CN117835550B - Circuit board assembly and electronic equipment - Google Patents
Circuit board assembly and electronic equipment Download PDFInfo
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- CN117835550B CN117835550B CN202410247510.2A CN202410247510A CN117835550B CN 117835550 B CN117835550 B CN 117835550B CN 202410247510 A CN202410247510 A CN 202410247510A CN 117835550 B CN117835550 B CN 117835550B
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- board assembly
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Abstract
The application discloses a circuit board assembly and electronic equipment, relates to the technical field of electronic products, and is used for improving the heat dissipation efficiency of a heating device. The circuit board assembly comprises a first circuit board, a second circuit board, a frame plate and a first radiating pipe, wherein the second circuit board and the first circuit board are stacked in a first direction and are arranged at intervals, and at least one of the first circuit board and the second circuit board is provided with a heating device; the frame plate is fixedly connected between the first circuit board and the second circuit board, and a containing cavity is defined among the first circuit board, the second circuit board and the frame plate; the first radiating pipe is provided with a first flow passage, a cooling medium is arranged in the first flow passage, and at least one part of the first radiating pipe is fixedly connected between the first circuit board and the second circuit board.
Description
Technical Field
The present application relates to the field of electronic products, and in particular, to a circuit board assembly and an electronic device.
Background
Currently, electronic devices such as mobile phones and tablet computers are continuously developed towards high performance, the configuration of the electronic devices is higher and higher, and the power density of heating devices (such as chips) is gradually improved. However, in the electronic device in the related art, the heat dissipation efficiency of the heat generating device is low, and the heat generating problem of the electronic device is more and more prominent, so that the reliability of the heat generating device is reduced and the power consumption is increased.
Disclosure of Invention
The application provides a circuit board assembly and electronic equipment, which are used for improving the heat dissipation efficiency of a heating device so as to improve the heat dissipation performance of the electronic equipment.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical scheme:
In a first aspect, the present application provides a circuit board assembly comprising: the heat dissipation device comprises a first circuit board, a second circuit board, a frame plate and a first heat dissipation tube, wherein the second circuit board and the first circuit board are stacked in a first direction and are arranged at intervals, and at least one of the first circuit board and the second circuit board is provided with a heat dissipation device; the frame plate is fixedly connected between the first circuit board and the second circuit board, and a containing cavity is defined among the first circuit board, the second circuit board and the frame plate; the first radiating pipe is provided with a first flow passage, a cooling medium is arranged in the first flow passage, and at least one part of the first radiating pipe is fixedly connected between the first circuit board and the second circuit board.
Because the cooling medium can flow in the first radiating pipe, the circuit board assembly in the embodiment can timely take away the heat on the heating device through the cooling medium, active heat dissipation is realized, and the heat exchange efficiency between the cooling medium and the first circuit board and between the cooling medium and the second circuit board is improved, so that the heat dissipation efficiency of the heating device is improved. In addition, because the at least part of the first radiating pipe is fixedly connected between the first circuit board and the second circuit board, the first radiating pipe can play a role in supporting the first circuit board and the second circuit board besides a role in radiating heat, the connection area between the first circuit board and the second circuit board can be increased, and therefore connection reliability between the first circuit board and the second circuit board can be improved, and structural stability and reliability of a circuit board assembly are guaranteed. In addition, the circuit board assembly in this embodiment realizes the heat dissipation of the heating device by adding the first heat dissipation tube, does not need to change the internal circuit structures of the first circuit board and the second circuit board, and the cooling medium does not need to occupy the internal space of the first circuit board and the second circuit board, thereby being beneficial to reducing the whole volume of the circuit board assembly, simplifying the processing technology of the circuit board assembly and reducing the cost of the circuit board assembly.
In a possible implementation manner of the first aspect, an orthographic projection of the first radiating pipe on the first reference plane overlaps an orthographic projection of the heat generating device on the first reference plane; the first reference plane is perpendicular to the first direction. Therefore, at least part of the first radiating pipe is opposite to the heating device, the heat transfer path between the heating device and the cooling medium can be shortened, the heat conduction efficiency can be improved, the heat loss can be reduced, and the radiating efficiency of the circuit board assembly can be effectively improved.
In one possible implementation of the first aspect, the circuit board assembly includes a first drive pump including a first pump port and a second pump port, one of the first pump port and the second pump port being a first pump inlet and the other being a first pump outlet; the first flow passage includes a first communication hole communicating with the first pump port and a second communication hole communicating with the second pump port. In this way, the flow rate of the cooling medium can be increased to increase the heat exchange efficiency between the cooling medium and the first circuit board, and the heat exchange efficiency between the cooling medium and the second circuit board.
In a possible implementation manner of the first aspect, the circuit board assembly includes a first fixing pad and a second fixing pad, the first fixing pad is disposed on the first driving pump and surrounds the periphery of the first pump port; the second fixing pad is arranged on the first radiating pipe and surrounds the periphery of the first communication hole, the second fixing pad is fixedly connected to the first fixing pad through a first welding spot structure, a first communication channel is defined among the first fixing pad, the second fixing pad and the first welding spot structure, and the first pump port and the first communication hole are communicated through the first communication channel. Like this, through the welding of first fixed pad and second fixed pad, not only can realize the fixed of first driving pump and first cooling tube, can also realize the intercommunication between first pump mouth and the first communication hole, simple structure, design benefit.
In a possible implementation manner of the first aspect, a surface of the first fixing pad facing the second fixing pad is provided with a first solder mask layer, and the first solder mask layer is located at a circumferential inner side of the first solder joint structure; and/or the surface of the second fixing pad facing the first fixing pad is provided with a second solder mask layer, and the second solder mask layer is positioned on the inner side of the circumference of the first welding spot structure. In this way, the solder can be prevented from clogging the first communication passage.
In a possible implementation manner of the first aspect, a first sealant is filled between the first driving pump and the first radiating pipe, and the first sealant is located at an outer periphery of the first welding spot structure. In this way, the sealing performance of the first communication passage can be improved, leakage of the cooling medium can be avoided, corrosion of components such as electronic components by the cooling medium can be avoided, and corrosion resistance of the circuit board assembly and the electronic device can be improved.
In a possible implementation manner of the first aspect, the first flow channel includes a first sub-flow channel and a second sub-flow channel that are arranged side by side, an arrangement direction of the first sub-flow channel and the second sub-flow channel may be perpendicular to the first direction, an extension path of the first sub-flow channel and an extension path of the second sub-flow channel are both the same as an extension path of the first radiating pipe, the second communication hole is located at one end of the first sub-flow channel, the first outlet is located at one end of the second sub-flow channel, and the other end of the first sub-flow channel is communicated with the other end of the second sub-flow channel. Thus, the widths of the two opposite end surfaces of the first radiating pipe in the first direction can be increased, the connection area between the first radiating pipe and the first circuit board and the connection area between the first radiating pipe and the second circuit board can be increased, the heat conduction efficiency between the first circuit board and the cooling medium and the heat conduction efficiency between the second circuit board and the cooling medium can be improved, and the connection reliability between the first circuit board and the second circuit board can be improved.
