge of the semiconductor layer 26 can include four sides 26X1, 26X2, 26Y1, and 26Y2 in plan view.
  • the area defined by the four sides 26X1, 26X2, 26Y1, and 26Y2 of the semiconductor layer 26 may correspond to one chip (die).
  • the semiconductor layer 26 can include an outer peripheral region 28 and an active region 30 surrounded by the outer peripheral region 28 in plan view.
  • the boundary between the outer peripheral region 28 and the active region 30 is indicated by a chain double-dashed line in FIG.
  • the active region 30 is a region that contributes to the operation of the semiconductor device 10 as a transistor.
  • the outer peripheral region 28 is a region that does not contribute to the operation of the semiconductor device 10 as a transistor.
  • the outer peripheral region 28 can include four sides 26X1, 26X2, 26Y1, and 26Y2 that are the outer edges of the semiconductor layer 26.
  • the outer peripheral region 28 may have a rectangular frame shape surrounding the active region 30 in plan view. Further details of the semiconductor layer 26 will be described later with reference to FIG.
  • the source wiring 20 can include the recess 20A by having a substantially rectangular cutout in plan view.
  • the recess 20A can be formed at the end of the source wiring 20 close to any of the four sides 26X1, 26X2, 26Y1, and 26Y2 of the semiconductor layer 26.
  • the recess 20A can be formed at the center of the source wiring 20 in the X-axis direction close to the side 26X2 of the semiconductor layer 26.
  • the recess 20A can be opened toward the side 26X2.
  • the gate wiring 22 can include a gate finger part 32 and a gate pad part 34.
  • Gate finger portion 32 may be located in outer peripheral region 28 .
  • the gate finger portion 32 can at least partially surround the source wiring 20 by extending along at least a portion of the four sides 26X1, 26X2, 26Y1, and 26Y2 of the semiconductor layer 26.
  • the gate pad portion 34 can be arranged in the outer peripheral region 28.
  • the gate pad portion 34 can be at least partially disposed within the recess 20A of the source wiring 20.
  • the gate pad section 34 may be integrally connected to the gate finger section 32. In the example of FIG. 2, the gate pad portion 34 can be arranged to connect two portions of the gate finger portion 32 extending along the side 26X2 in plan view.
  • the outer peripheral electrode 24 may have a closed annular shape in plan view.
  • the outer peripheral electrode 24 can extend along the four sides 26X1, 26X2, 26Y1, and 26Y2 of the semiconductor layer 26.
  • the outer peripheral electrode 24 may be spaced apart from the four sides 26X1, 26X2, 26Y1, and 26Y2 of the semiconductor layer 26.
  • FIG. 3 schematically shows some components formed in the semiconductor layer 26.
  • the semiconductor device 10 may further include a gate trench 36 formed in the semiconductor layer 26.
  • Gate trench 36 is formed in both outer peripheral region 28 and active region 30 of semiconductor layer 26 .
  • the gate trench 36 communicates an outer gate trench section 38 disposed in the outer circumferential region 28, an inner gate trench section 40 disposed in the active region 30 (see FIG. 4), and the outer gate trench section 38 with the inner gate trench section 40.
  • a connection gate trench portion 42 may be included.
  • the active region 30 may be formed at a position overlapping the source wiring 20 in plan view.
  • the active region 30 can have a similar shape in plan view to the source wiring 20 including the recess 20A.
  • the active region 30 may be one size smaller than the source wiring 20 including the recess 20A in plan view.
  • the active region 30 is covered by the source wiring 20 but not by the gate pad section 34.
  • Inner gate trench portion 40 may be located in active region 30 . Therefore, the inner gate trench portion 40 can be placed at a position overlapping the source wiring 20 in plan view.
  • the connection gate trench portion 42 connected to the inner gate trench portion 40 can be placed at a position that partially overlaps the source wiring 20 in plan view.
  • the outer peripheral region 28 can have a similar shape to the gate finger section 32 and the gate pad section 34 in plan view.
  • the outer peripheral region 28 can include a region that enters the recess 20A of the source wiring 20 in a plan view.
  • the outer peripheral region 28 is covered with a gate finger section 32 and a gate pad section 34.
  • the outer peripheral gate trench portion 38 disposed in the outer peripheral region 28 can have a shape that surrounds the source wiring 20.
  • the outer peripheral gate trench portion 38 can have a similar shape in plan view to the source wiring 20 including the recess 20A in the outer peripheral region 28.
  • the outer peripheral gate trench portion 38 may be one size larger than the source wiring 20 including the recessed portion 20A in plan view. In this way, the outer peripheral gate trench portion 38 can be formed into a closed annular shape having a recess along the recess 20A in plan view.
  • the outer peripheral gate trench portion 38 is arranged at a position that does not overlap with both the gate finger portion 32 and the gate pad portion 34 in plan view. Further, the outer peripheral gate trench portion 38 is arranged at a position that does not overlap with the source wiring 20 in plan view. That is, the outer peripheral gate trench section 38 is arranged between the source wiring 20, the gate finger section 32, and the gate pad section 34 in plan view.
  • the semiconductor device 10 may further include a protective trench 44 formed in the semiconductor layer 26.
  • the protective trench 44 can be arranged to surround the outer gate trench portion 38 .
  • the protection trench 44 can have a similar shape to the outer gate trench portion 38 in plan view. It can also be said that the outer peripheral gate trench portion 38 is surrounded by the protective trench 44 in a plan view.
  • the semiconductor device 10 may include a plurality of protection trenches 44.
  • FIG. 4 is a partially enlarged view of FIG. 3, in which a portion F4 surrounded by a dashed line in FIG. 3 is enlarged.
  • the source wiring 20, gate wiring 22 (gate finger portion 32), and outer peripheral electrode 24 are hatched with dots in FIG.
  • the inner gate trench portion 40 arranged in the active region 30 may be formed in a lattice shape.
  • the semiconductor device 10 can further include a source contact section 46 connected to the source wiring 20.
  • the source contact portions 46 may be arranged in a plurality of rectangular regions of the semiconductor layer 26 surrounded by the inner gate trench portions 40 .
  • the inner gate trench portion 40 may be formed in a stripe shape, for example.
  • the outer circumferential gate trench portion 38 disposed in the outer circumferential region 28 includes a first outer circumferential gate trench portion 38A and a second outer circumferential gate trench portion 38B provided outward from the first outer circumferential gate trench portion 38A. I can do it.
  • the second outer circumferential gate trench portion 38B is provided on the opposite side of the active region 30 with respect to the first outer circumferential gate trench portion 38A.
  • the second outer circumferential gate trench portion 38B is provided at a position farther from the active region 30 than the first outer circumferential gate trench portion 38A.
  • first outer circumferential gate trench portion 38A is provided closer to the active region 30 than the second outer circumferential gate trench portion 38B.
  • the first outer circumferential gate trench portion 38A and the second outer circumferential gate trench portion 38B may have similar shapes to each other in plan view.
  • Each outer circumferential gate trench portion 38A, 38B may have a larger width than the inner gate trench portion 40.
  • the width of the first outer circumferential gate trench portion 38A refers to a dimension in a direction perpendicular to the direction in which the first outer circumferential gate trench portion 38A extends in plan view.
  • the width of the first outer circumferential gate trench portion 38A can also be referred to as the length of the first outer circumferential gate trench portion 38A in the lateral direction in a plan view.
  • the first outer peripheral gate trench portion 38A shown in FIG. 4 extends in the Y-axis direction, and therefore has a width in the X-axis direction.
  • the width of the second outer circumferential gate trench portion 38B refers to the dimension in the direction perpendicular to the direction in which the second outer circumferential gate trench portion 38B extends in plan view.
  • the width of the second outer circumferential gate trench portion 38B can also be referred to as the length of the second outer circumferential gate trench portion 38B in the lateral direction in a plan view.
  • the second outer peripheral gate trench portion 38B shown in FIG. 4 extends in the Y-axis direction, and therefore has a width in the X-axis direction.
  • the width of the inner gate trench portion 40 refers to a dimension in a direction perpendicular to the direction in which the inner gate trench portion 40 extends in plan view. In other words, the width of the inner gate trench portion 40 can also be referred to as the length of the inner gate trench portion 40 in the lateral direction in a plan view.
  • the semiconductor device 10 can further include a gate contact section 48 connected to the gate wiring 22 (gate finger section 32).
  • the gate contact portion 48 can be arranged in a region overlapping each of the outer peripheral gate trench portions 38A and 38B in plan view.
  • the semiconductor device 10 may include a plurality of gate contact sections 48.
  • connection gate trench portion 42 that communicates the first outer gate trench portion 38A with the inner gate trench portion 40 is provided closer to the active region 30 than the first outer gate trench portion 38A.
  • the connection gate trench portion 42 is connected to the first outer peripheral gate trench portion 38A.
  • the connection gate trench portion 42 is not connected to the second outer peripheral gate trench portion 38B.
  • the connection gate trench portion 42 is arranged across both the outer peripheral region 28 and the active region 30.
  • the connection gate trench portion 42 can extend in a direction (X-axis direction in FIG. 4) that intersects the direction in which the first outer peripheral gate trench portion 38A extends (Y-axis direction in FIG. 4).
  • a plurality of connection gate trench portions 42 may be provided so as to be arranged in a stripe shape.
  • a plurality of (16 in the example of FIG. 4) protection trenches 44 surrounding each of the outer peripheral gate trench portions 38A and 38B are arranged in the outer peripheral region 28.
  • Semiconductor device 10 may include one or more protection trenches 44 .
  • the number of protective trenches 44 can be appropriately set depending on the desired performance and layout of the semiconductor device 10.
  • the plurality of protection trenches 44 are arranged at equal pitches. Note that the arrangement of the plurality of protection trenches 44 can be arbitrarily changed. In one example, at least some of the plurality of protection trenches 44 may be arranged at different pitches.
  • some of the protection trenches 44 may be arranged at positions overlapping with the gate finger portions 32 in plan view.
  • all of the plurality of protection trenches 44 may be arranged at positions overlapping with the gate finger portions 32 in plan view.
  • the semiconductor device 10 can further include a peripheral contact portion 50 connected to the peripheral electrode 24.
  • the outer periphery contact portion 50 can be formed into a closed annular shape.
  • the annular outer peripheral contact portion 50 can surround the protective trench 44 in a plan view.
  • the semiconductor device 10 may include a plurality of outer peripheral contact portions 50.
  • each contact portion 46, 48, 50 can be formed from at least one of tungsten (W), Ti, and titanium nitride (TiN).
  • the semiconductor device 10 can include a first floating trench 52A and a second floating trench 52B arranged between the connection gate trench section 42 and the protection trench 44. Further details of each floating trench 52A, 52B are discussed below with reference to FIGS. 4-6 and 8.
  • FIG. 5 is a schematic cross-sectional view of the semiconductor device 10 taken along line F5-F5 in FIG.
  • the semiconductor layer 26 can include a semiconductor substrate 54 including a first surface 26A of the semiconductor layer 26, and an epitaxial layer 56 formed on the semiconductor substrate 54 and including a second surface 26B of the semiconductor layer 26.
  • the semiconductor substrate 54 may be a Si substrate.
  • the semiconductor substrate 54 can correspond to the drain region of the MISFET.
  • the drain region (semiconductor substrate 54) may be a p + type region containing p type impurities.
  • the impurity concentration of the semiconductor substrate 54 can be set to 1 ⁇ 10 18 cm ⁇ 3 or more and 1 ⁇ 10 20 cm ⁇ 3 or less.
  • the semiconductor substrate 54 may have a thickness of 50 ⁇ m or more and 450 ⁇ m or less.
  • the epitaxial layer 56 may be a Si layer epitaxially grown on a Si substrate. Further details of epitaxial layer 56 are discussed below with reference to FIGS. 7 and 8.
  • the semiconductor device 10 can further include a drain electrode 58 formed on the first surface 26A of the semiconductor layer 26.
  • Drain electrode 58 is electrically connected to the drain region (semiconductor substrate 54).
  • Drain electrode 58 can be formed of at least one of Ti, Ni, Au, Ag, Cu, Al, Cu alloy, and Al alloy.
  • the semiconductor device 10 can further include an insulating layer 60 formed on the semiconductor layer 26.
  • the insulating layer 60 can be formed of SiO 2 in one example.
  • Insulating layer 60 may additionally or alternatively include a film formed of an insulating material other than SiO2 , such as SiN.
  • the insulating layer 60 may have a laminated structure of a SiN film and a SiO 2 film.
  • the insulating layer 60 is in contact with the second surface 26B of the semiconductor layer 26.
  • the source wiring 20, the gate wiring 22, and the outer peripheral electrode 24 are formed on the insulating layer 60.
  • the passivation layer 12 at least partially covers the source wiring 20, the gate wiring 22, and the outer peripheral electrode 24 formed on the insulating layer 60. Portions of the insulating layer 60 that are not covered by the source wiring 20, the gate wiring 22, and the outer peripheral electrode 24 may also be covered by the passivation layer 12.
  • the gate trench 36 has an opening in the second surface 26B of the semiconductor layer 26 and has a depth in the Z-axis direction.
  • the protective trench 44 also has an opening in the second surface 26B of the semiconductor layer 26 and has a depth in the Z-axis direction.
  • gate trench 36 and protection trench 44 are shown as having approximately the same depth, but in other examples, gate trench 36 and protection trench 44 may have different depths.
  • the protective trench 44 may be formed deeper within the semiconductor layer 26 than the gate trench 36.
  • the protective trench 44 may be formed in the semiconductor layer 26 to be shallower than the gate trench 36.
  • each outer gate trench section 38A, 38B and inner gate trench section 40 may have different depths.
  • each outer peripheral gate trench portion 38A, 38B may be formed deeper than the inner gate trench portion 40.
  • connection gate trench portion 42 In FIG. 5, a cross section of one connection gate trench portion 42 along the longitudinal direction is shown.
  • the two ends of the connection gate trench section 42 communicate with the first outer gate trench section 38A and the inner gate trench section 40, respectively.
  • the first outer gate trench section 38A, the inner gate trench section 40, and the connection gate trench section 42 communicate with each other, and the second outer gate trench section is spaced outwardly from the first outer gate trench section 38A.
  • the gate trench 36 can be configured by the portion 38B.
  • a gate electrode 62 which will be described later with reference to FIGS. 7 and 8, is embedded in each of the outer gate trench portions 38A and 38B, the inner gate trench portion 40, and the connection gate trench portion 42 via an insulating layer 60. Since the first outer gate trench section 38A, the inner gate trench section 40, and the connection gate trench section 42 are in communication with each other, the integrally configured gate electrode 62 can be connected to the first outer gate trench section 38A and the inner gate trench section. It can be embedded across the portion 40 and the connection gate trench portion 42. A gate electrode 62 different from the integrally configured gate electrode 62 described above can be embedded in the second outer peripheral gate trench portion 38B.
  • the source contact portion 46 connects the source wiring 20 and the semiconductor layer 26 by extending through the insulating layer 60 between the source wiring 20 and the semiconductor layer 26.
  • the outer periphery contact portion 50 connects the outer periphery electrode 24 and the semiconductor layer 26 by extending through the insulating layer 60 located between the outer periphery electrode 24 and the semiconductor layer 26 .
  • FIG. 6 is a schematic cross-sectional view of the semiconductor device 10 taken along line F6-F6 in FIG. 4, showing a region between two adjacent connection gate trench portions 42.
  • description of the same configuration as in FIG. 5 is omitted.
  • each outer gate trench section 38A, 38B can have a greater width than the inner gate trench section 40.
  • each outer circumferential gate trench portion 38A, 38B may have a width that is 1.2 times or more and 2.5 times or less the width of the inner gate trench portion 40.
  • the gate contact portion 48 extends through the insulating layer 60 to connect the gate finger portion 32 and the gate electrode 62 embedded in each outer gate trench portion 38A, 38B (see FIG. 8). Therefore, the gate wiring 22 is electrically connected to the gate electrode 62.
  • FIG. 7 is a partially enlarged view of FIG. 6, in which a portion F7 surrounded by a dashed line in FIG. 6 is enlarged.
  • FIG. 7 shows a cross-sectional view of the active region 30 (see FIG. 3).
  • Semiconductor device 10 can further include a gate electrode 62 buried in gate trench 36 with insulating layer 60 interposed therebetween.
  • the gate electrode 62 can be formed of conductive polysilicon, for example.
  • the insulating layer 60 includes: a gate insulating film 64 interposed between the gate electrode 62 and the semiconductor layer 26 and covering the gate trench 36; an interlayer insulating film 66 formed between the metal layer 18 and the semiconductor layer 26; can include.
  • Gate electrode 62 is separated from semiconductor layer 26 by gate insulating film 64 .
  • FIG. 7 a gate insulating film 64 interposed between the gate electrode 62 and the semiconductor layer 26 and covering the inner gate trench portion 40, and an interlayer insulating film 66 formed between the source wiring 20 and the semiconductor layer 26 are shown. It is shown.
  • the semiconductor layer 26 can include a drift region 68, a body region 70 formed on the drift region 68, and a source region 72 formed on the body region 70.
  • Source region 72 may include second surface 26B of semiconductor layer 26.
  • the semiconductor layer 26 may further include a contact region 74 located under the source contact portion 46.
  • Source wiring 20 is electrically connected to contact region 74 via source contact portion 46 .
  • Drift region 68 may be a p - type region containing p- type impurities at a lower concentration than the drain region (semiconductor substrate 54).
  • the impurity concentration of the drift region 68 can be set to 1 ⁇ 10 15 cm ⁇ 3 or more and 1 ⁇ 10 18 cm ⁇ 3 or less.
  • Drift region 68 may have a thickness of 1 ⁇ m or more and 25 ⁇ m or less.
  • Body region 70 may be an n ⁇ type region containing n type impurities.
  • the impurity concentration of the body region 70 can be set to 1 ⁇ 10 16 cm ⁇ 3 or more and 1 ⁇ 10 18 cm ⁇ 3 or less.
  • the body region 70 may have a thickness of 0.5 ⁇ m or more and 1.5 ⁇ m or less.
  • Source region 72 may be a p + -type region containing p-type impurities at a higher concentration than drift region 68 .
  • the impurity concentration of source region 72 may be higher than that of body region 70.
  • the impurity concentration of the source region 72 can be set to 1 ⁇ 10 19 cm ⁇ 3 or more and 1 ⁇ 10 21 cm ⁇ 3 or less.
  • the source region 72 may have a thickness of 0.1 ⁇ m or more and 1 ⁇ m or less.
  • Contact region 74 may be an n + type region containing n-type impurities.
  • the impurity concentration of the contact region 74 is higher than that of the body region 70, and can be set to 1 ⁇ 10 19 cm ⁇ 3 or more and 1 ⁇ 10 21 cm ⁇ 3 or less.
  • the p-type is also referred to as a first conductivity type
  • the n-type is also referred to as a second conductivity type.
  • the p-type impurity may be, for example, boron (B), aluminum (Al), or the like.
  • the n-type impurity may be, for example, phosphorus (P), arsenic (As), or the like.
  • the inner gate trench portion 40 has an opening in the second surface 26B of the semiconductor layer 26 and reaches the drift region 68 by penetrating both the source region 72 and the body region 70.
  • the sidewall of the inner gate trench portion 40 may extend in a direction perpendicular to the second surface 26B of the semiconductor layer 26 (Z-axis direction).
  • the inner gate trench portion 40 can have side surfaces that are slightly inclined with respect to the Z-axis direction.
  • the bottom wall of the inner gate trench portion 40 is formed into a generally curved shape, but the shape is not limited to this.
  • the bottom wall of the inner gate trench portion 40 may be curved at both ends in the X-axis direction, or may have a flat surface along the XY plane.
  • the semiconductor device 10 can control the flow of holes in the Z-axis direction between the p + type source region 72 and the p ⁇ type drift region 68 via this channel.
  • FIG. 8 is a partially enlarged view of FIG. 6, in which a portion F8 surrounded by a dashed line in FIG. 6 is enlarged.
  • FIG. 8 shows a cross-sectional view of the outer peripheral region 28 (see FIG. 3), particularly the region covered by the gate finger portion 32. As shown in FIG.
  • Each outer peripheral gate trench portion 38A, 38B has an opening in the second surface 26B of the semiconductor layer 26, and reaches the drift region 68 by penetrating the body region 70.
  • the sidewalls of each outer peripheral gate trench portion 38A, 38B may extend in a direction perpendicular to the second surface 26B of the semiconductor layer 26 (Z-axis direction).
  • each outer peripheral gate trench portion 38A, 38B can have a side surface that is slightly inclined with respect to the Z-axis direction.
  • the bottom wall of each outer peripheral gate trench portion 38A, 38B is formed in a curved shape at both ends in the X-axis direction, but the present invention is not limited to this.
  • the bottom wall of each outer circumferential gate trench portion 38A, 38B may be formed into an overall curved shape, or may have an overall flat surface along the XY plane.
  • the gate electrode 62 is also embedded in each outer peripheral gate trench portion 38A, 38B via the insulating layer 60. Since each outer circumferential gate trench portion 38A, 38B has a larger width than the inner gate trench portion 40, the gate insulating film 64 is formed thicker in each outer circumferential gate trench portion 38A, 38B than in the inner gate trench portion 40. may have been done. Thereby, the gate electrode 62 can have the same thickness in the outer gate trench part 38 as the gate electrode 62 in the inner gate trench part 40 .
  • each outer circumferential gate trench portion 38A, 38B may have a larger width than the gate electrode 62 in the inner gate trench portion 40, or the gate electrode 62 in the inner gate trench portion 40 may have a larger width. It may have a width smaller than that.
  • the gate contact portion 48 is embedded in each outer peripheral gate trench portion 38A, 38B by extending through the insulating layer 60 (interlayer insulating film 66) located between the gate electrode 62 and the gate finger portion 32.
  • a gate electrode 62 is connected to the gate finger portion 32.
  • the protection trench 44 can be placed apart from each outer gate trench portion 38A, 38B. When a plurality of protection trenches 44 are provided, the plurality of protection trenches 44 can also be spaced apart from each other.
  • the protection trench 44 may be provided outward from the second outer peripheral gate trench portion 38B.
  • the protection trench 44 is provided so as to surround the second outer peripheral gate trench portion 38B.
  • the protective trench 44 is provided on the opposite side of the active region 30 with respect to the second outer peripheral gate trench portion 38B.
  • the protective trench 44 is provided at a position farther from the active region 30 than the second outer peripheral gate trench portion 38B.
  • the second outer peripheral gate trench portion 38B is provided closer to the active region 30 than the protection trench 44 in plan view.
  • the protection trench 44 may have a width smaller than each outer gate trench portion 38A, 38B. In another example, protection trench 44 may have the same width as each outer gate trench portion 38A, 38B, or may have a width greater than each outer gate trench portion 38A, 38B.
  • protection trench 44 may have the same width as the inner gate trench portion 40 (see FIG. 7). In another example, protection trench 44 may have a width less than inner gate trench portion 40 or may have a width greater than inner gate trench portion 40.
  • the protective trench 44 has an opening in the second surface 26B of the semiconductor layer 26 and reaches the drift region 68 by penetrating the body region 70.
  • the sidewall of the protective trench 44 may extend in a direction (Z-axis direction) perpendicular to the second surface 26B of the semiconductor layer 26.
  • the protective trench 44 can have side surfaces that are slightly inclined with respect to the Z-axis direction.
  • the bottom wall of the protection trench 44 is formed into an overall curved shape, but the bottom wall is not limited to this.
  • the bottom wall of the protective trench 44 may have curved ends in the X-axis direction, or may have a flat surface along the XY plane.
  • the semiconductor device 10 can further include a protective electrode 76 embedded in the protective trench 44 with an insulating layer 60 interposed therebetween.
  • the protective electrode 76 can be formed of conductive polysilicon, for example. Since the protective trench 44 is formed in a closed annular shape in a plan view, the protective electrode 76 can also be formed in a closed annular shape in a plan view.
  • the insulating layer 60 may further include a protective insulating film 78 interposed between the protective electrode 76 and the semiconductor layer 26 and covering the protective trench 44 .
  • the protective electrode 76 is separated from the semiconductor layer 26 by a protective insulating film 78.
  • the protective electrode 76 embedded in the protective trench 44 is not connected to other metal members (eg, the gate finger portion 32) and may be in an electrically floating state.
  • the guard electrode 76 can have the same width as the gate electrode 62 within the inner gate trench portion 40 .
  • the protective electrode 76 may have a width larger than that of the gate electrode 62 in the inner gate trench portion 40 or may have a width smaller than that of the gate electrode 62 in the inner gate trench portion 40. .
  • the semiconductor layer 26 does not include the source region 72 (see FIG. 7), but includes a drift region 68 and a body region 70. Therefore, in the region shown in FIG. 8, the second surface 26B of the semiconductor layer 26 is included in the body region 70.
  • connection gate trench section and protection trench 44 The configuration between the connection gate trench portion 42 and the protection trench 44 will be described with reference to FIGS. 4, 6, and 8. In the following description, the protection trench 44 closest to the second outer circumferential gate trench portion 38B among the plurality of protection trenches 44 will be referred to as an "end protection trench 44E.”
  • a first floating trench 52A and a second floating trench 52B are arranged between the connection gate trench section 42 and the protection trench 44.
  • the first floating trenches 52A and the second floating trenches 52B are arranged alternately with the first outer circumferential gate trench portions 38A and the second outer circumferential gate trench portions 38B.
  • the first floating trench 52A is arranged between the first outer gate trench section 38A and the second outer gate trench section 38B. It can be said that the first floating trench 52A is disposed further outward than the first outer peripheral gate trench portion 38A. In plan view, it can be said that the first floating trench 52A is arranged on the opposite side of the active region 30 with respect to the first outer peripheral gate trench portion 38A. In plan view, it can be said that the first floating trench 52A is located further away from the active region 30 than the first outer peripheral gate trench portion 38A.
  • the first floating trench 52A may be arranged closer to the second outer circumferential gate trench portion 38B than the first outer circumferential gate trench portion 38A. That is, the distance DGF12 between the first floating trench 52A and the second outer circumferential gate trench section 38B is smaller than the distance DGF11 between the first floating trench 52A and the first outer circumferential gate trench section 38A.
  • the distance DGF11 can be greater than or equal to 1 ⁇ m and less than or equal to 10 ⁇ m. In one example, the distance DGF12 can be greater than or equal to 1 ⁇ m and less than or equal to 4.6 ⁇ m. Note that the relationship between the distance DGF12 and the distance DGF11 can be changed arbitrarily.
  • the second floating trench 52B is arranged further outward than the second outer peripheral gate trench portion 38B.
  • the second floating trench 52B is arranged on the opposite side of the first floating trench 52A with respect to the second outer peripheral gate trench portion 38B.
  • the second floating trench 52B may be arranged between the second outer peripheral gate trench portion 38B and the end protection trench 44E.
  • the second floating trench 52B is arranged at the center between the second outer peripheral gate trench portion 38B and the end protection trench 44E.
  • the distance DGF22 between the second outer gate trench portion 38B and the second floating trench 52B is equal to the distance DFP between the second floating trench 52B and the end protection trench 44E.
  • the distance DGF22 can be greater than or equal to 1 ⁇ m and less than or equal to 7 ⁇ m.
  • the position of the second floating trench 52B can be arbitrarily changed between the second outer peripheral gate trench portion 38B and the end protection trench 44E.
  • the second floating trench 52B may be arranged closer to the second outer peripheral gate trench portion 38B than the end protection trench 44E.
  • the second floating trench 52B may be arranged closer to the end protection trench 44E than the second outer peripheral gate trench portion 38B.
  • the distance DGF12 is larger than the distance DPP between adjacent protection trenches 44.
  • the distance DPP is 1 ⁇ m. That is, in the example of FIG. 4, the distance DGF12 is larger than 1 ⁇ m.
  • distance DGF12 is less than or equal to twice distance DPP. In one example, distance DGF12 is less than or equal to three times distance DPP. Note that the distance DGF12 may be equal to the distance DPP or may be smaller than the distance DPP.
  • the distance DGF11 is larger than the distance DPP. In one example, the distance DGF11 is more than twice the distance DPP. Note that the relationship between the distance DGF11 and the distance DPP can be changed arbitrarily. In one example, the distance DGF11 is more than three times the distance DPP. In one example, distance DGF11 is four times or more greater than distance DPP. In one example, distance DGF11 is five times or more greater than distance DPP. In one example, distance DGF11 is six times or more greater than distance DPP. In one example, the distance DGF11 is more than seven times the distance DPP. In one example, distance DGF11 is eight times or more greater than distance DPP. In one example, distance DGF11 is nine times or more greater than distance DPP. In one example, distance DGF11 is 10 times or less than distance DPP.
  • the distance DGF11 may be smaller than the distance DGF22 between the second outer peripheral gate trench portion 38B and the second floating trench 52B. Further, the distance DGF12 may be smaller than the distance DGF22.
  • distance DGF11 may be the same as distance DGF22, or may be larger than distance DGF22.
  • distance DGF12 may be the same as distance DGF22, or may be greater than distance DGF22.
  • the distance DGF11 may be larger than the distance DFP between the second floating trench 52B and the end protection trench 44E. In another example, distance DGF11 may be the same as distance DFP, or may be smaller than distance DFP.
  • the distance DGF22 may be the same as the distance DFP. In another example, distance DGF22 may be greater than or less than distance DFP. Both distance DGF22 and distance DFP may be greater than distance DPP.
  • the distance DFF between the first floating trench 52A and the second floating trench 52B is larger than the distance DPP between two adjacent protection trenches 44.
  • Distance DFF is larger than distance DGF12.
  • Distance DFF is larger than distance DGF11.
  • Distance DFF is greater than distance DFP.
  • the first floating trench 52A can have a shape that surrounds the first outer peripheral gate trench portion 38A in plan view. In one example, the first floating trench 52A may have a similar shape in plan view to the first outer gate trench portion 38A.
  • the second outer peripheral gate trench portion 38B can have a shape that surrounds the first floating trench 52A in plan view. In one example, the second outer peripheral gate trench portion 38B may have a similar shape to the first floating trench 52A in plan view. Therefore, the first floating trench 52A can have a closed annular shape including a shape along the recess 20A (see FIG. 2) in plan view.
  • the second floating trench 52B can have a shape that surrounds the second outer peripheral gate trench portion 38B in plan view.
  • the second floating trench 52B can have a similar shape in plan view to the second outer peripheral gate trench portion 38B. Therefore, the second floating trench 52B can have a closed annular shape including a shape along the recess 20A in plan view.
  • Each of the floating trenches 52A and 52B is arranged at a position that does not overlap with both the gate finger part 32 and the gate pad part 34 in plan view. Furthermore, each of the floating trenches 52A and 52B is arranged at a position that does not overlap with the source wiring 20 in plan view. That is, each floating trench 52A, 52B is arranged between the source wiring 20, the gate finger part 32, and the gate pad part 34 in plan view.
  • the first floating trench 52A may have the same width as each outer peripheral gate trench portion 38A, 38B. That is, the first floating trench 52A may have a width greater than the width of the inner gate trench portion 40 and the width of the protection trench 44.
  • the first floating trench 52A may have a width greater than each outer gate trench portion 38A, 38B, or may have a width smaller than each outer gate trench portion 38A, 38B. good. In another example, the first floating trench 52A may have the same width as the inner gate trench portion 40, or may have a width smaller than the inner gate trench portion 40. In another example, the first floating trench 52A may have the same width as the protection trench 44, or may have a width smaller than the protection trench 44.
  • the second floating trench 52B may have a width smaller than each of the outer peripheral gate trench portions 38A and 38B.
  • the second floating trench 52B may have the same width as the inner gate trench portion 40.
  • the second floating trench 52B may have the same width as the protection trench 44. That is, the width of the second floating trench 52B is smaller than the width of the first floating trench 52A. In other words, the width of the first floating trench 52A is larger than the width of the second floating trench 52B.
  • the second floating trench 52B may have the same width as each outer gate trench section 38A, 38B, or may have a width greater than each outer gate trench section 38A, 38B. . In another example, the second floating trench 52B may have a width greater than the inner gate trench portion 40 or may have a width smaller than the inner gate trench portion 40. Further, in another example, the second floating trench 52B may have a width larger than the protection trench 44, or may have a width smaller than the protection trench 44.
  • the first floating trench 52A may have the same depth as the second floating trench 52B.
  • Each floating trench 52A, 52B may have the same depth as each outer gate trench portion 38A, 38B. Additionally, each floating trench 52A, 52B may have the same depth as the inner gate trench portion 40 and the protection trench 44.
  • each floating trench 52A, 52B can be changed arbitrarily.
  • the first floating trench 52A may have a greater depth than the second floating trench 52B, or may have a shallower depth than the second floating trench 52B.
  • each floating trench 52A, 52B may have a greater depth than each outer gate trench section 38A, 38B or a shallower depth than each outer gate trench section 38A, 38B. You may.
  • each floating trench 52A, 52B may have a depth greater than inner gate trench portion 40 or may have a shallower depth than inner gate trench portion 40.
  • each floating trench 52A, 52B may have a greater depth than protection trench 44 or may have a shallower depth than protection trench 44.
  • the first floating trench 52A has an opening in the second surface 26B of the semiconductor layer 26, and reaches the drift region 68 by penetrating the body region 70.
  • the sidewall of the first floating trench 52A may extend in a direction (Z-axis direction) perpendicular to the second surface 26B of the semiconductor layer 26.
  • the first floating trench 52A can have a side surface that is slightly inclined with respect to the Z-axis direction.
  • both ends of the bottom wall of the first floating trench 52A in the X-axis direction are formed into a curved shape, but the bottom wall is not limited to this.
  • the bottom wall of the first floating trench 52A may be formed into an entirely curved shape, or may have a flat surface along the XY plane.
  • the first floating trench 52A in the cross-sectional view of FIG. 8, has the same cross-sectional shape as the respective outer peripheral gate trench portions 38A and 38B. Note that the first floating trench 52A may have a cross-sectional shape different from the cross-sectional shape of each outer peripheral gate trench portion 38A, 38B.
  • the second floating trench 52B has an opening in the second surface 26B of the semiconductor layer 26, and reaches the drift region 68 by penetrating the body region 70.
  • the sidewall of the second floating trench 52B may extend in a direction (Z-axis direction) perpendicular to the second surface 26B of the semiconductor layer 26.
  • the second floating trench 52B can have a side surface that is slightly inclined with respect to the Z-axis direction.
  • the bottom wall of the second floating trench 52B is formed into an overall curved shape, but the bottom wall is not limited to this.
  • the bottom wall of the second floating trench 52B may have curved ends in the X-axis direction, or may have a flat surface along the XY plane.
  • the second floating trench 52B has the same cross-sectional shape as the protective trench 44 in the cross-sectional view of FIG. Note that the second floating trench 52B may have a cross-sectional shape different from that of the protective trench 44.
  • the semiconductor device 10 includes a first floating electrode 80A embedded in a first floating trench 52A with an insulating layer 60 interposed therebetween, and a second floating electrode 80B embedded in a second floating trench 52B with an insulating layer 60 interposed therebetween. , may further include.
  • the first floating electrode 80A corresponds to a "floating electrode”.
  • Each floating electrode 80A, 80B can be formed of conductive polysilicon, for example. Since each floating trench 52A, 52B is formed in a similar shape to each outer circumferential gate trench portion 38A, 38B in plan view, floating electrodes 80A, 80B are also similar to each outer circumferential gate trench portion 38A, 38B in plan view. It can be formed into the shape of
  • the insulating layer 60 may further include a first floating insulating film 82A and a second floating insulating film 82B.
  • the first floating insulating film 82A is interposed between the first floating electrode 80A and the semiconductor layer 26 and is formed in the first floating trench 52A.
  • the second floating insulating film 82B is interposed between the second floating electrode 80B and the semiconductor layer 26 and is formed in the second floating trench 52B. Therefore, the first floating electrode 80A is separated from the semiconductor layer 26 by the first floating insulating film 82A.
  • the second floating electrode 80B is separated from the semiconductor layer 26 by a second floating insulating film 82B.
  • Each floating electrode 80A, 80B is not connected to another metal member (for example, gate finger portion 32) and is in an electrically floating state.
  • the thickness of the first floating insulating film 82A is The thickness is the same as that of the membrane 64.
  • the width of the first floating trench 52A is larger than the width of the inner gate trench portion 40, the thickness of the first floating insulating film 82A is thicker than the thickness of the gate insulating film 64 of the inner gate trench portion 40.
  • the thickness of the second floating insulating film 82B is smaller than the thickness of the gate insulating film 64 of each outer gate trench portion 38A, 38B. It's also thin. In other words, the thickness of the gate insulating film 64 of each outer peripheral gate trench portion 38A, 38B is thicker than the thickness of the second floating insulating film 82B. On the other hand, since the width of the second floating trench 52B is the same as the width of the inner gate trench section 40, the thickness of the second floating insulating film 82B is the same as the thickness of the gate insulating film 64 of the inner gate trench section 40. .
  • the thickness of the first floating insulating film 82A is thicker than the thickness of the second floating insulating film 82B.
  • the first floating electrode 80A may have the same width as the gate electrode 62 embedded in each outer peripheral gate trench portion 38A, 38B. That is, the first floating electrode 80A can have the same width as the gate electrode 62 and the protection electrode 76 buried in the inner gate trench portion 40.
  • the first floating electrode 80A may have a width greater than the gate electrode 62 in each outer gate trench section 38A, 38B, or the gate electrode 62 in each outer gate trench section 38A, 38B. It may have a width smaller than 62. In another example, the first floating electrode 80A may have a width greater than the width of the gate electrode 62 in the inner gate trench portion 40 or smaller than the width of the gate electrode 62 in the inner gate trench portion 40. It may have a width. Further, in another example, the first floating electrode 80A may have a width larger than the guard electrode 76 or may have a width smaller than the guard electrode 76.
  • the second floating electrode 80B may have the same width as the gate electrode 62 in each outer circumferential gate trench portion 38A, 38B. In one example, the second floating electrode 80B may have the same width as the gate electrode 62 within the inner gate trench portion 40. The second floating electrode 80B may have the same width as the protective electrode 76. The second floating electrode 80B may have the same width as the first floating electrode 80A.
  • the second floating electrode 80B may have a width greater than the gate electrode 62 in each outer gate trench portion 38A, 38B, or the gate electrode 62 in each outer gate trench portion 38A, 38B. It may have a width smaller than 62. In another example, the second floating electrode 80B may have a width greater than the width of the gate electrode 62 in the inner gate trench portion 40 or smaller than the width of the gate electrode 62 in the inner gate trench portion 40. It may have a width. Further, in another example, the second floating electrode 80B may have a width larger than the guard electrode 76 or may have a width smaller than the guard electrode 76. In another example, the second floating electrode 80B may have a smaller width than the first floating electrode 80A. In other words, the first floating electrode 80A may have a larger width than the second floating electrode 80B. Furthermore, in another example, the second floating electrode 80B may have a larger width than the first floating electrode 80A.
  • each outer gate trench portion 38A, 38B and each floating trench 52A, 52B and the relationship between the drain-source breakdown voltage (BV DSS ).
  • FIG. 9 is a graph showing the relationship between the distance DFP between the second floating trench 52B and the end protection trench 44E and the drain-source breakdown voltage BV DSS .
  • the drain-source breakdown voltage BV DSS is generally constant.
  • the drain-source breakdown voltage BV DSS decreases slightly as the distance DFP becomes smaller.
  • the distance DFP does not have a large effect on the drain-source breakdown voltage BV DSS , so it can be set arbitrarily.
  • FIG. 10 shows the first outer periphery gate trench portion 38A and the first outer periphery gate trench portion 38A in a state where the distance DFP is set to 4.16 ⁇ m and the distance DGF12 between the second outer periphery gate trench portion 38B and the first floating trench 52A is set to 4 ⁇ m.
  • 7 is a graph showing the relationship between the distance DGF11 from the first floating trench 52A and the drain-source breakdown voltage BV DSS .
  • the drain-source breakdown voltage BV DSS increases as the distance DGF11 increases.
  • the drain-source breakdown voltage BV DSS is approximately constant even if the distance DGF11 becomes large.
  • FIG. 11 is a graph showing the relationship between the distance DGF12 and the drain-source breakdown voltage BV DSS .
  • the graph plotted with a solid line and a black circle is a graph showing the relationship between the distance DGF12 and the drain-source breakdown voltage BV DSS when the distance DGF11 is set to 3.56 ⁇ m.
  • the graph shown by the dashed line and triangular plot is a graph showing the relationship between the distance DGF12 and the drain-source breakdown voltage BV DSS when the distance DGF11 is set to 2.56 ⁇ m.
  • the drain-source breakdown voltage BV DSS decreases as the distance DGF12 increases. Furthermore, when the distance DGF11 is 3.56 ⁇ m, the drain-source breakdown voltage BV DSS is higher overall than when the distance DGF11 is 2.56 ⁇ m. As a result, in order to increase the drain-source breakdown voltage BV DSS , it is preferable that the distance DGF11 be large. From the results shown in FIGS. 10 and 11, in order to increase the drain-source breakdown voltage BV DSS , the first floating trench 52A should be placed closer to the second outer gate trench portion 38B than the first outer gate trench portion 38A. It is preferable to arrange.
  • FIG. 12 is a schematic plan view showing a part of the outer peripheral region 28 in a semiconductor device of a comparative example (hereinafter referred to as "comparative semiconductor device 10X").
  • the comparative semiconductor device 10X has a configuration in which the first floating trench 52A, the first floating electrode 80A, and the first floating insulating film 82A are omitted from the semiconductor device 10. Due to the omission of these configurations, the second outer circumferential gate trench section 38B is arranged closer to the first outer circumferential gate trench section 38A than the second outer circumferential gate trench section 38B of this embodiment.
  • FIG. 13 is a graph showing the IV characteristics of the comparative semiconductor device 10X.
  • the horizontal axis indicates the drain-source voltage VD applied to the drain of the comparative semiconductor device 10X
  • the vertical axis indicates the current ID flowing to the drain of the comparative semiconductor device 10X.
  • a graph consisting of a solid line and a plot of black circles shows the results of the first IV characteristic measurement.
  • a graph consisting of a dashed-dotted line and a triangular plot shows the results of the second IV characteristic measurement.
  • the drain-source breakdown voltage BV DSS during the first measurement is the voltage BVT
  • the drain-source breakdown voltage BV DSS during the second measurement is a voltage BVL lower than the voltage BVT. Therefore, a walk-in phenomenon occurs in the comparative semiconductor device 10X. This is because, for example, the way the depletion layer spreads in the curved corner portions of the first outer circumferential gate trench portion 38A and the second outer circumferential gate trench portion 38B is This is different from how the depletion layer spreads in a straight portion extending along the Y-axis direction or the Y-axis direction. As a result, the way the drain-source current flows in the corner portion is different from the drain-source current flow in the straight line portion. As a result, after the drain-source breakdown voltage BV DSS is measured once, the withstand voltage performance of the corner portion becomes lower than that of the straight line portion, so the drain-source breakdown voltage at the second measurement is It is thought that BV DSS will decrease.
  • FIG. 14 is a graph showing the IV characteristics of the semiconductor device 10 of this embodiment.
  • the horizontal axis represents the drain-source voltage VD applied to the drain of the semiconductor device 10 of this embodiment
  • the vertical axis represents the current ID flowing through the drain of the semiconductor device 10 of this embodiment.
  • a graph consisting of a solid line and a plot of black circles shows the results of the first IV characteristic measurement.
  • a graph consisting of a dashed-dotted line and a triangular plot shows the results of the second IV characteristic measurement.
  • the drain-source breakdown voltage BV DSS during the first measurement is the voltage BVT
  • the drain-source breakdown voltage BV DSS during the second measurement is a voltage BVH higher than the voltage BVT. Therefore, in the semiconductor device 10 of this embodiment, a walkout phenomenon occurs. That is, in the semiconductor device 10 of this embodiment, no walk-in phenomenon occurs. This is because the withstand voltage performance of the curved corner portions of the first outer gate trench portion 38A and the second outer gate trench portion 38B is determined by the first floating trench 52A after the drain-source breakdown voltage BV DSS is measured once.
  • the semiconductor device 10 includes a semiconductor layer 26, a gate trench 36 formed in the semiconductor layer 26, an insulating layer 60 formed on the semiconductor layer 26, and an insulating layer 60 in the gate trench 36.
  • the gate wiring 22 is formed on the insulating layer 60 and electrically connected to the gate electrode 62.
  • the semiconductor layer 26 includes an outer peripheral region 28 that includes the outer edge of the semiconductor layer 26 in plan view and is provided with an outer peripheral gate trench portion 38, and an active region 30 surrounded by the outer peripheral region 28.
  • the outer circumferential gate trench section 38 includes a first outer circumferential gate trench section 38A and a second outer circumferential gate trench section 38B provided outward from the first outer circumferential gate trench section 38A.
  • the semiconductor device 10 includes a first floating trench 52A formed in a region between the first outer circumferential gate trench part 38A and the second outer circumferential gate trench part 38B in the semiconductor layer 26, and an insulating layer in the first floating trench 52A. 60 and a first floating electrode 80A in an electrically floating state.
  • the semiconductor device 10 of this embodiment has the first floating trench 52A and the first floating electrode 80A.
  • the walkout phenomenon occurs due to the presence of Therefore, according to the semiconductor device 10 of this embodiment, the occurrence of the walk-in phenomenon can be suppressed.
  • the semiconductor device 10 further includes a protective trench 44 formed in the outer peripheral region 28.
  • the width of the first floating trench 52A is larger than the width of the protection trench 44.
  • the thickness of the first floating insulating film 82A, which is the portion of the insulating layer 60 formed within the first floating trench 52A, is the same as that of the protective insulating film 78, which is the portion of the insulating layer 60 formed within the protective trench 44. thicker than thick.
  • the first floating trench 52A is arranged closer to the second outer circumferential gate trench portion 38B than the first outer circumferential gate trench portion 38A. According to this configuration, the distance DGF11 between the first floating trench 52A and the first outer circumferential gate trench section 38A becomes large, and the distance DGF12 between the first floating trench 52A and the second outer circumferential gate trench section 38B becomes small. Become. Therefore, as shown in the graphs of FIGS. 10 and 11, the drain-source breakdown voltage BV DSS can be increased.
  • the width of the first outer circumference gate trench portion 38A and the width of the second outer circumference gate trench portion 38B are larger than the width of the protection trench 44.
  • the gate insulating film 64 formed in each outer peripheral gate trench portion 38A, 38B can be made thicker than the protective insulating film 78 formed in the protective trench 44. Therefore, electric field concentration at the corners formed by bending each of the outer circumferential gate trench portions 38A and 38B in plan view can be alleviated. Therefore, the breakdown voltage of the semiconductor device 10 can be improved.
  • the outer peripheral electrode 24 is spaced apart from the gate wiring 22 and surrounds the gate wiring 22. According to this configuration, electric field concentration in the region surrounded by the outer peripheral electrode 24 can be alleviated, so that the breakdown voltage of the semiconductor device 10 can be improved.
  • the drain-source breakdown voltage BV DSS is approximately constant even if the distance DGF22 is made small, so the semiconductor device 10 can be made smaller by making the distance DGF22 small. At the same time, a decrease in the drain-source breakdown voltage BVDSS can be suppressed.
  • the distance DGF11 between the first outer gate trench portion 38A and the first floating trench 52A may be 4.56 ⁇ m or more. According to this configuration, as shown in the graph of FIG. 10, as the distance DGF11 becomes smaller in the range where the distance DGF11 is less than 4.56 ⁇ m, the drain-source breakdown voltage BV DSS decreases, and when the distance DGF11 is 4.56 ⁇ m or more, the drain-source breakdown voltage BV DSS decreases. In this range, the drain-source breakdown voltage BV DSS is approximately constant. Therefore, by setting the distance DGF11 to 4.56 ⁇ m or more, it is possible to suppress a decrease in the drain-source breakdown voltage BV DSS . Further, since the distance DGF11 is approximately 4.56 ⁇ m, the semiconductor device 10 can be miniaturized while suppressing a decrease in the drain-source breakdown voltage BV DSS .
  • the semiconductor device 10 of the second embodiment will be described with reference to FIGS. 15 to 20.
  • the semiconductor device 10 of the second embodiment differs from the semiconductor device 10 of the first embodiment mainly in the configuration of the outer gate trench portion 38 and the configuration between the connection gate trench portion 42 and the protection trench 44. .
  • the differences from the semiconductor device 10 of the first embodiment will be explained in detail, and the same components as those of the semiconductor device 10 of the first embodiment will be denoted by the same reference numerals, and the explanation thereof will be omitted.
