CN118696416A - 氮化物半导体装置 - Google Patents

氮化物半导体装置 Download PDF

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Publication number
CN118696416A
CN118696416A CN202280091589.3A CN202280091589A CN118696416A CN 118696416 A CN118696416 A CN 118696416A CN 202280091589 A CN202280091589 A CN 202280091589A CN 118696416 A CN118696416 A CN 118696416A
Authority
CN
China
Prior art keywords
electrode
layer
field plate
drain
nitride semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280091589.3A
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English (en)
Chinese (zh)
Inventor
大岳浩隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of CN118696416A publication Critical patent/CN118696416A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/343Gate regions of field-effect devices having PN junction gates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/40FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/47FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
    • H10D30/471High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
    • H10D30/475High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/111Field plates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices
    • H10D64/256Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/10Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503Nitride Group III-V materials, e.g. AlN or GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices
    • H10D64/257Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are characterised by top-view geometrical layouts, e.g. interdigitated, semi-circular, annular or L-shaped electrodes

Landscapes

  • Junction Field-Effect Transistors (AREA)
CN202280091589.3A 2022-02-17 2022-12-19 氮化物半导体装置 Pending CN118696416A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-022919 2022-02-17
JP2022022919 2022-02-17
PCT/JP2022/046702 WO2023157452A1 (ja) 2022-02-17 2022-12-19 窒化物半導体装置

Publications (1)

Publication Number Publication Date
CN118696416A true CN118696416A (zh) 2024-09-24

Family

ID=87578042

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280091589.3A Pending CN118696416A (zh) 2022-02-17 2022-12-19 氮化物半导体装置

Country Status (5)

Country Link
US (1) US20240405117A1 (https=)
JP (1) JPWO2023157452A1 (https=)
CN (1) CN118696416A (https=)
DE (1) DE112022006355T5 (https=)
WO (1) WO2023157452A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6014984B2 (ja) * 2011-09-29 2016-10-26 富士通株式会社 半導体装置及びその製造方法
JP2013157407A (ja) * 2012-01-27 2013-08-15 Fujitsu Semiconductor Ltd 化合物半導体装置及びその製造方法
JP2016139718A (ja) * 2015-01-28 2016-08-04 株式会社東芝 半導体装置
JP7095982B2 (ja) * 2017-12-07 2022-07-05 住友電工デバイス・イノベーション株式会社 半導体装置
US12550356B2 (en) * 2019-04-15 2026-02-10 Rohm Co. Ltd. Nitride semiconductor device and method for manufacturing same
CN110071173B (zh) * 2019-04-30 2023-04-18 英诺赛科(珠海)科技有限公司 半导体装置及其制造方法
US12501644B2 (en) * 2020-07-31 2025-12-16 Taiwan Semiconductor Manufacturing Co., Ltd. Gallium nitride-based device with step-wise field plate and method making the same

Also Published As

Publication number Publication date
DE112022006355T5 (de) 2024-10-24
WO2023157452A1 (ja) 2023-08-24
US20240405117A1 (en) 2024-12-05
JPWO2023157452A1 (https=) 2023-08-24

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