CN118288677A - Marking device for semiconductor package - Google Patents
Marking device for semiconductor package Download PDFInfo
- Publication number
- CN118288677A CN118288677A CN202410366637.6A CN202410366637A CN118288677A CN 118288677 A CN118288677 A CN 118288677A CN 202410366637 A CN202410366637 A CN 202410366637A CN 118288677 A CN118288677 A CN 118288677A
- Authority
- CN
- China
- Prior art keywords
- frame
- dust collection
- plate
- marking
- steel balls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 239000000428 dust Substances 0.000 claims abstract description 39
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 18
- 239000010959 steel Substances 0.000 claims abstract description 18
- 238000005498 polishing Methods 0.000 claims description 19
- 230000007246 mechanism Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 9
- 230000009471 action Effects 0.000 abstract description 6
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 description 11
- 238000003915 air pollution Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 238000007517 polishing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 239000003550 marker Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The invention discloses a marking device for semiconductor packaging, wherein electromagnetic slide rails are arranged on two opposite inner walls of a first frame, a second frame and a third frame respectively, and the electromagnetic slide rails positioned on the inner walls of the same side of the first frame, the second frame and the third frame are communicated; a motor is arranged on one side of the support plate, which is opposite to the second frame, the output shaft of the motor is connected with a first gear, and a turntable is rotatably arranged on the support plate; the supporting plate is provided with a circular chute, a plurality of steel balls are rotatably arranged in the chute along the circumferential direction, and the turntable is embedded in the chute and is rotatably connected with the supporting plate through the steel balls; the baffle is provided with an air nozzle, and a dust collection bin is arranged below the third frame and is in through connection with the air nozzle through a first air pipe. The marking device for the semiconductor package has smoother overturning action and better position accuracy of stopping in the overturning process, thereby ensuring the quality and accuracy of double-sided marking.
Description
Technical Field
The invention relates to the field of semiconductor device packaging, in particular to a marking device for semiconductor packaging.
Background
The semiconductor device is an electronic device with conductivity between good conductor and insulator, and uses the special electric property of semiconductor material to implement specific function, and can be used for producing, controlling, receiving, converting, amplifying signal and making energy conversion.
The marking in the existing semiconductor device packaging process can only be carried out face by face, the semiconductor device still needs to be turned over manually after one face of the semiconductor device is marked, the operation is troublesome, and in the existing semiconductor device deburring process, plastic scraps are not collected intensively, so that scraps splash, harm is generated to the body of staff, and later cleaning is difficult.
Disclosure of Invention
The invention aims at: in order to solve the problems that the prior semiconductor device packaging and marking cannot be performed in double-sided marking and the prior semiconductor device deburring does not collect scraps, the marking device for the semiconductor packaging is provided.
In order to achieve the above purpose, the invention adopts the following technical scheme: the marking device for the semiconductor package comprises a supporting plate, a first frame, a second frame, a third frame, a marking device and a polishing mechanism, wherein the first frame, the second frame and the third frame are sequentially connected and arranged on the same side of the supporting plate, the marking device is arranged above the second frame, and the polishing mechanism is arranged above the third frame;
Two opposite inner walls of the first frame, the second frame and the third frame are respectively provided with an electromagnetic slide rail, the electromagnetic slide rails positioned on the inner walls of the same side of the first frame, the second frame and the third frame are communicated, and a moving block is connected between the oppositely arranged electromagnetic slide rails;
a motor is arranged on one side of the supporting plate, which is opposite to the second frame, the output shaft of the motor is connected with a first gear, a rotary table is rotatably arranged on the supporting plate, a second gear is arranged on one side surface of the rotary table opposite to the second frame, the second gear is meshed with the first gear, at least two connecting blocks are arranged on the other side surface of the rotary table, and the connecting blocks are fixedly connected with the second frame;
The supporting plate is provided with a circular chute, a plurality of steel balls are rotatably arranged in the chute along the circumferential direction, and the turntable is embedded in the chute and is rotatably connected with the supporting plate through the steel balls;
The polishing mechanism comprises a top plate and a polishing head movably arranged below the top plate, one side of the top plate is fixedly connected with the supporting plate, a baffle is arranged on the other side of the top plate, and the baffle is arranged on the third frame;
The dust collection device comprises a baffle, a dust collection bin, a dust collection plate, a negative pressure fan, a first filter screen and a second filter screen, wherein the dust collection bin is arranged below the third frame and is in through connection with the wind nozzle through a first air pipe;
the number of the steel balls is 18, the 18 steel balls are arranged at equal intervals along the circumferential direction, a plurality of sliding blocks corresponding to the electromagnetic sliding rails are arranged on the two side surfaces of the moving block, and a plurality of through grooves are formed in the moving block.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, support columns are connected below the first frame and the third frame.
