CN118382811A - 探头 - Google Patents

探头 Download PDF

Info

Publication number
CN118382811A
CN118382811A CN202280081062.2A CN202280081062A CN118382811A CN 118382811 A CN118382811 A CN 118382811A CN 202280081062 A CN202280081062 A CN 202280081062A CN 118382811 A CN118382811 A CN 118382811A
Authority
CN
China
Prior art keywords
hole
plunger
tapered
probe
horizontal direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280081062.2A
Other languages
English (en)
Chinese (zh)
Inventor
清水祐辅
佐藤胜彦
奥野刚欣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokowo Co Ltd
Original Assignee
Yokowo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yokowo Co Ltd filed Critical Yokowo Co Ltd
Publication of CN118382811A publication Critical patent/CN118382811A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN202280081062.2A 2021-12-21 2022-11-02 探头 Pending CN118382811A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021206915 2021-12-21
JP2021-206915 2021-12-21
PCT/JP2022/040970 WO2023119897A1 (ja) 2021-12-21 2022-11-02 プローブヘッド

Publications (1)

Publication Number Publication Date
CN118382811A true CN118382811A (zh) 2024-07-23

Family

ID=86902033

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280081062.2A Pending CN118382811A (zh) 2021-12-21 2022-11-02 探头

Country Status (5)

Country Link
US (1) US20250060393A1 (https=)
JP (1) JPWO2023119897A1 (https=)
CN (1) CN118382811A (https=)
TW (1) TW202326149A (https=)
WO (1) WO2023119897A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7734517B2 (ja) * 2021-06-24 2025-09-05 株式会社ヨコオ ソケット

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006300581A (ja) * 2005-04-18 2006-11-02 Yokowo Co Ltd プローブの組付け構造
US8493085B2 (en) * 2009-03-27 2013-07-23 Essai, Inc. Spring contact pin for an ic test socket and the like
KR101415722B1 (ko) * 2010-06-25 2014-07-25 니혼 하츠쵸 가부시키가이샤 콘택트 프로브 및 프로브 유닛
WO2015122472A1 (ja) * 2014-02-13 2015-08-20 日本発條株式会社 プローブユニット
JP2020165803A (ja) * 2019-03-29 2020-10-08 山一電機株式会社 コンタクトプローブ及びこれを備えた検査用ソケット
JP7335507B2 (ja) * 2019-12-10 2023-08-30 山一電機株式会社 検査用ソケット
JP7602112B2 (ja) * 2020-11-17 2024-12-18 山一電機株式会社 検査用ソケット
JP7734517B2 (ja) * 2021-06-24 2025-09-05 株式会社ヨコオ ソケット
JP7605717B2 (ja) * 2021-09-02 2024-12-24 山一電機株式会社 プローブ及び検査用ソケット

Also Published As

Publication number Publication date
WO2023119897A1 (ja) 2023-06-29
TW202326149A (zh) 2023-07-01
US20250060393A1 (en) 2025-02-20
JPWO2023119897A1 (https=) 2023-06-29

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