CN117913045B - Semiconductor device radiator adopting boundary flow for heat radiation - Google Patents
Semiconductor device radiator adopting boundary flow for heat radiation Download PDFInfo
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- CN117913045B CN117913045B CN202410317461.5A CN202410317461A CN117913045B CN 117913045 B CN117913045 B CN 117913045B CN 202410317461 A CN202410317461 A CN 202410317461A CN 117913045 B CN117913045 B CN 117913045B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 58
- 230000005855 radiation Effects 0.000 title description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 99
- 229910052802 copper Inorganic materials 0.000 claims description 95
- 239000010949 copper Substances 0.000 claims description 95
- 238000004140 cleaning Methods 0.000 claims description 33
- 230000000670 limiting effect Effects 0.000 claims description 33
- 230000017525 heat dissipation Effects 0.000 claims description 21
- 230000000149 penetrating effect Effects 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 12
- 238000010438 heat treatment Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000000428 dust Substances 0.000 description 5
- 238000010276 construction Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28G—CLEANING OF INTERNAL OR EXTERNAL SURFACES OF HEAT-EXCHANGE OR HEAT-TRANSFER CONDUITS, e.g. WATER TUBES OR BOILERS
- F28G1/00—Non-rotary, e.g. reciprocated, appliances
- F28G1/02—Non-rotary, e.g. reciprocated, appliances having brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to the technical field of radiators, and particularly relates to a semiconductor device radiator adopting boundary flow for radiating, which comprises a radiator, wherein the radiator comprises an upper wing plate and a lower wing plate, the upper wing plate and the lower wing plate are vertically and fixedly connected together to form an L shape, one side of the lower wing plate, which is close to the upper wing plate, is vertically and fixedly connected with a plurality of first fins, and the first fins are parallel to the upper wing plate. According to the invention, the strip-shaped blocks are arranged on the lower wing plate, when wind generated by the fan blows on the radiator, a part of wind can blow on the first fins, so that heat on the radiator can be emitted to the outside through the first fins, and the other part of wind can blow on one side, away from the first fins, of the lower wing plate through the area between the two strip-shaped blocks, so that heat is emitted to one side, away from the first fins, of the lower wing plate, and the heat-emitting effect of the whole radiator is improved by matching with the first fins.
Description
Technical Field
The invention belongs to the technical field of radiators, and particularly relates to a semiconductor device radiator adopting boundary flow for radiating.
Background
A heat sink is a generic term for a series of devices used to conduct and release heat. The radiator mainly comprises a heating radiator, a computer radiator, a semiconductor device radiator and the like.
Conventional semiconductor heat sinks generally use heat dissipation fins on the heat sink to dissipate heat from the semiconductor device. In the use, install semiconductor device on the radiator, the heat that the semiconductor device produced can pass through the radiator and transmit on the radiating fin this moment, then utilize the fan to cool down to the radiating fin of radiator to reach the purpose that the semiconductor device cooled down.
Because the existing semiconductor radiator is generally mounted closely to the circuit board, when the air generated by the fan blows on the radiator, the back plate of the radiator cannot realize air circulation, so that most of heat transferred to the radiator by the semiconductor device can only be dissipated from the radiating fins, and the radiating effect of the radiator is general.
Therefore, it is necessary to invent a semiconductor device heat sink that uses boundary flow heat dissipation to solve the above-described problems.
Disclosure of Invention
In view of the above, the present invention provides a semiconductor device radiator adopting boundary flow to radiate heat, so as to solve the above-mentioned problems in the background art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides an adopt radiating semiconductor device radiator of boundary flow, includes the radiator, the radiator includes upper wing plate and lower pterygoid lamina, upper wing plate and lower pterygoid lamina are perpendicular fixed connection be in the shape together, one side perpendicular fixed connection that the lower pterygoid lamina is close to the upper wing plate has a plurality of first fins, a plurality of first fins all are parallel with the upper wing plate, and install same clearance subassembly between a plurality of first fins, the semiconductor device is installed to one side that the lower pterygoid lamina is close to the upper wing plate, the embedded groove has all been seted up to the both sides of lower pterygoid lamina and semiconductor device relative position, and runs through between the cell wall of two embedded groove relative one sides and has seted up a plurality of connecting holes, and installs same heat conduction subassembly in two embedded grooves, one side that the upper wing plate was kept away from to the lower pterygoid lamina is parallel with two bar blocks of direction fixedly connected with, and two bar blocks are close to top edge and base of lower pterygoid lamina respectively.
Further, the clearance subassembly is including the clearance pole of vertical setting, the top fixedly connected with fixed axle of clearance pole, go up the spacing hole of seting up the bar with the relative position of fixed axle runs through, and spacing hole and the length direction parallel of first fin, the top of fixed axle runs through and inserts in spacing hole, and the top fixedly connected with plectrum of fixed axle, the bottom fixedly connected with limiting plate of clearance pole, the limiting plate is located the bottom of first fin of bottommost, and limiting plate and lower pterygoid lamina are perpendicular, the top fixedly connected with stopper of limiting plate, is located bottommost the spacing groove of bar has been seted up with the relative position of stopper in the bottom of first fin, and spacing groove and spacing hole are parallel, the width of spacing groove is the same with the width of stopper, and the one end of spacing groove has seted up the notch, notch and spacing groove intercommunication, the size of notch groove is greater than the size of stopper, and one side that the pterygoid lamina was kept away from down is the opening design, one side fixedly connected with a plurality of first fin of clearance pole is close to a plurality of fixed blocks, a plurality of fixed blocks correspond one side of fin with one side of elastic strip, one side of elastic strip is connected with one side of two elastic strip and two elastic strip of elastic strip, one side of elastic strip is the elastic strip is connected with two elastic strip of elastic strip, one side of the elastic strip is equal to one side of the elastic strip, and the elastic strip is connected.
Further, the heat conduction subassembly includes first copper sheet and second copper sheet, and the thickness of second copper sheet is greater than the degree of depth of embedding groove, first copper sheet and second copper sheet are installed respectively in two embedding grooves, first copper sheet is located down the pterygoid lamina and keeps away from the embedding inslot of upper wing plate one side, one side fixedly connected with a plurality of connecting blocks of semiconductor device are kept away from to first copper sheet, and a plurality of the connecting block peg graft respectively in a plurality of connecting holes, and the connecting block has seted up the slot on one side of keeping away from first copper sheet, one side fixedly connected with a plurality of inserts that the second copper sheet is close to first copper sheet, and a plurality of inserts peg graft respectively in the slot of corresponding connecting block, one side of keeping away from first copper sheet runs through the grafting and has the connecting screw, the connecting screw thread is pegged graft on the insert block that corresponds, a plurality of heat conduction grooves have been seted up to the position that the pterygoid lamina is located the embedding groove top, and the bottom of heat conduction groove communicates with the embedding groove of corresponding one side, install the copper wire in the copper wire, a plurality of fixedly connected with copper strip between the bottom of heat conduction wire and the copper strip, and the first heat conduction strip closely laminate together.
Further, the sum of the lengths of the elastic sheet and the fixed block is larger than the width of the first fin, and two elastic sheets positioned on the same fixed block are respectively flush with the top and the bottom of the fixed block at the separated sides.
Further, a plurality of mounting holes and a plurality of fixing holes are formed in the lower wing plate in a penetrating mode, and fixing screws are connected between the semiconductor device and the mounting holes in a threaded mode.
Further, the thickness of the copper bar is matched with the thickness of the first copper sheet, the opposite positions of the copper bar and the first copper sheet are designed to be inclined planes, and the copper bar and the first copper sheet are tightly pressed together through the inclined planes.
Further, the connecting block and the inserting block are made of metal copper, and the size of the connecting block is matched with the size of the slot.
Further, the front side and the rear side of the lower wing plate are fixedly connected with guide strips, the length of each guide strip is larger than the distance between the two strip-shaped blocks, the guide strips are flush with one side, away from the first fin, of the lower wing plate, and the thickness of each guide strip gradually increases in thickness in the direction close to the lower wing plate.
Further, the radiator still includes the heating panel, run through on the heating panel and set up with lower wing plate on the same mounting hole and fixed orifices, the upper half of heating panel is the inclined plane design, and fixedly connected with a plurality of second fins on the upper half inclined plane of heating panel, and the width of second fin increases gradually from bottom to top, the bottom parallel of second fin and heating panel, and the length phase-match of second fin and heating panel, semiconductor device passes through the fixed screw and installs on the lower half that the heating panel is close to second fin one side.
Further, upper wing plate, lower wing plate, fixed block, first fin, second fin and heating panel are the metal aluminum material, and the connecting block can laminate with two adjacent first fins.
The invention has the technical effects and advantages that:
1. According to the invention, the strip-shaped blocks are arranged on the lower wing plate, when wind generated by the fan blows on the radiator, a part of wind can blow on the first fins, so that heat on the radiator can be emitted to the outside through the first fins, and the other part of wind can blow on one side, away from the first fins, of the lower wing plate through the area between the two strip-shaped blocks, so that heat is emitted to one side, away from the first fins, of the lower wing plate, and the heat-emitting effect of the whole radiator is improved by matching with the first fins;
2. according to the invention, the heat conducting component is arranged, so that the heat conducting component can uniformly transfer the heat emitted by the semiconductor device to the upper wing plate, the lower wing plate and the first fins in the using process of the radiator, the whole radiator can more uniformly receive the heat of the semiconductor device, and the heat radiating effect of the whole radiator is improved by matching with the wind blown by the fan;
3. According to the invention, the cleaning assembly is arranged, so that the cleaning assembly can be used for cleaning the first fin after the radiator is used for a long time, dust attached to the first fin and the bottom of the upper wing plate is brushed off, and the heat dissipation effect of the first fin and the upper wing plate on the semiconductor device is ensured.
Drawings
FIG. 1 is a first overall construction schematic of the present invention;
FIG. 2 is a second overall construction schematic of the present invention;
Fig. 3 is a schematic perspective view of all structures except a semiconductor device of the present invention;
FIG. 4 is a schematic perspective view of all but the semiconductor device, cleaning assembly and second copper sheet of the present invention;
FIG. 5 is a schematic perspective view of a portion of a cleaning assembly of the present invention;
FIG. 6 is a schematic perspective view of a first copper sheet, a connection block, a conductive copper wire and a copper bar according to the present invention;
FIG. 7 is a perspective view of a first copper sheet, a second copper sheet, a connection block, an insert block and a connection screw according to the present invention;
Fig. 8 is a perspective view of a heat dissipating plate, a second fin, a set screw, and a semiconductor device according to the present invention.
In the figure: 1. an upper wing plate; 2. a lower wing plate; 3. a first fin; 4. cleaning the assembly; 40. cleaning a rod; 41. a fixed shaft; 42. a shifting block; 43. a limiting plate; 44. a limiting block; 45. a limit groove; 46. a groove is formed; 47. a fixed block; 48. an elastic sheet; 49. brushing strips; 5. a semiconductor device; 6. an embedding groove; 7. a heat conducting component; 71. a first copper sheet; 72. a second copper sheet; 73. a connecting block; 74. inserting blocks; 75. a connecting screw; 76. a thermally conductive copper wire; 77. copper bars; 8. a bar block; 9. a mounting hole; 10. a fixing hole; 11. a set screw; 12. a flow guiding strip; 13. a heat dissipation plate; 14. and a second fin.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the embodiments.
Embodiment one:
The invention provides a semiconductor device radiator adopting boundary flow heat dissipation as shown in fig. 1-8, which comprises a radiator, wherein the radiator comprises an upper wing plate 1 and a lower wing plate 2, the upper wing plate 1 and the lower wing plate 2 are vertically and fixedly connected together in an L shape, one side of the lower wing plate 2, which is close to the upper wing plate 1, is vertically and fixedly connected with a plurality of first fins 3, the plurality of first fins 3 are parallel to the upper wing plate 1, a same cleaning component 4 is arranged between the plurality of first fins 3, a semiconductor device 5 is arranged on one side of the lower wing plate 2, which is close to the upper wing plate 1, a plurality of mounting holes 9 and a plurality of fixing holes 10 are formed on two sides of the lower wing plate 2, which are opposite to the semiconductor device 5, a plurality of connecting holes are formed between the groove walls of the two opposite sides of the two embedding grooves 6 in a penetrating way, the two heat conducting components 7 are arranged in the two embedding grooves 6, one side of the lower wing plate 2, which is far away from the upper wing plate 1, is fixedly connected with two strip-shaped blocks 8, the two strip-shaped blocks 8 are respectively close to the top edge and the bottom edge of the lower wing plate 2, a plurality of mounting holes 9 and a plurality of mounting holes 10 are formed on the lower wing plate 2, and a plurality of screw threads 11 are formed between the mounting holes 11 and the semiconductor device 5;
When the radiator is used, the radiator is fixed to a designated position on a circuit board through the fixing holes 10, then the semiconductor device 5 is mounted to the position of the heat conducting assembly 7, the semiconductor device 5 and the mounting holes 9 are connected and fixed through the fixing screws 11, in the using process of the semiconductor device 5, the heat conducting assembly 7 can rapidly and uniformly transfer heat generated by the semiconductor device 5 to the upper wing plate 1, the lower wing plate 2 and the first fins 3, so that the whole radiator can more uniformly receive the heat emitted by the semiconductor device 5, then, as wind generated by the fan blows on the radiator, a part of wind can blow on the first fins 3, so that the heat on the radiator can be emitted to the outside through the first fins 3, and the other part of wind can blow on one side, away from the first fins 3, of the lower wing plate 2 through the area between the two strip-shaped blocks 8, so that the heat radiation effect on one side, away from the first fins 3, of the lower wing plate 2 is further matched with the first fins 3 is improved;
In addition, when the radiator is used for a long time, the cleaning assembly 4 can be used for cleaning the first fin 3, so that dust attached to the bottoms of the first fin 3 and the upper wing plate 1 is brushed off, and the heat dissipation effect of the first fin 3 and the upper wing plate 1 on the semiconductor device 5 is guaranteed.
As shown in fig. 1,3 and 5, the cleaning assembly 4 comprises a vertically arranged cleaning rod 40, a fixed shaft 41 is fixedly connected to the top end of the cleaning rod 40, a bar-shaped limit hole is formed in a penetrating manner in a position, opposite to the fixed shaft 41, of the upper wing plate 1, the limit hole is parallel to the length direction of the first fin 3, the top end of the fixed shaft 41 is inserted into the limit hole in a penetrating manner, a shifting block 42 is fixedly connected to the top end of the fixed shaft 41, a limit plate 43 is fixedly connected to the bottom end of the cleaning rod 40, the limit plate 43 is positioned at the bottom of the bottommost first fin 3, the limit plate 43 is perpendicular to the lower wing plate 2, a limit block 44 is fixedly connected to the top of the limit plate 43, a bar-shaped limit groove 45 is formed in a position, opposite to the limit block 44, of the bottom of the bottommost first fin 3, the limit groove 45 is parallel to the limit hole, the width of the limit groove 45 is identical to the width of the limit block 44, the limit groove 45 is provided with a notch 46 at one end, the notch 46 is communicated with the limit groove 45, the size of the notch 46 is larger than that of the limit groove 44, one side of the notch 46 away from the lower wing plate 2 is of an opening design, one side of the cleaning rod 40 close to the first fins 3 is fixedly connected with a plurality of fixing blocks 47, the plurality of fixing blocks 47 are correspondingly spliced among the plurality of first fins 3 one by one, one side of the fixing block 47 away from the cleaning rod 40 is fixedly connected with two elastic sheets 48, the two elastic sheets 48 are vertically distributed, one side of the two elastic sheets 48 away from each other is fixedly connected with brush strips 49 matched with the length of the elastic sheets 48, the brush strips 49 can be attached to the corresponding first fins 3 or the upper wing plate 1 under the action of the elastic force of the elastic sheets 48, the sum of the lengths of the elastic sheets 48 and the fixing blocks 47 is larger than the width of the first fins 3, and the two elastic sheets 48 positioned on the same fixing block 47, the separated sides of the two fins are respectively flush with the top and the bottom of the fixed block 47, and the connecting block 73 can be attached to the adjacent two first fins 3;
through being provided with the cleaning component 4, in the long-time use process of the radiator, dust and sundries are adhered to the first fins 3, so that the radiating effect of the first fins 3 is affected, at the moment, the shifting block 42 can be shifted, the fixed shaft 41 and the cleaning rod 40 can move back and forth along the limiting hole direction, in the moving process of the cleaning rod 40, the fixed block 47 can drive the elastic piece 48 to move along the area between two adjacent first fins 3 under the driving of the cleaning rod 40, in the process, the brush strips 49 on the elastic piece 48 can brush against the first fins 3 and the upper wing plates 1 under the elastic force of the elastic piece 48, so that the dust attached to the bottoms of the first fins 3 and the upper wing plates 1 is brushed, and the radiating effect of the first fins 3 and the upper wing plates 1 on the semiconductor device 5 is further ensured;
In addition, in the process of moving the cleaning rod 40, the limiting block 44 on the limiting plate 43 can move along the limiting groove 45 under the driving of the cleaning rod 40, so that the cleaning rod 40 can drive the elastic sheet 48 and the brush strip 49 to clean the first fins 3 and the upper wing plate 1 more stably by matching with the limiting effect of the limiting hole on the fixed shaft 41, when the cleaning rod 40 drives the limiting block 44 to move to the position of the notch 46, the limiting block 44 is not limited by the limiting groove 45, so that the shifting block 42 can be rotated, the elastic sheet 48 is driven by the fixing shaft 41 and the cleaning rod 40 to deflect in the direction away from the lower wing plate 2 by taking the fixed shaft 41 as the center of a circle, the elastic sheet 48 can deflect between two adjacent first fins 3, so that dust and sundries on the brush strip 49 can be cleaned conveniently by using a brush, the cleaning of the brush strip 49 is ensured, and after the brush strip 49 is cleaned, the shifting block 42 can be shifted again, so that the elastic sheet 48 can be driven to return to the position between two adjacent first fins 3;
In addition, due to the fixing block 47, when the heat generated by the semiconductor device 5 is transferred from bottom to top to the plurality of first fins 3 one by one, the fixing block 47 can play a role of connecting two adjacent first fins 3, thereby accelerating the transfer of the heat among the plurality of first fins 3 and improving the heat dissipation effect of the first fins 3 to the semiconductor device 5.
As shown in fig. 2, 3,6 and 7, the heat conduction assembly 7 includes a first copper sheet 71 and a second copper sheet 72, and the thickness of the second copper sheet 72 is greater than the depth of the embedded groove 6, the first copper sheet 71 and the second copper sheet 72 are respectively installed in the two embedded grooves 6, the first copper sheet 71 is located in the embedded groove 6 on one side of the lower wing plate 2 far away from the upper wing plate 1, a plurality of connection blocks 73 are fixedly connected to one side of the first copper sheet 71 far away from the semiconductor device 5, the plurality of connection blocks 73 are respectively inserted in the plurality of connection holes, a slot is provided on one side of the connection block 73 far away from the first copper sheet 71, a plurality of insertion blocks 74 are fixedly connected to one side of the second copper sheet 72 near the first copper sheet 71, and the plurality of insertion blocks 74 are respectively inserted in the slots of the corresponding connection blocks 73, the second copper sheet 72 is far away from the first copper sheet 71, one side of the second copper sheet 72 is inserted with a connecting screw 75 in a penetrating manner, the connecting screw 75 is inserted on a corresponding inserting block 74 in a threaded manner, a plurality of heat conducting grooves are formed in the position, located at the top of the embedded groove 6, of the lower wing plate 2, the bottoms of the heat conducting grooves are communicated with the embedded groove 6 on the corresponding side, heat conducting copper wires 76 are installed in the heat conducting grooves, the bottoms of the plurality of heat conducting copper wires 76 are fixedly connected with the same copper bar 77, the copper bar 77 is tightly attached to the top of the first copper sheet 71, the thickness of the copper bar 77 is matched with the thickness of the first copper sheet 71, the positions, opposite to the first copper sheet 71, of the copper bar 77 are designed to be inclined planes, the copper bar 77 and the first copper sheet 71 are tightly pressed together through inclined planes, the connecting block 73 and the inserting block 74 are made of metal copper, and the size of the connecting block 73 is matched with the size of the inserting groove;
In use, the heat conducting copper wires 76 are firstly installed in the heat conducting grooves, then the first copper sheet 71 and the second copper sheet 72 are respectively installed in the two embedded grooves 6, the first copper sheet 71 and the second copper sheet 72 are connected together through the connecting blocks 73 and the inserting blocks 74, then the connecting screws 75 are used for locking the first copper sheet 71 and the second copper sheet 72, and as the first copper sheet 71 and the second copper sheet 72 are gradually locked, the first copper sheet 71 can be connected with the heat conducting copper wires 76 through the copper bars 77;
In the process of using the semiconductor device 5, when the semiconductor device 5 generates heat, because the heat conductivity of copper is higher than that of aluminum, the heat generated by the semiconductor device 5 can be quickly transferred to the lower wing plate 2 through the second copper sheet 72, so that the speed of receiving the heat by the second fin 14 and the upper wing plate 1 is improved, meanwhile, the heat generated by the semiconductor device 5 can be further transferred to the first copper sheet 71 through the connecting block 73 and the inserting block 74, and then the heat reaching the first copper sheet 71 can be quickly transferred to the side, far away from the first fin 3, of the lower wing plate 2 through the copper strips 77 and the heat conducting copper wires 76, so that the heat generated by the semiconductor device 5 can be absorbed more uniformly on the side, far away from the first fin 3, of the whole lower wing plate 2, and then when the wind generated by the fan blows on the upper wing plate 1 and the lower wing plate 2, the lower wing plate 3 can quickly dissipate the heat, and the other wind can be further processed on the side, far away from the first fin 3, of the lower wing plate 2 through the two strip-shaped blocks 8, so that the heat dissipation effect of the whole radiator is improved by matching with the first fin 3.
As shown in fig. 1 to 4, the front side and the rear side of the lower wing plate 2 are fixedly connected with the guide strips 12, the length of the guide strips 12 is larger than the distance between the two strip-shaped blocks 8, the guide strips 12 are flush with one side of the lower wing plate 2 away from the first fins 3, and the thickness of the guide strips 12 gradually increases in the direction approaching the lower wing plate 2;
through being provided with the water conservancy diversion strip 12, when the wind that the fan produced blows on first fin 3 from the front and back side direction of lower pterygoid lamina 2, the wind that the fan produced can more enter into between two bar pieces 8 under the guiding action of water conservancy diversion strip 12 to increase the flow of the first fin 3 side wind of lower pterygoid lamina 2 is kept away from, and then promotes the radiating effect of lower pterygoid lamina 2 side of keeping away from first fin 3.
Embodiment two:
As shown in fig. 8, the radiator further includes a heat dissipation plate 13, the heat dissipation plate 13 is provided with the same mounting hole 9 and the same fixing hole 10 as those on the lower wing plate 2, the upper half part of the heat dissipation plate 13 is designed as an inclined plane, the inclined plane of the upper half part of the heat dissipation plate 13 is fixedly connected with a plurality of second fins 14, the width of the second fins 14 gradually increases from bottom to top, the second fins 14 are parallel to the bottom of the heat dissipation plate 13, the length of the second fins 14 is matched with the length of the heat dissipation plate 13, and the semiconductor device 5 is mounted on the lower half part of one side of the heat dissipation plate 13 close to the second fins 14 through fixing screws 11.
The upper wing plate 1, the lower wing plate 2, the fixed block 47, the first fin 3, the second fin 14 and the heat dissipation plate 13 are all made of metal aluminum;
When the heat sink is mounted on some small circuit boards, the semiconductor device 5 can be mounted on the heat dissipation plate 13, and then the heat dissipation plate 13 is connected with the circuit board through the fixing holes 10, so that the purpose of reducing the size of the heat sink is achieved, and in the process of using the semiconductor device 5, heat generated by the semiconductor device 5 can be dissipated through the second fins 14 on the heat dissipation plate 13.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting.
Claims (3)
1. A semiconductor device heat sink employing boundary flow heat dissipation, comprising a heat sink, characterized in that: the radiator comprises an upper wing plate (1) and a lower wing plate (2), wherein the upper wing plate (1) and the lower wing plate (2) are vertically and fixedly connected together to form an L shape, one side, close to the upper wing plate (1), of the lower wing plate (2) is vertically and fixedly connected with a plurality of first fins (3), a plurality of the first fins (3) are parallel to the upper wing plate (1), the same cleaning assembly (4) is arranged among the plurality of the first fins (3), a semiconductor device (5) is arranged on one side, close to the upper wing plate (1), of the lower wing plate (2), embedded grooves (6) are formed in two sides, close to the opposite positions of the semiconductor device (5), of the lower wing plate (2), a plurality of connecting holes are formed between groove walls, which are opposite to each other, of the two embedded grooves (6) are internally provided with one heat conducting assembly (7), one side, far from the upper wing plate (1), of the lower wing plate (2) is parallel to the upper wing plate (1), of which is fixedly connected with two blocks (8), and the two blocks (8) are respectively close to the top edges (2) of the strip-shaped top edges and the strip-shaped bottom edges (2);
The cleaning component (4) comprises a vertically arranged cleaning rod (40), the top end of the cleaning rod (40) is fixedly connected with a fixed shaft (41), a strip-shaped limiting hole is formed in a penetrating mode in the position, opposite to the fixed shaft (41), of the upper wing plate (1), the limiting hole is parallel to the length direction of the first wing plate (3), the top end of the fixed shaft (41) is connected in the limiting hole in a penetrating mode, the top end of the fixed shaft (41) is fixedly connected with a shifting block (42), the bottom end of the cleaning rod (40) is fixedly connected with a limiting plate (43), the limiting plate (43) is located at the bottom of the first wing plate (3), the limiting plate (43) is perpendicular to the lower wing plate (2), a limiting block (44) is fixedly connected to the top of the limiting plate (43), a strip-shaped limiting groove (45) is formed in the position, opposite to the first wing plate (44), the bottom of the first wing plate (3), the limiting groove (45) is parallel to the limiting hole, the width of the limiting groove (45) is identical to the width of the limiting block (44), the limiting groove (45) is the width of the limiting groove (45), the limiting groove (45) is the notch groove (46), the limiting groove (46) is the size is larger than the notch groove (46), and is the notch groove (46) is the size of the notch groove (46) and is larger than the size, and is the notch groove (46) is the size is larger than the notch groove (46), one side of the cleaning rod (40) close to the first fins (3) is fixedly connected with a plurality of fixing blocks (47), the fixing blocks (47) are correspondingly inserted between the first fins (3) one by one, one side of the fixing blocks (47) away from the cleaning rod (40) is fixedly connected with two elastic sheets (48), the two elastic sheets (48) are vertically distributed, one side of the two elastic sheets (48) away from each other is fixedly connected with brush strips (49) matched with the lengths of the elastic sheets (48), and the brush strips (49) can be attached to the corresponding first fins (3) or upper wing plates (1) under the action of the elastic sheets (48);
The heat conduction component (7) comprises a first copper sheet (71) and a second copper sheet (72), the thickness of the second copper sheet (72) is larger than the depth of the embedded groove (6), the first copper sheet (71) and the second copper sheet (72) are respectively installed in the two embedded grooves (6), the first copper sheet (71) is positioned in the embedded groove (6) on one side of the lower wing plate (2) far away from the upper wing plate (1), one side of the first copper sheet (71) far away from the semiconductor device (5) is fixedly connected with a plurality of connecting blocks (73), the connecting blocks (73) are respectively inserted into a plurality of connecting holes, one side of the connecting blocks (73) far away from the first copper sheet (71) is provided with a slot, one side of the second copper sheet (72) close to the first copper sheet (71) is fixedly connected with a plurality of inserting blocks (74), the plurality of inserting blocks (74) are respectively inserted into the slots corresponding to the connecting blocks (73), one side of the second copper sheet (72) far away from the first copper sheet (71) is penetrated by a connecting screw (75), the connecting blocks (75) are inserted into the corresponding copper sheet (6) at the bottom of the corresponding inserting grooves (6), the heat conduction groove (6) is provided with the heat conduction groove (6), the bottom ends of the heat conducting copper wires (76) are fixedly connected with the same copper bar (77), and the copper bars (77) are tightly attached to the top of the first copper sheet (71);
The sum of the lengths of the elastic sheets (48) and the fixed blocks (47) is larger than the width of the first fin (3), and two elastic sheets (48) which are positioned on the same fixed block (47) are respectively flush with the top and the bottom of the fixed block (47) at the opposite sides;
a plurality of mounting holes (9) and a plurality of fixing holes (10) are formed in the lower wing plate (2) in a penetrating mode, and fixing screws (11) are connected between the semiconductor device (5) and the mounting holes (9) in a threaded mode;
The thickness of the copper strip (77) is matched with that of the first copper sheet (71), the positions of the copper strip (77) opposite to the first copper sheet (71) are designed to be inclined planes, and the copper strip and the first copper sheet are tightly pressed together through the inclined planes;
The connecting blocks (73) and the inserting blocks (74) are made of metal copper, and the sizes of the connecting blocks (73) are matched with the sizes of the slots;
The front side and the rear side of the lower wing plate (2) are fixedly connected with guide strips (12), the length of each guide strip (12) is larger than the distance between the two strip-shaped blocks (8), the guide strips (12) are flush with one side, away from the first fin (3), of the lower wing plate (2), and the thickness of each guide strip (12) gradually thickens towards the direction, close to the lower wing plate (2).