2. In the scheme, the sliding block is in sliding connection with the electromagnetic sliding rail.
3. In the above scheme, the through groove is connected with the semiconductor device in a clamping way.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. The marking device for the semiconductor package realizes the rotation of the second frame, so that the moving block moving into the second frame can be overturned, the double-sided marking of the semiconductor device arranged in the moving block is automatically realized without manual intervention for overturning, the marking precision can be prevented from being influenced by errors caused by manual overturning, the labor and the operation time can be saved, and the operation efficiency can be improved; in addition, be provided with a ring shape spout in its backup pad, rotationally be provided with a plurality of steel balls along circumference in this spout, the carousel imbeds in this spout and pass through steel ball and backup pad rotate and be connected, on the basis that the second frame can overturn, reduced the resistance of second frame upset in-process for the upset action of second frame is smoother and the position accuracy that the in-process was stopped is better, thereby guarantees the quality and the precision of two-sided marking.
2. The marking device for the semiconductor package provided by the invention realizes the polishing of the semiconductor device moving to the third frame, enriches the connotation of the device, improves the automation degree of the processing of the semiconductor device, and can also avoid the splashing of scraps generated in the polishing process; in addition, open there is a tuyere on its baffle, third frame below is provided with a dust absorption storehouse, this dust absorption storehouse through a first tuber pipe with the tuyere link up and be connected, be provided with a negative pressure fan in the dust absorption storehouse, through negative pressure fan and dust absorption storehouse, can absorb the piece that produces in the process of polishing to the inside in dust absorption storehouse, avoid the piece to cause air pollution to influence staff healthy, can also avoid later stage cleanup crew to clear up the difficulty simultaneously.
3. According to the marking device for semiconductor encapsulation, the first filter screen and the second filter screen are respectively arranged on the two sides of the negative pressure fan, the first filter screen is positioned on one side, close to the first air pipe, of the negative pressure fan, and through the arrangement of the two filter screens, not only can the fan failure caused by the fact that scraps in the dust collection bin enter the fan to block the fan be avoided, but also circulation with external air can be ensured, so that the negative pressure fan can continuously and stably work, and further high-efficiency absorption of polishing scraps is ensured; further, a dust collecting plate is arranged below the third frame, a through hole is formed in the dust collecting plate and is in through connection with the dust collection bin through a second air pipe, and the dust collecting plate and the second air pipe are arranged on the basis of the first air pipe, so that the first air pipe can further miss the re-absorption of unincorporated scraps, the comprehensive absorption of scraps generated in the grinding process is ensured, and the situations that the physical health of workers is affected by the scraps and the later cleaning is difficult due to air pollution are avoided.
Drawings
FIG. 1 is a schematic diagram of a marking apparatus for semiconductor packages according to the present invention;
fig. 2 is a schematic diagram of a motor connection structure of the marking apparatus for semiconductor package according to the present invention;
Fig. 3 is a cross-sectional view of a support plate of the marking apparatus for semiconductor packages of the present invention;
FIG. 4 is a cross-sectional view of a suction bin of the marking device for semiconductor packages of the present invention;
FIG. 5 is a schematic view of the connection structure of the dust collection bin of the marking device for semiconductor package of the present invention;
Fig. 6 is a schematic view showing a partial structure of a marking device for semiconductor package according to the present invention.
In the above figures: 1. a support plate; 2. a first frame; 3. a second frame; 4. a third frame; 5. an electromagnetic slide rail; 6. a moving block; 7. a marker; 8. a motor; 9. a first gear; 10. a turntable; 11. a second gear; 12. a connecting block; 13. steel balls; 14. a polishing mechanism; 141. a top plate; 15. a dust collection bin; 16. a first air duct; 17. a tuyere; 18. a second air duct; 19. a dust collecting plate; 20. a through hole; 22. a first filter screen; 23. a negative pressure fan; 24. a second filter screen; 25. a chute; 26. and a baffle.
Detailed Description
The present patent will be further understood by the specific examples given below, which are not intended to be limiting.
Examples: the marking device for the semiconductor package comprises a supporting plate 1, a first frame 2, a second frame 3, a third frame 4, a marking device 7 and a polishing mechanism 14, wherein the first frame 2, the second frame 3 and the third frame 4 are sequentially connected and arranged on the same side of the supporting plate 1, the marking device 7 is arranged above the second frame 3, and the polishing mechanism 14 is arranged above the third frame 4;
Two opposite inner walls of the first frame 2, the second frame 3 and the third frame 4 are respectively provided with an electromagnetic slide rail 5, the electromagnetic slide rails 5 positioned on the same side of the inner walls of the first frame 2, the second frame 3 and the third frame 4 are communicated, a moving block 6 is connected between the oppositely arranged electromagnetic slide rails 5, and the moving block 6 can slide between the first frame 2, the second frame 3 and the third frame 4 along the electromagnetic slide rails 5;
A motor 8 is arranged on one side of the support plate 1, which is opposite to the second frame 3, a first gear 9 is connected to an output shaft of the motor 8, a rotary table 10 is rotatably arranged on the support plate 1, a second gear 11 is arranged on one side surface of the rotary table 10, which is opposite to the second frame 3, the second gear 11 is meshed with the first gear 9, at least two connecting blocks 12 are arranged on the other side surface of the rotary table 10, the connecting blocks 12 are fixedly connected with the second frame 3, and the second frame 3 is driven to rotate by the connecting blocks 12;
The supporting plate 1 is provided with a circular chute 25, a plurality of steel balls 13 are rotatably arranged in the chute 25 along the circumferential direction, and the turntable 10 is embedded in the chute 25 and is rotatably connected with the supporting plate 1 through the steel balls 13;
the polishing mechanism 14 comprises a top plate 141 and a polishing head movably arranged below the top plate 141, one side of the top plate 141 is fixedly connected with the supporting plate 1, the other side of the top plate 141 is provided with a baffle plate 26, and the baffle plate 26 is arranged on the third frame 4;
The baffle 26 is provided with a wind nozzle 17, a dust collection bin 15 is arranged below the third frame 4, the dust collection bin 15 is in through connection with the wind nozzle 17 through a first air pipe 16, a negative pressure fan 23 is arranged in the dust collection bin 15, a first filter screen 22 and a second filter screen 24 are respectively arranged on two sides of the negative pressure fan 23, the first filter screen 22 is positioned on one side, close to the first air pipe 16, of the negative pressure fan 23, the mesh diameter of the first filter screen 22 is smaller than that of the second filter screen 24, a dust collection plate 19 is arranged below the third frame 4, a through hole 20 is formed in the dust collection plate 19, and the through hole 20 is in through connection with the dust collection bin 15 through a second air pipe 18.
The second frame 3 and the third frame 4 are rectangular frames formed by sequentially connecting four beam bodies end to end; support columns are connected below the first frame 2 and the third frame 4; the dust collecting plate 19 is installed on the support column below the third frame 4;
the number of the steel balls 13 is 18, and the 18 steel balls 13 are arranged at equal intervals along the circumferential direction; a plurality of sliding blocks corresponding to the electromagnetic sliding rails 5 are arranged on the two side surfaces of the moving block 6, and the sliding blocks are in sliding connection with the electromagnetic sliding rails 5; the moving block 6 is provided with a plurality of through grooves which are connected with the semiconductor device in a clamping way.
Working principle: when in use, an external power supply is needed to be connected, the external power supply provides electric energy for the device, so that the device can normally operate, a semiconductor device is placed in a cavity inside the moving block 6, is clamped with the moving block 6, is not easy to fall off, then the electromagnetic sliding rail 5 is started, the moving block 6 slides inside the first frame 2, the second frame 3 and the third frame 4 under the action of the electromagnetic sliding rail 5, when the moving block 6 enters the second frame 3 from the first frame 2, the marker 7 marks one side of the semiconductor, after all marking is finished, the motor 8 is started, the motor 8 rotates to drive the first gear 9 to rotate, the first gear 9 rotates to drive the second gear 11 meshed with the first gear to rotate, the rotation of the second gear 11 can drive the rotary table 10 to rotate inside the supporting plate 1, the rotating process is smoother under the action of the sliding groove 25 and the steel balls 13, the rotating of the rotary table 10 can drive the second frame 3 fixedly connected with the rotary table to rotate, so that the second frame 3 overturns, the overturned second frame 3 overturns the other side of the semiconductor, the marking device 7 marks the other side of the semiconductor, the two sides of the semiconductor are marked, the process is simple, when the marking is finished, the moving block 6 moves forward, when moving to the inside of the third frame 4, the moving block is polished by the polishing mechanism 14, a part of chips generated by polishing can enter the inside of the dust collection bin 15 through the air nozzle 17 and the first air pipe 16 under the action of the negative pressure fan 23, and a part of chips can fall into the second air pipe 18 in the dust collection plate 19 to be transported to the inside of the dust collection bin 15.
When the marking device for the semiconductor package is adopted, the second frame is rotated, so that the moving block which moves into the second frame can be overturned, double-sided marking of the semiconductor device which is arranged in the moving block is automatically realized without manual intervention for overturning, the marking precision can be prevented from being influenced by errors caused by manual overturning, the labor and the operation time can be saved, and the operation efficiency can be improved; in addition, on the basis that the second frame can be overturned, the resistance in the overturning process of the second frame is reduced, so that the overturning action of the second frame is smoother, the position accuracy of stopping in the overturning process is better, and the quality and the accuracy of double-sided marking are ensured;
In addition, the polishing of the semiconductor device moving to the third frame is realized, the connotation of the device is enriched, the degree of automation of the processing of the semiconductor device is improved, and the splashing of scraps generated in the polishing process can be avoided; the negative pressure fan and the dust collection bin can absorb scraps generated in the polishing process into the dust collection bin, so that the influence of air pollution caused by the scraps on the health of staff is avoided, and meanwhile, the difficulty in cleaning of later-stage cleaning staff can be avoided;
furthermore, by arranging the two filter screens, not only can the fan fault caused by the fact that scraps in the dust collection bin enter the fan to block the fan be avoided, but also the circulation of the dust collection bin and external air can be ensured, so that the negative pressure fan can continuously and stably work, and further the high-efficiency absorption of polished scraps is ensured; in addition, set up dust collecting plate and second tuber pipe on the basis of first tuber pipe, can further miss the absorption once more of the not inhaled piece of first tuber pipe, guarantee the comprehensive absorption to the piece that produces in the grinding process, avoid the piece to cause the circumstances such as the healthy and later stage clearance difficulty of air pollution influence staff.
The above embodiments are provided to illustrate the technical concept and features of the present invention and are intended to enable those skilled in the art to understand the content of the present invention and implement the same, and are not intended to limit the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (4)
1. A marking apparatus for a semiconductor package, characterized by: the automatic marking device comprises a supporting plate (1), a first frame (2), a second frame (3), a third frame (4), a marking device (7) and a polishing mechanism (14), wherein the first frame (2), the second frame (3) and the third frame (4) are sequentially connected and arranged on the same side of the supporting plate (1), the marking device (7) is arranged above the second frame (3), and the polishing mechanism (14) is arranged above the third frame (4);
Two opposite inner walls of the first frame (2), the second frame (3) and the third frame (4) are respectively provided with an electromagnetic slide rail (5), the electromagnetic slide rails (5) positioned on the same side inner wall of the first frame (2), the second frame (3) and the third frame (4) are communicated, and a moving block (6) is connected between the oppositely arranged electromagnetic slide rails (5);
a motor (8) is arranged on one side of the support plate (1) opposite to the second frame (3), a first gear (9) is connected to an output shaft of the motor (8), a rotary table (10) is rotatably arranged on the support plate (1), a second gear (11) is arranged on one side surface of the rotary table (10) opposite to the second frame (3), the second gear (11) is meshed with the first gear (9), at least two connecting blocks (12) are arranged on the other side surface of the rotary table (10), and the connecting blocks (12) are fixedly connected with the second frame (3);
the support plate (1) is provided with a circular chute (25), a plurality of steel balls (13) are rotatably arranged in the chute (25) along the circumferential direction, and the turntable (10) is embedded in the chute (25) and is in rotary connection with the support plate (1) through the steel balls (13);
The polishing mechanism (14) comprises a top plate (141) and a polishing head movably arranged below the top plate (141), one side of the top plate (141) is fixedly connected with the supporting plate (1), the other side of the top plate (141) is provided with a baffle plate (26), and the baffle plate (26) is arranged on the third frame (4);
A wind nozzle (17) is arranged on the baffle (26), a dust collection bin (15) is arranged below the third frame (4), the dust collection bin (15) is in through connection with the wind nozzle (17) through a first air pipe (16), a negative pressure fan (23) is arranged in the dust collection bin (15), a first filter screen (22) and a second filter screen (24) are respectively arranged on two sides of the negative pressure fan (23), the first filter screen (22) is positioned on one side, close to the first air pipe (16), of the negative pressure fan (23), the mesh diameter of the first filter screen (22) is smaller than that of the second filter screen (24), a dust collection plate (19) is arranged below the third frame (4), and a through hole (20) is arranged on the dust collection plate (19), and the through hole (20) is in through connection with the dust collection bin (15) through a second air pipe (18).
