CN118280946A - Microchannel radiator and system with variable cross-section manifold and scaling channel - Google Patents
Microchannel radiator and system with variable cross-section manifold and scaling channelInfo
- Publication number
- CN118280946A CN118280946A CN202410400635.4A CN202410400635A CN118280946A CN 118280946 A CN118280946 A CN 118280946A CN 202410400635 A CN202410400635 A CN 202410400635A CN 118280946 A CN118280946 A CN 118280946A
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- Prior art keywords
- section
- manifold
- working medium
- channel
- variable cross
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- 239000000758 substrate Substances 0.000 claims abstract description 21
- 230000002829 reductive effect Effects 0.000 claims abstract description 8
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical group O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000003486 chemical etching Methods 0.000 claims description 3
- 238000010329 laser etching Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims 1
- 230000008602 contraction Effects 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 13
- 239000012530 fluid Substances 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000002826 coolant Substances 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Abstract
The invention discloses a microchannel radiator with a variable cross-section manifold and a scaling channel and a system, wherein the microchannel radiator is a closed radiator shell, an upper cover plate, a manifold shunt, the variable cross-section scaling microchannel and a heat conducting substrate are sequentially stacked, the manifold shunt comprises a working medium inlet manifold and a working medium outlet manifold which are alternately distributed, and the cross section of the inlet manifold is gradually reduced along the inflow direction of working medium; a variable cross-section scaling micro-channel comprises a plurality of parallel sub-channels, wherein the sub-channels comprise convergence sections and divergence sections which are alternately distributed; the working medium inlet manifold is communicated with the beginning end of the converging section and the end of the diverging section, and the working medium outlet manifold is communicated with the end of the converging section and the beginning end of the diverging section; the surface of the heat conducting substrate far away from the variable-section scaling micro-channel is contacted with the high-performance electronic chip; according to the invention, the local resistance of the working medium flowing into each micro-channel from the manifold is regulated, so that the uniformity of flow distribution of the working medium is effectively improved; the temperature gradient of the flow direction of the micro-channel is reduced by alternately arranging the contraction sections and the divergence sections of the micro-channel.
Description
Technical Field
The invention belongs to the technical field of micro-channel heat dissipation, and particularly relates to a micro-channel heat radiator with a variable cross-section manifold and a scaling channel.
Background
With the continuous development of electronic devices in the directions of miniaturization, high power and high integration, the heat flux density per unit chip area has exceeded 100W cm -2, and the local heat flux density is even above 1000W cm -2. Such high heat flux density exceeds the upper limit of the conventional air-cooled cooling capacity, and in view of reducing the energy consumption of the cooling system and avoiding the failure of electronic equipment caused by local high temperature, a new efficient and energy-saving cooling mode needs to be developed.
Liquid media with higher specific heat capacities exhibit more excellent cooling capacity than air, and liquid-based cooling systems can better dissipate heat. Liquid cooling technology has become the key to solve the heat dissipation of high-power electronic devices nowadays, and in all liquid cooling schemes, microchannel cooling technology has good application prospect. The microchannel radiator has the advantages of large specific surface area, strong unit heat exchange capability and miniaturization, and is very suitable for being applied to heat dissipation of small electronic equipment with high heat flux density. The problem of significant temperature differences in the heat sink has not yet been adequately addressed. On the one hand, conventional rectangular manifolds do not deliver coolant uniformly to the individual flow channels, which results in uneven temperature distribution along the manifold flow direction; on the other hand, the jet impingement zone below the inlet manifold has a very high local heat transfer coefficient, but with the flow of fluid, the temperature gradient along the flow direction of the microchannel is caused by the gradual thickening of the boundary layer, the gradual rise in temperature, and the presence of stagnation zones at the outlets. The uneven distribution of temperature is easy to promote local hot spots, which brings great challenges to the safe and stable operation of electronic products.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide a micro-channel radiator with a variable-section manifold and a scaling channel, which improves the cooling capacity of the radiator, improves the temperature uniformity and greatly reduces the local hot spot temperature on the basis of not obviously increasing the pumping power consumption.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: the micro-channel radiator is characterized by comprising an airtight radiator shell, an upper cover plate, a manifold flow divider, variable-section zooming micro-channels and a heat conducting substrate, wherein the manifold flow divider comprises working medium inlet manifolds and working medium outlet manifolds which are alternately distributed, the section of the inlet manifolds is gradually reduced along the inflow direction of working medium, and the section of the outlet manifolds is unchanged along the flow direction of working medium; the variable cross-section scaling micro-channel comprises a plurality of sub-channels which are arranged in parallel, and each sub-channel comprises converging sections and diverging sections which are alternately distributed; the axial directions of the working medium inlet manifold and the working medium outlet manifold are perpendicular to the axial direction of the sub-channel; the working medium inlet manifold is communicated with the beginning end of the converging section and the end of the diverging section, and the working medium outlet manifold is communicated with the end of the converging section and the beginning end of the diverging section; the surface of the heat conducting substrate far away from the variable-section scaling micro-channel is contacted with the high-performance electronic chip.