In a possible implementation manner of the first aspect, the first radiating pipe includes a first pipe section, the first pipe section is fixedly connected between the first circuit board and the second circuit board, and at least a portion of the first pipe section is located in the accommodating cavity. Like this, can support the great region of first circuit board and second circuit board deflection through first pipeline section, can reduce electronic equipment effectively and fall the in-process, the deformation degree of first circuit board and second circuit board.
In a possible implementation manner of the first aspect, the first radiating pipe includes a second pipe section, and the second pipe section is located at a circumferential outer side of the frame plate. Therefore, external stress can be blocked through the second pipe section, and cracking and failure of welding points between the frame plate and the first circuit board and welding points between the frame plate and the second circuit board under the action of external stress are avoided, so that the reliability of electric connection and mechanical connection between the first circuit board and the second circuit board can be improved.
In a possible implementation manner of the first aspect, the first radiating pipe includes a first pipe section and a second pipe section, the first pipe section is fixedly connected between the first circuit board and the second circuit board, at least a portion of the first pipe section is located in the accommodating cavity, and the second pipe section is located on a circumferential outer side of the frame plate.
In a possible implementation manner of the first aspect, the first radiating pipe is disposed spaced apart from the frame plate. In this way, the stress on the first radiating pipe can be prevented from being transmitted to the frame plate.
In a possible implementation manner of the first aspect, the second pipe section includes a first extension section, and the first extension section is located between the first circuit board and the second circuit board; the first circuit board is provided with a first grounding structure, the second circuit board is provided with a second grounding structure, the first extension section is provided with a third grounding structure and a fourth grounding structure, the third grounding structure is electrically connected with the first grounding structure, and the fourth grounding structure is electrically connected with the second grounding structure. In this way, grounding points (such as grounding welding points) can be formed between the first extension section and the first circuit board and between the first extension section and the second circuit board respectively, on one hand, the functional welding points between the frame board and the first circuit board and the functional welding points between the frame board and the second circuit board can be shielded through the grounding welding points, the functional welding points can be reinforced and protected, the risk of cracking failure of the functional welding points caused by external stress can be further reduced, and the connection reliability between the first circuit board and the second circuit board is ensured; on the other hand, the frame plate corresponding to the first extension section is not required to be provided with a grounding pad, so that the widths of two opposite end faces of the frame plate in the first direction can be reduced, the area of the frame plate occupied by the first circuit plate and the second circuit plate can be reduced, the effective layout area of the circuit board assembly can be ensured, and the number of electronic components on the circuit board assembly can be increased.
In a possible implementation manner of the first aspect, the second pipe section includes a heat dissipation portion, and an orthographic projection of the heat dissipation portion on the first reference plane does not overlap with the first circuit board; wherein the first reference plane is perpendicular to the first direction. Therefore, the end face of the heat radiating part in the first direction can be exposed out of the first circuit board, so that the heat conducting connection between the heat radiating part and the shell is convenient to achieve, and the difficulty in heat conducting connection between the first heat radiating pipe and the shell can be reduced.
In a possible implementation manner of the first aspect, the circuit board assembly includes a first shielding case, the first shielding case is disposed on a side surface of the first circuit board facing away from the second circuit board, and a portion of the first shielding case is located on a circumferential outer side of the first circuit board, and the heat dissipation portion is in heat conduction connection with the first shielding case. A specific way of thermally conductive connection between the heat sink and the housing is provided.
In a second aspect, the present application provides a circuit board assembly comprising: the first circuit board, the second circuit board, the frame plate and the second runner are stacked in the first direction and are arranged at intervals; the frame plate is fixedly connected between the first circuit board and the second circuit board, and a containing cavity is defined among the first circuit board, the second circuit board and the frame plate; a cooling medium is arranged in the second flow passage, and at least one part of the second flow passage is positioned in the frame plate; at least one of the first circuit board and the second circuit board is provided with a heating device, and the orthographic projection of the heating device on the first reference plane is overlapped with the orthographic projection of the second runner on the first reference plane; wherein the first reference plane is perpendicular to the first direction.
Because the cooling medium can flow in the second flow channel, heat on the heating device can be timely taken away through the cooling medium, active heat dissipation is realized, and therefore the heat dissipation efficiency of the heating device can be improved. In addition, the circuit board assembly in this embodiment, through setting at least a portion of the second runner in the frame board, need not to change the internal circuit structure of first circuit board and second circuit board, and need not to occupy the inner space of first circuit board and second circuit board, be favorable to reducing the whole volume of circuit board assembly, and can simplify the processing technology of circuit board assembly, reduce the cost of circuit board assembly.
In one possible implementation manner of the second aspect, the circuit board assembly includes a second driving pump, the second driving pump includes a third pump port and a fourth pump port, one of the third pump port and the fourth pump port is a second pump inlet, and the other is a second pump outlet; the circuit board assembly further comprises a third communication hole and a fourth communication hole, wherein the third communication hole and the fourth communication hole are communicated with the second flow channel, the third communication hole is communicated with the third pump port, and the fourth communication hole is communicated with the fourth pump port. Thus, the flow rate of the cooling medium can be increased, and the heat dissipation efficiency of the heat generating device can be further improved.
In a possible implementation manner of the second aspect, the frame plate includes a first end surface facing the first circuit board, the third communication hole and the fourth communication hole are formed in the frame plate, and the third communication hole and the fourth communication hole penetrate through the first end surface; the first circuit board comprises a first bearing surface and a second bearing surface which are opposite to each other, the first bearing surface is opposite to the frame plate, the second driving pump is arranged on the first bearing surface, a first through hole is formed in the first circuit board, and two ends of the first through hole are respectively communicated with the third pump port and the third communication hole. A communication mode of the third pump port and the third communication hole is provided.
In a possible implementation manner of the second aspect, the circuit board assembly includes a first connection pad and a second connection pad, where the first connection pad is disposed on the second driving pump and surrounds the periphery of the third pump port; the second connection pad sets up in first loading face, and encircles in the periphery of first through-hole, and the second connection pad passes through second welded structure fixed connection in first connection pad, and defines the second intercommunication passageway between first connection pad, second connection pad and the second welded structure, and third pump mouth and first through-hole communicate through the second intercommunication passageway. Like this, through the welding of first connection pad and second connection pad, not only can realize the fixed between second driving pump and the first circuit board, can also realize the intercommunication between third pump mouth and the first through-hole, simple structure, design benefit.
In a possible implementation manner of the second aspect, the second driving pump is disposed on the frame plate, the third communication hole and the fourth communication hole are each formed on the frame plate, and the third communication hole and the fourth communication hole each penetrate through a surface of the frame plate facing the second driving pump. Another second drive pump set position is provided.
In a possible implementation manner of the second aspect, the frame plate includes a first frame section, the first frame section includes a first fixing portion and a first protruding portion, the first fixing portion is fixedly connected between the first circuit board and the second circuit board, the first protruding portion is located at a circumferential outer side of the first fixing portion, and the second driving pump is disposed at a side of the first protruding portion facing away from the second circuit board; the orthographic projection of the first projection on the first reference plane is not overlapped with the orthographic projection of the first circuit board on the first reference plane, wherein the first reference plane is perpendicular to the first direction. The first protrusion may be fixedly connected to the first fixing portion. In this way, interference between the second drive pump and the first circuit board can be avoided.
In a possible implementation manner of the second aspect, the frame plate includes a first plate body and a second plate body, the second plate body is stacked with the first plate body, and a first groove is formed on the first plate body to define a first cavity between the first plate body and the second plate body, and the first cavity is formed as the second flow channel. A concrete structure of a frame plate is provided.
In a possible implementation manner of the second aspect, the frame plate includes a first plate body and a second plate body, where the second plate body is stacked with the first plate body, and a first groove is provided on the first plate body to define a first cavity between the first plate body and the second plate body, and a second heat dissipation tube is provided in the first cavity, and a second flow channel is provided in the second heat dissipation tube. That is, the second flow passage is formed in the second radiating pipe. Another specific construction of the frame plate is provided.
In a possible implementation manner of the second aspect, the first plate body and/or the second plate body are/is a metal piece, and the frame plate further includes an injection molding layer, and the injection molding layer wraps at least part of an outer surface of the first plate body and/or at least part of an outer surface of the second plate body. In this way, the heat conduction efficiency between the cooling medium and the frame plate can be improved, so that the heat dissipation can be enhanced, and the heat dissipation efficiency of the heating device can be improved.
In a possible implementation manner of the second aspect, the first plate body is a metal piece, and a surface of the first plate body facing away from the second plate body is exposed to the injection molding layer. In this way, the heat conduction efficiency between the cooling medium and the frame plate can be further improved.
In a possible implementation manner of the second aspect, the frame plate includes a first end surface facing the first circuit board, a first groove body is provided on the frame plate, the first groove body penetrates through the first end surface, a second cavity is defined between the first circuit board and the first groove body, the second cavity is formed into a second flow channel, or a second radiating tube is provided in the second cavity, and the second radiating tube has a second flow channel. Another implementation of the second flow channel is provided.
In a possible implementation manner of the second aspect, the frame plate includes a frame plate body and a second radiating pipe, the frame plate body is provided with a second groove body, the second groove body includes an open mouth and a groove bottom wall, the open mouth is located on the outer surface of the frame plate body, and the groove bottom wall is opposite to the open mouth; the second radiating pipe is internally provided with a second flow passage and is arranged on the second groove body. Another implementation of the second flow channel is provided.
In a possible implementation manner of the second aspect, the circuit board assembly further includes a plastic layer, and the plastic layer is filled in the second groove body and wraps at least part of an outer surface of the second heat dissipation pipeline. Therefore, the second radiating pipe can be fixed in the second groove body through the plastic sealing layer, and the second radiating pipe can be prevented from moving.
In a possible implementation manner of the second aspect, the plastic sealing layer includes a first plastic sealing portion, and the first plastic sealing portion covers a surface of the second radiating pipe facing away from the bottom wall of the groove; the frame plate is provided with a third communication hole which is communicated with the second flow passage, and the third communication hole penetrates through the first plastic package part and penetrates through the pipe wall of the second radiating pipe. In this way, communication between the third communication hole and the second flow passage can be achieved.
In a possible implementation manner of the second aspect, the circuit board assembly further includes a third protection layer, and the third protection layer is disposed on a hole wall surface of the third communication hole. Therefore, the cooling medium can be separated from the first plastic sealing part through the third protective layer, so that the cooling medium can be prevented from being immersed into the first plastic sealing part, on one hand, the separation of the bonding interface between the pipe wall of the second radiating pipe and the first plastic sealing layer under the corrosion of the cooling medium can be avoided, and the connection reliability between the second radiating pipe and the first plastic sealing layer can be improved; on the other hand, the loss of the cooling medium caused by the absorption of the cooling medium by the plastic sealing layer can be avoided, so that the service life of the circuit board assembly can be prolonged while the heat dissipation effect of the circuit board assembly is ensured.
In a possible implementation manner of the second aspect, the circuit board assembly further includes a cooling structure, and the cooling structure has a third flow passage therein, and the third flow passage is in communication with the second flow passage. The cooling structural member comprises a third end face and a fourth end face which are opposite in the first direction, and the fourth end face faces the frame plate; the cooling structural member is arranged on one side of the frame plate, which is far away from the second circuit board, and at least one part of the third end face is exposed out of the first circuit board. In this way, the cooling structure can be thermally conductively connected to the housing via the third end face.
In a possible implementation manner of the second aspect, the cooling structure includes a first split portion and a second split portion, the second split portion is fixedly connected to the first split portion, and a third groove is provided on the first split portion to define a third flow channel between the first split portion and the second split portion. A specific structure of a cooling structure is provided.
In a possible implementation manner of the second aspect, a fourth flow channel is provided on the first circuit board, and the fourth flow channel is in communication with the second flow channel. Thus, the heat dissipation performance of the circuit board assembly can be further improved.
In a third aspect, the present application provides an electronic device, including a housing and a circuit board assembly, where the circuit board assembly is a circuit board assembly in any of the foregoing embodiments, and the circuit board assembly is disposed in the housing.
In a possible implementation manner of the third aspect, the heat generating device is in thermally conductive connection with the housing.
The technical effects caused by any implementation manner of the third aspect may refer to the technical effects caused by different implementation manners of the first aspect and the second aspect, which are not described herein.
Drawings
Fig. 1 is a perspective view of an electronic device provided in some embodiments of the present application;
FIG. 2 is an exploded view of the electronic device shown in FIG. 1;
FIG. 3 is a cross-sectional view of a circuit board assembly in the electronic device of FIG. 2;
FIG. 4 is a schematic diagram illustrating the assembly of the circuit board assembly of FIG. 3 with a housing of an electronic device;
Fig. 5 is a schematic structural diagram of a circuit board assembly according to other embodiments of the present application;
FIG. 6 is a top view of the circuit board assembly of FIG. 5 with the first shield hidden;
FIG. 7 is a schematic diagram illustrating an assembly of a first driving pump and a first heat pipe in the circuit board assembly shown in FIG. 5;
FIG. 8 is a cross-sectional view of the circuit board assembly shown in FIG. 6 taken along line A-A;
FIG. 9 is a schematic diagram illustrating the assembly of the circuit board assembly of FIG. 5 with a housing of an electronic device;
FIG. 10 is another assembly schematic of the circuit board assembly of FIG. 5 with a housing of an electronic device;
FIG. 11 is a schematic view of a circuit board assembly according to other embodiments of the present application;
Fig. 12 is a schematic structural view of a circuit board assembly according to other embodiments of the present application;
Fig. 13 is a schematic structural view of a circuit board assembly according to still other embodiments of the present application;
FIG. 14 is a top view of the circuit board assembly of FIG. 13 with the first circuit board hidden;
FIG. 15 is a schematic illustration of a second drive pump in communication with a second fluid path in the circuit board assembly of FIG. 13;
Fig. 16 is a partial cross-sectional view of a frame plate in the circuit board assembly of fig. 13;
fig. 17 is a flow chart of a method of processing the frame plate shown in fig. 16;
Fig. 18 is a schematic flow chart of a method for processing a frame plate according to another embodiment of the present application;
Fig. 19 is a schematic flow chart of a method for processing a frame plate according to still other embodiments of the present application;
FIG. 20 is a schematic view of a cooling structure of the circuit board assembly of FIG. 13;
FIG. 21 is a top view of the cooling structure shown in FIG. 20;
FIG. 22 is a top view of a cooling structure provided in accordance with further embodiments of the present application;
FIG. 23 is an assembled schematic view of the circuit board assembly of FIG. 13 and a housing of an electronic device;
fig. 24 is a top view of a circuit board assembly provided by other embodiments of the present application;
fig. 25 is an assembly schematic diagram of a circuit board assembly and a housing of an electronic device according to other embodiments of the present application;
FIG. 26 is a schematic illustration of a second drive pump in communication with a second fluid path in the circuit board assembly of FIG. 25;
FIG. 27 is a top view of the circuit board assembly of the assembly schematic of FIG. 25;
FIG. 28 is a schematic view of a circuit board assembly according to still other embodiments of the present application;
fig. 29 is a schematic view of a frame plate according to still other embodiments of the present application;
fig. 30 is a flow chart of a method of processing the frame plate shown in fig. 29;
Fig. 31 is a schematic structural view of a circuit board assembly according to still other embodiments of the present application.
Detailed Description
The following description of the technical solutions according to the embodiments of the present application will be given with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments.
In embodiments of the present application, the terms "exemplary" or "such as" and the like are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g." in an embodiment should not be taken as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.
In embodiments of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
In the description of the embodiment of the present application, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In the present application, the character "/" generally indicates that the front and rear related objects are an or relationship.
In the present embodiments, it is to be understood that references to orientation terms, such as "top," "bottom," "inner," "outer," etc., are merely with reference to the orientation of the drawings, and thus are used in order to better and more clearly illustrate and understand the present embodiments, rather than to indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present embodiments.
In describing embodiments of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" should be construed broadly, and for example, "connected" may be either detachably connected or non-detachably connected; may be directly connected or indirectly connected through an intermediate medium. Wherein, "fixedly connected" means that the relative positional relationship is unchanged after being connected with each other. "rotationally coupled" means coupled to each other and capable of relative rotation after coupling. "slidingly coupled" means coupled to each other and capable of sliding relative to each other after being coupled. By "drive connection" is meant that movement of one of the two components being connected may be transferred to the other component, the connection between the two components including, but not limited to, at least one of a rotational connection, a sliding connection, a gear engagement drive connection, a sprocket drive connection, a cam mechanism drive connection, and the like. By "thermally conductive connection" is meant a connection having heat transfer between two components.
In the description of embodiments of the application, the terms "parallel", "perpendicular", "equal", "direction coincident" include the stated case as well as the case similar to the stated case, the range of which is within acceptable deviation ranges as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, wherein the range of acceptable deviations from approximately parallel may be, for example, deviations within 5 °, 8 °, or 10 °; "vertical" includes absolute vertical and near vertical, where the acceptable deviation range for near vertical may also be within, for example, 5 °, 8 °, or 10 °. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5%, 8%, or 10% of either within an acceptable deviation of approximately equal.
For ease of understanding, before describing the electronic device in detail in the embodiments of the present application, description will be first made of related terms related to the embodiments of the present application.
Effective layout area of circuit board assembly: refers to the area of the circuit board assembly that may be used to mount electronic components.
Functional welding spots: refers to a solder joint for electrically connecting two components. For example, functional pads between the first circuit board and the frame plate hereinafter refer to pads for making electrical connection between the first circuit board and the frame plate. The functional solder joints between the second circuit board and the frame plate refer to solder joints for achieving electrical connection between the second circuit board and the frame plate.
Interface thermal conductive material (THERMAL INTERFACE MATERIALS, TIM): the material is a material commonly used for IC packaging and electronic heat dissipation, and is mainly used for filling micro-voids and rugged surface holes generated when the two materials are jointed or contacted, reducing heat transfer resistance and improving heat dissipation performance.
The embodiment of the application provides electronic equipment, which comprises a circuit board assembly. In order to improve the heat radiation efficiency of the heat generating device and improve the heat radiation performance of the circuit board assembly and the electronic device, the present application provides a flow passage (such as a first flow passage and/or a second flow passage mentioned below) for filling a cooling medium in the circuit board assembly, and the flow passage is provided between the first circuit board and the second circuit board. Therefore, heat generated by the heating device can be transferred to the cooling medium, active heat dissipation is realized through the flow of the cooling medium in the flow channel, the heat dissipation efficiency of the heating device can be improved, the temperature of the heating device is reduced, and the heat dissipation performance of the circuit board assembly can be effectively improved. And because the runner is located between first circuit board and the second circuit board, need not to change the internal circuit structure of first circuit board and second circuit board, need not to occupy the area of first circuit board and second circuit board simultaneously, can simplify the processing technology of circuit board subassembly, the result is simple, design benefit, processing cost is low.
Electronic devices in embodiments of the application include, but are not limited to, cell phones, tablet computers (tablet personal computer), laptop computers (lap computers), personal Digital Assistants (PDAs), personal computers, notebook computers, vehicle devices, electronic readers, wearable devices, augmented reality (augmented reality, AR) glasses, AR helmets, virtual Reality (VR) glasses, VR helmets, or the like.
Referring to fig. 1 and fig. 2, fig. 1 is a perspective view of an electronic device 100 according to some embodiments of the present application, and fig. 2 is an exploded view of the electronic device 100 shown in fig. 1. The electronic device 100 shown in fig. 1 is described by taking a mobile phone as an example. In this example, the electronic device 100 includes a screen 10, a housing 20, a circuit board assembly 30, and a battery 40.
It is to be understood that fig. 1 and 2 and the related figures below only schematically illustrate some of the components comprised by the electronic device 100, the actual shape, actual size, actual position and actual configuration of which are not limited by fig. 1 and 2 and the figures below. In addition, when the electronic device 100 is some other form of device, the electronic device 100 may not include the screen 10.
In the embodiment shown in fig. 1, the electronic device 100 has a rectangular flat plate shape. For convenience of description of the embodiments below, an XYZ coordinate system is established. Specifically, the width direction of the electronic device 100 is defined as the X-axis direction, the length direction of the electronic device 100 is defined as the Y-axis direction, and the thickness direction of the electronic device 100 is defined as the Z-axis direction. It is to be understood that the coordinate system of the electronic device 100 may be flexibly set according to actual needs, which is not specifically limited herein. In other embodiments, the shape of the electronic device 100 may also be square planar, circular planar, oval planar, etc.
The screen 10 is used to display images, videos, and the like. Referring to fig. 2, a screen 10 includes a light-transmitting cover plate 11 and a display screen 12. The light-transmitting cover plate 11 is mainly used for protecting and preventing dust of the display screen 12. The display 12 may be a flexible display or a rigid display.
The housing 20 is used to protect the internal electronics of the electronic device 100. Referring to fig. 2, the housing 20 includes a middle frame 21 and a back cover 22. The middle frame 21 includes a rim 211 and a middle plate 212. The rim 211 may have a ring shape. For example, the bezel 211 may be substantially rectangular. The transparent cover 11 and the back cover 22 are fixedly connected to the frame 211, and the transparent cover 11, the back cover 22 and the frame 211 enclose an internal accommodating space of the electronic device 100, and the internal accommodating space can accommodate the display screen 12, the circuit board assembly 30, the battery 40 and the like.
The middle plate 212 is fixed to the inner surface of the frame 211 for one circle and is located between the screen 10 and the back cover 22. Midplane 212 may serve as a support backbone for electronic device 100 and circuit board assembly 30, battery 40, etc. may be secured to midplane 212.
The battery 40 is used to provide power to electronic devices within the electronic device 100, such as the display 12, the circuit board assembly 30, and the like.
The circuit board assembly 30 includes a circuit board stack 301 and electronic components 302. The circuit board stack structure 301 includes a plurality of circuit boards arranged in a stacked manner. The electronic component 302 is disposed on the circuit board stack structure 301. The electronic component 302 includes, but is not limited to, a processor (also referred to as a chip), an antenna module, a bluetooth module, a WiFi module, a GPS module, a charging module or a screen display and operation module, a resistor, a capacitor, an inductor, a potentiometer, a valve, a heat sink, an electromechanical element, a connector, a semiconductor discrete device, a sensor, a power source, a switch, a micro-motor, an electronic transformer, a relay, a SIM card holder, a universal serial bus (universal serial bus, USB) device, and the like.
In addition, the electronic device 100 may further include an external memory interface, an internal memory, a universal serial bus (universal serial bus, USB) interface, a charge management module, a power management module, an antenna, a mobile communication module, a wireless communication module, an audio module, a speaker, a receiver, a microphone, an earphone interface, a sensor module, keys, a camera module, and the like, electrically connected to the processor.
Referring to fig. 3, fig. 3 is a cross-sectional view of the circuit board assembly 30 in the electronic device 100 shown in fig. 2. The circuit board stack structure 301 includes a first circuit board 31, a second circuit board 32, and a frame board 33 (FB). Wherein the first circuit board 31, the second circuit board 32 and the frame plate 33 are circuit boards. That is, in this embodiment, the circuit board stack structure 301 includes three circuit boards. It will be appreciated that in other embodiments, the circuit board stack 301 may also include five, seven, etc. more circuit boards.
The first circuit board 31 and the second circuit board 32 are stacked in the first direction and arranged at intervals, and the frame plate 33 is fixedly connected between the first circuit board 31 and the second circuit board 32. The first circuit board 31, the frame plate 33, and the second circuit board 32 may form a sandwich laminated structure. For example, the first circuit board 31, the frame plate 33, and the second circuit board 32 may be sequentially stacked in the Z-axis direction. That is, the first direction may be a Z-axis direction.
Both the first circuit board 31 and the second circuit board 32 may be used to arrange the electronic components 302. The first circuit board 31 and the second circuit board 32 each include, but are not limited to, a printed circuit board (printed circuit board, PCB) and a flexible circuit (flexible printed circuit, FPC) board. Referring to fig. 3, the first circuit board 31 and the second circuit board 32 are both plate-shaped. The thickness direction of the first circuit board 31 and the thickness direction of the second circuit board 32 are both parallel to the Z-axis direction.
In some embodiments, the first circuit board 31 is a motherboard (also referred to as a "main circuit board") and the second circuit board 32 is a radio frequency daughter board. In other embodiments, the first circuit board 31 may be a radio frequency daughter board, and the second circuit board 32 may be a motherboard.
The frame plate 33 is used to make electrical connection between the first circuit board 31 and the second circuit board 32. Illustratively, the frame plate 33 may be soldered to the first circuit board 31, and the frame plate 33 may be soldered to the second circuit board 32. In this case, the function pads between the frame plate 33 and the first circuit board 31 may be electrically connected with the function pads between the frame plate 33 and the second circuit board 32. In this way, electrical and mechanical connection between the first circuit board 31 and the second circuit board 32 can be achieved through the frame plate 33.
The frame plate 33 is a frame structure. Specifically, the middle portion of the frame plate 33 has a hollowed-out area. By way of example, the frame plate 33 may be formed in a "back" shape, an "8" shape, or the like. The frame board 33 may be a PCB board, or other circuit board with an electrical connection function. The first circuit board 31 and the second circuit board 32 may be spaced apart from each other by the frame plate 33 such that the first circuit board 31, the frame plate 33, and the second circuit board 32 define therebetween the accommodation chamber 301a. In this way, both side surfaces in the thickness direction (for example, the Z-axis direction in fig. 3) of the first circuit board 31 and both side surfaces in the thickness direction of the second circuit board 32 can be used for disposing the electronic components 302, the effective layout area of the circuit board stack structure 301 can be increased, and the number of the electronic components 302 in the circuit board assembly 30 can be increased.
Referring to fig. 3, the electronic component 302 includes a heat generating device 3021. The number of heat generating devices 3021 may be one or more. The heat generating device 3021 may be the electronic component 302 having a large heat generation amount or a high temperature change requirement. Illustratively, the heat generating device 3021 may be a System On Chip (SOC), a central processing unit (central processing unit, CPU), a graphics processor (graphics processing unit, GPU), or the like.
At least one of the first circuit board 31 and the second circuit board 32 is provided with a heat generating device 3021. Specifically, the heat generating devices 3021 may be all provided on one of the first circuit board 31 and the second circuit board 32. Alternatively, when the heat generating devices 3021 are plural, one part of the heat generating devices 3021 may be provided on the first circuit board 31 and the other part of the heat generating devices 3021 may be provided on the second circuit board 32. For example, in the embodiment shown in fig. 3, the heat generating device 3021 may be provided on a side surface of the first circuit board 31 facing away from the second circuit board 32.
In order to avoid electromagnetic interference between the electronic components 302, referring to fig. 3, the circuit board assembly 30 further includes a first shielding case 34 and a second shielding case 35. In order to secure the shielding effect of the first and second shields 34 and 35, each of the first and second shields 34 and 35 may be a metal member. Illustratively, the material of the first and second shields 34, 35 may be copper (Cu), stainless steel, or the like.
The first shield 34 is fixedly connected to the first circuit board 31, and covers the exterior of the heat generating device 3021. The second shielding case 35 is fixedly connected to the second circuit board 32, and covers the exterior of a portion of the electronic components 302. By way of example, the second shield 35 may be located on a side of the second circuit board 32 facing away from the first circuit board 31.
In some embodiments, in order to facilitate the assembly between the circuit board assembly 30 and the housing 20 of the electronic device 100, referring to fig. 4, fig. 4 is a schematic diagram illustrating the assembly of the circuit board assembly 30 and the housing 20 of the electronic device 100 in fig. 3, and the electronic device 100 further includes a circuit board bracket 50, where the circuit board assembly 30 may be fixed to the middle frame 21 by the circuit board bracket 50. Illustratively, the circuit board carrier 50 may be coupled to the circuit board stack 301, the midplane 212 by fasteners 60. The fasteners 60 include, but are not limited to, screws, bolts, and the like.
Since the heat generating device 3021 inevitably generates heat during operation. When the heat generated by the heat generating device 3021 is large, heat may accumulate inside or around the heat generating device 3021, resulting in a decrease in reliability of the heat generating device 3021 and an increase in power consumption. In addition, the heat accumulation can also increase the body temperature of the electronic device 100, shorten the endurance time of the electronic device 100, and the like, so as to affect the user experience.
In order to avoid heat accumulation in or around the heat generating device 3021 to reduce the temperature of the heat generating device 3021 and prevent the temperature of the heat generating device 3021 from being too high, the heat generated by the heat generating device 3021 needs to be dissipated to the outside of the electronic apparatus 100 through a certain heat dissipation path, or the heat needs to be rapidly diffused by means of soaking so that the heat is dissipated to the outside of the electronic apparatus 100.
In some embodiments, referring to fig. 4, in order to facilitate outward dissipation of heat generated by the heat generating device 3021, the electronic device 100 further includes a Vapor Chamber (VC) 70, a first heat conductive adhesive 81, and a second heat conductive adhesive 82. The vapor chamber 70 is provided in the center 21. Specifically, the soaking plate 70 may be disposed on a surface of the middle plate 212 facing away from the back cover 22. The first heat-conducting glue 81 is connected between the heat-generating device 3021 and the first shield can 34, and the second heat-conducting glue 82 is connected between the first shield can 34 and the soaking plate. Thus, referring to fig. 4, heat generated by the heat generating device 3021 may be transferred to the middle frame 21 through the first heat conductive adhesive 81, the first shielding case 34, the second heat conductive adhesive 82, and the vapor chamber 70 in sequence, and may be emitted to the outside of the electronic apparatus 100 through the middle frame 21, so as to prevent the temperature of the heat generating device 3021 from being too high.
In addition, the heat generated by the heat generating device 3021 may also be transferred to the first circuit board 31 and guided to the middle frame 21 and/or the back cover 22 of the electronic apparatus 100 through the first circuit board 31.
However, as the electronic apparatus 100 is advanced toward high performance, the heat generation amount of the heat generating device 3021 is increased, and the above heat dissipation manner cannot satisfy the heat dissipation requirement of the heat generating device 3021, so that the development of the electronic apparatus 100 is limited.
In order to improve the heat dissipation efficiency of the heat generating device 3021, referring to fig. 5, fig. 5 is a schematic diagram of a circuit board assembly 30 according to another embodiment of the present application. The circuit board assembly 30 in the present embodiment is different from the circuit board assembly 30 shown in fig. 3 in that the circuit board assembly 30 in the present embodiment includes, in addition to the first circuit board 31, the second circuit board 32, the frame board 33, the heat generating device 3021, the first shield case 34, the second shield case 35, a first heat radiation pipe 361 for accommodating and transmitting the cooling medium Q. It will be appreciated that in other embodiments, the circuit board assembly 30 may not include at least one of the first and second shields 34, 35.
Specifically, referring to fig. 5, the first radiating pipe 361 has a first flow channel L1, a cooling medium Q is disposed in the first flow channel L1, and the cooling medium Q can flow in the first flow channel L1. The cooling medium Q may be a single substance or a mixture of a plurality of substances. In some embodiments, the cooling medium Q may be a liquid. For example, the cooling medium Q may be water, an ethylene glycol solution, a propylene glycol solution, a fluorinated liquid, a liquid metal, or the like. In other embodiments, the cooling medium Q may also be a gas or a phase change material. The phase change material can be solid-liquid phase change material, gas-liquid phase change material, etc. The phase change material may be, for example, paraffin wax. The cooling medium Q may remain single-phase (i.e., no phase change occurs) during flow, or may change between two phases (e.g., between a liquid phase and a gas phase).
At least a portion of the first radiating pipe 361 is fixedly connected between the first circuit board 31 and the second circuit board 32. Specifically, at least a portion of the first radiating pipe 361 is fixedly connected to the first circuit board 31 and the second circuit board 32 at both end surfaces thereof in the first direction (i.e., the Z-axis direction in fig. 5), respectively. Specifically, in some embodiments, the first radiating pipe 361 may be integrally and fixedly connected between the first circuit board 31 and the second circuit board 32. In other embodiments, only one portion of the first radiating pipe 361 may be fixedly connected between the first circuit board 31 and the second circuit board 32, in which case, the other portion of the first radiating pipe 361 may be connected to only one of the first circuit board 31 and the second circuit board 32, or the other portion of the first radiating pipe 361 may be disconnected from both the first circuit board 31 and the second circuit board 32.