The number of the steel balls (13) is 18, the 18 steel balls (13) are arranged at equal intervals along the circumferential direction, a plurality of sliding blocks corresponding to the electromagnetic sliding rail (5) are arranged on the two side surfaces of the moving block (6), and a plurality of through grooves are formed in the moving block (6).
2. The marking apparatus for semiconductor packages as claimed in claim 1, wherein: the sliding block is in sliding connection with the electromagnetic sliding rail (5).
3. The marking apparatus for semiconductor packages as claimed in claim 1, wherein: and support columns are connected below the first frame (2) and the third frame (4).
4. The marking apparatus for semiconductor packages as claimed in claim 1, wherein: the through groove is connected with the semiconductor device in a clamping way.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410366637.6A CN118288677A (en) | 2019-11-27 | 2019-11-27 | Marking device for semiconductor package |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911180523.8A CN112864041B (en) | 2019-11-27 | 2019-11-27 | Semiconductor device packaging device |
| CN202410366637.6A CN118288677A (en) | 2019-11-27 | 2019-11-27 | Marking device for semiconductor package |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911180523.8A Division CN112864041B (en) | 2019-11-27 | 2019-11-27 | Semiconductor device packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118288677A true CN118288677A (en) | 2024-07-05 |
Family
ID=75985518
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410366637.6A Pending CN118288677A (en) | 2019-11-27 | 2019-11-27 | Marking device for semiconductor package |
| CN202410370509.9A Pending CN118342386A (en) | 2019-11-27 | 2019-11-27 | High-precision semiconductor device manufacturing apparatus |
| CN201911180523.8A Active CN112864041B (en) | 2019-11-27 | 2019-11-27 | Semiconductor device packaging device |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410370509.9A Pending CN118342386A (en) | 2019-11-27 | 2019-11-27 | High-precision semiconductor device manufacturing apparatus |
| CN201911180523.8A Active CN112864041B (en) | 2019-11-27 | 2019-11-27 | Semiconductor device packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (3) | CN118288677A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113451180B (en) * | 2021-07-12 | 2022-09-02 | 深圳市宸芯科技有限公司 | Packaging plastic packaging equipment with peculiar smell removing function for integrated circuit |
| CN116237577A (en) * | 2023-02-08 | 2023-06-09 | 徐州尚航船舶配件有限公司 | Multi-angle dustproof cutting device for metal processing |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100814448B1 (en) * | 2003-12-12 | 2008-03-17 | 한미반도체 주식회사 | dry system of semiconductor package |
| KR101992263B1 (en) * | 2017-11-01 | 2019-06-25 | 박경화 | Recycling method for semiconductor package and recycling semiconductor package |
| CN108565233B (en) * | 2018-05-25 | 2023-12-08 | 重庆市嘉凌新科技有限公司 | Semiconductor device packaging device |
| CN109273375B (en) * | 2018-09-10 | 2020-04-17 | 无锡豪帮高科股份有限公司 | MCM integrated circuit packaging method fusing SMT |
-
2019
- 2019-11-27 CN CN202410366637.6A patent/CN118288677A/en active Pending
- 2019-11-27 CN CN202410370509.9A patent/CN118342386A/en active Pending
- 2019-11-27 CN CN201911180523.8A patent/CN112864041B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN112864041B (en) | 2024-03-22 |
| CN118342386A (en) | 2024-07-16 |
| CN112864041A (en) | 2021-05-28 |
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