Further, the sections of the working medium inlet manifold and the working medium outlet manifold are rectangular, at least two working medium inlet manifolds are arranged, the working medium outlet manifolds and the working medium inlet manifold are arranged at intervals, and the widths of the working medium outlet manifolds at the two ends are half of the widths of the working medium outlet manifolds in the middle.
Further, the ratio of the cross-sectional area of the tail end of the working medium inlet manifold to the cross-sectional area of the primary end is 0.3-1.
Further, the variable cross-section scaled micro-channel is processed by a chemical etching or laser etching method.
Further, the manifold diverter and the variable cross-section scaled micro-channel are integrally processed or the manifold diverter, the variable cross-section scaled micro-channel and the heat conducting substrate are integrally processed and formed.
Further, the ratio of the minimum sectional area to the maximum sectional area of the variable-section scaling micro-channel along the flowing direction of the working medium is 0.2-1.
Further, the lengths of the converging section and the diverging section of the variable-section zooming channel are equal to the distance between the working medium inlet manifold and the working medium outlet manifold.
Furthermore, the upper cover plate, the manifold splitter, the variable-section scaling micro-channel and the heat conducting substrate are all made of silicon, and the working medium is deionized water or nanofluid.
Further, the joints of the upper cover plate, the manifold splitter, the variable-section scaling micro-channel and the heat conducting substrate are hermetically connected in a bonding mode.
The invention also provides a micro-channel heat dissipation system, and the heat radiator adopts the micro-channel heat radiator with the variable cross-section manifold and the scaling channels.
Compared with the prior art, the invention has at least the following beneficial effects: according to the invention, the conical manifold replaces a rectangular manifold, so that the micro-channels close to the tail end of the inlet manifold obtain more flow, the flow distribution of working media in each channel is more uniform, and the problem of uneven temperature of the micro-channels of the traditional manifold is effectively solved; the invention adopts the variable cross section zooming micro-channel with convergence-divergence sections alternated in turn to replace the equal cross section micro-channel, the fluid speed in the divergence sections is reduced, and the static pressure is increased; in the convergence section, the fluid speed is increased, the static pressure is reduced, the continuous change of the pressure gradient promotes the generation of vortex, and the heat transfer efficiency of the radiator is improved. In addition, the working medium below the outlet manifold has higher flow velocity through reasonable arrangement of the convergent section and the divergent section, so that the problem of heat exchange capacity deterioration caused by factors such as inlet effect and the like is solved, and the temperature uniformity of the flow direction of the micro-channel is effectively improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the manifold microchannel heat sink inlet of the present invention;
FIG. 2 is a schematic view of the overall structure of the manifold microchannel heat sink outlet of the present invention;
FIG. 3 is an exploded view of the top-down structure of the top cover plate to the base of the manifold microchannel heat sink of the present invention;
FIG. 4 is a schematic view of the substrate and heating area of the manifold microchannel heat sink of the present invention;
FIG. 5 is a top view of a manifold splitter inlet manifold of the manifold microchannel heat sink of the invention in a trapezoidal shape;
FIG. 6 is a top view of the manifold splitter inlet manifold of the manifold microchannel heat sink of the invention as it would be if it were tapered;
Fig. 7 is a top view of a variable cross-section scaled microchannel of a manifold microchannel heat sink of the invention.
In the drawings, 1-upper cover plate, 2-manifold splitter, 3-variable cross-section scaled micro-channel, 4-thermally conductive substrate, 201-inlet manifold, 202-complete outlet manifold, 203-half outlet manifold, 301-converging section, 302-diverging section.
Detailed Description
In order that the invention may be more clearly understood, the invention will be explained below with reference to the drawings in the examples. It is apparent that the described embodiments are only a few of the embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, the drawings provided in the present embodiment are only for illustrating the basic concept of the present invention by way of illustration, and only the components related to the manifold microchannel heat sink of the present invention are shown in the drawings, and are not drawn according to the number, shape and size of the components in actual implementation, and the shape, number and size ratio of the components in actual implementation may be changed accordingly according to actual needs.
