JPWO2023157452A1 - - Google Patents
Info
- Publication number
- JPWO2023157452A1 JPWO2023157452A1 JP2024500984A JP2024500984A JPWO2023157452A1 JP WO2023157452 A1 JPWO2023157452 A1 JP WO2023157452A1 JP 2024500984 A JP2024500984 A JP 2024500984A JP 2024500984 A JP2024500984 A JP 2024500984A JP WO2023157452 A1 JPWO2023157452 A1 JP WO2023157452A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/343—Gate regions of field-effect devices having PN junction gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/256—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/257—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are characterised by top-view geometrical layouts, e.g. interdigitated, semi-circular, annular or L-shaped electrodes
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022022919 | 2022-02-17 | ||
| PCT/JP2022/046702 WO2023157452A1 (ja) | 2022-02-17 | 2022-12-19 | 窒化物半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023157452A1 true JPWO2023157452A1 (https=) | 2023-08-24 |
| JPWO2023157452A5 JPWO2023157452A5 (https=) | 2024-10-23 |
Family
ID=87578042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024500984A Pending JPWO2023157452A1 (https=) | 2022-02-17 | 2022-12-19 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240405117A1 (https=) |
| JP (1) | JPWO2023157452A1 (https=) |
| CN (1) | CN118696416A (https=) |
| DE (1) | DE112022006355T5 (https=) |
| WO (1) | WO2023157452A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6014984B2 (ja) * | 2011-09-29 | 2016-10-26 | 富士通株式会社 | 半導体装置及びその製造方法 |
| JP2013157407A (ja) * | 2012-01-27 | 2013-08-15 | Fujitsu Semiconductor Ltd | 化合物半導体装置及びその製造方法 |
| JP2016139718A (ja) * | 2015-01-28 | 2016-08-04 | 株式会社東芝 | 半導体装置 |
| JP7095982B2 (ja) * | 2017-12-07 | 2022-07-05 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
| US12550356B2 (en) * | 2019-04-15 | 2026-02-10 | Rohm Co. Ltd. | Nitride semiconductor device and method for manufacturing same |
| CN110071173B (zh) * | 2019-04-30 | 2023-04-18 | 英诺赛科(珠海)科技有限公司 | 半导体装置及其制造方法 |
| US12501644B2 (en) * | 2020-07-31 | 2025-12-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gallium nitride-based device with step-wise field plate and method making the same |
-
2022
- 2022-12-19 DE DE112022006355.6T patent/DE112022006355T5/de active Pending
- 2022-12-19 JP JP2024500984A patent/JPWO2023157452A1/ja active Pending
- 2022-12-19 CN CN202280091589.3A patent/CN118696416A/zh active Pending
- 2022-12-19 WO PCT/JP2022/046702 patent/WO2023157452A1/ja not_active Ceased
-
2024
- 2024-08-09 US US18/798,932 patent/US20240405117A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE112022006355T5 (de) | 2024-10-24 |
| WO2023157452A1 (ja) | 2023-08-24 |
| CN118696416A (zh) | 2024-09-24 |
| US20240405117A1 (en) | 2024-12-05 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240725 |