2. A semiconductor device heat sink for dissipating heat using a boundary flow as set forth in claim 1, wherein: the radiator further comprises a radiating plate (13), the radiating plate (13) is provided with the same mounting hole (9) and the same fixing hole (10) in a penetrating mode, the upper half portion of the radiating plate (13) is of an inclined plane design, a plurality of second fins (14) are fixedly connected to the inclined plane of the upper half portion of the radiating plate (13), the width of each second fin (14) is gradually increased from bottom to top, the second fins (14) are parallel to the bottom of the radiating plate (13), the length of each second fin (14) is matched with the length of the radiating plate (13), and the semiconductor device (5) is mounted on the lower half portion, close to one side of each second fin (14), of the radiating plate (13) through a fixing screw (11).
3. A semiconductor device heat sink employing boundary flow heat dissipation as defined in claim 2, wherein: the upper wing plate (1), the lower wing plate (2), the fixing block (47), the first fins (3), the second fins (14) and the radiating plate (13) are all made of metal aluminum, and the connecting block (73) can be attached to two adjacent first fins (3).
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| CN202410317461.5A CN117913045B (en) | 2024-03-20 | 2024-03-20 | Semiconductor device radiator adopting boundary flow for heat radiation |
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| CN202410317461.5A CN117913045B (en) | 2024-03-20 | 2024-03-20 | Semiconductor device radiator adopting boundary flow for heat radiation |
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| CN117913045B true CN117913045B (en) | 2024-05-17 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0079238A2 (en) * | 1981-11-10 | 1983-05-18 | Fujitsu Limited | Semiconductor devices provided with heat-dissipating means |
| CN107658279A (en) * | 2017-10-19 | 2018-02-02 | 华中科技大学 | A kind of rib film-type radiator with strip of paper used for sealing |
| CN207249594U (en) * | 2017-08-29 | 2018-04-17 | 四川省蓝扬科技有限公司 | A kind of automatically cleaning radiator of computer |
| CN210200706U (en) * | 2019-08-27 | 2020-03-27 | 昆山品岱电子有限公司 | Novel blowing plate type fin heat dissipation module |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4141613B2 (en) * | 2000-03-09 | 2008-08-27 | 富士通株式会社 | Closed cycle refrigerator and dry evaporator for closed cycle refrigerator |
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- 2024-03-20 CN CN202410317461.5A patent/CN117913045B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0079238A2 (en) * | 1981-11-10 | 1983-05-18 | Fujitsu Limited | Semiconductor devices provided with heat-dissipating means |
| CN207249594U (en) * | 2017-08-29 | 2018-04-17 | 四川省蓝扬科技有限公司 | A kind of automatically cleaning radiator of computer |
| CN107658279A (en) * | 2017-10-19 | 2018-02-02 | 华中科技大学 | A kind of rib film-type radiator with strip of paper used for sealing |
| CN210200706U (en) * | 2019-08-27 | 2020-03-27 | 昆山品岱电子有限公司 | Novel blowing plate type fin heat dissipation module |
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| CN117913045A (en) | 2024-04-19 |
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