As shown in fig. 1, 2 and 3, a microchannel radiator with a variable-section manifold and a scaling channel comprises an upper cover plate 1, a manifold splitter 2, a variable-section scaling microchannel 3 and a heat conducting substrate 4, wherein convergence-divergence sections of the variable-section scaling microchannel 3 and the heat conducting substrate 4 are sequentially alternated, and the upper cover plate 1, the manifold splitter 2, the variable-section scaling microchannel 3 and the heat conducting substrate 4 are sequentially overlapped and are in sealing connection through bonding. The upper cover plate 1 is arranged in parallel with the heat conducting substrate 4 and has the same shape and area, and the manifold splitter 2 is located between the variable-section scaled micro-channels 3 and the upper cover plate 1, and is responsible for distributing the cooling medium uniformly into the individual micro-channels below, and the manifold splitter 2 comprises two inlet manifolds 201, one complete outlet manifold 202 and two half outlet manifolds 203. The cooling medium flows into the radiator from the inlet manifold 201, and flows out from the complete outlet manifold 202 and the half outlet manifold 203 after cooling the high temperature heat source.
As shown in fig. 3, 4 and 5, the cross section of the inlet manifold 201 is any one of conical and trapezoidal, and the cross section gradually decreases along the inflow direction of the working medium; the cross section of the outlet manifold is rectangular, and the cross section area of the outlet manifold is kept unchanged along the outflow direction of working medium. Compared with the conventional manifold microchannel radiator, the tapered or trapezoidal inlet manifold 201 has larger flow resistance at the tail end, so that more cooling working medium flows into the front-end microchannels, and the problem of uneven flow distribution of the conventional manifold microchannel radiator can be effectively solved. In addition, it has been found that the tapered configuration of the complete outlet manifold 202 and the half outlet manifold 203 both adversely affects the flow distribution of the cooling medium and increases the pumping power consumption, and is therefore configured as a conventional rectangular configuration.
As shown in fig. 6, the variable-section scaling micro-channel 3 is composed of a plurality of converging sections 301 and diverging sections 302 which are alternately arranged end to end, and the ratio of the minimum sectional area to the maximum sectional area along the flowing direction of the working medium is 0.2-1. The decreasing fluid velocity in the diverging section 302 and the increasing static pressure, while the increasing fluid velocity in the converging section 301 and the decreasing static pressure, the constant change in pressure gradient promotes the generation of a return vortex, thereby improving the heat transfer efficiency of the radiator. The various channels in the variable-section scaling micro-channel 3 are arranged in parallel, and the lengths and the numbers of the converging section 301 and the diverging section 302 are related to the manifold diverter 2, so that the following conditions are satisfied: the cross-sectional area of the micro-channel below the inlet manifold 201 is larger, corresponding to the initial end 301 of the converging section and the end of the diverging section 302 of the micro-channel; the cross-sectional areas of the microchannels below the full outlet manifold 202 and half outlet manifold 203 are smaller, corresponding to the ends of the converging section 301 and the initial ends of the diverging section 302 of the microchannels. The arrangement ensures that the working medium below the outlet manifold has higher flow velocity, thereby solving the problem of deterioration of heat exchange capacity caused by factors such as inlet effect and the like and effectively improving the temperature uniformity of the flow direction of the micro-channel.
Further, the variable-section scaled micro-channel 3 is manufactured by chemical etching or laser etching, and the length of each of the converging section 301 and the diverging section 302 is 0.4-1.2 mm, which is equal to the distance between the inlet manifold and the outlet manifold.
As shown in fig. 7, the surface of the heat conducting substrate 4 far from the variable-section scaling micro-channel 3 is a heat source surface, and is in direct contact with the high-performance electronic chip.
Further, in terms of material selection, the cooling working medium can be deionized water or nano particles such as CuO and the like are added into the deionized water to form nano fluid, wherein compared with the deionized water, the nano fluid has a higher heat transfer coefficient. In order to avoid the influence of contact thermal resistance on the heat dissipation of the chip, the chip and the radiator are etched on the basis of the silicon chip, so that the cooling effect can be enhanced to a great extent, and the solid material is silicon.
Optionally, when the manifold shunt 2 and the variable-section scaling micro-channel 3 are integrally processed, no connection surface is generated between the manifold shunt 2 and the variable-section scaling micro-channel 3, and a thermal interface material TIM is not required to be added, so that on one hand, the tightness is improved, the heat sink contact thermal resistance is greatly reduced, the heat dissipation performance is also improved, the upper cover plate 1 and the manifold shunt 2 are in sealing connection in a bonding mode, and the heat conducting substrate 4 and the variable-section scaling micro-channel 3 are connected in a bonding mode.