In this way, heat generated when the heat generating device 3021 is operated can be transferred to the cooling medium Q in the first heat radiation pipe 361 via at least one of the first circuit board 31 and the second circuit board 32, so that heat generated by the heat generating device 3021 can be absorbed by the cooling medium Q. Because the cooling medium Q can flow in the first heat dissipation tube 361, the circuit board assembly 30 in this embodiment can timely take away the heat on the heat generating device 3021 through the cooling medium Q, so as to realize active heat dissipation, effectively reduce the temperature rise amplitude of the cooling medium Q, and facilitate improving the heat exchange efficiency between the cooling medium Q and the first circuit board 31 and between the cooling medium Q and the second circuit board 32, thereby improving the heat dissipation efficiency of the heat generating device 3021, avoiding heat accumulation in or around the heat generating device 3021, facilitating improving the reliability of the heat generating device 3021, and reducing the power consumption of the heat generating device 3021. Meanwhile, the temperature sensing degree of the electronic equipment 100 is reduced, the endurance time of the electronic equipment 100 can be prolonged, the reliability of the whole machine of the electronic equipment 100 can be improved, and the user experience is improved.
In addition, in the circuit board assembly 30 of the present embodiment, at least a portion of the first radiating pipe 361 is fixedly connected between the first circuit board 31 and the second circuit board 32, so that the first radiating pipe 361 can play a role of supporting the first circuit board 31 and the second circuit board 32 in addition to a role of radiating heat, and a connection area between the first circuit board 31 and the second circuit board 32 can be increased, thereby improving connection reliability between the first circuit board 31 and the second circuit board 32, and ensuring structural stability and reliability of the circuit board assembly 30. In addition, in the circuit board assembly 30 in this embodiment, the heat dissipation of the heat generating device 3021 is achieved by adding the first heat dissipation tube 361, the internal circuit structures of the first circuit board 31 and the second circuit board 32 do not need to be changed, and the cooling medium Q does not need to occupy the internal space of the first circuit board 31 and the second circuit board 32, so that the overall volume of the circuit board assembly 30 is reduced, the processing technology of the circuit board assembly 30 can be simplified, and the cost of the circuit board assembly 30 is reduced.
Therefore, the circuit board assembly 30 in the embodiment can improve the heat dissipation efficiency of the heat generating device 3021, improve the structural stability and reliability of the circuit board assembly 30, reduce the overall volume of the circuit board assembly 30, and have simple process, smart design and low processing cost.
In some embodiments, in order to improve heat transfer efficiency between the first circuit board 31 and the cooling medium Q, the first radiating pipe 361 may be a metal member. For example, the material of the first radiating pipe 361 may be stainless steel, copper alloy, aluminum alloy, titanium alloy, magnesium alloy, or the like.
In order to further improve the heat dissipation efficiency of the heat generating device 3021, please refer to fig. 5 in combination with fig. 6, fig. 6 is a top view of the circuit board assembly 30 shown in fig. 5 after hiding the first shielding case 34. The top view shown in fig. 6 is a schematic view from the first circuit board 31 to the second circuit board 32. In order to clearly show the positional relationship of the heat generating device 3021 and the first heat radiation pipe 361, the first circuit board 31 and the heat generating device 3021 in fig. 6 are each illustrated with a broken line. The front projection of the first radiating pipe 361 on the first reference plane overlaps with the front projection of the heat generating device 3021 on the first reference plane. The first reference plane is perpendicular to the first direction (i.e., the Z-axis direction in fig. 5).
In this way, it is ensured that at least part of the first heat dissipation pipe 361 is directly opposite to the heat generating device 3021, so that the heat transfer path between the heat generating device 3021 and the cooling medium Q can be shortened, which is advantageous for improving the heat conduction efficiency, and reducing the heat loss, thereby effectively improving the heat dissipation efficiency of the circuit board assembly 30.
In some embodiments, referring to fig. 5 to 6, the circuit board assembly 30 further includes a first driving pump 371 for driving the cooling medium Q to flow in the first radiating pipe 361. The first drive pump 371 may be an electromagnetic pump, a mechanical pump, a piezo-ceramic pump, or the like. The first driving pump 371 may be fixedly connected to the first circuit board 31 or the second circuit board 32. In this way, the flow rate of the cooling medium Q can be increased to increase the heat exchange efficiency between the cooling medium Q and the first circuit board 31, and the heat exchange efficiency between the cooling medium Q and the second circuit board 32.
It will be appreciated that in other embodiments, the circuit board assembly 30 may not include the first drive pump 371.
Specifically, referring to fig. 7, fig. 7 is a schematic diagram illustrating the assembly of the first driving pump 371 and the first heat dissipation tube 361 in the circuit board assembly 30 shown in fig. 5. The first drive pump 371 includes a first pump port 3711 and a second pump port 3712. One of the first pump port 3711 and the second pump port 3712 is a first pump inlet, and the other is a first pump outlet. In this embodiment, the first pump port 3711 is exemplified as the first pump inlet.
The first flow passage L1 has a first communication hole L1a and a second communication hole L1b. The first communication hole L1a and the second communication hole L1b may be located at both ends of the extension path of the first flow path L1, respectively. The first communication hole L1a communicates with the first pump port 3711, and the second communication hole L1b communicates with the second pump port 3712. Illustratively, the cooling medium Q may enter the first pump port 3711 of the first driving pump 371 from the first communication hole L1a of the first flow passage L1, then flow from the second pump port 3712 of the first driving pump 371 to the second communication hole L1b, and then flow from the second communication hole L1b to the first communication hole L1a, thus circulating.
In this way, the cooling medium Q can circulate between the first communication hole L1a and the second communication hole L1b by being driven by the first drive pump 371. Thereby, the flow rate of the cooling medium Q can be increased, the heat exchange efficiency between the cooling medium Q and the first circuit board 31 and the heat exchange efficiency between the cooling medium Q and the second circuit board 32 can be further increased, the heat radiation efficiency of the heat generating device 3021 can be further increased, and the temperature of the heat generating device 3021 can be reduced.
In some embodiments, the first communication hole L1a and the second communication hole L1b are located at the same end of the first radiating pipe 361. Specifically, referring to fig. 7 in combination with fig. 6, the first flow channel L1 may include a first sub-flow channel L11 and a second sub-flow channel L12 disposed side by side. The first sub-flow path L11 communicates with the second sub-flow path L12. The extension path of the first sub-flow path L11 and the extension path of the second sub-flow path L12 are the same as those of the first radiating pipe 361. The first communication hole L1a may be located at one end of the first sub-flow path L11, and the second communication hole L1b may be located at one end of the second sub-flow path L12, and the other end of the first sub-flow path L11 communicates with the other end of the second sub-flow path L12. Thus, the connection between the first driving pump 371 and the first radiating pipe 361 is facilitated, and the assembling difficulty of the circuit board assembly 30 can be reduced.
