TW202320970A - Inspection system, control method, manufacturing method for electronic component, and cutting device - Google Patents

Abstract

The present invention provides an inspection system that inspects an object to be inspected on the basis of a captured image of the object to be inspected. The inspection system includes a lighting section, a camera, a control section, and a storage section. The lighting section can change a light irradiation state and irradiates the object to be inspected with light. The camera generates a captured image with the object to be inspected irradiated with light. The control section controls each of the lighting section and the camera to generate a plurality of captured images in different irradiation states. The storage section stores a reference histogram. The control section compares the reference histogram with each histogram generated on the basis of a respective one of the plurality of captured images, and determines an irradiation state to be used in inspection on the basis of comparison results.

Description

Inspection system, control method, manufacturing method of electronic component, and cutting device

The present invention relates to an inspection system, a control method, a manufacturing method of an electronic component, and a cutting device.

Japanese Patent Laid-Open No. 2021-115668 (Patent Document 1) discloses a processing device including a camera unit. The camera unit includes an illuminator that irradiates light onto a workpiece. In this processing device, the workpiece is imaged while the workpiece is being irradiated with light (see Patent Document 1). [Prior Art Literature] [Patent Document]

Patent Document 1: Japanese Patent Laid-Open No. 2021-115668

[Problem to be solved by the invention]

For example, in the processing apparatus disclosed in Patent Document 1, the adjustment of the illuminator can be performed manually. In this case, the brightness of light irradiated on the workpiece is determined according to the operator's judgment (hereinafter, also referred to as "irradiation state of light"). However, this judgment is not always easy.

The present invention has been made to solve such problems, and its object is to provide an inspection system, a control method, a manufacturing method of electronic components, and an Cut off device. [Technical means to solve the problem]

An inspection system according to one aspect of the present invention inspects an inspection object based on a captured image of the inspection object. The inspection system includes an illumination unit, a camera, a control unit, and a memory unit. The illuminating unit can change the light irradiation state to irradiate the inspection object with light. The camera generates a captured image while irradiating light onto the inspection object. The control unit controls each of the lighting unit and the camera so as to generate a plurality of captured images respectively generated in different irradiation states. Histogram of memory benchmarks. The control section compares each histogram generated based on each of the plurality of captured images with a reference histogram, and determines an irradiation state used in the inspection based on a result of the comparison.

Also, a control method according to another aspect of the present invention is a control method used in the above-mentioned inspection system. The control method includes a control step of controlling each of the lighting unit and the camera to generate a plurality of captured images respectively generated under different illumination states, and a determination step based on the plurality of captured images Each histogram generated by each is compared with a reference histogram, and based on the result of the comparison, the illumination state used in the inspection is decided.

Moreover, the manufacturing method of the electronic component according to another aspect of this invention is the manufacturing method of the electronic component using the said inspection system. The manufacturing method of an electronic component includes a determination step of determining the irradiation state used in the above-mentioned inspection and a manufacturing step of cutting a resin-sealed substrate using a cutting mechanism to manufacture a plurality of electronic components . Each of the plurality of electronic components is an inspection target. The method of manufacturing an electronic component further includes the step of generating a captured image while irradiating the inspection object with light in the determined irradiation state, and performing the above-mentioned inspection.

Also, a cutting device according to another aspect of the present invention includes a cutting mechanism and the above-mentioned inspection system. The cutting mechanism cuts the resin-sealed substrate. [Effect of the invention]

According to the present invention, it is possible to provide an inspection system, a control method, a manufacturing method of an electronic component, and a cutting device capable of automatically adjusting the irradiation state of light irradiated on an inspection object when inspecting the inspection object.

Hereinafter, an embodiment (hereinafter also referred to as "the present embodiment") related to one aspect of the present invention will be described in detail using the drawings. In addition, the same or corresponding part is given the same code|symbol in a figure, and the description is not repeated. In addition, for easy understanding, appropriate objects are omitted or exaggerated and schematically drawn in each drawing. [1. Composition] <1-1. Overall configuration of cutting device>

Fig. 1 is a plan view schematically showing a cutting device 1 according to the present embodiment. The cutting device 1 is configured to separate the package substrate into a plurality of electronic components (package components) by cutting the package substrate (object to be cut). In the package substrate, a substrate or a lead frame on which a semiconductor chip is mounted is resin-sealed.

Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (light emitting Diode, Light Emitting Diode) package substrate, QFN (Quad Flat No-leaded) package substrate.

Furthermore, the cutting device 1 is configured to inspect each of a plurality of electronic components that have been singulated. In the cutting device 1 , an image of each electronic component is captured, and inspection of each electronic component is performed based on the image. Through this inspection, inspection data are generated to classify each electronic component as "defective product" or "defective product".

In this example, the package substrate P1 is used as a cutting object, and the package substrate P1 is singulated into a plurality of electronic components S1 by the cutting device 1 . Hereinafter, of the two surfaces of the package substrate P1, the surface sealed with resin is called the sealing surface, and the surface opposite to the sealing surface is called the solder ball/lead surface.

As shown in FIG. 1 , the cutting device 1 includes a cutting module A1 and an inspection and storage module B1 as constituent elements. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting the package substrate P1. The inspection and storage module B1 is configured to inspect each of a plurality of manufactured electronic components S1, and then store the electronic components S1 in a tray. In the cutting device 1 , each component can be attached to and detached from another component and exchanged.

The cutting module A1 mainly includes a substrate supply unit 3 , a positioning unit 4 , a cutting table 5 , a mandrel unit 6 , and a transport unit 7 .

The substrate supply unit 3 pushes out the package substrates P1 one at a time from the cassette M1 accommodating a plurality of package substrates P1 , thereby supplying the package substrates P1 one at a time toward the positioning unit 4 . At this time, the package substrate P1 is arranged such that the solder ball/lead surface faces upward.

The positioning section 4 arranges the package substrate P1 pushed out from the substrate supply section 3 on the rail section 4a, thereby positioning the package substrate P1. Thereafter, the positioning unit 4 conveys the positioned package substrate P1 toward the cutting stage 5 .

The cutting table 5 holds the package substrate P to be cut. In this example, a cutting device 1 having a double cutting stage configuration including two cutting stages 5 is illustrated. The cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5 a sucks the package substrate P1 conveyed by the positioning unit 4 from below to hold the package substrate P1 . The rotation mechanism 5b can rotate the holding member 5a in the θ1 direction in the drawing. The moving mechanism 5c can move the holding member 5a along the Y-axis in the figure.

The mandrel portion 6 separates the package substrate P1 into a plurality of electronic components S1 by cutting the package substrate P1. In this example, a cutting device 1 having a double-spindle portion configuration including two core shaft portions 6 is exemplified. The core shaft portion 6 is movable along the X-axis and Z-axis of the drawing. In addition, the cutting device 1 may be configured as a single mandrel unit including one mandrel unit 6 .

FIG. 2 is a side view schematically showing the core shaft portion 6 . As shown in FIG. 2 , the core shaft portion 6 includes a blade 6 a, a rotating shaft 6 c, a first flange 6 d, a second flange 6 e, and a fastening member 6 f.

The blade 6 a cuts the package substrate P1 by rotating at a high speed, so as to singulate the package substrate P1 into a plurality of electronic components S1 . The blade 6a is attached to the rotating shaft 6c in a state sandwiched by one flange (first flange) 6d and the other flange (second flange) 6e. The first flange 6d and the second flange 6e are fixed to the rotation shaft 6c by fastening members 6f such as nuts. The first flange 6d is called an inner flange, and the second flange 6e is called an outer flange.

In the core shaft portion 6 , nozzles for cutting water, nozzles for cooling water, nozzles for washing water (none of which are shown) and the like are provided. The cutting water nozzle sprays cutting water toward the high-speed rotating blade 6a. Cooling water Spray cooling water with nozzles. The washing water nozzle sprays washing water for washing cutting chips and the like.

Referring again to FIG. 1 , after the cutting table 5 absorbs the package substrate P1 , the package substrate P1 is photographed by the first position confirmation camera 5 d to confirm the position of the package substrate P1 . The confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of a mark provided on the package substrate P1. This mark indicates, for example, the cutting position of the package substrate P1.

Thereafter, the cutting table 5 moves toward the mandrel 6 along the Y-axis in the figure. After the cutting table 5 moves below the mandrel part 6 , the package substrate P1 is cut by relatively moving the cutting table 5 and the mandrel part 6 . Thereafter, according to need, the package substrate P1 is photographed by the second position confirmation camera 6 b included in the mandrel part 6 to confirm the position of the package substrate P1 and the like. The confirmation using the second position confirmation camera 6b is, for example, confirmation of the cutting position and cutting width of the package substrate P1.

After the cutting of the package substrate P1 is completed, the cutting stage 5 moves in a direction away from the core shaft portion 6 along the Y-axis in the figure while the plurality of electronic components S1 that have been separated into pieces are sucked. . During this movement, the upper surface (solder ball/wire surface) of the electronic component S1 is cleaned and dried by the first cleaner 5e.

The transport unit 7 suctions the electronic component S1 held on the cutting table 5 from above, and transports the electronic component S1 toward the inspection table 11 of the inspection and storage module B1. During this transfer process, the lower surface (sealant surface) of the electronic component S1 is cleaned and dried by the second washer 7a.

The inspection and storage module B1 mainly includes an inspection table 11 , a first optical inspection camera 12 , a second optical inspection camera 13 , illumination units 16 , 17 , an arrangement unit 14 , and an extraction unit 15 . In addition, the first optical inspection camera 12 may also be installed in the cutting module A1.

The inspection table 11 holds the electronic component S1 for optical inspection of the electronic component S1. The inspection table 11 is movable along the X-axis of the figure. In addition, the inspection table 11 can be turned upside down. In the inspection table 11 , a holding member that holds the electronic component S1 by sucking the electronic component S1 is provided. In addition, in the inspection table 11, the surface for holding the electronic component S1 is made of black rubber, for example. In addition, the color of the rubber may not be black, for example, may be white or the like.

The first optical inspection camera 12 and the second optical inspection camera 13 take pictures of both sides of the electronic component S1 (solder ball/wire surface and sealing surface). Various inspections of the electronic component S1 are performed based on captured images (image data) generated by the first optical inspection camera 12 and the second optical inspection camera 13 . Each of the 1st optical inspection camera 12 and the 2nd optical inspection camera 13 is arrange|positioned near the inspection table 11, and images the upper side. The captured image generated by each of the first optical inspection camera 12 and the second optical inspection camera 13 is, for example, a grayscale (256-gradation) image.

The first optical inspection camera 12 photographs the sealing surface of the electronic component S1 conveyed to the inspection table 11 by the conveying unit 7 . Thereafter, the transport unit 7 places the electronic component S1 on the holding member of the inspection table 11 . After the electronic component S1 is adsorbed by the holding member, the inspection table 11 is turned upside down. The inspection table 11 moves above the second optical inspection camera 13 , and uses the second optical inspection camera 13 to photograph the solder ball/wire surface of the electronic component S1 .

The illuminating part 16 is disposed above the first optical inspection camera 12 , and the illuminating part 17 is disposed above the second optical inspection camera 13 . Each of the lighting sections 16 and 17 is constituted by, for example, so-called coaxial lighting. The illuminating unit 16 is configured to irradiate light onto the electronic component S1 on the inspection table 11 during inspection by the first optical inspection camera 12 . The illuminating unit 17 is configured to irradiate light onto the electronic component S1 on the inspection table 11 during inspection by the second optical inspection camera 13 . Since the lighting sections 16 and 17 have, for example, the same configuration, the configuration of the lighting section 17 will be representatively described below.

FIG. 3 is a diagram schematically showing a cross section of the lighting unit 17 . As shown in FIG. 3 , during inspection by the second optical inspection camera 13 , the electronic component S1 is irradiated with light emitted by the illuminating unit 17 . In a state where light is irradiated to electronic component S1 , a captured image of electronic component S1 is generated by second optical inspection camera 13 . Based on this captured image, inspection of electronic component S1 is performed.

The lighting unit 17 is constituted by a dome-shaped lighting, and includes a dome 17a and a plurality of LEDs 17b. In addition, the dome-shaped lighting may be composed of so-called dome lighting, but it may not necessarily be composed of dome lighting, but may include a dome-shaped (umbrella-shaped) member and a plurality of light-emitting members ( For example, LEDs). The dome 17a has a dome shape, and the shape of the dome 17a is circular when viewed from above. Moreover, several LED17b is arrange|positioned on the surface inside the dome 17a. In the lighting unit 17 , a plurality of segments (Ch01 to Ch08 ) are formed from the inside to the outside in the radial direction of the dome 17 a. In each of the plurality of segments, the plurality of LEDs 17b are arranged at predetermined intervals along the circumferential direction of the dome 17a.

The lighting section 17 is a so-called multi-channel lighting. In the lighting unit 17, dimming can be individually performed for each segment. That is, in the lighting unit 17 , the illuminance (brightness of light) can be adjusted for each segment. For example, in each section, the illuminance level can be adjusted in the range of 0-100. In this case, for example, the closer the illuminance level is to 100, the higher the illuminance, and the closer the illuminance level is to 0, the lower the illuminance. For example, by adjusting the illuminance in each segment, the irradiation state (illumination condition) of light in the illumination section 17 is adjusted. For example, the adjustment of the illuminance in each segment may be performed manually by an operator, or may be performed automatically. The automatic adjustment of the illuminance in each section will be described in detail later.

Referring again to FIG. 1 , the inspected electronic component S1 is arranged in the arrangement unit 14 . The disposing part 14 is movable along the Y-axis of the drawing. The inspection table 11 arranges the inspected electronic component S1 on the placement unit 14 .

The extraction part 15 transfers the electronic component S1 arrange|positioned at the arrangement|positioning part 14 to a tray. Based on the inspection results using the first optical inspection camera 12 and the second optical inspection camera 13, the electronic component S1 is classified as "good product" or "defective product". Based on the discrimination result, the extraction part 15 transfers every electronic component S1 to the tray 15a for good products or the tray 15b for defective products. That is, good products are accommodated in the tray 15a for good products, and defective products are accommodated in the tray 15b for defective products. When the trays 15a for good products and the trays 15b for defective products are filled with electronic components S1, they will be replaced with new ones.

The cutting device 1 further includes a computer 50 and a monitor 20 . The monitor 20 is configured to display images. The monitor 20 is constituted by, for example, a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor.

The computer 50 controls, for example, the operation of each part of the cutting module A1 and the inspection and storage module B1. For example, the substrate supply part 3, the positioning part 4, the cutting table 5, the mandrel part 6, the conveying part 7, the inspection table 11, the first optical inspection camera 12, the second optical inspection camera 13, and the lighting part are controlled by the computer 50 16, 17. Operations of the arrangement unit 14, the extraction unit 15, and the monitor 20.

Moreover, the computer 50 performs various inspections of the electronic component S1 based on the image data generated by the 1st optical inspection camera 12 and the 2nd optical inspection camera 13, for example. Next, the computer 50 will be described in detail. ＜1-2. Computer hardware configuration＞

FIG. 4 is a diagram schematically showing the hardware configuration of the computer 50 . As shown in FIG. 4 , the computer 50 includes a computing unit 70 , an input/output I/F (interface) 90 , a receiving unit 95 , and a memory unit 80 , and the components are electrically connected through a bus bar.

The computing unit 70 includes a CPU (Central Processing Unit, Central Processing Unit) 72 , a RAM (Random Access Memory, Random Access Memory) 74 , a ROM (Read Only Memory, Read Only Memory) 76 , and the like. The computing unit 70 is configured to control each component in the computer 50 and each component in the cutting device 1 in accordance with information processing.

The input/output I/F 90 is configured to communicate with each component included in the cutting device 1 via a signal line. The input/output I/F 90 is used for transmission of data from the computer 50 to each component in the cutting device 1 and reception of transmission data from each component in the cutting device 1 to the computer 50 . The receiving unit 95 is configured to receive instructions from the user. The receiving unit 95 is constituted by, for example, a part or all of a touch panel, a keyboard, a mouse, and a microphone.

The memory unit 80 is an auxiliary memory device such as a hard disk drive, a solid state disk, or the like. The storage unit 80 is configured to store, for example, a control program 81 . Various operations in the cutting device 1 are realized by the control unit 70 executing the control program 81 . When the control unit 70 executes the control program 81 , the control program 81 is expanded in the RAM 74 . Furthermore, the control unit 70 controls each component by causing the CPU 72 to interpret and execute the control program 81 developed in the RAM 74 . [2. Automatic adjustment of irradiation state of light]

As described above, the inspection of the electronic component S1 is performed based on, for example, the captured image generated by the first optical inspection camera 12 and the captured image generated by the second optical inspection camera 13 . Therefore, the quality of the inspection of the electronic component S1 is affected by the quality of each captured image. The quality of each captured image is influenced by the irradiation state of the light emitted from the lighting units 16 and 17 to the electronic component S1 when the electronic component S1 is captured. Since the lighting parts 16 and 17 can be said to be identical, the description below focuses on the lighting part 17 .

As an example, consider a case where the electronic component S1 is a BGA. For example, the solder ball/wire surface of the electronic component S1 is inspected by using the second optical inspection camera 13 to photograph the solder ball/wire surface of the electronic component S1. In this case, the 2nd optical inspection camera 13 images the some electronic component S1 which was singulated by cutting the package board|substrate P1. Therefore, the captured image shows the plurality of electronic components S1 and the rubber at the boundary portion between adjacent electronic components S1 (inspection table 11 ).

Fig. 5 is a diagram showing an example of a preferable captured image. As shown in FIG. 5 , the captured image IM1 includes a plurality of electronic component parts 100 , a plurality of solder bead parts 120 on each electronic component part 100 , and black groove parts 110 between adjacent electronic component parts 100 . The black groove portion 110 is rubber on the inspection table 11 .

The captured image IM1 is characterized by (1) a clear contrast between the electronic component portion 100 and the black groove portion 110 , and (2) the image as a whole is not too bright. Such a preferable captured image is generated when the lighting state of the light emitted from the lighting unit 17 toward the electronic component S1 is appropriate. The quality of inspection based on such better captured images is high.

Fig. 6 is a diagram showing a histogram of the captured image shown in Fig. 5 . Referring to FIG. 6, the horizontal axis represents the gradation, and the vertical axis represents the number of pixels. Histogram HG1 contains components C1, C2, C3. The composition C1 corresponds to the electronic component part 100 ( FIG. 5 ), and the composition C2 corresponds to the black groove part 110 . Composition C3 corresponds to the bead portion 120 . In the histogram HG1, the composition C1 is clearly separated from the composition C2. Also, the peak of component C1 having the largest number of pixels appears near the center of the gradation. A histogram corresponding to a better captured image has such characteristics.

Fig. 7 is a diagram showing an example of a poor captured image. As shown in FIG. 7 , the captured image IM2 includes a plurality of electronic component parts 200 , a plurality of solder bead parts 220 on each electronic component part 200 , and black groove parts 210 between adjacent electronic component parts 200 . In the captured image IM2 , there is no clear contrast between the electronic component portion 200 and the black groove portion 210 . When the lighting state of the light emitted from the lighting unit 17 toward the electronic component S1 is inappropriate, such a poor captured image is generated. Inspections based on such poorer captured images are of lower quality.

Fig. 8 is a diagram showing a histogram of the captured image shown in Fig. 7 . Referring to FIG. 8, the horizontal axis represents the gradation, and the vertical axis represents the number of pixels. Histogram HG2 contains components C4, C5, C6. Composition C4 corresponds to the electronic component part 200 ( FIG. 7 ), and composition C5 corresponds to the black groove part 210 . Composition C6 corresponds to the bead portion 220 . In the histogram HG2, the composition C4 is not clearly separated from the composition C5, but the composition C4 is mixed with the composition C5. A histogram corresponding to an example of a poorer captured image has such characteristics.

As mentioned above, the quality of the captured image generated by the second optical inspection camera 13 is affected by whether the irradiation state of the light emitted from the illumination unit 17 toward the electronic component S1 is appropriate, thereby affecting the inspection of the electronic component S1 . It is assumed that the adjustment of the illuminance of each segment of the lighting unit 17 can only be performed manually. In this case, the light irradiation state of the lighting unit 17 is determined according to the judgment of the operator. However, this judgment is not always easy. Therefore, at least partially, there are problems of low-quality inspection due to inappropriate light irradiation state of the lighting unit 17 and a problem that it takes a long time to adjust the illuminance of each section of the lighting unit 17 .

In the cutting device 1 of the present embodiment, the computer 50 can automatically adjust the light irradiation state of the lighting unit 17 to an appropriate state. That is, the computer 50 can automatically adjust the illuminance level of each segment of the lighting unit 17 to an appropriate value. Thereby, the possibility of occurrence of the above-mentioned problems can be reduced. That is, according to the cutting device 1 of the present embodiment, the illuminance of each segment of the illuminating unit 17 can be adjusted to an appropriate value without being affected by the operator's proficiency, etc., and high-quality inspection can be performed.

In order to realize such a function, the storage unit 80 of the computer 50 stores in advance information representing a histogram of an ideal captured image (hereinafter also referred to as a “reference histogram”). The reference histogram is a histogram generated based on a reference captured image. For example, a reference histogram is generated based on an ideal captured image. An example of an ideal captured image is an image including the electronic component S1 as an inspection object, and as shown in FIG. A captured image of a characteristic that the image as a whole is not too bright.

Fig. 9 is a flowchart showing the procedure for generating a reference histogram. Each step shown in this flowchart is performed by an operator, for example, during the manufacture of the cutting device 1 (when the reference histogram is not stored in the memory unit 80 ). In the steps shown in this flowchart, when changing the combination pattern of the illuminance level of each segment of the illumination unit 17, a plurality of captured images are generated, and a reference histogram is generated based on the optimal captured image. The generated reference histogram is stored in the storage unit 80 . The details will be described below.

Referring to FIG. 9 , the operator adjusts the illuminance level of each segment of the lighting unit 17 (step S100 ). The operator operates the cutting device 1 and images the electronic component S1 with the second optical inspection camera 13 in a state where light is irradiated from the illumination unit 17 to the electronic component S1 (step S110 ). The operator judges whether the captured image generated by the second optical inspection camera 13 is an ideal captured image based on past experience (step S120 ).

If it is judged that the captured image generated by the second optical inspection camera 13 is not an ideal captured image (No in step S120), the operator changes to a pattern different from the combination pattern of the illuminance levels of each section of the illumination unit 17. pattern (step S100). On the other hand, if it is judged that the captured image generated by the second optical inspection camera 13 is an ideal captured image (Yes in step S120), the operator operates the cutting device 1 to to generate a reference histogram (step S130).

Also, as a method of generating a histogram based on a captured image, various known methods can be used. For example, it is also possible to generate a reference histogram by modifying the histogram of an ideal captured image. For example, the histogram of the ideal captured image may be modified by abstracting the histogram of the ideal captured image.

Also, when the value of the gradation at the peak of the inspection object is known in advance from past inspection results, an ideal histogram can be created based on the operator's experience without requiring separate imaging.

Then, the operator operates the cutting device 1 to store the generated reference histogram in the storage unit 80 (step S140 ). In the cutting device 1 , automatic adjustment of the irradiation state of light in the illumination unit 17 is performed by using a reference histogram generated based on an ideal captured image. Hereinafter, the procedure of automatic adjustment of the light irradiation state in the lighting unit 17 will be described in detail. [3. Action]

As described above, in each section of the lighting section 17, the illuminance level can be adjusted within a range of 0 to 100, for example. For example, in the inspection of the state of the singulated electronic component S1 by cutting the package substrate P1 (sealed substrate), it is preferable to irradiate light from a direction approximately perpendicular to the surface (inspection surface) of the electronic component S1. . In the present embodiment, only Ch01 to Ch03 among the plurality of blocks (Ch01 to Ch08 ) of the illumination unit 17 are used. That is, the illuminance levels of Ch04 to Ch08 are set to 0. In the cutting device 1 according to the present embodiment, an optimal combination is automatically searched for as a combination for each illuminance level of Ch01 to Ch03.

FIG. 10 is a flowchart showing the automatic adjustment procedure of the lighting state of the light in the lighting unit 17 . The process shown in this flowchart is executed by the control part 70 of the computer 50 in the stage before the start of the actual manufacture of the electronic component S1 of the cutting apparatus 1. As shown in FIG. For example, at the beginning of this flowchart, the illuminance level of each of Ch01 to Ch03 is set to 0.

Referring to FIG. 10, for each of Ch01 to Ch03, the control unit 70 executes a precise search range (for example, the illuminance level The width is the range of 10) processing (step S200).

Fig. 11 is a flowchart showing the processing executed in step S200 of Fig. 10 . The processing shown in this flowchart is executed by the control unit 70 of the computer 50 .

Referring to FIG. 11 , for Ch01 of the lighting unit 17 , the control unit 70 changes the illuminance level by a first unit (for example, 5) (step S300 ). The control part 70 controls the 2nd optical inspection camera 13 so that the electronic component S1 may be imaged in the state which irradiated light from the illumination part 17 toward the electronic component S1 (step S305). The control unit 70 generates a histogram based on the captured image generated by the second optical inspection camera 13 (step S310 ).

The control unit 70 calculates the amount of deviation between the generated histogram and the reference histogram stored in the storage unit 80 (step S315 ). Specifically, the control unit 70 calculates the difference in the number of pixels at each level between the generated histogram and the reference histogram, and calculates the sum of the absolute values of the calculated differences. The sum of the absolute values is an example of "deviation".

The control unit 70 determines whether the calculated deviation is smaller than the deviation stored in the storage unit 80 (step S320 ). In addition, when the amount of deviation is not stored in the storage unit 80, it is determined as YES in step S320. If it is determined that the calculated deviation is smaller than the deviation stored in the storage unit 80 (Yes in step S320), the control unit 70 controls the current illuminance level of each of Ch01, Ch02, and Ch03, and controls the storage unit 80, To memorize the deviation calculated in step S315 (step S325). That is, the illuminance level and deviation amount for each of Ch01 , Ch02 , and Ch03 stored in the storage unit 80 are updated.

When it is determined that the calculated deviation amount is greater than or equal to the deviation amount stored in the storage unit 80 (No in step S320), or when the processing in step S325 is completed, the control unit 70 determines that the difference between the current Ch02 and Ch03 Whether all the modes of the Ch01 illumination level have been completed in the combination of the illumination levels of Ch01 (step S330 ). In addition, when the first unit is 5, all modes of the illuminance level of Ch01 are 0, 5, 10, 15, 20, . . . , 90, 95, and 100.

If it is determined that all modes of the illuminance level of Ch01 have not been completed in the current combination of illuminance levels of Ch02 and Ch03 (NO in step S330 ), the processes of steps S300 to S330 are performed again. On the other hand, if it is determined that all modes of the illuminance level of Ch01 have been completed in the combination of the current illuminance levels of Ch02 and Ch03 (Yes in step S330 ), the control section 70 determines whether or not the modes of the current illuminance level of Ch03 have been completed. All modes of the illuminance level of Ch02 are completed (step S335 ).

If it is determined that all modes of the illuminance level of Ch02 have not been completed in the current illuminance level of Ch03 (NO in step S335 ), the control section 70 changes the illuminance level of Ch02 by the first unit (step S340 ). Thereafter, the processing from step S300 to step S335 is performed again. On the other hand, if it is determined that all modes of the illuminance level of Ch02 have been completed in the current illuminance level of Ch03 (Yes in step S335), the control part 70 determines whether all modes of the illuminance level of Ch03 have been completed (step S345) .

If it is determined that all modes of the illuminance level of Ch03 have not been completed (NO in step S345 ), the control section 70 changes the illuminance level by the first unit for Ch03 (step S350 ). Thereafter, the processing from step S300 to step S345 is performed again. On the other hand, if it is determined that all modes of the illuminance level of Ch03 have been completed (Yes in step S345), the control unit 70 determines the precise examination based on the illuminance levels of each of Ch01, Ch02, and Ch03 stored in the memory unit 80. range (step S355).

The precise search range for Ch01 is, for example, a range of five before and after the illuminance level of Ch01 stored in the memory unit 80 . The precise search range for CH02 is, for example, a range of five before and after the illuminance level of CH02 stored in the memory unit 80 . The precise search range for CH03 is, for example, a range of five before and after the illuminance level of CH03 stored in the memory unit 80 . For example, assume that Ch01, Ch02, and Ch03 stored in the storage unit 80 are 40, 50, and 55, respectively. In this case, the precise detection ranges of Ch01, Ch02, and Ch03 are, for example, 35-45, 45-55, and 50-60, respectively.

Referring again to FIG. 10 , when the precise examination range is determined in step S200 , the control unit 70 executes a process for determining an irradiation state for inspection (step S210 ).

Fig. 12 is a flowchart showing the processing executed in step S210 of Fig. 10 . The processing shown in this flowchart is executed by the control unit 70 of the computer 50 .

Referring to FIG. 12 , with respect to Ch01 of the lighting unit 17 , the control unit 70 changes the illuminance level by the second unit (for example, 1) within the precise examination range (step S400 ). The second unit is a unit smaller than the first unit described above. Since the processes of steps S405 to S425 are respectively the same as the processes of steps S305 to S325 in Fig. 11, description will not be repeated.

When it is determined in step S420 that the calculated deviation amount is greater than or equal to the deviation amount stored in the storage unit 80 (No in step S420), or when the processing in step S425 is completed, the control unit 70 determines that the current In the combination of the illuminance levels of Ch02 and Ch03, whether or not all patterns of the illuminance levels of Ch01 within the range have been finely checked (step S430 ). In addition, when the second unit is 1 and the precise search range of Ch01 is, for example, 35-45, all modes of the illuminance level of Ch01 are 35, 36, 37, 38, 39, . . . , 43, 44, 45.

If it is determined that all modes of the illuminance levels of Ch01 within the fine-search range have not been completed in the current combination of illuminance levels of Ch02 and Ch03 (No in step S430 ), the processes of steps S400 to S430 are performed again. On the other hand, if it is determined that all modes of the illuminance levels of Ch01 within the range of fine-tuning have been completed in the combination of the current illuminance levels of Ch02 and Ch03 (Yes in step S430), the control unit 70 determines that the combination of the current illuminance levels of Ch03 In the illuminance level, whether or not all patterns of the illuminance level of Ch02 within the fine-check range have been completed (step S435 ).

If it is determined that all the patterns of the illuminance levels of Ch02 within the fine-examination range have not been completed at the current illuminance level of Ch03 (NO in step S435), the control section 70 changes the illuminance level by the second unit within the fine-examination range for Ch02 (step S440). Thereafter, the processing from step S400 to step S435 is performed again. On the other hand, if it is determined that all patterns of the illuminance level of Ch02 within the precise examination range have been completed at the current illuminance level of Ch03 (Yes in step S435), the control unit 70 determines whether or not Ch03 within the precise examination range has been completed. All modes of the illuminance level (step S445).

If it is determined that all patterns of the illuminance levels of Ch03 within the precise examination range have not been completed (NO in step S445 ), the control unit 70 changes the illuminance level by the second unit within the precise examination range for Ch03 (step S450 ). Thereafter, the processing from step S400 to step S445 is performed again. On the other hand, if it is determined that all patterns of the illuminance levels of Ch03 within the fine-search range have been completed (Yes in step S445), the control unit 70 stores the illuminance levels of each of Ch01, Ch02, and Ch03 stored in the storage unit 80 The level is determined as the illuminance level for inspection (step S455 ). That is, the control unit 70 determines the light irradiation state stored in the storage unit 80 as the light irradiation state for inspection. [4. Features]

As described above, in the cutting device 1 according to the present embodiment, the second optical inspection camera 13 generates a plurality of captured images respectively generated under different light irradiation states, and the control unit 70 generates a plurality of captured images based on the plurality of captured images. Each histogram generated by each of them is compared with the reference histogram, and based on the result of the comparison, the irradiation state of light used in the inspection of the electronic component S1 is decided. According to the cutting device 1 , the irradiation state of light in the illumination unit 17 can be automatically determined based on the comparison result of each histogram generated based on each of the plurality of captured images and the reference histogram. As a result, according to the cutting device 1 of the present embodiment, the illuminance of each segment of the illuminating unit 17 can be adjusted to an appropriate value without being affected by the operator's proficiency, etc., and high-quality inspection can be performed.

Also, in the cutting device 1 according to the present embodiment, the control unit 70 calculates the amount of deviation between each histogram generated based on each of the plurality of captured images and the reference histogram, and generates The irradiation state at the time of capturing the image corresponding to the histogram of the deviation amount is determined as the irradiation state used for the inspection. According to the cutting device 1, since the irradiation state of light at the time of generating the captured image corresponding to the histogram close to the reference histogram is adopted as the irradiation state for inspection, it is possible to suppress the occurrence of the captured image by the second optical inspection camera 13 deterioration of the quality. As a result, deterioration of the inspection quality of the electronic component S1 can be suppressed.

In addition, in the cutting device 1 according to the present embodiment, in order to determine the irradiation state of the lighting unit 17, the control unit 70 changes the illumination level by the first unit to determine the precise examination range, and thereafter, within the precise examination range, the illumination level is changed by the first unit. A second, smaller unit changes the illuminance level to search for the best irradiance state. According to the cutting device 1 , since the entire range of the settable range of the illuminance level is not searched in detail for each segment of the lighting unit 17 , the search for the optimum irradiation state can be effectively performed.

In addition, the electronic component S1 is an example of the "inspection object" in this invention. Each of the first optical inspection camera 12 and the second optical inspection camera 13 is an example of a "camera" in the present invention. Each of the lighting sections 16 and 17 is an example of the "illumination section" in the present invention. The control unit 70 is an example of a "control unit" in the present invention. The storage unit 80 is an example of a "storage unit" in the present invention. LED17b is an example of "illumination" in this invention. The entire range of the settable range of the illuminance level is an example of the "first range" in the present invention, and the precise detection range is an example of the "second range" in the present invention. [5. Variation example]

The concepts of the above-mentioned embodiments are not limited to the above-described embodiments. Hereinafter, an example of other embodiments to which the concepts of the above-mentioned embodiments can be applied will be described. <5-1>

In the above embodiment, the control unit 70 changes the illuminance level by the first unit to determine the precise examination range, and then changes the illuminance level by the second unit (second unit<first unit) within the precise examination range to perform The search for the best light irradiation state. However, it is not necessarily necessary to perform the search for the illumination state in two stages. For example, the control unit 70 may change the illuminance level by the second unit within the entire settable range of the illuminance level to search for the optimal irradiation state, without determining the precise search range. In this case, since a more detailed search is performed, the optimal light irradiation state can be specified more reliably.

In addition, the search for the irradiation state of light may be performed by searching in three or more stages. For example, the control unit 70 may change the illuminance level by the first unit to determine the first precise examination range, and then change the illuminance level by the second unit (the second unit<the first unit) within the first precise examination range, To determine the second precise search range, and change the illumination level with the third unit (third unit < second unit) within the second fine search range to search for the best light irradiation state (three-stage search) . If the number of steps of the search is increased, more detailed search is performed, so that the irradiation state of the light in the illumination unit 17 can be brought closer to the ideal irradiation state. <5-2>

In the above-described embodiment, each of the lighting units 16 and 17 is constituted by a plurality of segments. However, each of the lighting sections 16 and 17 does not necessarily have to be composed of a plurality of segments. For example, each of the lighting sections 16 and 17 may also be composed of one segment as long as the segment is dimmable. Also, the number of segments for each of the lighting units 16 and 17 does not necessarily have to be eight, and may be eight or less, or may be nine or more. In addition, in the above-mentioned embodiment, the illuminance levels of Ch04 to Ch08 are set to 0, but the illuminance levels of Ch04 to Ch08 do not necessarily have to be 0. Also, for example, it is also possible to automatically adjust the illuminance levels in all Ch01 to Ch08. <5-3>

In the above-mentioned embodiment, the BGA in which solder balls are formed on the entire solder ball/lead surface is exemplified as the electronic component S1. However, electronic component S1 is not limited to this. For example, the electronic component S1 may be a BGA in which no solder balls are formed on a part of the solder ball/wire surface, or may be an LGA, QFN, etc. as described above.

FIG. 13 is a diagram showing an example of a captured image of electronic component S1 in a modified example. As shown in FIG. 13, the captured image IM3 shows a plurality of electronic components S1. In each electronic component S1, a region T1 in which no solder beads are formed is provided. Such an electronic component S1 can also be used as an inspection object.

Also, regarding the reference histogram, the precision of the value of the number of pixels in the peak may be lower than the precision of the value of the gradation in the peak. That is, if the precision of the gradation value in the peak is high to some extent, the value of the number of pixels in the peak does not need such precision. This is because, in the calculation of the deviation amount, a calculation for obtaining a difference in the value of each pixel in each gradation is performed, and a comparison is performed. Like the histogram of the captured image in FIG. 5 (see FIG. 6), the histogram of the captured image in FIG. 13 includes composition C1 corresponding to the electronic component part 100, composition C2 corresponding to the black groove part 110, and Composition C3 of the bead portion 120 (that is, the gradation in the peaks is the same, but the number of pixels is different). Therefore, the reference histogram of the captured image in FIG. 5 can be used as the reference histogram of the captured image in FIG. 13 .

In the above-mentioned embodiment, the sum of the absolute values of the differences between the histogram of the captured image and the number of pixels of the reference histogram (value of the histogram) for each level is defined as the “difference amount”. However, the "deviation amount" is not limited to this. The shape of each of the histogram of the captured image and the reference histogram is represented by a function, and the "offset" may be, for example, the correlation of these functions. <5-4>

In the above embodiment, the reference histogram is generated by the procedure shown in the flowchart of FIG. 9 . However, the reference histogram may not necessarily be generated in this order. For example, a reference histogram may be automatically generated based on the characteristics of the electronic component S1. Also, for example, a reference histogram corresponding to a plurality of types of electronic components S1 may be prepared, and the plurality of reference histograms may be stored in the storage unit 80 . In this case, the reference histogram to be used may be changed depending on what kind of electronic component S1 the inspection target is.

As mentioned above, the embodiment of this invention was illustrated and described. That is, the detailed description and the attached drawings are disclosed for the purpose of illustration. Therefore, among the constituent elements described in the detailed description and the attached drawings, constituent elements not necessary for solving the problem may be included. Therefore, although these non-essential constituent elements are described in the detailed description and the attached drawings, these non-essential constituent elements should not be directly regarded as essential.

In addition, the above-mentioned embodiments are merely illustrations of the present invention from various viewpoints. Various improvements and changes can be made to the above-described embodiments within the scope of the present invention. For implementation of the present invention, specific configurations can be appropriately adopted in accordance with the embodiments.

1: cutting device 3: Substrate supply part 4: Positioning Department 4a: track part 5: Cutting table 5a: Holding member 5b: Rotary mechanism 5c: Mobile Mechanism 5d: First position confirmation camera 5e: First Scrubber 6: mandrel part 6a: blade 6b:Second position confirmation camera 6c: axis of rotation 6d: First flange 6e: Second flange 6f: fastening parts 7:Transportation department 7a: Second scrubber 11: Examination table 12: The first optical inspection camera 13: Second optical inspection camera 14:Configuration Department 15: Extraction part 15a: Trays for good products 15b: Tray for defective products 16, 17: Lighting Department 17a: Dome 17b:LED 20: Monitor 50: computer 70: Control Department 72:CPU 74: RAM 76:ROM 80: memory department 81: Control program 90: Input and output I/F 100, 200: Electronic Components Department 110, 210: Heigou Department 120, 220: welding bead part A1: cut off module B1: Inspection and storage module C1, C2, C3, C4, C5, C6: composition HG1, HG2: Histogram IM1, IM2, IM3: Capture images M1: Cassette P1: Package substrate S1: Electronic components T1: area

Fig. 1 is a plan view schematically showing a cutting device. Fig. 2 is a side view schematically showing a mandrel portion. Fig. 3 is a diagram schematically showing a section of an illumination unit. Fig. 4 is a diagram schematically showing a hardware configuration of a computer. Fig. 5 is a diagram showing an example of a preferable captured image. Fig. 6 is a diagram showing a histogram of the captured image shown in Fig. 5 . Fig. 7 is a diagram showing an example of a poor captured image. Fig. 8 is a diagram showing a histogram of the captured image shown in Fig. 7 . Fig. 9 is a flowchart showing the procedure for generating a reference histogram. Fig. 10 is a flowchart showing the automatic adjustment procedure of the lighting state of the light in the lighting unit. Fig. 11 is a flowchart showing the processing executed in step S200 of Fig. 10 . Fig. 12 is a flowchart showing the processing executed in step S210 of Fig. 10 . Fig. 13 is a diagram showing an example of a captured image of an electronic component in a modified example.

Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none

1: cutting device

3: Substrate supply part

4: Positioning Department

4a: track part

5: Cutting table

5a: Holding member

5b: Rotary mechanism

5c: Mobile Mechanism

5d: First position confirmation camera

5e: First Scrubber

6: mandrel part

6a: blade

6b:Second position confirmation camera

7:Transportation department

7a: Second scrubber

11: Examination table

12: The first optical inspection camera

13: Second optical inspection camera

14:Configuration Department

15: Extraction part

15a: Trays for good products

15b: Tray for defective products

16, 17: Lighting department

20: Monitor

50: computer

M1: Cassette

P1: Package substrate

Claims (9)

An inspection system for inspecting the aforementioned inspection object based on a captured image of the inspection object, comprising: The lighting unit can change the light irradiation state to irradiate the light to the aforementioned inspection object; a camera for generating the captured image while irradiating light onto the inspection object; a control unit that controls each of the lighting unit and the camera to generate a plurality of captured images that are generated in different lighting states; and, memory unit, memory reference histogram; The control unit compares each histogram generated based on each of the plurality of captured images with the reference histogram, and determines the irradiation state used in the inspection based on a result of the comparison. The inspection system as described in claim 1, wherein the lighting unit is composed of a plurality of sections including one or a plurality of lighting units, Each of the aforementioned plurality of zones can be individually dimmed, The aforementioned illumination state is changed by adjusting light for each of the aforementioned plurality of segments. The inspection system described in claim 1 or claim 2, wherein the control section calculates a deviation amount between each histogram generated based on each of the plurality of captured images and the reference histogram, and The irradiation state when the captured image corresponding to the histogram having the smallest deviation amount is generated is determined as the irradiation state used in the inspection. The inspection system as described in claim 3, wherein the aforementioned offset is a sum of absolute values of differences of values of the histograms in each level. In the inspection system described in claim 3 or claim 4, wherein the control unit calculates the difference between the generated histogram and the reference histogram when generating the histogram based on the captured image of the inspection object. deviation amount, and when the calculated deviation amount is less than the aforementioned deviation amount stored in the aforementioned storage unit, the calculated aforementioned deviation amount and the aforementioned captured image corresponding to the aforementioned generated histogram are generated. The irradiation state is memorized in the aforementioned memory unit. The inspection system described in any one of claim 1 to claim 5, wherein the aforementioned control unit performs the following steps: changing the illumination state by a first unit in a first range, and controlling each of the illumination unit and the camera to generate the plurality of captured images, performing a first comparison with the aforementioned reference histogram for each of the aforementioned plurality of captured images generated based on changing the aforementioned illumination state by the aforementioned first unit, and based on the result of the aforementioned first comparison determine the second scope included in the aforementioned first scope, changing the illumination state by a second unit smaller than the first unit in a second range, and controlling each of the illumination unit and the camera to generate the plurality of captured images, performing a second comparison with the aforementioned reference histogram for each of the aforementioned plurality of captured images generated based on changing the aforementioned illumination state by the aforementioned second unit, and performing a second comparison based on a result of the aforementioned second comparison. The aforementioned irradiation state used for the aforementioned inspection is determined. The inspection system according to any one of claims 1 to 6, wherein the lighting unit is formed of a dome-shaped lighting. A method of manufacturing an electronic component is a method of manufacturing an electronic component using the inspection system described in any one of claim 1 to claim 7, comprising the following steps: determining the aforementioned irradiation conditions to be used for the aforementioned examinations; and, Use the cutting mechanism to cut the resin-sealed substrate to manufacture multiple electronic components; wherein each of the aforementioned plurality of electronic components is the aforementioned inspection object, The manufacturing method of the aforementioned electronic components further comprises the following steps: The captured image is generated in a state where light is irradiated to the inspection object in the determined irradiation state, and the inspection is performed. A cutting device comprising: a cutting mechanism for cutting the resin-sealed substrate; and, The inspection system described in any one of claim 1 to claim 7.

Images