  • the semiconductor device 10 of this embodiment includes an outer gate trench section 90 instead of the outer gate trench section 38 (see FIG. 4).
  • the outer circumferential gate trench section 90 corresponds to the first outer circumferential gate trench section 38A (see FIG. 4) of the first embodiment. That is, the semiconductor device 10 of this embodiment does not include the second outer peripheral gate trench portion 38B (see FIG. 4).
  • the outer peripheral gate trench portion 90 is disposed in the outer peripheral region 28 and is surrounded by the protective trench 44 in plan view.
  • the configuration of the outer gate trench section 90 is the same as the configuration of the first outer gate trench section 38A, so the same reference numerals are given to the same components as the first outer gate trench section 38A. The detailed explanation will be omitted.
  • the gate trench 36 of this embodiment can include an inner gate trench section 40, a connection gate trench section 42, and an outer gate trench section 90.
  • the connection gate trench section 42 connects the inner gate trench section 40 and the outer gate trench section 90 .
  • a first floating trench 52A and a second floating trench 52B are arranged between the outer peripheral gate trench portion 90 and the protection trench 44.
  • the second floating trench 52B is arranged further outward than the first floating trench 52A. It can also be said that the second floating trench 52B is arranged on the opposite side of the outer peripheral gate trench portion 90 with respect to the first floating trench 52A.
  • the second floating trench 52B is arranged between the first floating trench 52A and the end protection trench 44E.
  • the first floating trench 52A is arranged between the outer peripheral gate trench section 90 and the second floating trench 52B.
  • the first floating trench 52A is arranged closer to the second floating trench 52B than the outer peripheral gate trench portion 90. That is, the distance DGF between the outer peripheral gate trench portion 90 and the first floating trench 52A is larger than the distance DFF between the first floating trench 52A and the second floating trench 52B.
  • the distance DGF can be greater than or equal to 2 ⁇ m and less than or equal to 4.6 ⁇ m.
  • the distance DFF can be greater than or equal to 1 ⁇ m and less than or equal to 3.7 ⁇ m.
  • distance DGF may be smaller than distance DFF. That is, the first floating trench 52A may be arranged closer to the outer peripheral gate trench portion 90 than the second floating trench 52B. Also, in another example, distance DGF may be the same as distance DFF.
  • Both the distance DGF and the distance DFF may be larger than the distance DPP between two adjacent protection trenches 44.
  • the distance DGF is more than twice the distance DPP. In one example, distance DGF is three times greater than distance DPP. In one example, the distance DGF is less than or equal to four times the distance DPP. Further, in one example, the distance DFF is more than twice the distance DPP. In one example, the distance DFF is more than three times the distance DPP. In one example, distance DFF is four times greater than distance DPP. In one example, distance DFF is less than or equal to five times distance DPP.
  • the distance DGF may be larger than the distance DFP between the second floating trench 52B and the end protection trench 44E. In another example, distance DGF may be the same as distance DFP, or may be less than distance DFP. Moreover, the distance DFF may be smaller than the distance DFP. In another example, distance DFF may be the same as distance DFP, or may be greater than distance DFP.
  • Each of the floating trenches 52A and 52B can have a shape that surrounds the outer peripheral gate trench portion 90 in plan view.
  • each of the floating trenches 52A and 52B can have a shape similar to the outer gate trench portion 90 in plan view in the outer circumferential region 28. Therefore, the first floating trench 52A can have a closed annular shape including a shape along the recess 20A (see FIG. 2) in plan view.
  • Each of the floating trenches 52A and 52B is arranged at a position that does not overlap with both the gate finger part 32 and the gate pad part 34 in plan view. Furthermore, each of the floating trenches 52A and 52B is arranged at a position that does not overlap with the source wiring 20 in plan view. That is, each floating trench 52A, 52B is arranged between the source wiring 20, the gate finger part 32, and the gate pad part 34 in plan view.
  • a first floating electrode 80A and a first floating insulating film 82A are provided, similar to the first embodiment.
  • a second floating electrode 80B and a second floating insulating film 82B are provided, similar to the first embodiment.
  • FIG. 18 is a graph showing the relationship between the distance DFF between the first floating trench 52A and the second floating trench 52B and the drain-source breakdown voltage BV DSS .
  • the distance DFF is small within the above-mentioned range of distance DFF of 1 ⁇ m or more and 3.7 ⁇ m or less.
  • FIG. 19 is a graph showing the relationship between the distance DGF between the outer gate trench portion 90 and the first floating trench 52A and the drain-source breakdown voltage BV DSS .
  • FIG. 19 is a graph showing the relationship between the distance DGF and the drain-source breakdown voltage BV DSS when the distance DFF is set to 3.72 ⁇ m.
  • the drain-source breakdown voltage BV DSS increases.
  • the distance DGF it is preferable that the distance DGF be large.
  • the first floating trench 52A should be placed closer to the second floating trench 52B than the outer gate trench portion 90. preferable.
  • FIG. 20 is a graph showing the IV characteristics of the semiconductor device 10 of this embodiment.
  • the horizontal axis indicates the drain-source voltage VD applied to the drain of the semiconductor device 10 of this embodiment
  • the vertical axis indicates the current ID flowing to the drain of the semiconductor device 10 of this embodiment.
  • a graph consisting of a solid line and a plot of black circles shows the results of the first IV characteristic measurement.
  • a graph consisting of a dashed-dotted line and a triangular plot shows the results of the second IV characteristic measurement.
  • the drain-source breakdown voltage BV DSS during the first measurement is the voltage BVS
  • the drain-source breakdown voltage BV DSS during the second measurement is a voltage BVU higher than the voltage BVS.
  • a walkout phenomenon occurs. That is, in the semiconductor device 10 of this embodiment, no walk-in phenomenon occurs. In this way, by forming the first floating trench 52A (first floating electrode 80A) between the outer peripheral gate trench portion 90 and the protection trench 44, the occurrence of the walk-in phenomenon can be suppressed.
  • the voltage BVS is lower than the voltage BVT, which is the drain-source breakdown voltage BV DSS at the time of the first measurement of the semiconductor device 10 of the first embodiment.
  • the voltage BVU is lower than the voltage BVH, which is the drain-source breakdown voltage BV DSS at the time of the second measurement of the semiconductor device 10 of the first embodiment.
  • the semiconductor device 10 includes the semiconductor layer 26, the gate trench 36 formed in the semiconductor layer 26, the insulating layer 60 formed on the semiconductor layer 26, and the insulating layer 60 in the gate trench 36.
  • the gate electrode 62 embedded in the insulating layer 60 and the gate wiring 22 electrically connected to the gate electrode 62; the plurality of protective trenches 44 formed in the semiconductor layer 26;
  • a protective electrode 76 is embedded through the insulating layer 60.
  • the semiconductor layer 26 includes an outer peripheral region 28 that includes the outer edge of the semiconductor layer 26 in a plan view and in which a protective trench 44 is arranged, and an active region 30 surrounded by the outer peripheral region 28.
  • the gate trench 36 includes an outer circumferential gate trench portion 90 that is arranged in the outer circumferential region 28 and surrounded by the protective trench 44 in plan view.
  • the semiconductor device 10 includes a first floating trench 52A and a second floating trench 52B formed in a region between the outer peripheral gate trench portion 90 and the protective trench 44 in the semiconductor layer 26, and an insulating layer in the first floating trench 52A.
  • a first floating electrode 80A that is embedded through the insulating layer 60 and is in an electrically floating state
  • a second floating electrode 80B that is embedded in the second floating trench 52B via the insulating layer 60 and is in an electrically floating state. Be prepared.
  • the first floating trench 52A is arranged closer to the second floating trench 52B than the outer peripheral gate trench portion 90.
  • a walkout phenomenon occurs due to the provision of the first floating trench 52A and the first floating electrode 80A. Therefore, according to the semiconductor device 10 of this embodiment, the occurrence of the walk-in phenomenon can be suppressed.
  • the width of the first floating trench 52A is larger than the width of the protection trench 44.
  • the thickness of the first floating insulating film 82A, which is the portion of the insulating layer 60 formed within the first floating trench 52A, is the same as that of the protective insulating film 78, which is the portion of the insulating layer 60 formed within the protective trench 44. thicker than thick.
  • the width of the outer peripheral gate trench portion 90 is larger than the width of the protection trench 44. According to this configuration, the gate insulating film 64 formed in the outer peripheral gate trench portion 90 can be made thicker than the protective insulating film 78 formed in the protective trench 44. Thereby, electric field concentration at the corners formed by bending the outer peripheral gate trench portion 90 in plan view can be alleviated. Therefore, the breakdown voltage of the semiconductor device 10 can be improved.
  • each outer peripheral gate trench part 38A, 38B may be formed in a closed ring shape along the four sides 26X1, 26X2, 26Y1, 26Y2 of the semiconductor layer 26 in the outer peripheral region 28.
  • the protective trench 44 may be formed in a closed ring shape along the four sides 26X1, 26X2, 26Y1, and 26Y2 of the semiconductor layer 26 in the outer peripheral region 28. That is, the protective trench 44 may extend along the four sides 26X1, 26X2, 26Y1, and 26Y2 of the semiconductor layer 26.
  • each floating trench 52A, 52B may be formed in a closed ring shape along the four sides 26X1, 26X2, 26Y1, 26Y2 of the semiconductor layer 26 in the outer peripheral region 28.
  • the outer peripheral electrode 24 may be omitted.
  • the protective trench 44, the protective electrode 76, and the protective insulating film 78 may be omitted.
  • the position of the gate pad section 34 can be changed arbitrarily.
  • the gate pad portion 34 may be located at any of four corner portions of the semiconductor layer 26 in plan view.
  • a structure in which the conductivity type of each region in the semiconductor layer 26 is reversed may be adopted. That is, the p-type region may be made into an n-type region, and the n-type region may be made into a p-type region.
  • the term “on” includes the meanings of “on” and “over” unless the context clearly indicates otherwise.
  • the phrase “the first layer is formed on the second layer” refers to the fact that in some embodiments the first layer may be directly disposed on the second layer in contact with the second layer, but in other embodiments. It is contemplated that the first layer can be placed above the second layer without contacting the second layer. That is, the term “on” does not exclude a structure in which another layer is formed between the first layer and the second layer.
  • the Z-axis direction used in this specification does not necessarily need to be a vertical direction, nor does it need to completely coincide with the vertical direction. Accordingly, various structures according to the present disclosure (e.g., the structure shown in FIG. 5) are different from each other in that "upper” and “lower” in the Z-axis direction described herein are “upper” and “lower” in the vertical direction. Not limited to one thing.
  • the X-axis direction may be a vertical direction, or the Y-axis direction may be a vertical direction.
  • the semiconductor layer (26) includes an outer peripheral region (28) including an outer edge of the semiconductor layer (26) in plan view,
  • the gate trench (36) is a first outer peripheral gate trench portion (38A) provided in the outer peripheral region (28); a second outer circumferential gate trench portion (38B) provided outward from the first outer circumferential gate trench portion (38A); a first floating trench (52A) formed in a region of the semiconductor layer (26) between the first outer gate trench section (38A) and the second outer gate trench section (38B);
  • a semiconductor device (10) comprising: a floating electrode (80A) buried in the first floating trench (52A) via the insulating layer (60) and in
  • the width of the first floating trench (52A) is larger than the width of the second floating trench (52B),
  • the thickness of the portion (82A) of the insulating layer (60) formed in the first floating trench (52A) is equal to the thickness of the portion (82A) of the insulating layer (60) formed in the second floating trench (52B).
  • the plurality of protection trenches (44) include an end protection trench (44E) as a protection trench (44) closer to the second floating trench (52B) among the plurality of protection trenches (44),
  • the distance (DFP) between the second floating trench (52B) and the end protection trench (44E) is larger than the distance (DPP) between two adjacent protection trenches (44); Additional Note 4; 5.
  • the semiconductor device according to any one of 7.
  • the semiconductor layer (26) includes an active region (30) surrounded by the outer peripheral region (28),
  • the gate trench (36) is an inner gate trench portion (40) provided in the active region (30); 9.
  • the semiconductor layer (26) includes an outer peripheral region (28) that includes an outer edge of the semiconductor layer (26) in plan view and in which the protective trench (44) is arranged,
  • the gate trench (36) includes an outer peripheral gate trench portion (90) located in the outer peripheral region (28) and surrounded by the protective trench (44) in plan view, A first floating trench (52A) and a second floating trench (52B) formed in a region of the semiconductor layer (26) between the outer peripheral gate trench portion (90) and the protective trench (44);
  • the width of the first floating trench (52A) is larger than the width of the protection trench (44),
  • the thickness of the portion (82A) of the insulating layer (60) formed in the first floating trench (52A) is equal to the thickness of the portion (82A) of the insulating layer (60) formed in the protective trench (44).
  • the width of the outer peripheral gate trench portion (90) is larger than the width of the protection trench (44),
  • the thickness of the portion (64) of the insulating layer (60) formed within the outer peripheral gate trench portion (90) is equal to the thickness of the portion (64) of the insulating layer (60) formed within the protective trench (44).
  • the width of the first floating trench (52A) is equal to the width of the outer peripheral gate trench portion (90),
  • the thickness of the portion (82A) of the insulating layer (60) formed in the first floating trench (52A) is equal to the thickness of the portion (82A) of the insulating layer (60) formed in the outer peripheral gate trench portion (90).
  • the width of the first floating trench (52A) is larger than the width of the second floating trench (52B),
  • the thickness of the portion (82A) of the insulating layer (60) formed in the first floating trench (52A) is equal to the thickness of the portion (82A) of the insulating layer (60) formed in the second floating trench (52B).
  • Appendix 15 A plurality of the protective trenches (44) are provided, The distance (DGF) between the outer peripheral gate trench portion (90) and the first floating trench (52A) is larger than the distance (DPP) between two adjacent protection trenches (44). Appendix 10 ⁇ 15. The semiconductor device according to any one of 14.
  • Appendix 16 A plurality of the protective trenches (44) are provided, The distance (DFF) between the first floating trench (52A) and the second floating trench (52B) is greater than the distance (DPP) between two adjacent protection trenches (44). Appendix 10 ⁇ 15. The semiconductor device according to any one of 15.
  • the plurality of protection trenches (44) include an end protection trench (44E) as a protection trench (44) closer to the second floating trench (52B) among the plurality of protection trenches (44),
  • the distance (DFP) between the second floating trench (52B) and the end protection trench (44E) is greater than the distance (DPP) between two adjacent protection trenches (44).
  • the semiconductor layer (26) includes an active region (30),
  • the gate trench (36) is an inner gate trench portion (40) provided in the active region (30); 18.
  • an outer peripheral electrode (24) formed on the insulating layer (60) and spaced apart from the gate wiring (22); The semiconductor device according to any one of appendices 1 to 19, wherein the outer peripheral electrode (24) surrounds the gate wiring (22).
  • Outer periphery gate trench section 40 Inner gate trench section 42...Connection gate trench section 44...Protection trench 44E...End protection trench 46...Source contact section 48...Gate contact section 50...Outer periphery contact section 52A...First floating trench 52B... Second floating trench 54... Semiconductor substrate 56... Epitaxial layer 58... Drain electrode 60... Insulating layer 62... Gate electrode 64... Gate insulating film 66... Interlayer insulating film 68... Drift region 70... Body region 72... Source region 74... Contact region 76... Protective electrode 78... Protective insulating film 80A... First floating electrode 80B... Second floating electrode 82A... First floating insulating film 82B... Second floating insulating film 90...

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US20120261737A1 (en) * 2009-11-20 2012-10-18 Force Mos Technology Co. Ltd. Trench mosfet with trenched floating gates and trenched channel stop gates in termination
JP2019117867A (ja) * 2017-12-27 2019-07-18 株式会社東芝 半導体装置
JP2020061412A (ja) * 2018-10-05 2020-04-16 ローム株式会社 半導体装置
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US20120261737A1 (en) * 2009-11-20 2012-10-18 Force Mos Technology Co. Ltd. Trench mosfet with trenched floating gates and trenched channel stop gates in termination
JP2019117867A (ja) * 2017-12-27 2019-07-18 株式会社東芝 半導体装置
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US20210104624A1 (en) * 2019-10-07 2021-04-08 Nami MOS CO., LTD. Trench mosfets having dummy cells for avalanche capability improvement

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WO2025173150A1 (ja) * 2024-02-15 2025-08-21 三菱電機株式会社 半導体装置及び半導体装置の製造方法

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