CN118048007A - 发光元件密封用树脂组合物、光源装置和光源装置的制造方法 - Google Patents

发光元件密封用树脂组合物、光源装置和光源装置的制造方法 Download PDF

Info

Publication number
CN118048007A
CN118048007A CN202410178990.1A CN202410178990A CN118048007A CN 118048007 A CN118048007 A CN 118048007A CN 202410178990 A CN202410178990 A CN 202410178990A CN 118048007 A CN118048007 A CN 118048007A
Authority
CN
China
Prior art keywords
polymer
resin composition
group
source device
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202410178990.1A
Other languages
English (en)
Chinese (zh)
Inventor
杉本直哉
川满昇一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN118048007A publication Critical patent/CN118048007A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/04—Anhydrides, e.g. cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L37/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K8/00—Compositions for drilling of boreholes or wells; Compositions for treating boreholes or wells, e.g. for completion or for remedial operations
    • C09K8/50—Compositions for plastering borehole walls, i.e. compositions for temporary consolidation of borehole walls
    • C09K8/516—Compositions for plastering borehole walls, i.e. compositions for temporary consolidation of borehole walls characterised by their form or by the form of their components, e.g. encapsulated material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN202410178990.1A 2019-07-31 2020-07-31 发光元件密封用树脂组合物、光源装置和光源装置的制造方法 Pending CN118048007A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-141644 2019-07-31
JP2019141644A JP7225054B2 (ja) 2019-07-31 2019-07-31 発光素子封止用樹脂組成物、光源装置及び光源装置の製造方法
PCT/JP2020/029453 WO2021020565A1 (ja) 2019-07-31 2020-07-31 発光素子封止用樹脂組成物、光源装置及び光源装置の製造方法
CN202080054074.7A CN114174416B (zh) 2019-07-31 2020-07-31 发光元件密封用树脂组合物、光源装置和光源装置的制造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202080054074.7A Division CN114174416B (zh) 2019-07-31 2020-07-31 发光元件密封用树脂组合物、光源装置和光源装置的制造方法

Publications (1)

Publication Number Publication Date
CN118048007A true CN118048007A (zh) 2024-05-17

Family

ID=74229705

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202080054074.7A Active CN114174416B (zh) 2019-07-31 2020-07-31 发光元件密封用树脂组合物、光源装置和光源装置的制造方法
CN202410178990.1A Pending CN118048007A (zh) 2019-07-31 2020-07-31 发光元件密封用树脂组合物、光源装置和光源装置的制造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN202080054074.7A Active CN114174416B (zh) 2019-07-31 2020-07-31 发光元件密封用树脂组合物、光源装置和光源装置的制造方法

Country Status (5)

Country Link
US (1) US20220262692A1 (ja)
JP (2) JP7225054B2 (ja)
CN (2) CN114174416B (ja)
TW (1) TW202112858A (ja)
WO (1) WO2021020565A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114945641A (zh) * 2020-01-08 2022-08-26 大金工业株式会社 含有氟聚合物的涂布用组合物
WO2023190793A1 (ja) * 2022-03-31 2023-10-05 日東電工株式会社 樹脂溶液の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3308107A (en) * 1965-04-30 1967-03-07 Du Pont Perfluoro(2-methylene-4-methyl-1, 3-dioxolane) and polymers thereof
JPH0819317B2 (ja) * 1988-08-29 1996-02-28 三菱レイヨン株式会社 重合体組成物及びそれを鞘材とする光フアイバ
KR20070009582A (ko) 2004-03-08 2007-01-18 아사히 가라스 가부시키가이샤 경화성 조성물 및 함불소 경화물의 제조 방법
JP5028901B2 (ja) * 2006-08-02 2012-09-19 Ｊｓｒ株式会社 環状オレフィン系樹脂組成物、該組成物を用いた光学フィルムおよび位相差板ならびにそれらの製造方法
KR101411682B1 (ko) 2010-11-10 2014-06-26 주식회사 엘지화학 다층 필름 및 이를 포함하는 광전지 모듈
JP2013087162A (ja) 2011-10-14 2013-05-13 Daikin Industries Ltd 含フッ素ポリマー、硬化性樹脂組成物、及び、硬化物
JP5972747B2 (ja) 2012-10-15 2016-08-17 富士フイルム株式会社 半導体発光装置用封止剤、これを用いた半導体発光装置用封止材及び半導体発光装置
US9450157B2 (en) * 2013-04-30 2016-09-20 Soko Kagaku Co., Ltd. Ultraviolet light emitting device using metal non-bondable amorphous fluororesin molding compound
JP6465113B2 (ja) * 2014-07-15 2019-02-06 Ａｇｃ株式会社 紫外線発光装置用接着剤および紫外線発光装置
US9753151B2 (en) 2015-07-31 2017-09-05 General Electric Company Light guide array for pet detector fabrication methods and apparatus

Also Published As

Publication number Publication date
CN114174416B (zh) 2024-03-01
TW202112858A (zh) 2021-04-01
WO2021020565A1 (ja) 2021-02-04
JP7225054B2 (ja) 2023-02-20
US20220262692A1 (en) 2022-08-18
JP2023059896A (ja) 2023-04-27
CN114174416A (zh) 2022-03-11
JP7432776B2 (ja) 2024-02-16
JP2021024901A (ja) 2021-02-22

Similar Documents

Publication Publication Date Title
JP7432776B2 (ja) 発光素子封止用樹脂組成物、光源装置及び光源装置の製造方法
EP2028200B1 (en) Curable composition and fluorine-containing cured product
RU2589449C1 (ru) Излучающий ультрафиолетовое излучение прибор
US10246615B2 (en) Ultraviolet-light-emitting device with adhesive having low glass transition temperature
JP6432524B2 (ja) 含フッ素架橋体の製造方法およびその使用
JP6642580B2 (ja) 含フッ素重合体、その製造方法、および含フッ素重合体の硬化物
JP6927283B2 (ja) 含フッ素重合体、その硬化物の製造方法および発光装置
KR20190004326A (ko) 개선된 내화학성을 갖는 발광기 디바이스 및 구성요소 및 관련 방법
KR20190091448A (ko) 조성물 및 유기 광전자 소자 그리고 그 제조 방법
TW201134838A (en) Curable fluorinated resin composition
JP2010123769A (ja) 発光装置及びその製造方法
TWI638040B (zh) Curable composition for optical semiconductor sealing and optical semiconductor device using the same
KR102411754B1 (ko) 함불소 중합체, 그 제조 방법, 및 함불소 중합체의 경화물을 구비하는 물품
JP5194431B2 (ja) 発光素子用封入剤および発光素子
TW201422715A (zh) 光半導體密封用硬化性組成物及使用此之光半導體裝置
TW201139472A (en) Fluoropolymer and curable fluorinated resin composition
CN118496406A (zh) 一种非晶氟聚合物及其制备方法和应用
TW202132366A (zh) 密封樹脂

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination