CN118102589A - 基板载具夹具 - Google Patents
基板载具夹具 Download PDFInfo
- Publication number
- CN118102589A CN118102589A CN202310819979.4A CN202310819979A CN118102589A CN 118102589 A CN118102589 A CN 118102589A CN 202310819979 A CN202310819979 A CN 202310819979A CN 118102589 A CN118102589 A CN 118102589A
- Authority
- CN
- China
- Prior art keywords
- substrate
- clamp
- substrate carrier
- frames
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 215
- 239000007788 liquid Substances 0.000 claims abstract description 25
- 238000007599 discharging Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000005530 etching Methods 0.000 abstract description 33
- 239000003814 drug Substances 0.000 abstract description 8
- 230000014759 maintenance of location Effects 0.000 abstract description 6
- 229940079593 drug Drugs 0.000 abstract 1
- 238000012545 processing Methods 0.000 description 23
- 238000012546 transfer Methods 0.000 description 23
- 238000000034 method Methods 0.000 description 10
- 230000009471 action Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000009977 dual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Weting (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2022-0160632 | 2022-11-25 | ||
| KR1020220160632A KR102538707B1 (ko) | 2022-11-25 | 2022-11-25 | 기판 캐리어 지그 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118102589A true CN118102589A (zh) | 2024-05-28 |
Family
ID=86770593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310819979.4A Pending CN118102589A (zh) | 2022-11-25 | 2023-07-05 | 基板载具夹具 |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102538707B1 (ko) |
| CN (1) | CN118102589A (ko) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100316307B1 (ko) * | 1998-05-26 | 2002-03-21 | 윤종용 | 홈을가진클램프를구비한기판냉각장치 |
| KR101038572B1 (ko) | 2009-06-05 | 2011-06-02 | 주식회사 엠엠테크 | 진공기판지그를 구비하는 기판 에칭시스템 |
| JP2015109363A (ja) * | 2013-12-05 | 2015-06-11 | 埼玉日本電気株式会社 | 基板搬送用治具、搬送装置及び搬送方法 |
| KR102507370B1 (ko) * | 2021-03-04 | 2023-03-07 | (주)한빛테크놀로지 | 반송용 지그 |
| KR102470535B1 (ko) | 2021-05-03 | 2022-11-28 | 주식회사 티케이씨 | 기판처리장비의 기판 파지용 지그장치 |
-
2022
- 2022-11-25 KR KR1020220160632A patent/KR102538707B1/ko active IP Right Grant
-
2023
- 2023-07-05 CN CN202310819979.4A patent/CN118102589A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR102538707B1 (ko) | 2023-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |