KR20240093456A - 금속 적층재 및 그 제조 방법, 및 프린트 배선판 - Google Patents

금속 적층재 및 그 제조 방법, 및 프린트 배선판 Download PDF

Info

Publication number
KR20240093456A
KR20240093456A KR1020247008169A KR20247008169A KR20240093456A KR 20240093456 A KR20240093456 A KR 20240093456A KR 1020247008169 A KR1020247008169 A KR 1020247008169A KR 20247008169 A KR20247008169 A KR 20247008169A KR 20240093456 A KR20240093456 A KR 20240093456A
Authority
KR
South Korea
Prior art keywords
metal
layer
dielectric film
foil
low dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247008169A
Other languages
English (en)
Korean (ko)
Inventor
코지 난부
타카후미 하타케다
요시카즈 마루하시
텟페이 쿠로카와
Original Assignee
도요 고한 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도요 고한 가부시키가이샤 filed Critical 도요 고한 가부시키가이샤
Publication of KR20240093456A publication Critical patent/KR20240093456A/ko
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
KR1020247008169A 2021-10-26 2022-10-20 금속 적층재 및 그 제조 방법, 및 프린트 배선판 Pending KR20240093456A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-174667 2021-10-26
JP2021174667 2021-10-26
PCT/JP2022/039148 WO2023074531A1 (ja) 2021-10-26 2022-10-20 金属積層材及びその製造方法、並びにプリント配線板

Publications (1)

Publication Number Publication Date
KR20240093456A true KR20240093456A (ko) 2024-06-24

Family

ID=86159386

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247008169A Pending KR20240093456A (ko) 2021-10-26 2022-10-20 금속 적층재 및 그 제조 방법, 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JPWO2023074531A1 (https=)
KR (1) KR20240093456A (https=)
CN (1) CN117881535B (https=)
TW (1) TW202400848A (https=)
WO (1) WO2023074531A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018090906A (ja) 2016-12-06 2018-06-14 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4532713B2 (ja) * 2000-10-11 2010-08-25 東洋鋼鈑株式会社 多層金属積層フィルム及びその製造方法
US20090246554A1 (en) * 2007-05-23 2009-10-01 Mikio Furukawa Laminate having peelability and production method therefor
JP2014193606A (ja) * 2013-03-01 2014-10-09 Jx Nippon Mining & Metals Corp キャリア付銅箔、それを用いた銅張積層板、プリント配線板、それを用いた電子機器及びプリント配線板の製造方法
JP7085419B2 (ja) * 2018-03-14 2022-06-16 東洋鋼鈑株式会社 圧延接合体及びその製造方法
JP7588956B2 (ja) * 2019-08-26 2024-11-25 東洋鋼鈑株式会社 キャリア層付き金属積層基材及びその製造方法、金属積層基材及びその製造方法、並びにプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018090906A (ja) 2016-12-06 2018-06-14 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法

Also Published As

Publication number Publication date
JPWO2023074531A1 (https=) 2023-05-04
CN117881535A (zh) 2024-04-12
WO2023074531A1 (ja) 2023-05-04
TW202400848A (zh) 2024-01-01
CN117881535B (zh) 2026-03-17

Similar Documents

Publication Publication Date Title
JP7799793B2 (ja) キャリア層付き金属積層基材及びその製造方法、金属積層基材及びその製造方法、並びにプリント配線板
JP7177956B2 (ja) 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
US20090246554A1 (en) Laminate having peelability and production method therefor
KR102573723B1 (ko) 압연 접합체 및 그 제조 방법
WO2015122258A1 (ja) キャリア付き極薄銅箔、並びにこれを用いて作製された銅張積層板、プリント配線基板及びコアレス基板
JP4652020B2 (ja) 銅張り積層板
WO2021215353A1 (ja) 金属積層フィルム及びその製造方法
TWI783190B (zh) 層積體
KR20120053195A (ko) 내열접착력을 개선한 연성회로기판용 동박 적층 구조체 및 그의 제조방법
KR20240093456A (ko) 금속 적층재 및 그 제조 방법, 및 프린트 배선판
JP2010218905A (ja) 基板用金属材料、基板用金属材料の表面粗化処理方法および基板用金属材料の製造方法
JP2010239095A (ja) プリント配線板用銅箔
KR20220042307A (ko) 폴리아릴렌술피드계 수지 필름, 금속 적층체, 폴리아릴렌술피드계 수지 필름의 제조 방법, 및 금속 적층체의 제조 방법
KR20250172614A (ko) 금속 적층재 및 그 제조 방법, 그리고 프린트 배선판
TWI914342B (zh) 金屬層積膜及其製造方法
JP4677381B2 (ja) プリント配線基板用金属材料
JP5373453B2 (ja) プリント配線板用銅箔
JP5073801B2 (ja) 銅張り積層板の製造方法
WO2019176937A1 (ja) 圧延接合体及びその製造方法
KR20230109728A (ko) 표면 처리 구리박, 동장 적층판 및 프린트 배선판

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20240311

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20250521

Comment text: Request for Examination of Application