CN118355077A - 树脂组合物、层叠片、预浸体、硬化物、带硬化物的基板及电子机器 - Google Patents

树脂组合物、层叠片、预浸体、硬化物、带硬化物的基板及电子机器 Download PDF

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Publication number
CN118355077A
CN118355077A CN202280080896.1A CN202280080896A CN118355077A CN 118355077 A CN118355077 A CN 118355077A CN 202280080896 A CN202280080896 A CN 202280080896A CN 118355077 A CN118355077 A CN 118355077A
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compound
group
resin composition
resin
acid
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Chinese (zh)
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阪口豪
曽根田裕士
宇佐勇贵
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Aitiansi Co ltd
Toyochem Co Ltd
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Aitiansi Co ltd
Toyochem Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
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    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
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    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
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    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
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    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
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    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
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    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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  • Engineering & Computer Science (AREA)
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  • Reinforced Plastic Materials (AREA)
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CN202280080896.1A 2021-12-27 2022-12-15 树脂组合物、层叠片、预浸体、硬化物、带硬化物的基板及电子机器 Pending CN118355077A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021213179A JP7196275B1 (ja) 2021-12-27 2021-12-27 樹脂組成物、積層シート、プリプレグ、硬化物、硬化物付基板および電子機器
JP2021-213179 2021-12-27
PCT/JP2022/046199 WO2023127523A1 (ja) 2021-12-27 2022-12-15 樹脂組成物、積層シート、プリプレグ、硬化物、硬化物付基板および電子機器

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CN118355077A true CN118355077A (zh) 2024-07-16

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CN202280080896.1A Pending CN118355077A (zh) 2021-12-27 2022-12-15 树脂组合物、层叠片、预浸体、硬化物、带硬化物的基板及电子机器

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JP (3) JP7196275B1 (ja)
KR (1) KR20240124940A (ja)
CN (1) CN118355077A (ja)
TW (1) TWI832614B (ja)
WO (1) WO2023127523A1 (ja)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5534378B2 (ja) 2012-02-24 2014-06-25 荒川化学工業株式会社 ポリイミド系接着剤組成物、硬化物、接着シート、積層体、フレキシブルプリント基板
JP2015117278A (ja) 2013-12-17 2015-06-25 株式会社ティ−アンドケイ東華 官能基化ポリイミド樹脂及びそれを含むエポキシ樹脂組成物
JP6686619B2 (ja) 2015-03-30 2020-04-22 荒川化学工業株式会社 ポリイミド系接着剤、フィルム状接着材、接着層、接着シート、銅張積層板及びプリント配線板、並びに多層配線板及びその製造方法
KR20190059872A (ko) * 2016-09-29 2019-05-31 세키스이가가쿠 고교가부시키가이샤 층간 절연 재료 및 다층 프린트 배선판
JP2019119755A (ja) 2017-12-28 2019-07-22 日鉄ケミカル＆マテリアル株式会社 光電表示装置形成用ポリイミド原料のジアミン化合物、これを用いたポリアミド酸及びポリイミド
KR20200138165A (ko) 2018-03-28 2020-12-09 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 접착제, 접착 필름, 회로 기판, 층간 절연 재료, 및 프린트 배선판
JP6660513B1 (ja) 2018-03-28 2020-03-11 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7474064B2 (ja) 2019-02-18 2024-04-24 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP7135970B2 (ja) 2019-03-27 2022-09-13 味の素株式会社 樹脂組成物
JP7563913B2 (ja) 2019-08-01 2024-10-08 積水化学工業株式会社 樹脂材料及び多層プリント配線板
JP2021042340A (ja) * 2019-09-13 2021-03-18 味の素株式会社 樹脂組成物
JP2021070824A (ja) * 2019-10-29 2021-05-06 日鉄ケミカル＆マテリアル株式会社 ポリイミド組成物、樹脂フィルム、積層体、カバーレイフィルム、樹脂付き銅箔、金属張積層板及び回路基板
JP6791428B2 (ja) 2020-07-17 2020-11-25 味の素株式会社 樹脂組成物
JP7400678B2 (ja) * 2020-09-25 2023-12-19 東洋インキＳｃホールディングス株式会社 熱硬化性組成物、熱硬化性シート、硬化物、硬化シートおよびプリント配線板
JP6981522B1 (ja) 2020-12-15 2021-12-15 東洋インキＳｃホールディングス株式会社 熱硬化性樹脂組成物、およびその利用

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JP2023097359A (ja) 2023-07-07
TWI832614B (zh) 2024-02-11
TW202325799A (zh) 2023-07-01
WO2023127523A1 (ja) 2023-07-06
KR20240124940A (ko) 2024-08-19
JPWO2023127523A1 (ja) 2023-07-06
JP7196275B1 (ja) 2022-12-26
JP2023097050A (ja) 2023-07-07

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