Optionally, when the manifold shunt 2, the variable-section scaling micro-channel 3 and the heat conducting substrate 4 are integrally formed, a thermal interface material TIM does not need to be added, so that the heat sink contact thermal resistance is greatly reduced, and at the moment, the upper cover plate 1 and the manifold shunt 2 are in sealing connection in a bonding mode.
Through improvement of the existing microchannel radiator technology, the flow distribution of the radiator is effectively improved, the temperature uniformity and the heat transfer efficiency of the radiator are greatly improved, and meanwhile, experiments prove that the invention does not obviously increase the pump power consumption of the radiator and has the advantages of high specific surface area, miniaturization, simplicity in manufacturing and wide applicability.
The foregoing has described the principal features and principles of the present invention. It will be appreciated by those skilled in the art that the foregoing embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not in any way limiting of the invention. All other embodiments, which can be made by one of ordinary skill in the art without undue burden on the person of ordinary skill in the art based on the embodiments of the present invention, are intended to be encompassed within the scope of the present invention.
Claims (10)
1. The micro-channel radiator with the variable cross-section manifold and the scaling channels is characterized by comprising an airtight radiator shell, wherein the airtight radiator shell comprises an upper cover plate (1), a manifold splitter (2), variable cross-section scaling micro-channels (3) and a heat conducting substrate (4) which are sequentially stacked, the manifold splitter (2) comprises working medium inlet manifolds and working medium outlet manifolds which are alternately distributed, the cross section of the inlet manifolds is gradually reduced along the working medium inflow direction, and the cross section of the outlet manifolds is unchanged along the working medium flow direction; the variable cross-section scaling micro-channel comprises a plurality of sub-channels which are arranged in parallel, and each sub-channel comprises converging sections and diverging sections which are alternately distributed; the axial directions of the working medium inlet manifold and the working medium outlet manifold are perpendicular to the axial direction of the sub-channel; the working medium inlet manifold is communicated with the beginning end of the converging section (301) and the end of the diverging section (302), and the working medium outlet manifold is communicated with the end of the converging section (301) and the beginning end of the diverging section (302); the surface of the heat conducting substrate (4) far away from the variable-section scaling micro-channel (3) is contacted with a high-performance electronic chip.
2. The microchannel heat sink with variable cross section manifold and convergent-divergent channel as claimed in claim 1, wherein the cross section of the working medium inlet manifold and the working medium outlet manifold is rectangular, the working medium inlet manifold is provided with at least two working medium outlet manifolds, the working medium outlet manifolds are spaced from the working medium inlet manifold, and the widths of the working medium outlet manifolds at the two ends are half of the widths of the working medium outlet manifolds at the middle part.
3. The microchannel heat sink with variable cross-section manifold and scaled channels of claim 1, wherein the ratio of the cross-sectional area of the working medium inlet manifold end to the cross-sectional area of the primary end is 0.3-1.
4. The microchannel heat sink with variable cross-section manifold and scaled channels according to claim 1, characterized in that the variable cross-section scaled microchannels (3) are machined by chemical etching or laser etching methods.
5. The microchannel heat sink with variable cross-section manifold and scaled channels according to claim 1, characterized in that the manifold splitter (2) is integrally machined with the variable cross-section scaled microchannels (3) or the manifold splitter (2), the variable cross-section scaled microchannels (3) are integrally machined with the thermally conductive substrate (4).
6. The microchannel heat sink with variable cross-section manifold and scaled channels according to claim 1, characterized in that the ratio of the minimum cross-sectional area to the maximum cross-sectional area of the variable cross-section scaled microchannel (3) in the flow direction of the working medium is 0.2-1.
7. The microchannel heat sink with variable cross-section manifold and converging-diverging section of claim 1 wherein the converging section and diverging section of the variable cross-section converging-diverging section have a length equal to the separation of the working medium inlet manifold from the working medium outlet manifold.
8. The micro-channel radiator with the variable cross-section manifold and the scaling channel according to claim 1, wherein the upper cover plate (1), the manifold splitter (2), the variable cross-section scaling micro-channel (3) and the heat conducting substrate (4) are all made of silicon, and the working medium is deionized water or nanofluid.
9. The microchannel heat sink with variable cross-section manifold and scaled channels according to claim 1, characterized in that the joints of the upper cover plate (1), manifold splitter (2), variable cross-section scaled microchannels (3) and thermally conductive substrate (4) are sealingly connected by means of bonding.
10. A microchannel heat sink system wherein the heat sink employs a microchannel heat sink with a variable cross-section manifold and a scaling channel as defined in any one of claims 1-9.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118280946A true CN118280946A (en) | 2024-07-02 |
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