CN117943365A - Brush sheet packaging integrated machine - Google Patents
Brush sheet packaging integrated machine Download PDFInfo
- Publication number
- CN117943365A CN117943365A CN202410323087.XA CN202410323087A CN117943365A CN 117943365 A CN117943365 A CN 117943365A CN 202410323087 A CN202410323087 A CN 202410323087A CN 117943365 A CN117943365 A CN 117943365A
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- China
- Prior art keywords
- packaging
- wafer
- cleaning
- ring plate
- collecting ring
- Prior art date
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 140
- 238000004140 cleaning Methods 0.000 claims abstract description 139
- 235000012431 wafers Nutrition 0.000 claims abstract description 124
- 238000007599 discharging Methods 0.000 claims abstract description 46
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 239000007921 spray Substances 0.000 claims description 37
- 238000007664 blowing Methods 0.000 claims description 26
- 239000000126 substance Substances 0.000 claims description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 20
- 238000011084 recovery Methods 0.000 claims description 20
- 238000012856 packing Methods 0.000 claims description 18
- 230000001680 brushing effect Effects 0.000 claims description 16
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 14
- 238000011010 flushing procedure Methods 0.000 claims description 14
- 239000008367 deionised water Substances 0.000 claims description 13
- 229910021641 deionized water Inorganic materials 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 11
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 9
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 8
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 7
- 238000011068 loading method Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 8
- 238000012858 packaging process Methods 0.000 abstract description 8
- 230000009471 action Effects 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 2
- 239000012535 impurity Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 230000003749 cleanliness Effects 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 238000011049 filling Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000009461 vacuum packaging Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B17/00—Methods preventing fouling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B55/00—Preserving, protecting or purifying packages or package contents in association with packaging
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a brush piece packaging integrated machine, which relates to the technical field of wafer processing and comprises a sealed cleaning chamber, a feeding device, a cleaning brush piece device, a discharging device and a packaging mechanism, wherein the feeding device is arranged at one end of the sealed cleaning chamber, and meanwhile, the cleaning brush piece device is arranged at one side of the feeding device, so that the cleaning action of wafers is realized, the discharging device is arranged at one side of the cleaning brush piece far away from the feeding device and is connected with the cleaning brush piece device, and the packaging mechanism is arranged at one side of the discharging device far away from the cleaning brush piece device and is connected with the discharging device, so that the wafers can be packaged. Compared with the prior art, the invention realizes the integrated design of the brush piece and the package, ensures that the whole brush piece and the package are not contacted with external pollution sources, and simultaneously avoids wafer pollution in the packaging process, thereby avoiding the contact of the brushed wafer with the outside and avoiding the risk of secondary pollution of the wafer.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a brush piece packaging integrated machine.
Background
In the silicon carbide wafer production process, the cleanliness requirements on the wafer surface are becoming more and more stringent, and multiple cleaning operations are generally required to remove impurities and process liquid residues on the wafer surface. Therefore, the wafer needs to be brushed before leaving the factory, so that the surface cleanliness of the wafer is ensured, and the wafer is packaged and leaves the factory. The industry uses the brush mascerating machine at present as the cleaning equipment of final shipment, and need carry out the packing operation before the shipment, wash and pack as mutually independent technology, lead to present equipment for packing and brush mascerating machine to be mutually independent structure generally, after the wafer is scrubbed, need leave the brush mascerating machine and get into outside transportation after entering again equipment for packing operation, and the wafer has the risk of secondary pollution after contacting the external world, in the packaging process simultaneously, owing to need carry out the ejection of compact, can lead to external impurity to get into equipment for packing inside through the discharge gate, probably lead to the impurity such as particle to have on the wafer surface equally.
Disclosure of Invention
The invention aims at providing a brush piece packaging integrated machine, which can design a brush piece and packaging integrally, so that wafers after the brush piece are prevented from contacting the outside, and the risk of secondary pollution to the wafers is avoided.
Embodiments of the invention may be implemented as follows:
In a first aspect, the present invention provides a brush piece packaging machine comprising:
Sealing the clean room;
The feeding device is arranged at one end of the sealed clean room and used for extending out of the sealed clean room and feeding wafers;
The cleaning brush piece device is arranged on one side of the feeding device, is connected with the feeding device and is used for cleaning the wafer;
The discharging device is arranged on one side of the cleaning brush piece device, which is far away from the feeding device, and is connected with the cleaning brush piece device and used for outputting the cleaned wafer;
The packaging mechanism is arranged on one side of the discharging device, which is far away from the cleaning brush piece device, and is connected with the discharging device, and is used for packaging the wafers and forming a packaging box;
the packaging mechanism is provided with a packaging cavity, a cleaning blowing component is arranged on the top end of the packaging cavity and used for blowing cleaning air to the surface of the wafer, a discharge hole is formed in the bottom end of the packaging cavity and provided with a conveying pipe, the conveying pipe is connected to the outside of the sealed cleaning chamber, and the air pressure in the packaging cavity is larger than the external air pressure of the sealed cleaning chamber.
