CN117881535B - 金属层叠材料及其制造方法、印刷线路板 - Google Patents

金属层叠材料及其制造方法、印刷线路板

Info

Publication number
CN117881535B
CN117881535B CN202280058455.1A CN202280058455A CN117881535B CN 117881535 B CN117881535 B CN 117881535B CN 202280058455 A CN202280058455 A CN 202280058455A CN 117881535 B CN117881535 B CN 117881535B
Authority
CN
China
Prior art keywords
metal
layer
dielectric film
foil
metal foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202280058455.1A
Other languages
English (en)
Chinese (zh)
Other versions
CN117881535A (zh
Inventor
南部光司
畠田贵文
丸桥由和
黑川哲平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Kohan Co Ltd
Original Assignee
Toyo Kohan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kohan Co Ltd filed Critical Toyo Kohan Co Ltd
Publication of CN117881535A publication Critical patent/CN117881535A/zh
Application granted granted Critical
Publication of CN117881535B publication Critical patent/CN117881535B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
CN202280058455.1A 2021-10-26 2022-10-20 金属层叠材料及其制造方法、印刷线路板 Active CN117881535B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021174667 2021-10-26
JP2021-174667 2021-10-26
PCT/JP2022/039148 WO2023074531A1 (ja) 2021-10-26 2022-10-20 金属積層材及びその製造方法、並びにプリント配線板

Publications (2)

Publication Number Publication Date
CN117881535A CN117881535A (zh) 2024-04-12
CN117881535B true CN117881535B (zh) 2026-03-17

Family

ID=86159386

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280058455.1A Active CN117881535B (zh) 2021-10-26 2022-10-20 金属层叠材料及其制造方法、印刷线路板

Country Status (5)

Country Link
JP (1) JPWO2023074531A1 (https=)
KR (1) KR20240093456A (https=)
CN (1) CN117881535B (https=)
TW (1) TW202400848A (https=)
WO (1) WO2023074531A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4532713B2 (ja) * 2000-10-11 2010-08-25 東洋鋼鈑株式会社 多層金属積層フィルム及びその製造方法
US20090246554A1 (en) * 2007-05-23 2009-10-01 Mikio Furukawa Laminate having peelability and production method therefor
JP2014193606A (ja) * 2013-03-01 2014-10-09 Jx Nippon Mining & Metals Corp キャリア付銅箔、それを用いた銅張積層板、プリント配線板、それを用いた電子機器及びプリント配線板の製造方法
JP7492807B2 (ja) 2016-12-06 2024-05-30 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7085419B2 (ja) * 2018-03-14 2022-06-16 東洋鋼鈑株式会社 圧延接合体及びその製造方法
JP7588956B2 (ja) * 2019-08-26 2024-11-25 東洋鋼鈑株式会社 キャリア層付き金属積層基材及びその製造方法、金属積層基材及びその製造方法、並びにプリント配線板

Also Published As

Publication number Publication date
JPWO2023074531A1 (https=) 2023-05-04
CN117881535A (zh) 2024-04-12
WO2023074531A1 (ja) 2023-05-04
TW202400848A (zh) 2024-01-01
KR20240093456A (ko) 2024-06-24

Similar Documents

Publication Publication Date Title
JP7799793B2 (ja) キャリア層付き金属積層基材及びその製造方法、金属積層基材及びその製造方法、並びにプリント配線板
JP7177956B2 (ja) 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN102124823B (zh) 印刷布线板用铜箔
US20090246554A1 (en) Laminate having peelability and production method therefor
CN106455341A (zh) 附载体铜箔、积层体、印刷配线板的制造方法及电子机器的制造方法
CN112424399A (zh) 粗糙化处理铜箔、带载体的铜箔、覆铜层叠板及印刷电路板
CN101904228B (zh) 印刷配线板用铜箔
JP4652020B2 (ja) 銅張り積層板
CN108124391A (zh) 复合金属箔、覆铜层叠板及该覆铜层叠板的制造方法
TWI783190B (zh) 層積體
JP7618390B2 (ja) 金属積層フィルム及びその製造方法
JP6854114B2 (ja) 表面処理銅箔
JP7259093B2 (ja) 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
CN117881535B (zh) 金属层叠材料及其制造方法、印刷线路板
JP2010239095A (ja) プリント配線板用銅箔
JP4762533B2 (ja) 銅メタライズド積層板及びその製造方法
CN120936492A (zh) 金属层叠材料及其制造方法、印刷线路板
TWI914342B (zh) 金屬層積膜及其製造方法
JP5073801B2 (ja) 銅張り積層板の製造方法
JP4776217B2 (ja) 銅メタライズド積層板及びその製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant