CN117859052A - Inspection system, control method, electronic component manufacturing method, and cutting device - Google Patents
Inspection system, control method, electronic component manufacturing method, and cutting device Download PDFInfo
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- CN117859052A CN117859052A CN202280051448.9A CN202280051448A CN117859052A CN 117859052 A CN117859052 A CN 117859052A CN 202280051448 A CN202280051448 A CN 202280051448A CN 117859052 A CN117859052 A CN 117859052A
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- 238000007689 inspection Methods 0.000 title claims abstract description 150
- 238000005520 cutting process Methods 0.000 title claims description 79
- 238000000034 method Methods 0.000 title claims description 27
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 238000005286 illumination Methods 0.000 claims abstract description 85
- 238000003860 storage Methods 0.000 claims abstract description 40
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 50
- 238000005192 partition Methods 0.000 claims description 20
- 230000007246 mechanism Effects 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 description 44
- 238000012545 processing Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 12
- 238000011835 investigation Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000012790 confirmation Methods 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000000465 moulding Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8809—Adjustment for highlighting flaws
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8812—Diffuse illumination, e.g. "sky"
- G01N2021/8816—Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/104—Mechano-optical scan, i.e. object and beam moving
- G01N2201/1042—X, Y scan, i.e. object moving in X, beam in Y
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Signal Processing (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Dicing (AREA)
Abstract
The inspection system inspects the inspection object based on the photographed image of the inspection object. The inspection system includes an illumination section, a camera, a control section, and a storage section. The illumination unit is capable of changing the irradiation state of light and irradiating the inspection object with light. The camera generates a captured image in a state of irradiating light to the inspection object. The control unit controls the illumination unit and the camera to generate a plurality of captured images generated in different illumination states. The storage unit stores the reference histogram. The control unit compares each histogram generated based on the plurality of captured images with a reference histogram, and determines an irradiation state used for the examination based on the result of the comparison.
Description
Technical Field
The invention relates to an inspection system, a control method, a method for manufacturing an electronic component, and a cutting device.
Background
Japanese patent laying-open No. 2021-115668 (patent document 1) discloses a processing apparatus having a camera unit. The camera unit includes an illuminator for illuminating light to the object to be processed. In this processing apparatus, an object to be processed is photographed in a state where light is irradiated to the object to be processed (see patent document 1).
Patent document 1: japanese patent laid-open publication No. 2021-115668
In the processing apparatus disclosed in patent document 1, for example, the illuminator is manually adjusted. In this case, the brightness or the like of the light irradiated to the workpiece (hereinafter also referred to as "light irradiation state") is determined according to the judgment of the operator. However, this determination is not necessarily easy.
Disclosure of Invention
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an inspection system, a control method, a method for manufacturing an electronic component, and a cutting device capable of automatically adjusting an irradiation state of light irradiated to an inspection object when the inspection object is inspected.
An inspection system according to an aspect of the present invention inspects an inspection object based on a captured image of the inspection object. The inspection system includes an illumination section, a camera, a control section, and a storage section. The illumination unit is capable of changing the irradiation state of light and irradiating the inspection object with light. The camera generates a captured image in a state of irradiating light to the inspection object. The control unit controls the illumination unit and the camera to generate a plurality of captured images generated in different illumination states. The storage unit stores the reference histogram. The control unit compares each histogram generated based on the plurality of captured images with a reference histogram, and determines an irradiation state used for the examination based on the result of the comparison.
In addition, a control method according to another aspect of the present invention is a control method of the above-described inspection system. The control method comprises the following steps: a step of controlling the illumination unit and the camera to generate a plurality of captured images generated in different illumination states, respectively; and a step of comparing each histogram generated based on the plurality of captured images with a reference histogram, and determining an irradiation state used in the inspection based on a result of the comparison.
In addition, a method of manufacturing an electronic component according to still another aspect of the present invention is a method of manufacturing an electronic component using the inspection system described above. The manufacturing method of the electronic component comprises the following steps: a step of determining an irradiation state used in the inspection; and cutting the resin-sealed substrate by a cutting mechanism to manufacture a plurality of electronic components. The plurality of electronic components are objects to be inspected, respectively. The method for manufacturing an electronic component further includes a step of generating a photographed image in a state in which the inspection object is irradiated with light in the specified irradiation state, and performing the inspection.
In addition, a cutting device according to still another aspect of the present invention includes the cutting mechanism and the inspection system described above. The cutting mechanism cuts the resin-sealed substrate.
Effects of the invention
According to the present invention, it is possible to provide an inspection system, a control method, a method of manufacturing an electronic component, and a cutting device capable of automatically adjusting an irradiation state of light irradiated to an inspection object when the inspection object is inspected.
Drawings
Fig. 1 is a plan view schematically showing a cutting device.
Fig. 2 is a side view schematically showing the spindle portion.
Fig. 3 is a view including a cross section of a schematically illustrated illumination portion.
Fig. 4 is a diagram schematically showing a hardware configuration of a computer.
Fig. 5 is a diagram showing one example of a preferable photographed image.
Fig. 6 is a diagram showing a histogram of the photographed image shown in fig. 5.
Fig. 7 is a diagram showing one example of an undesired photographed image.
Fig. 8 is a diagram showing a histogram of the photographed image shown in fig. 7.
Fig. 9 is a flowchart showing a procedure of generating a reference histogram.
Fig. 10 is a flowchart showing an automatic adjustment procedure of the irradiation state of light in the illumination section.
Fig. 11 is a flowchart showing the process performed in step S200 of fig. 10.
Fig. 12 is a flowchart showing the process performed in step S210 of fig. 10.
Fig. 13 is a diagram showing an example of a captured image of an electronic component in a modification.
Description of the reference numerals
A cutting device 1, a substrate supply unit 3, a positioning unit 4, a track unit 4, a cutting table 5, a holding unit 5B, a rotating mechanism 5C, a moving mechanism 5d, a first position checking camera 5e, a first cleaner 6 spindle part 6a blade 6B, a second position checking camera 6C, a rotating shaft 6d, a first flange 6e, a second flange 6F, a fastening unit 6F, a conveying unit 7, a second cleaner 7a, a inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement unit 14, an extraction unit 15, a tray for 15a good product, a tray for 15B, a 16, a 17 illumination unit 17a dome, a 17B LED, a 20 monitor, a 50 computer, a 70 control unit 72CPU, a 74RAM, a 76ROM, an 80 storage unit 81 control program, a 90 input/output I/F, 100, 200 electronic component units 110, a 210 black slot unit 120, 220 solder balls, an A1 cutting module B1 inspection storage module, a C1, C2, C3, C4, C5 IM1, IM2, IM1, an image component storage module, an hgc 1, an image component 1, an hgm 2, an hgm 1, an hgm 2, an image component 1, an hgm 1.
Detailed Description
Hereinafter, an embodiment (hereinafter also referred to as "the present embodiment") according to an aspect of the present invention will be described in detail with reference to the accompanying drawings. In addition, the same or corresponding portions in the drawings are denoted by the same reference numerals and the description thereof is not repeated. In addition, the drawings schematically depict the objects appropriately omitted or exaggerated for ease of understanding.
[1. Constitution ]
1-1. Integral Structure of cutting device
Fig. 1 is a plan view schematically showing a cutting device 1 according to the present embodiment. The cutting device 1 is configured to: the package substrate (object to be cut) is cut, and the package substrate is singulated into a plurality of electronic components (package members). In the package substrate, the substrate or the lead frame on which the semiconductor chip is mounted is sealed with a resin.
As an example of the package substrate, a BGA (Ball Grid Array) package substrate, an LGA (Land Grid Array) package substrate, a CSP (Chip Size Package ) package substrate, an LED (Light Emitting Diode ) package substrate, a QFN (Quad Flat No-lead) package substrate can be cited.
The cutting device 1 is configured to inspect the singulated electronic components, respectively. In the cutting device 1, an image of each electronic component is captured, and inspection of each electronic component is performed based on the image. Inspection data is generated by the inspection, and each electronic component is classified as "good" or "bad".
In this example, the package substrate P1 is used as a cutting object, and the package substrate P1 is singulated into a plurality of electronic components S1 by the cutting device 1. Hereinafter, the resin-sealed surface of the package substrate P1 is referred to as a molding surface, and the surface opposite to the molding surface is referred to as a ball/pin surface.
As shown in fig. 1, the cutting device 1 includes a cutting module A1 and an inspection storage module B1 as constituent elements. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting the package substrate P1. The inspection and storage module B1 is configured to inspect each of the plurality of manufactured electronic components S1 and then store the electronic components S1 in a tray. In the cutting device 1, each component is removable and replaceable with respect to other components.
The cutting module A1 mainly includes a substrate supply section 3, a positioning section 4, a cutting table 5, a spindle section 6, and a conveying section 7.
The substrate supply unit 3 pushes out the package substrates P1 one by one from the magazine M1 accommodating the plurality of package substrates P1, thereby supplying the package substrates P1 one by one to the positioning unit 4. At this time, the package substrate P1 is configured such that the ball/pin faces upward.
The positioning unit 4 positions the package substrate P1 pushed out from the substrate supply unit 3 by disposing the package substrate P1 on the rail portion 4 a. Then, the positioning unit 4 conveys the positioned package substrate P1 to the cutting table 5.
The cutting stage 5 holds the package substrate P to be cut. In this example, the cutting device 1 having a double-cutting-stage structure with two cutting stages 5 is illustrated. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a holds the package substrate P1 by sucking the package substrate P1 conveyed by the positioning portion 4 from below. The rotation mechanism 5b can rotate the holding member 5a around the θ1 direction in the drawing. The moving mechanism 5c can move the holding member 5a along the Y axis in the drawing.
The spindle portion 6 cuts the package substrate P1 to singulate the package substrate P1 into a plurality of electronic components S1. In this example, a cutting device 1 of a double spindle structure having two spindle portions 6 is illustrated. The spindle portion 6 is movable along the X-axis and the Z-axis in the drawing. The cutting device 1 may have a single spindle structure having one spindle portion 6.
Fig. 2 is a side view schematically showing the spindle portion 6. As shown in fig. 2, the spindle portion 6 includes a blade 6a, a rotation shaft 6c, a first flange 6d, a second flange 6e, and a fastening member 6f.
The blade 6a cuts the package substrate P1 by rotating at a high speed, thereby singulating the package substrate P1 into a plurality of electronic components S1. The blade 6a is attached to the rotation shaft 6c in a state sandwiched by one flange (first flange) 6d and the other flange (second flange) 6 e. The first flange 6d and the second flange 6e are fixed to the rotation shaft 6c by a fastening member 6f such as a nut. The first flange 6d is also called an inner flange and the second flange 6e is also called an outer flange.
The spindle portion 6 is provided with a cutting water nozzle, a cooling water nozzle, a cleaning water nozzle (both not shown), and the like. The cutting water nozzle sprays cutting water to the blade 6a rotating at a high speed. The cooling water is sprayed by a nozzle. The cleaning water jets the cleaning water for cleaning the chips and the like by the nozzle.
Referring again to fig. 1, after the package substrate P1 is suctioned by the cutting stage 5, the package substrate P1 is photographed by the first position confirmation camera 5d, and the position of the package substrate P1 is confirmed. The confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of the mark provided on the package substrate P1. The mark indicates, for example, a cutting position of the package substrate P1.
Then, the cutting table 5 moves toward the spindle portion 6 along the Y axis in the drawing. After the cutting stage 5 moves below the spindle 6, the package substrate P1 is cut by relatively moving the cutting stage 5 and the spindle 6. Then, the package substrate P1 is photographed by the second position confirmation camera 6b provided in the spindle portion 6 as necessary, and the position and the like of the package substrate P1 are confirmed. The confirmation using the second position confirmation camera 6b is, for example, confirmation of the cutting position and the cutting width of the package substrate P1.
After the completion of cutting the package substrate P1, the cutting stage 5 moves in a direction away from the centrifugal shaft portion 6 along the Y axis in the drawing in a state where the singulated electronic components S1 are adsorbed. During this movement, cleaning and drying of the upper surface (ball/pin surface) of the electronic component S1 are performed with the first cleaner 5 e.
The transport unit 7 suctions the electronic component S1 held by the cutting table 5 from above, and transports the electronic component S1 to the inspection table 11 of the inspection storage module B1. During this conveyance, the cleaning and drying of the lower surface (molded surface) of the electronic component S1 are performed by the second cleaner 7 a.
The inspection storage module B1 mainly includes an inspection stage 11, a first optical inspection camera 12, a second optical inspection camera 13, illumination sections 16, 17, an arrangement section 14, and an extraction section 15. In addition, the first optical inspection camera 12 may be provided on the cutting module A1.
The inspection stage 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection stage 11 is movable along the X-axis in the drawing. The inspection table 11 can be turned upside down. The inspection stage 11 is provided with a holding member for holding the electronic component S1 by sucking the electronic component S1. In the inspection stage 11, the surface holding the electronic component S1 is made of, for example, black rubber. The rubber is not necessarily black, and may be white, for example.
The first optical inspection camera 12 and the second optical inspection camera 13 capture both sides (ball/socket side and molding side) of the electronic component S1. Various inspections of the electronic component S1 are performed based on the captured images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are each disposed near the inspection stage 11 so as to capture an image of the upper side. The captured images generated by the first optical inspection camera 12 and the second optical inspection camera 13, respectively, are, for example, images of gradation (256 gradations).
The first optical inspection camera 12 photographs the molding surface of the electronic component S1 conveyed to the inspection stage 11 by the conveying section 7. Then, the conveying unit 7 mounts the electronic component S1 on the holding member of the inspection stage 11. After the holding member adsorbs the electronic component S1, the inspection stage 11 is turned upside down. The inspection stage 11 moves upward of the second optical inspection camera 13, and the ball/socket surface of the electronic component S1 is photographed by the second optical inspection camera 13.
An illumination unit 16 is provided above the first optical inspection camera 12, and an illumination unit 17 is provided above the second optical inspection camera 13. The illumination units 16 and 17 are constituted by so-called coaxial illumination, for example. The illumination unit 16 is configured to: when the inspection is performed by the first optical inspection camera 12, light is irradiated to the electronic component S1 on the inspection stage 11. The illumination unit 17 is configured to: when the inspection is performed by the second optical inspection camera 13, light is irradiated to the electronic component S1 on the inspection stage 11. Since the illumination units 16 and 17 have the same configuration, the configuration of the illumination unit 17 will be representatively described below.
Fig. 3 is a view including a cross section of the illumination portion 17 schematically shown. As shown in fig. 3, in the inspection by the second optical inspection camera 13, light emitted by the illumination section 17 is irradiated to the electronic component S1. In a state where light is irradiated to the electronic component S1, a captured image of the electronic component S1 is generated by the second optical inspection camera 13. Based on the captured image, inspection of the electronic component S1 is performed.
The illumination unit 17 is configured by dome-shaped illumination, and includes a dome 17a and a plurality of LEDs 17b. The dome-shaped illumination may be constituted by so-called dome illumination, but is not necessarily required to be constituted by dome illumination, and may be constituted by a dome-shaped (umbrella-shaped) member and a plurality of light emitting members (e.g., LEDs) disposed in the member. The dome 17a has a dome shape, and the dome 17a has a circular shape in plan view. A plurality of LEDs 17b are arranged on the inner surface of the dome 17 a. In the illumination portion 17, a plurality of partitions (Ch 01 to Ch 08) are formed from the radially inner side to the outer side of the dome 17 a. In each of the plurality of partitions, a plurality of LEDs 17b are arranged at predetermined intervals in the circumferential direction of the dome 17 a.
The illumination section 17 is so-called multi-channel illumination. The lighting unit 17 can perform dimming of each of the partitions. That is, the illumination unit 17 can adjust illuminance (brightness of light) for each of the sections. For example, the illuminance level can be adjusted in the range of 0 to 100 in each zone. In this case, for example, the closer the illuminance level is to 100, the higher the illuminance, the closer the illuminance level is to 0, and the lower the illuminance. For example, by adjusting illuminance in each of the partitions, the irradiation state (illumination condition) of light in the illumination section 17 is adjusted. For example, the illuminance adjustment in each partition may be performed manually by an operator or may be performed automatically. The automatic adjustment of illuminance in each partition will be described in detail later.
Referring again to fig. 1, the inspected electronic component S1 is arranged in the arrangement section 14. The arrangement portion 14 is movable along the Y axis in the figure. The inspection stage 11 disposes the inspected electronic component S1 in the disposing section 14.
The extracting unit 15 transfers the electronic component S1 placed in the placement unit 14 to a tray. The electronic component S1 is classified as "good" or "bad" based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13. The extracting unit 15 transfers each electronic device S1 to the good tray 15a or the defective tray 15b based on the classification result. That is, the good product is stored in the good product tray 15a, and the defective product is stored in the defective product tray 15b. When the good tray 15a and the bad tray 15b are filled with the electronic component S1, they are replaced with new trays.
The cutting device 1 further comprises a computer 50 and a monitor 20. The monitor 20 is configured to display an image. The monitor 20 is constituted by a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence: electroluminescence) monitor, for example.
The computer 50 controls operations of the respective components of the cutting module A1 and the inspection housing module B1, for example. For example, operations such as the substrate supply section 3, the positioning section 4, the cutting stage 5, the spindle section 6, the conveying section 7, the inspection stage 11, the first optical inspection camera 12, the second optical inspection camera 13, the illumination sections 16, 17, the arrangement section 14, the extraction section 15, and the monitor 20 are controlled by the computer 50.
The computer 50 performs various inspections of the electronic component S1 based on, for example, the image data generated by the first optical inspection camera 12 and the second optical inspection camera 13. Next, the computer 50 will be described in detail.
<1-2. Hardware Structure of computer >
Fig. 4 is a diagram schematically showing a hardware configuration of the computer 50. As shown in fig. 4, the computer 50 includes an arithmetic unit 70, an input/output (interface) 90, and a storage unit 80, and the respective components are electrically connected via a bus.
The control section 70 includes a CPU (Central Processing Unit ) 72, a RAM (Random Access Memory, random access Memory) 74, a ROM (Read Only Memory) 76, and the like. The control unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 in response to the information processing.
The input/output I/F90 is configured to communicate with each component included in the cutting device 1 via a signal line. The I/F90 is used to transmit data from the computer 50 to each component in the cutting device 1 and to receive data transmitted from each component in the cutting device 1 to the computer 50. The receiving unit 95 is configured to receive an instruction from a user. The receiving section 95 includes, for example, a part or all of a touch panel, a keyboard, a mouse, and a microphone.
The storage unit 80 is an auxiliary storage device such as a hard disk drive or a solid state drive. The storage unit 80 is configured to store a control program 81, for example. Various operations in the cutting device 1 are realized by the control section 70 executing the control program 81. In the case where the control section 70 executes the control program 81, the control program 81 is expanded into the RAM 74. Accordingly, the control unit 70 controls the respective constituent elements by the CPU72 interpreting and executing the control program 81 developed in the RAM 74.
[2 ] automatic adjustment of light irradiation State ]
As described above, the inspection of the electronic component S1 is performed, for example, based on the photographed image generated by the first optical inspection camera 12 and the photographed image generated by the second optical inspection camera 13. Therefore, the inspection quality of the electronic component S1 is affected by the quality of each photographed image. The quality of each photographed image is affected by the irradiation state of light emitted from the illumination sections 16, 17 to the electronic component S1 when the electronic component S1 is photographed. Since the illumination units 16 and 17 are the same, the following description focuses on the illumination unit 17.
As one example, consider the case where the electronic component S1 is a BGA. For example, the inspection of the ball/socket surface of the electronic component S1 is performed by photographing the ball/socket surface of the electronic component S1 by the second optical inspection camera 13. In this case, the plurality of electronic components S1 singulated by cutting the package substrate P1 are photographed by the second optical inspection camera 13. Therefore, rubber (inspection stage 11) located at the boundary portion between the plurality of electronic components S1 and the adjacent electronic components S1 is reflected in the photographed image.
Fig. 5 is a diagram showing one example of a preferable photographed image. As shown in fig. 5, the captured image IM1 includes a plurality of electronic component parts 100, a plurality of solder ball parts 120 located on each electronic component part 100, and black groove parts 110 located between adjacent electronic component parts 100. The black groove 110 is rubber on the inspection table 11.
The captured image IM1 has the following features: (1) The electronic component part 100 and the black groove part 110 show a significant contrast ratio, (2) the image as a whole is not bright. Such a preferable captured image is generated when the irradiation state of the light emitted from the illumination unit 17 to the electronic component S1 is appropriate. The quality of the inspection based on such a preferable photographed image is high.
Fig. 6 is a diagram showing a histogram of the photographed image shown in fig. 5. Referring to fig. 6, the horizontal axis represents the gradation, and the vertical axis represents the number of pixels. Histogram HG1 includes components C1, C2, and C3. Component C1 corresponds to the electronic component part 100 (fig. 5), and component C2 corresponds to the black groove part 110. Component C3 corresponds to solder ball portion 120. In the histogram HG1, the component C1 and the component C2 are significantly separated. In addition, a peak of the component C1 having the largest number of pixels is generated near the center of the gradation. The histogram corresponding to the preferred captured image has such a feature.
Fig. 7 is a diagram showing one example of an undesired photographed image. As shown in fig. 7, the captured image IM2 includes a plurality of electronic components 200, a plurality of solder ball portions 220 located on each electronic component portion 200, and black groove portions 210 located between adjacent electronic component portions 200. In the photographed image IM2, the electronic part section 200 and the black groove section 210 do not show a significant contrast. When the irradiation state of the light emitted from the illumination unit 17 to the electronic component S1 is not appropriate, such an undesired captured image may be generated. The quality of the inspection based on such an unexpected photographed image is low.
Fig. 8 is a diagram showing a histogram of the photographed image shown in fig. 7. Referring to fig. 8, the horizontal axis represents the gradation, and the vertical axis represents the number of pixels. Histogram HG2 includes components C4, C5, and C6. Component C4 corresponds to the electronic component part 200 (fig. 7), and component C5 corresponds to the black groove part 210. Component C6 corresponds to solder ball 220. In the histogram HG2, the component C4 and the component C5 are not significantly separated, and the component C4 and the component C5 are mixed. A histogram corresponding to one example of an undesired captured image has such a feature.
In this way, depending on whether or not the irradiation state of the light emitted from the illumination unit 17 to the electronic component S1 is appropriate, the quality of the captured image generated by the second optical inspection camera 13 is affected, and as a result, the inspection quality of the electronic component S1 is affected. It is assumed that the illuminance adjustment of each partition of the illumination section 17 can be performed manually. In this case, the irradiation state of the light in the illumination section 17 is determined according to the judgment of the operator. However, such determination is not necessarily easy. Therefore, there is a possibility that at least a part of the problem that the irradiation state of the light in the illumination unit 17 becomes unsuitable and the low quality inspection is performed and the problem that the illuminance adjustment of each partition of the illumination unit 17 requires a long time may occur.
In the cutting device 1 according to the present embodiment, the computer 50 can automatically adjust the irradiation state of light in the illumination section 17 to an appropriate state. That is, the computer 50 can automatically adjust the illuminance level of each partition in the illumination section 17 to an appropriate value. This reduces the possibility of occurrence of the above-described problem. That is, according to the cutting device 1 of the present embodiment, the illuminance of each partition in the illumination unit 17 can be adjusted to an appropriate value without being affected by the proficiency of the operator or the like, and high-quality inspection can be realized.
In order to realize such a function, information indicating a histogram (hereinafter also referred to as "reference histogram") of an ideal captured image is stored in advance in the storage unit 80 of the computer 50. The reference histogram is a histogram generated based on the photographed image as a reference. For example, a reference histogram is generated based on an ideal captured image. An example of an ideal captured image is an image including the electronic component S1 as the inspection object, and is a captured image having (1) the electronic component section 100 and the black groove section 110 as shown in fig. 5 showing a distinct contrast and (2) the characteristic that the entire image is not bright.
Fig. 9 is a flowchart showing a procedure of generating a reference histogram. Each step shown in the flowchart is performed by an operator, for example, during the production of the cutting device 1 (in a state where the reference histogram is not stored in the storage unit 80). In the step shown in this flowchart, a plurality of captured images are generated while changing the combination pattern of the illuminance levels of each partition of the illumination unit 17, and a reference histogram is generated based on the optimal captured image. The generated reference histogram is stored in the storage unit 80. The following is a detailed description.
Referring to fig. 9, the worker adjusts the illuminance levels of the respective partitions of the illumination unit 17 (step S100). The operator operates the cutting device 1, and the electronic component S1 is photographed by the second optical inspection camera 13 while light is being irradiated from the illumination unit 17 to the electronic component S1 (step S110). The worker determines whether or not the photographed image generated by the second optical inspection camera 13 is an ideal photographed image based on past experience (step S120).
If it is determined that the captured image generated by the second optical inspection camera 13 is not an ideal captured image (no in step S120), the worker changes the combined pattern of the illuminance levels of the respective sections of the illumination section 17 to a different pattern (step S100). On the other hand, if it is determined that the captured image generated by the second optical inspection camera 13 is an ideal captured image (yes in step S120), the operator operates the cutting device 1 to generate a reference histogram based on the ideal captured image (step S130).
As a method for generating a histogram based on a captured image, various known methods can be used. For example, the reference histogram may be generated by correcting a histogram of an ideal captured image. For example, the histogram of the ideal captured image may be corrected by abstracting the histogram of the ideal captured image.
In addition, when the gradation value at the peak of the inspection object is known in advance from the past inspection result, an ideal histogram may be created from the experience of the operator without separately imaging.
Then, the operator operates the cutting device 1, and stores the generated reference histogram in the storage unit 80 (step S140). In the cutting device 1, the irradiation state of the light in the illumination unit 17 is automatically adjusted by using the reference histogram generated based on the ideal captured image. The following describes in detail a procedure for automatically adjusting the irradiation state of light in the illumination unit 17.
[3. Operation ]
As described above, in each section of the illumination unit 17, the illuminance level can be adjusted in the range of 0 to 100, for example. For example, in the inspection of the state of the electronic component S1 singulated by cutting the package substrate P1 (sealed substrate), it is preferable to irradiate light from a direction perpendicular to the surface (inspection surface) of the electronic component S1, and in the present embodiment, only Ch01 to Ch03 among the plurality of partitions (Ch 01 to Ch 08) of the illumination unit 17 are used. That is, the illuminance levels of Ch04 to Ch08 are set to 0. In the cutting device 1 according to the present embodiment, an optimal combination is automatically searched for as a combination of the illuminance levels Ch01 to Ch03.
Fig. 10 is a flowchart showing an automatic adjustment procedure of the irradiation state of light in the illumination section 17. The processing shown in the flowchart is executed by the control unit 70 of the computer 50 at a stage before the cutting device 1 formally starts manufacturing the electronic component S1. For example, at the beginning of the flowchart, ch01 to Ch03 are each set to 0 in illuminance level.
Referring to fig. 10, the control unit 70 performs processing for determining an inspected range (for example, a range having a width of 10 of illuminance levels) among the illuminance level ranges of 0 to 100 (a range having a width of 100) for Ch01 to Ch03, respectively (step S200).
Fig. 11 is a flowchart showing the process performed in step S200 of fig. 10. The processing shown in the flowchart is executed by the control section 70 of the computer 50.
Referring to fig. 11, the control unit 70 changes the illuminance level to the first unit (for example, 5) for Ch01 of the illumination unit 17 (step S300). The control unit 70 controls the second optical inspection camera 13 to capture the electronic component S1 while light is being emitted from the illumination unit 17 toward the electronic component S1 (step S305). The control section 70 generates a histogram based on the captured image generated by the second optical inspection camera 13 (step S310).
The control unit 70 calculates the deviation amount between the generated histogram and the reference histogram stored in the storage unit 80 (step S315). Specifically, the control unit 70 calculates the difference value of the pixel number in each gradation between the generated histogram and the reference histogram, and calculates the sum of the absolute values of the calculated difference values. The sum of the absolute values is one example of the "deviation amount".
The control unit 70 determines whether or not the calculated deviation amount is smaller than the deviation amount stored in the storage unit 80 (step S320). If the deviation amount is not stored in the storage unit 80, it is determined as yes in step S320. If it is determined that the calculated deviation amount is smaller than the deviation amount stored in the storage section 80 (yes in step S320), the control section 70 controls the storage section 80 to store the respective illuminance levels of Ch01, ch02, ch03 at present, and the deviation amount calculated in step S315 (step S325). That is, the respective illuminance levels and the amounts of deviation of Ch01, ch02, ch03 stored in the storage unit 80 are updated.
When it is determined that the calculated deviation amount is equal to or larger than the deviation amount stored in the storage unit 80 (no in step S320), or when the process of step S325 is completed, the control unit 70 determines whether or not all modes of the illuminance levels of Ch01 in the current combination of the illuminance levels of Ch02 and Ch03 are completed (step S330). In addition, when the first unit is 5, all modes of the illuminance level of Ch01 are 0, 5, 10, 15, 20 …, 95, 100.
If it is determined that all the modes of the illuminance levels of Ch01 in the current combination of the illuminance levels of Ch02 and Ch03 have not been completed (no in step S330), the processing of steps S300 to S330 is performed again. On the other hand, if it is determined that all the modes of the illuminance levels of Ch01 in the combination of the illuminance levels of Ch02 and Ch03 at present are ended (yes in step S330), the control unit 70 determines whether all the modes of the illuminance levels of Ch02 in the illuminance level of Ch03 at present are ended (step S335).
If it is determined that all the modes of the illuminance level of Ch02 among the current illuminance levels of Ch03 are not ended (no in step S335), the control unit 70 changes the illuminance level to the first unit for Ch02 (step S340). Thereafter, the processing of step S300 to step S335 is performed again. On the other hand, if it is determined that all the modes of the illuminance levels of Ch02 out of the current illuminance levels of Ch03 are ended (yes in step S335), the control unit 70 determines whether or not all the modes of the illuminance levels of Ch03 are ended (step S345).
If it is determined that all the modes of the illuminance level of Ch03 are not completed (no in step S345), the control unit 70 changes the illuminance level to the first unit for Ch03 (step S350). Thereafter, the processing of step S300 to step S345 is performed again. On the other hand, when it is determined that all the modes of the illuminance levels of Ch03 are completed (yes in step S345), the control unit 70 determines the investigation range based on the illuminance levels of Ch01, ch02, ch03 stored in the storage unit 80 (step S355).
The search range of Ch01 is, for example, the range of addition or subtraction 5 of the illuminance level of Ch01 stored in the storage unit 80. The investigation range of Ch02 is, for example, the range of addition or subtraction 5 of the illuminance level of Ch02 stored in the storage unit 80. The investigation range of Ch03 is, for example, a range of addition or subtraction 5 of the illuminance level of Ch03 stored in the storage unit 80. For example, ch01, ch02, and Ch03 stored in the storage unit 80 are assumed to be 40, 50, and 55, respectively. In this case, ch01, ch02, and Ch03 have a range of examination of 35 to 45, 45 to 55, and 50 to 60, respectively.
Referring again to fig. 10, after the verification range is determined in step S200, the control unit 70 executes processing for determining the irradiation state for the inspection (step S210).
Fig. 12 is a flowchart showing the process performed in step S210 of fig. 10. The processing shown in the flowchart is executed by the control section 70 of the computer 50.
Referring to fig. 12, the control unit 70 changes the illuminance level to the second unit (for example, 1) within the examination range for Ch01 of the illumination unit 17 (step S400). The second unit is a unit smaller than the first unit. The processing of steps S405 to S425 is the same as the processing of steps S305 to S325 in fig. 11, and therefore, description thereof will not be repeated.
When it is determined that the deviation amount calculated in step S420 is equal to or larger than the deviation amount stored in the storage unit 80 (no in step S420), or when the process of step S425 is completed, the control unit 70 determines whether or not all modes of the illuminance levels of Ch01 within the examination range in the current combination of the illuminance levels of Ch02 and Ch03 are completed (step S430). In the case where the second unit is 1 and the refinement range of Ch01 is, for example, 35 to 45, all the patterns of illuminance ranks of Ch01 are 35, 36, 37, 38, 39 … 43, 44, 45.
If it is determined that all the modes of the illuminance levels of Ch01 within the refinement range in the current combination of the illuminance levels of Ch02 and Ch03 are not completed (no in step S430), the processing of steps S400 to S430 is performed again. On the other hand, if it is determined that all the modes of the illuminance levels of Ch01 in the refinement range among the combinations of the illuminance levels of Ch02 and Ch03 currently end (yes in step S430), the control unit 70 determines whether or not all the modes of the illuminance levels of Ch02 in the refinement range among the illuminance levels of Ch03 currently end (step S435).
If it is determined that all the modes of the illuminance levels of Ch02 within the refinement range among the current illuminance levels of Ch03 are not completed (no in step S435), the control unit 70 changes the illuminance level to the second unit within the refinement range for Ch02 (step S440). Thereafter, the processing of step S400 to step S435 is performed again. On the other hand, if it is determined that all the modes of the illuminance levels of Ch02 within the examination range among the current illuminance levels of Ch03 are ended (yes in step S435), the control unit 70 determines whether or not all the modes of the illuminance levels of Ch03 within the examination range are ended (step S445).
If it is determined that all the modes of the illuminance levels of Ch03 within the examination range are not completed (no in step S445), the control unit 70 changes the illuminance level to the second unit within the examination range for Ch03 (step S450). Thereafter, the processing of step S400 to step S445 is performed again. On the other hand, when it is determined that all the modes of the illuminance levels of Ch03 within the examination range are completed (yes in step S445), the control unit 70 determines the illuminance levels of Ch01, ch02, and Ch03 stored in the storage unit 80 as examination illuminance levels (step S455). That is, the control section 70 determines the irradiation state of the light stored in the storage section 80 as the irradiation state of the inspection light.
[4. Characteristics ]
As described above, in the cutting device 1 according to the present embodiment, the plurality of captured images generated in the respective different light irradiation states are generated by the second optical inspection camera 13, and the control section 70 compares each histogram generated based on the plurality of captured images with the reference histogram, and determines the light irradiation state used in the inspection of the electronic component S1 based on the result of the comparison. According to the cutting device 1, the irradiation state of the light in the illumination unit 17 can be automatically determined based on the comparison result between each histogram generated based on the plurality of captured images and the reference histogram. As a result, according to the cutting device 1 of the present embodiment, the illuminance of each partition in the illumination unit 17 can be adjusted to an appropriate value without being affected by the proficiency of the operator or the like, and high-quality inspection can be realized.
In addition, in the cutting device 1 according to the present embodiment, the control unit 70 calculates the amount of deviation between each histogram generated based on the plurality of captured images and the reference histogram, and determines the irradiation state of light when the captured image corresponding to the histogram having the smallest amount of deviation is generated as the irradiation state used for inspection. According to the cutting device 1, since the irradiation state for inspection is the irradiation state of light at the time of generating the captured image corresponding to the histogram close to the reference histogram, deterioration in quality of the captured image obtained by the second optical inspection camera 13 can be suppressed. As a result, deterioration of inspection quality of the electronic component S1 can be suppressed.
In addition, in the cutting device 1 according to the present embodiment, the control unit 70 determines the investigation range by changing the illuminance level in the first unit in order to determine the illumination state of the illumination unit 17, and then searches for the optimum illumination state by changing the illuminance level in the second unit smaller than the first unit in the investigation range. According to the cutting device 1, since the entire range of the settable range of the illuminance level is not finely searched for in each section of the illumination unit 17, the optimum irradiation state can be efficiently searched for.
The electronic component S1 is an example of the "object under inspection" in the present invention. The first optical inspection camera 12 and the second optical inspection camera 13 are each one example of "camera" in the present invention. The illumination portions 16, 17 are each an example of "illumination portion" in the present invention. The control section 70 is one example of a "control section" in the present invention. The storage section 80 is one example of a "storage section" in the present invention. LED17b is one example of "illumination" in the present invention. The entire range of the settable range of illuminance levels is one example of the "first range" in the present invention, and the scrutiny range is one example of the "second range" in the present invention.
[5. Modification ]
The ideas of the above embodiments are not limited to the embodiments described above. An example of another embodiment to which the ideas of the above embodiment can be applied will be described below.
＜5-1＞
In the above embodiment, the control unit 70 determines the investigation range by changing the illuminance level in the first unit, and then searches for the optimum light irradiation state by changing the illuminance level in the second unit (second unit < first unit) within the investigation range. However, it is not necessary to search for the irradiation state in two stages. For example, the control unit 70 may search for an optimum irradiation state by changing the illuminance level in the second unit in the entire settable range of illuminance levels without specifying the search range. In this case, since a finer search is performed, the optimum light irradiation state can be determined more reliably.
The search for the irradiation state of light may be performed through three or more stages. For example, the control unit 70 may determine the first investigation range by changing the illuminance level in the first unit, then determine the second investigation range by changing the illuminance level in the second unit (second unit < first unit) within the first investigation range, and search for the optimum light irradiation state (three-stage search) by changing the illuminance level in the third unit (third unit < second unit) within the second investigation range. As the number of search steps increases, the irradiation state of the light in the illumination unit 17 can be made closer to a more ideal irradiation state because finer search is performed.
＜5-2＞
In the above embodiment, each of the illumination sections 16 and 17 is constituted by a plurality of partitions. However, each of the illumination sections 16 and 17 may not necessarily be constituted by a plurality of partitions. For example, each of the illumination units 16 and 17 may be constituted by one partition as long as the partition can be dimmed. The number of the respective partitions of the illumination sections 16, 17 is not necessarily 8, and may be smaller than 8 or 9 or more. In the above embodiment, the illuminance levels of Ch04 to Ch08 are 0, but the illuminance levels of Ch04 to Ch08 may not be 0. Further, for example, the illuminance level may be automatically adjusted in all of Ch01 to Ch 08.
＜5-3＞
In the above embodiment, as the electronic component S1, a BGA in which solder balls are formed on the entire ball/socket surface is exemplified. However, the electronic component S1 is not limited thereto. For example, the electronic component S1 may be a BGA in which no solder ball is formed in a partial region of the ball/lead surface, or may be an LGA, QFN, or the like as described above.
Fig. 13 is a diagram showing an example of a captured image of the electronic component S1 in the modification. As shown in fig. 13, a plurality of electronic components S1 are reflected in the captured image IM 3. In each electronic component S1, a region T1 where no solder ball is formed is provided. Such an electronic component S1 may be an inspection object.
In addition, with respect to the reference histogram, the accuracy of the pixel values in the peak may be lower than the accuracy of the gradation values in the peak. That is, if the accuracy of the gradation value in the peak is high to some extent, such accuracy is not required with respect to the pixel value in the peak. This is because, in the calculation of the deviation amount, the difference value is calculated for each pixel value in each gradation and is compared. The histogram of the captured image of fig. 13 includes, as in the histogram of the captured image of fig. 5 (see fig. 6), a component C1 corresponding to the electronic component unit 100, a component C2 corresponding to the black groove unit 110, and a component C3 corresponding to the solder ball unit 120 (that is, the peak tone level is the same and the number of pixels is different). Therefore, as the reference histogram of the photographed image of fig. 13, the reference histogram of the photographed image of fig. 5 may be used.
In the above embodiment, the sum of absolute values of differences between the histogram of the captured image at each gradation and the number of pixels (the value of the histogram) of the reference histogram is taken as the "deviation amount". However, the "deviation amount" is not limited thereto. The respective shapes of the histogram of the captured image and the reference histogram are represented by functions, and the "deviation amount" may be, for example, a correlation of these functions.
＜5-4＞
In the above embodiment, the reference histogram is generated according to the procedure shown in the flowchart of fig. 9. However, the reference histogram may not necessarily be generated in accordance with such a procedure. For example, the reference histogram may be automatically generated in response to the characteristics of the electronic component S1. For example, a reference histogram corresponding to each of the plurality of types of electronic components S1 may be prepared, and a plurality of reference histograms may be stored in the storage unit 80. In this case, the reference histogram to be used may be changed according to the type of the electronic component S1 to be inspected.
The embodiments of the present invention have been described above by way of example. That is, the detailed description and drawings are disclosed for illustrative purposes. Therefore, the components described in the detailed description and the drawings may include components that are not necessary for solving the problem. Accordingly, these unnecessary components should not be directly regarded as necessary because they are described in the detailed description and drawings.
Moreover, the above-described embodiments are merely examples of the present invention in all respects. The above-described embodiments can be variously modified and changed within the scope of the present invention. That is, in carrying out the present invention, a specific structure may be appropriately adopted according to the embodiment.
Claims (9)
1. An inspection system for inspecting an inspection object based on a captured image of the inspection object, comprising:
an illumination unit configured to be capable of changing an irradiation state of light and irradiating the inspection object with light;
a camera that generates the captured image in a state in which light is irradiated to the inspection object;
a control unit that controls the illumination unit and the camera to generate a plurality of captured images generated in the respective different irradiation states; and
a storage unit for storing the reference histogram,
the control unit compares each histogram generated based on the plurality of captured images with the reference histogram, and determines the irradiation state used in the inspection based on a result of the comparison.
2. The inspection system of claim 1, wherein,
the illumination section is constituted by a plurality of zones containing one or more illuminations,
The multiple zones are individually capable of dimming,
the irradiation state is changed by dimming the plurality of partitions, respectively.
3. The inspection system of claim 1 or 2, wherein,
the control unit calculates a deviation amount between each histogram generated based on the plurality of captured images and the reference histogram, and determines the irradiation state at the time of generating the captured image corresponding to the histogram having the smallest deviation amount as the irradiation state used for the inspection.
4. The inspection system of claim 3 wherein,
the deviation amount is the sum of absolute values of differences between values of histograms in the respective gradation.
5. The inspection system of claim 3 or 4, wherein,
the control unit calculates the deviation amount between the generated histogram and the reference histogram each time a histogram is generated based on the captured image of the inspection object, and when the calculated deviation amount is smaller than the deviation amount stored in the storage unit, causes the storage unit to store the calculated deviation amount and the irradiation state at the time of generating the captured image corresponding to the generated histogram.
6. The inspection system of any one of claims 1 to 5, wherein,
the control part is provided with a control part,
the illumination unit and the camera are controlled to change the illumination state in a first unit within a first range to generate a plurality of captured images,
first comparing each histogram generated based on the plurality of captured images generated by changing the irradiation state in the first unit with the reference histogram, determining a second range included in the first range based on a result of the first comparison,
the illumination unit and the camera are controlled to change the illumination state in a second unit smaller than the first unit within the second range to generate a plurality of captured images,
and a second comparison unit configured to compare each histogram generated based on the plurality of captured images generated by changing the irradiation state in the second unit with the reference histogram, and to determine the irradiation state used in the inspection based on a result of the second comparison.
7. The inspection system of any one of claims 1 to 6, wherein,
the illumination portion is constituted by dome-shaped illumination.
8. A manufacturing method of an electronic component, which is the manufacturing method of an electronic component using the inspection system according to any one of claims 1 to 7, comprising:
A step of determining the irradiation state used in the inspection; and
a step of manufacturing a plurality of electronic components by cutting the resin-sealed substrate by a cutting mechanism,
the plurality of electronic components are each the inspection object,
the method for manufacturing an electronic component further includes a step of generating the captured image in a state in which the inspection object is irradiated with light in the determined irradiation state, and performing the inspection.
9. A cutoff device, comprising:
a cutting mechanism for cutting the resin-sealed substrate; and
the inspection system of any one of claims 1 to 7.
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| JP2021-189566 | 2021-11-22 | ||
| JP2021189566A JP7291766B2 (en) | 2021-11-22 | 2021-11-22 | Inspection system, control method, electronic component manufacturing method and cutting device |
| PCT/JP2022/024819 WO2023089857A1 (en) | 2021-11-22 | 2022-06-22 | Inspection system, control method, manufacturing method for electronic component, and cutting device |
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| CN117859052A true CN117859052A (en) | 2024-04-09 |
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| CN202280051448.9A Pending CN117859052A (en) | 2021-11-22 | 2022-06-22 | Inspection system, control method, electronic component manufacturing method, and cutting device |
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| JP (1) | JP7291766B2 (en) |
| KR (1) | KR20240039194A (en) |
| CN (1) | CN117859052A (en) |
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| CN116678827A (en) * | 2023-05-31 | 2023-09-01 | 天芯电子科技(江阴)有限公司 | LGA (land grid array) packaging pin detection system of high-current power supply module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH10103931A (en) * | 1996-09-30 | 1998-04-24 | Murata Mfg Co Ltd | Appearance inspection method for electronic component |
| US6207946B1 (en) * | 1998-09-03 | 2001-03-27 | Semiconductor Technologies & Instruments, Inc. | Adaptive lighting system and method for machine vision apparatus |
| JP3152216B2 (en) * | 1998-09-16 | 2001-04-03 | 日本電気株式会社 | Apparatus and method for visual inspection of electronic parts |
| JP3471262B2 (en) * | 1999-07-30 | 2003-12-02 | 日本電信電話株式会社 | 3D image processing device |
| JP4287090B2 (en) * | 2002-01-15 | 2009-07-01 | Ｔｏｗａ株式会社 | Jig for cutting resin-sealed substrates |
| JP3903890B2 (en) * | 2002-08-15 | 2007-04-11 | ソニー株式会社 | Image processing apparatus and image processing method |
| JP5071282B2 (en) * | 2008-07-15 | 2012-11-14 | ソニー株式会社 | Bit selection circuit |
| JP2019176229A (en) * | 2018-03-27 | 2019-10-10 | ヤマハ株式会社 | Signal synchronization method |
| KR102117675B1 (en) * | 2018-07-05 | 2020-06-01 | 주식회사 디딤센서 | Illumination system and control method of the illumination system |
| JP7330636B2 (en) | 2020-01-27 | 2023-08-22 | 株式会社ディスコ | Method for adjusting brightness of illuminator in processing equipment |
| CN113176270B (en) * | 2021-06-29 | 2021-11-09 | 中移(上海)信息通信科技有限公司 | Dimming method, device and equipment |
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- 2021-11-22 JP JP2021189566A patent/JP7291766B2/en active Active
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- 2022-06-22 KR KR1020247007448A patent/KR20240039194A/en unknown
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| KR20240039194A (en) | 2024-03-26 |
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| JP2023076250A (en) | 2023-06-01 |
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