In an alternative embodiment, the clean blowing assembly includes a boron-free blower filter unit disposed at a top end of the packaging chamber for filtering external air and then sending the filtered external air downward, and a diffuser disposed at a bottom end of the boron-free blower filter unit for diffusing the clean air so that the clean air uniformly flows to a surface of the wafer.
In an alternative embodiment, the packaging mechanism comprises a housing, a first packaging component, a second packaging component and a lifting conveying rail, wherein the housing is internally provided with a packaging cavity, the first packaging component and the second packaging component are both arranged in the housing, the first packaging component is connected with the discharging device and is used for packaging the wafer into a first packaging bag and vacuumizing, the second packaging component is connected with the first packaging component and is used for packaging the first packaging bag into a second packaging bag and conveying the first packaging bag to the discharging hole, and one end of the lifting conveying rail is connected to the second packaging component, and the other end of the lifting conveying rail is connected to the discharging hole.
In an alternative embodiment, the first packaging assembly comprises a first conveying track, a first bagging device and a negative pressure air suction piece, wherein one end of the first conveying track is connected to the discharging device, the other end of the first conveying track is connected to the first bagging device, the first bagging device is used for loading the wafers into the first packaging bag and sealing the first packaging bag, and the negative pressure air suction piece is arranged on the first bagging device and is used for sucking air in the first packaging bag;
The second package assembly comprises a second conveying track, a second bagging device and a nitrogen pipeline, one end of the second conveying track is connected to the first bagging device, the other end of the second conveying track is connected to the second bagging device, the second bagging device is used for filling the first packaging bag into the second packaging bag and sealing the second packaging bag, and the nitrogen pipeline is connected to the second bagging device and is used for filling nitrogen into the second packaging bag.
In an alternative embodiment, the cleaning brush piece device comprises a horizontal conveying rail, a cleaning assembly and a grabbing mechanical arm, one end of the horizontal conveying rail is connected to the feeding device, the other end of the horizontal conveying rail is connected to the discharging device, station grooves are formed in two sides of the horizontal conveying rail, the cleaning assembly is arranged in the station grooves and used for cleaning the surfaces of the wafers in the station grooves, and the grabbing mechanical arm is arranged on one side of the station grooves and used for conveying the wafers between the horizontal conveying rail and the station grooves.
In an alternative embodiment, the upper and lower sides of the horizontal conveying rail are provided with air blowing pipes for blowing nitrogen gas to the upper and lower surfaces of the wafer on the horizontal conveying rail.
In an alternative embodiment, the cleaning assembly comprises a holding box body, a lifting bearing table, a brushing frame and a flushing frame, wherein the holding box body is arranged in the station groove and is provided with a lifting channel, the lifting bearing table is movably arranged in the lifting channel and can ascend or descend along the lifting channel, a placing frame used for bearing the wafer is arranged on the lifting bearing table, the brushing frame and the flushing frame are both arranged at the top end of the lifting channel, a cleaning brush head is arranged on the brushing frame and used for carrying out rough brushing on the wafer, and a two-fluid spray head is arranged on the flushing frame and used for carrying out two-fluid flushing on the wafer.
In an alternative embodiment, a first cleaning station, a second cleaning station and a third cleaning station are sequentially formed in the accommodating box from top to bottom, the lifting bearing table can be switched among the first cleaning station, the second cleaning station and the third cleaning station, the first cleaning station is provided with a deionized spray head, and the deionized spray head is used for spraying deionized water to the surface of the wafer; the second cleaning station is provided with a first chemical spray head which is used for spraying ammonia water to the surface of the wafer; the third cleaning station is provided with a second chemical spray head which is used for spraying hydrofluoric acid solution on the surface of the wafer.
In an optional embodiment, the two-fluid spray head is further provided with an ultrasonic spray head, the washing frame is further provided with an ultrasonic spray head, the ultrasonic spray head is used for carrying out ultrasonic washing on the wafer, the bottom of the lifting bearing table is provided with a rotating shaft, and the rotating shaft is used for driving the lifting bearing table to rotate so as to spin-dry the wafer.
In an alternative embodiment, the accommodating box body comprises a peripheral plate, a first collecting ring plate, a second collecting ring plate and a third collecting ring plate, the first collecting ring plate, the second collecting ring plate and the third collecting ring plate are sequentially arranged on the inner wall of the peripheral plate from top to bottom, a first opening for the lifting bearing table to pass through is formed in the middle of the first collecting ring plate, a second opening for the lifting bearing table to pass through is formed in the middle of the second collecting ring plate, a third opening for the lifting bearing table to pass through is formed in the middle of the third collecting ring plate, and the first opening, the second opening and the third opening sequentially correspond to each other and form the lifting channel.
In an alternative embodiment, the bottom of the first collecting ring plate is provided with a drain pipe for draining the deionized water mixture collected by the first collecting ring plate; the bottom of the second collecting ring plate is provided with a first recovery pipe which is connected to the first chemical spray head and used for recovering the ammonia water mixture collected by the second collecting ring plate; the bottom of the third collecting ring plate is provided with a second recovery pipe, and the second recovery pipe is connected to the second chemical spray head and used for recovering the hydrofluoric acid solution collected by the third collecting ring plate.
The beneficial effects of the embodiment of the invention include, for example:
The brush piece packaging integrated machine provided by the embodiment of the invention has the advantages that the feeding device is arranged at one end of the sealed cleaning chamber, the wafer feeding is realized, the cleaning brush piece device is arranged at one side of the feeding device and is connected with the feeding device, so that the cleaning action of wafers is realized, the discharging device is arranged at one side of the cleaning brush piece far away from the feeding device and is connected with the cleaning brush piece device, the cleaned wafers can be output, and the packaging mechanism is arranged at one side of the discharging device far away from the cleaning brush piece device and is connected with the discharging device, so that the wafers can be packaged, the packaging box is formed, and the packaging action is completed. Compared with the prior art, the cleaning brush device and the packaging mechanism are arranged in the sealed cleaning chamber at the same time, so that the integrated design of the brush and the packaging is realized, the whole cleaning brush device and the packaging mechanism are not contacted with an external pollution source, meanwhile, the cleaning blowing assembly is designed at the top end of the packaging cavity to provide cleaning air, the air pressure in the packaging cavity is enabled to be larger than the external air pressure, external impurities are prevented from entering the discharge port of the packaging mechanism along with the air, wafer pollution in the packaging process is avoided, wafers after the brush are prevented from contacting the outside, and the risk of secondary pollution of the wafers is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is an overall top view of a brush sheet packaging machine provided by an embodiment of the present invention;
fig. 2 is a schematic partial structure of a brush sheet packaging machine according to an embodiment of the present invention;
FIG. 3 is a schematic view of the packaging mechanism of FIG. 2;
FIG. 4 is a schematic view of the cleaning brush device of FIG. 2;
fig. 5 is a schematic diagram of a connection structure of the first recovery pipe and the second recovery pipe in fig. 4.
Icon: 100-a brush piece packaging integrated machine; 110-sealing the clean room; 120-feeding device; 130-cleaning brush piece device; 131-horizontal conveying tracks; 132-cleaning the assembly; 133-a grasping mechanical arm; 134-station slots; 135-blowing pipeline; 136-accommodating a box; 1361-lifting channel; 1362-deionizing spray head; 1363-first chemical spray head; 1364-second chemical spray head; 1365-peripheral plate; 1366-a first collection ring plate; 1367-a second collection ring plate; 1368-third collecting ring plate; 137-lifting bearing platform; 1371-placing rack; 138-a brush rack; 1381-cleaning brush heads; 139-flushing rack; 1391—a two-fluid ejection head; 1393-ultrasonic nozzle; 140-a discharging device; 150-a packaging mechanism; 151-packaging cavity; 152-a discharge port; 153-housing; 154-a first package assembly; 1541-a first delivery track; 1543-a first bagging apparatus; 1545-negative pressure suction; 155-a second package assembly; 1551-a second conveyor track; 1553-a second bagging apparatus; 1555-nitrogen piping; 156-lifting conveying tracks; 160-cleaning the blowing assembly; 161-boron-free fan filter unit; 163-diffuser; 170-a discharge pipe; 180-a first recovery pipe; 181-a first reservoir; 182-a first transfer pump; 183-first heater; 184-a first filter; 190-a second recovery pipe; 191-a second reservoir; 192-a second transfer pump; 193-a second heater; 194-second filter.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or the azimuth or the positional relationship in which the inventive product is conventionally put in use, it is merely for convenience of describing the present invention and simplifying the description, and it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus it should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.
As disclosed in the background art, in the existing wafer production process, the brush sheet and the packaging process are in mutually independent states, so that after the brush sheet is finished, the wafer needs to be exposed to the outside for transportation, and the pollution risk is increased. And in the packaging process, as the discharging is needed after the packaging is completed, the discharging hole is directly communicated with the outside, so that impurities in the outside air can enter the packaging machine through the discharging hole, and further, the surface of a wafer in the packaging process is polluted.
In addition, the existing brushing machine is generally used for cleaning the surface of a wafer only through deionized water and a brush, so that various chemical residues on the surface of the wafer are difficult to thoroughly remove, the cleaning effect is poor, and the process liquid in the cleaning process cannot be recycled, so that the resource waste is caused.
In order to solve the above-mentioned problems, the embodiment of the present invention provides a brush sheet packaging integrated machine, and it should be noted that, without conflict, features in the embodiment of the present invention may be combined with each other.
Referring to fig. 1 to 5, the present embodiment provides a brush sheet packaging integrated machine 100, which can integrate the brush sheet and the package, thereby avoiding the contact of the wafer after the brush sheet with the outside, and avoiding the risk of secondary pollution of the wafer. Meanwhile, the cleaning effect is good, and impurities on the surface of the wafer can be thoroughly removed. And the packaging effect is good, and the transportation is convenient.
The brush sheet packaging integrated machine 100 provided in this embodiment includes a sealed clean room 110, a feeding device 120, a cleaning brush sheet device 130, a discharging device 140 and a packaging mechanism 150, wherein the feeding device 120 is disposed at one end in the sealed clean room 110, and is used for extending out of the sealed clean room 110 and feeding wafers; the cleaning brush piece device 130 is arranged on one side of the feeding device 120, and is connected with the feeding device 120 for cleaning the wafer; the discharging device 140 is arranged at one side of the cleaning brush piece device 130 far away from the feeding device 120, and is connected with the cleaning brush piece device 130 for outputting cleaned wafers; the packaging mechanism 150 is arranged on one side of the discharging device 140 away from the cleaning brush piece device 130, and is connected with the discharging device 140, and is used for packaging the wafers and forming a packaging box; the packaging mechanism 150 is provided with a packaging cavity 151, a cleaning blowing component 160 is arranged on the top end of the packaging cavity 151, the cleaning blowing component 160 is used for blowing cleaning air to the surface of a wafer, a discharging hole 152 is arranged at the bottom end of the packaging cavity 151, a conveying pipe is arranged at the discharging hole 152 and connected to the outside of the sealed cleaning chamber 110, and the air pressure in the packaging cavity 151 is larger than the external air pressure of the sealed cleaning chamber 110.
In this embodiment, the cleaning brush device 130 and the packaging mechanism 150 are simultaneously arranged in the sealed cleaning chamber 110, so that the integrated design of the brush and the packaging is realized, the whole cleaning brush device is not contacted with an external pollution source, meanwhile, the cleaning blowing component 160 is designed at the top end of the packaging cavity 151 to provide cleaning air, the air pressure in the packaging cavity 151 is larger than the external air pressure, the external impurities are prevented from entering the discharge port 152 of the packaging mechanism 150 along with the air, the wafer pollution caused in the packaging process is avoided, the wafer after the brush is prevented from contacting the outside, and the risk of secondary pollution of the wafer is avoided.
It should be noted that, in this embodiment, the feeding device 120, the cleaning brush device, the discharging device 140 and the packaging mechanism 150 are all automated devices, so the cleaning device can be directly placed into the sealed clean room 110, and the sealed clean room 110 is isolated from the external space, so as to avoid contamination caused by entry of external impurities.
It should be noted that, in this embodiment, the air is introduced into the packaging cavity 151 through the cleaning and blowing component 160, and is mainly discharged through the discharge port 152, so that under the condition of continuous air inlet, the air pressure in the packaging cavity 151 can be ensured to be always greater than that of the other air, and the external impurities are prevented from entering the packaging cavity 151 to pollute the surface of the wafer along with the air.
In the present embodiment, the clean blowing assembly 160 includes a boron-free blower filter unit 161 and a diffuser 163, the boron-free blower filter unit 161 being disposed at a top end of the packing chamber 151 for filtering the external air and then discharging the filtered external air downward, and the diffuser 163 being disposed at a bottom end of the boron-free blower filter unit 161 for diffusing the clean air so that the clean air uniformly flows to the surface of the wafer. Specifically, the boron-free blower filter unit 161, i.e., boron-free FFU, is a purification unit with an air supply device and a high efficiency filter, which is installed on the top end of the packing chamber 151, for providing and maintaining high cleanliness of air in the packing chamber 151. The boron-free FFU uses boron-free materials in the manufacturing process, and the HEPA or ULPA filter provided with the boron-free FFU can effectively remove boron particles and other pollutants in the air, so that the environment of the packaging cavity 151 is ensured to meet strict boron-free requirements. By providing the diffuser 163, clean air in the packaging cavity 151 can be uniformly distributed, and the influence of local swirling air flow on the air pressure in the packaging cavity 151 can be avoided.
In this embodiment, the packaging mechanism 150 includes a housing 153, a first packaging component 154, a second packaging component 155, and a lifting conveying rail 156, the housing 153 has a packaging cavity 151 therein, the first packaging component 154 and the second packaging component 155 are both disposed in the housing 153, the first packaging component 154 is connected with the discharging device 140 for loading the wafer into the first packaging bag and evacuating, the second packaging component 155 is connected with the first packaging component 154 for loading the first packaging bag into the second packaging bag and conveying to the discharging port 152, one end of the lifting conveying rail 156 is connected to the second packaging component 155, and the other end is connected to the discharging port 152. Specifically, the first packaging bag can be a hard bag body or a soft bag body, and the second packaging bag can be a relatively hard bag body and is internally provided with a soft lining, so that the anti-seismic effect is improved. Through adopting the vacuum packaging of first wrapping bag realization wafer, guarantee its surface cleanliness, through additionally setting up the second wrapping bag, promote its antidetonation effect on the one hand, convenient transportation, on the other hand also realizes protection and isolating effect through extra packaging structure, has further guaranteed the cleanliness on wafer surface.
Further, the first packaging assembly 154 includes a first conveying rail 1541, a first bagging machine 1543, and a negative pressure suction member 1545, one end of the first conveying rail 1541 is connected to the discharging device 140, the other end is connected to the first bagging machine 1543, the first bagging machine 1543 is used for loading wafers into first packaging bags and sealing, and the negative pressure suction member 1545 is provided on the first bagging machine 1543 and is used for sucking gas in the first packaging bags; the second packing assembly 155 includes a second conveying rail 1551, a second bagging apparatus 1553, and a nitrogen gas pipe 1555, one end of the second conveying rail 1551 is connected to the first bagging apparatus 1543, the other end is connected to the second bagging apparatus 1553, the second bagging apparatus 1553 is used for packing and sealing the first packing bag into the second packing bag, and the nitrogen gas pipe 1555 is connected to the second bagging apparatus 1553 for filling nitrogen gas into the second packing bag. The basic construction and operation of first and second bagging apparatuses 1543 and 1553 may be referred to as an existing bagging structure.
It should be noted that, through filling nitrogen gas into the second packaging bag in this embodiment, guarantee its filling degree on the one hand, avoid indent deformation, on the other hand can effectively form the shielding gas layer, avoid external gas or impurity to get into to convenient transportation.
The cleaning brush piece device 130 comprises a horizontal conveying rail 131, a cleaning assembly 132 and a grabbing mechanical arm 133, one end of the horizontal conveying rail 131 is connected to the feeding device 120, the other end of the horizontal conveying rail is connected to the discharging device 140, station grooves 134 are formed in two sides of the horizontal conveying rail 131, the cleaning assembly 132 is arranged in the station grooves 134 and used for brushing the surfaces of wafers in the station grooves 134, and the grabbing mechanical arm 133 is arranged on one side of the station grooves 134 and used for conveying the wafers between the horizontal conveying rail 131 and the station grooves 134.
In the present embodiment, the upper and lower sides of the horizontal transfer rail 131 are each provided with a blowing pipe 135, and the blowing pipe 135 is used to blow nitrogen gas to the upper and lower surfaces of the wafer on the horizontal transfer rail 131. Wherein, the air blowing pipelines 135 are connected to an external nitrogen source, and the air blowing pipelines 135 are plural and are sequentially arranged at intervals along the extending direction of the horizontal conveying rail 131, and each air blowing pipeline 135 blows nitrogen to the surface of the wafer through the gas spray head, so that a nitrogen protection layer is formed on the upper surface and the lower surface of the wafer, and the pollution of various polluted gases or impurities brought by the cleaning assembly 132 to the surface of the wafer is further avoided.
It should be noted that, in this embodiment, the feeding device 120 and the discharging device 140 are both composed of a rail and a mechanical arm, that is, the feeding rail of the feeding device 120 may extend to the outside, so as to facilitate feeding, the mechanical arm at the end of the feeding rail may transfer the wafer on the feeding rail to a horizontal conveying rule, so as to facilitate conveying to each station, and the mechanical arm of the discharging device 140 may also transfer the cleaned wafer onto the discharging rail, where the discharging rail may be connected to the first conveying rail 1541 at the rear, so as to realize seamless conveying.
In this embodiment, the ejection of compact track is tunnel type design to further guarantee the surface cleanliness of wafer, simultaneously, still be provided with hot-blast stoving fan on the ejection of compact track, can further dry the wafer, guarantee the dryness before the packing.
The cleaning assembly 132 includes a housing case 136, a lifting bearing table 137, a brush holder 138 and a rinse holder 139, the housing case 136 is disposed in the station tank 134 and has a lifting channel 1361, the lifting bearing table 137 is movably disposed in the lifting channel 1361 and can rise or fall along the lifting channel 1361, the lifting bearing table 137 is provided with a rack 1371 for carrying wafers, the brush holder 138 and the rinse holder 139 are both disposed at the top end of the lifting channel 1361, and the brush holder 138 is provided with a cleaning brush head 1381, the cleaning brush head 1381 is used for rough brushing wafers, the rinse holder 139 is provided with a fluid nozzle 1391, and the fluid nozzle 1391 is used for performing two-fluid rinsing on wafers. Specifically, the rack 1371 on the lifting carrier 137 can fix the wafer, and a lifting driving member, such as an electric push rod or an air cylinder, is disposed at the bottom of the lifting carrier 137, so as to drive the lifting carrier 137 to lift or descend in the lifting channel 1361 to approach or separate from the cleaning brush head 1381 and the two-fluid sprayer 1391.
It should be noted that, in this embodiment, the brush head 1381 can be driven by a motor to realize rotation, so as to perform conventional mechanical brushing on the surface of the wafer.
In this embodiment, a first cleaning station, a second cleaning station and a third cleaning station are sequentially formed in the accommodating box 136 from top to bottom, the lifting bearing table 137 can be switched among the first cleaning station, the second cleaning station and the third cleaning station, and the first cleaning station is provided with a deionized water spray nozzle 1362, and the deionized water spray nozzle 1362 is used for spraying deionized water to the surface of the wafer; the second cleaning station is provided with a first chemical spray head 1363, and the first chemical spray head 1363 is used for spraying ammonia water to the surface of the wafer; the third cleaning station is provided with a second chemical spray head 1364, the second chemical spray head 1364 being used to spray a hydrofluoric acid solution onto the surface of the wafer.
In this embodiment, an ultrasonic nozzle 1393 is further disposed on the rinsing rack 139, the ultrasonic nozzle 1393 is used for performing ultrasonic rinsing on the wafer, and a rotating shaft is disposed at the bottom of the lifting bearing table 137, and the rotating shaft is used for driving the lifting bearing table 137 to rotate so as to spin-dry the wafer. Wherein, the rotation axis drives through a motor and realizes rotating, and then drives lift plummer 137 and rotate, and rotation axis and motor are whole to be connected with the lift driving piece to make lift plummer 137 can realize going up and down, can realize rotating again.
When in actual cleaning, the cleaning can be performed sequentially, firstly, after the wafer is mounted on the rack 1371 on the lifting bearing table 137 by using the grabbing mechanical arm 133, the wafer is firstly moved to the first cleaning station, two fluids and the cleaning brush head 1381 are started to perform rough brushing, and are matched with deionized water for flushing, then, the wafer is downwards moved to the second cleaning station by using the lifting bearing table 137, ammonia water flushing and ultrasonic flushing are performed, then, the wafer is dried and downwards moved to the third cleaning station again, hydrofluoric acid flushing and ultrasonic flushing are performed, finally, the wafer is upwards moved to the first cleaning station after being dried, and the wafer is taken away by using the grabbing mechanical arm 133.
In particular, since the brush head 1381 of the present application can perform rough brushing on only one surface of the wafer, in other preferred embodiments, in order to further ensure the cleaning effect on the wafer, the grabbing mechanical arm 133 may be used to turn over the wafer and then place the wafer on the rack 1371 for rough brushing on the other surface.
It should be noted that, in this embodiment, the second cleaning station and the third cleaning station are deeper, and the second cleaning station and the third cleaning station cannot be turned over by the grabbing mechanical arm 133, for this case, in this embodiment, the first chemical spray head 1363 and the second chemical spray head 1364 may be additionally added on the lifting bearing table 137 to achieve the cleaning of the back surface of the wafer, or the second cleaning station and the third cleaning station may be performed again after the first cleaning station turns over the wafer, so as to complete the cleaning action on the surfaces of two sides of the wafer.
In this embodiment, the accommodating case 136 includes a peripheral plate 1365, a first collecting ring plate 1366, a second collecting ring plate 1367 and a third collecting ring plate 1368, the first collecting ring plate 1366, the second collecting ring plate 1367 and the third collecting ring plate 1368 are sequentially disposed on the inner wall of the peripheral plate 1365 from top to bottom, a first opening for the lifting bearing table 137 to pass through is provided in the middle of the first collecting ring plate 1366, a second opening for the lifting bearing table 137 to pass through is provided in the middle of the second collecting ring plate 1367, a third opening for the lifting bearing table 137 to pass through is provided in the middle of the third collecting ring plate 1368, and the first opening, the second opening and the third opening sequentially correspond to each other and form a lifting channel 1361. Specifically, the first opening, the second opening and the third opening are sequentially arranged from top to bottom, and the first collecting ring plate 1366 is in a frustum-shaped design, so that the position, close to the first opening, on the first collecting ring plate 1366 is higher than the position, away from the first opening, and further the first collecting ring plate 1366 can collect deionized water mixture overflowed from the first cleaning station. Likewise, second collection ring 1367 and third collection ring 1368 also have a frustoconical configuration to facilitate collection.
In this embodiment, a drain pipe 170 is provided at the bottom of the first collecting ring plate 1366, and the drain pipe 170 is used to drain the deionized water mixture collected by the first collecting ring plate 1366; the bottom of the second collecting ring plate 1367 is provided with a first recovery pipe 180, and the first recovery pipe 180 is connected to the first chemical spray head 1363 for recovering the ammonia water mixture collected by the second collecting ring plate 1367; the bottom of the third collecting ring plate 1368 is provided with a second recovery pipe 190, and the second recovery pipe 190 is connected to a second chemical spray head 1364 for recovering the hydrofluoric acid solution collected by the third collecting ring plate 1368.
In this embodiment, the first recovery pipe 180 is provided with a first liquid tank 181 for storing an ammonia water mixture, and meanwhile, the first recovery pipe 180 is sequentially provided with a first delivery pump 182, a first heater 183, a first filter 184, and the like, so that the ammonia water mixture is filtered and heated and then supplied to the first chemical spray head 1363 again. Similarly, the second recovery pipe 190 is provided with a second tank 191, a second transfer pump 192, a second heater 193, a second filter 194, and the like. Through the design of the first recovery pipe 180 and the second recovery pipe 190, the reuse of the liquid medicine can be realized, and the resource is saved.
In summary, the brush-sheet packaging integrated machine 100 provided in this embodiment is configured to set a feeding device at one end of the sealed cleaning chamber 110, and to supply wafers, and simultaneously set the cleaning brush-sheet device 130 at one side of the feeding device 120 and connect with the feeding device 120, so as to realize a cleaning action on the wafers, set the discharging device 140 at one side of the cleaning brush-sheet away from the feeding device 120 and connect with the cleaning brush-sheet device 130, and can output the cleaned wafers, and the packaging mechanism 150 is set at one side of the discharging device 140 away from the cleaning brush-sheet device 130 and connect with the discharging device 140, so as to package the wafers, form a packaging box, and complete the packaging action. Compared with the prior art, the cleaning brush device 130 and the packaging mechanism 150 are arranged in the sealed cleaning chamber 110 at the same time, so that the integrated design of the brush and the packaging is realized, the whole cleaning brush device is not contacted with an external pollution source, meanwhile, the cleaning blowing component 160 is designed at the top end of the packaging cavity 151 to provide cleaning air, the air pressure in the packaging cavity 151 is enabled to be larger than the external air pressure, external impurities are prevented from entering the discharge port 152 of the packaging mechanism 150 along with the air, the wafer pollution in the packaging process is avoided, the wafer after the brush is prevented from contacting the outside, and the risk of secondary pollution of the wafer is avoided.
The present invention is not limited to the above embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a brush piece packing all-in-one which characterized in that includes:
A sealed clean room (110);
the feeding device (120) is arranged at one end in the sealed clean room (110) and used for extending out of the sealed clean room (110) and feeding wafers;
the cleaning brush piece device (130) is arranged on one side of the feeding device (120) and connected with the feeding device (120) for cleaning the wafer;
The discharging device (140) is arranged on one side, far away from the feeding device (120), of the cleaning brush piece device (130), and is connected with the cleaning brush piece device (130) and used for outputting the cleaned wafer;
The packaging mechanism (150) is arranged on one side of the discharging device (140) away from the cleaning brush piece device (130), and is connected with the discharging device (140) and used for packaging the wafers and forming a packaging box;
Wherein, packagine machine constructs (150) have a packing chamber (151), be provided with clean subassembly (160) of blowing on the top of packing chamber (151), clean subassembly (160) of blowing are used for to the surface of wafer blows clean air, the bottom of packing chamber (151) is provided with discharge gate (152), discharge gate (152) are provided with the conveyer pipe, the conveyer pipe is connected to sealed clean room (110) outside, just the atmospheric pressure in packing chamber (151) is greater than sealed clean room (110) outside atmospheric pressure.
2. The brush sheet packaging all-in-one machine according to claim 1, wherein the clean blowing assembly (160) comprises a boron-free blower filter unit (161) and a diffuser (163), the boron-free blower filter unit (161) is disposed at the top end of the Bao Zhuangqiang (151) for filtering the external air and then sending the external air downward, and the diffuser (163) is disposed at the bottom end of the boron-free blower filter unit (161) for diffusing the clean air so that the clean air flows uniformly to the surface of the wafer.
3. The brush sheet packaging machine according to claim 2, wherein the packaging mechanism (150) comprises a housing (153), a first packaging component (154), a second packaging component (155) and a lifting conveying track (156), the housing (153) is internally provided with the packaging cavity (151), the first packaging component (154) and the second packaging component (155) are both arranged in the housing (153), the first packaging component (154) is connected with the discharging device (140) and is used for loading the wafer into a first packaging bag and vacuumizing, the second packaging component (155) is connected with the first packaging component (154) and is used for loading the first packaging bag into a second packaging bag and conveying the first packaging bag to the discharging hole (152), and one end of the lifting conveying track (156) is connected to the second packaging component (155), and the other end of the lifting conveying track is connected to the discharging hole (152).
4. The brush sheet packaging integrated machine according to claim 1, wherein the cleaning brush sheet device (130) comprises a horizontal conveying rail (131), a cleaning assembly (132) and a grabbing mechanical arm (133), one end of the horizontal conveying rail (131) is connected to the feeding device (120), the other end is connected to the discharging device (140), two sides of the horizontal conveying rail (131) are provided with station grooves (134), the cleaning assembly (132) is arranged in the station grooves (134) and used for brushing the surfaces of the wafers in the station grooves (134), and the grabbing mechanical arm (133) is arranged on one side of the station grooves (134) and used for transferring the wafers between the horizontal conveying rail (131) and the station grooves (134).
5. The brush sheet packaging integrated machine according to claim 4, wherein the upper and lower sides of the horizontal conveying rail (131) are provided with air blowing pipes (135), and the air blowing pipes (135) are used for blowing nitrogen gas to the upper and lower surfaces of the wafer on the horizontal conveying rail (131).
6. The brush sheet packaging machine of claim 4, wherein the cleaning assembly (132) comprises a containing box (136), a lifting bearing table (137), a brushing frame (138) and a flushing frame (139), the containing box (136) is arranged in the station groove (134) and is provided with a lifting channel (1361), the lifting bearing table (137) is movably arranged in the lifting channel (1361) and can be lifted or lowered along the lifting channel (1361), a placing frame (1371) for bearing the wafer is arranged on the lifting bearing table (137), the brushing frame (138) and the flushing frame (139) are both arranged at the top end of the lifting channel (1361), a cleaning brush head (1381) is arranged on the brushing frame (138), the cleaning brush head (1381) is used for coarsely brushing the wafer, a two-fluid spray head (1391) is arranged on the flushing frame (139), and the two-fluid spray head (1391) is used for flushing the wafer.
7. The brush sheet packaging integrated machine according to claim 6, wherein a first cleaning station, a second cleaning station and a third cleaning station are sequentially formed in the accommodating box body (136) from top to bottom, the lifting bearing table (137) can be switched among the first cleaning station, the second cleaning station and the third cleaning station, the first cleaning station is provided with a deionized water spray head (1362), and the deionized water spray head (1362) is used for spraying deionized water to the surface of the wafer; the second cleaning station is provided with a first chemical spray head (1363), and the first chemical spray head (1363) is used for spraying ammonia water to the surface of the wafer; the third cleaning station is provided with a second chemical spray head (1364), and the second chemical spray head (1364) is used for spraying hydrofluoric acid solution on the surface of the wafer.
8. The brush sheet packaging integrated machine according to claim 7, wherein an ultrasonic nozzle (1393) is further disposed on the rinsing rack (139), the ultrasonic nozzle (1393) is used for performing ultrasonic rinsing on the wafer, and a rotating shaft is disposed at the bottom of the lifting bearing table (137) and is used for driving the lifting bearing table (137) to rotate so as to spin-dry the wafer.
9. The brush sheet packaging integrated machine according to claim 7, wherein the accommodating box (136) comprises a peripheral plate (1365), a first collecting ring plate (1366), a second collecting ring plate (1367) and a third collecting ring plate (1368), the first collecting ring plate (1366), the second collecting ring plate (1367) and the third collecting ring plate (1368) are sequentially arranged on the inner wall of the peripheral plate (1365) from top to bottom, a first opening for the passage of the lifting bearing table (137) is formed in the middle of the first collecting ring plate (1366), a second opening for the passage of the lifting bearing table (137) is formed in the middle of the second collecting ring plate (1367), a third opening for the passage of the lifting bearing table (137) is formed in the middle of the third collecting ring plate (1368), and the first opening, the second opening and the third opening are sequentially corresponding to each other and form the lifting channel (1361).
10. The brush sheet packaging machine of claim 9, wherein a drain pipe (170) is provided at a bottom of the first collection ring plate (1366), the drain pipe (170) being for draining the deionized water mixture collected by the first collection ring plate (1366); a first recovery pipe (180) is arranged at the bottom of the second collecting ring plate (1367), and the first recovery pipe (180) is connected to the first chemical spray head (1363) and is used for recovering the ammonia water mixture collected by the second collecting ring plate (1367); the bottom of the third collecting ring plate (1368) is provided with a second recovery pipe (190), and the second recovery pipe (190) is connected to the second chemical spray head (1364) for recovering the hydrofluoric acid solution collected by the third collecting ring plate (1368).
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| CN202410323087.XA CN117943365B (en) | 2024-03-21 | 2024-03-21 | Brush sheet packaging integrated machine |
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| CN202410323087.XA CN117943365B (en) | 2024-03-21 | 2024-03-21 | Brush sheet packaging integrated machine |
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