In some embodiments, the arrangement direction of the first and second sub-flow passages L11 and L12 may be perpendicular to the first direction. In this way, the widths of the opposite end surfaces of the first radiating pipe 361 in the Z-axis direction can be advantageously increased, the connection area between the first radiating pipe 361 and the first circuit board 31 and the connection area between the first radiating pipe 361 and the second circuit board 32 can be increased, thereby facilitating the improvement of the heat conduction efficiency between the first circuit board 31 and the cooling medium Q and the heat conduction efficiency between the second circuit board 32 and the cooling medium Q, and improving the connection reliability between the first circuit board 31 and the second circuit board 32.
It is understood that in other embodiments, the arrangement direction of the first sub-flow path L11 and the second sub-flow path L12 may be parallel to the first direction.
In some embodiments, the first driving pump 371 is welded to the first radiating pipe 361. On this basis, in order to fix the first driving pump 371 and the first radiating pipe 361, referring to fig. 7, a first fixing pad 381 is provided on the first driving pump 371, a second fixing pad 382 is provided on the first radiating pipe 361, and the first fixing pad 381 is welded to the second fixing pad 382. The first fixing pad 381 may be a metal plating layer provided on the first driving pump 371, or when the housing of the first driving pump 371 includes a metal structure, the metal structure may constitute the first fixing pad 381. Also, the second fixing pad 382 may be a metal plating layer disposed on the first radiating pipe 361, or when the first radiating pipe 361 is a metal pipe, a pipe wall of the first radiating pipe 361 may constitute the first fixing pad 381. It is understood that other pads mentioned below are all understood identically, and will not be described in detail.
In some embodiments, the first anchor pad 381 surrounds the periphery of the first pump port 3711. The second fixing pad 382 surrounds the outer circumference of the first communication hole L1 a. The first fixing pad 381 and the second fixing pad 382 may each have a ring shape. By way of example, the first and second anchor pads 381, 382 may be circular, square, elliptical, irregularly shaped, etc.
Specifically, referring to fig. 7, the first fixing pad 381 and the second fixing pad 382 may be fixedly connected through the first pad structure H1. The first fixing pad 381, the second fixing pad 382 and the first pad structure H1 define a first communication channel K1 therebetween, and the first pump port 3711 and the first communication hole L1a communicate through the first communication channel K1. For example, during the soldering process, a first solder may be disposed on at least one of the first fixing pad 381 and the second fixing pad 382, and the first solder joint structure H1 may be formed after the first solder is melted by heating. Wherein the first solder includes, but is not limited to, solder paste, pre-solder, and the like. The first fixing pad 381 and the second fixing pad 382 may be welded by a reflow welding, a laser welding, a milling welding, a diffusion welding, or the like.
In this way, by welding the first fixing pad 381 and the second fixing pad 382, not only the first driving pump 371 and the first radiating pipe 361 can be fixed, but also the communication between the first pump port 3711 and the first communication hole L1a can be realized, and the structure is simple and the design is smart.
On this basis, in order to avoid blocking the first communication channel K1 after the first solder is melted, referring to fig. 7, a first solder mask layer 391 is disposed on a surface of the first fixing pad 381 facing the second fixing pad 382, and the first solder mask layer 391 is located on a circumferential inner side of the first solder joint structure H1. The circumferential inner side of the first welding spot structure H1 refers to a side of the first welding spot structure H1 near the first communication channel K1.
The second fixing pad 382 is provided with a second solder resist layer 392 on a surface facing the first fixing pad 381, the second solder resist layer 392 being located circumferentially inward of the first solder joint structure H1. Both the first solder mask 391 and the second solder mask 392 may be ink. Illustratively, both the first solder mask 391 and the second solder mask 392 may be annular in shape, which may enhance the barrier effect of the first solder mask 391 and the second solder mask 392.
It is understood that in other embodiments, the circuit board assembly 30 may include only one of the first solder mask 391 and the second solder mask 392.
In order to improve the sealing performance of the first communication channel K1, referring to fig. 7, a first sealing compound C1 may be filled between the first driving pump 371 and the first radiating pipe 361. Specifically, the first sealant C1 may surround the outer circumference of the first pad structure H1. In this case, at least one of the first fixing pad 381 and the second fixing pad 382 may also have a non-loop shape. In this way, the sealing performance of the first communication passage K1 can be improved, and leakage of the cooling medium Q can be avoided, so that corrosion of the electronic component 302 and other parts by the cooling medium Q can be avoided, and corrosion resistance of the circuit board assembly 30 and the electronic device 100 can be improved.
The communication between the second pump port 3712 and the second communication hole L1b may be the same as the communication between the first pump port 3711 and the first communication hole L1a, and will not be described in detail herein.
In some embodiments, referring to fig. 5 and 6, the first radiating pipe 361 includes a first pipe segment 3611. The first pipe segment 3611 is fixedly connected between the first circuit board 31 and the second circuit board 32, and at least a portion of the first pipe segment 3611 is located in the accommodation chamber 301 a. Specifically, the first pipe segment 3611 may be entirely disposed in the accommodation chamber 301a, or one portion of the first pipe segment 3611 may be disposed in the accommodation chamber 301a and the other portion of the first pipe segment 3611 may be disposed outside the accommodation chamber 301 a. Illustratively, the first tube segment 3611 and the first circuit board 31 and the first tube segment 3611 and the second circuit board 32 may be secured by welding, bonding, clamping, screwing, or the like.
Because the middle area of the frame plate 33 is hollowed out in a large area, when the electronic device 100 falls, the area corresponding to the accommodating cavity 301a of the first circuit board 31 and the area corresponding to the accommodating cavity 301a of the second circuit board 32 are easy to deform, so that the welding point between the first circuit board 31 and the frame plate 33 and the welding point between the second circuit board 32 and the frame plate 33 are easy to crack and fail, the reliability of the electrical connection and the mechanical connection between the first circuit board 31 and the second circuit board 32 is greatly reduced, and the structural stability of the circuit board assembly 30 is further reduced.
In the circuit board assembly 30 in this embodiment, the first pipe section 3611 is fixedly connected between the first circuit board 31 and the second circuit board 32, and at least a portion of the first pipe section 3611 is disposed in the accommodating cavity 301a, so that the area of the first circuit board 31 opposite to the accommodating cavity 301a and the area of the second circuit board 32 opposite to the accommodating cavity 301a can be supported by the first pipe section 3611, that is, the area of the first circuit board 31 and the area of the second circuit board 32 with larger deformation can be supported by the first pipe section 3611, the deformation degree of the first circuit board 31 and the second circuit board 32 in the dropping process of the electronic device 100 can be effectively reduced, and thus, cracking failure of the welding point between the first circuit board 31 and the frame board 33 and the welding point between the second circuit board 32 and the frame board 33 can be effectively avoided, the reliability of the electrical connection and the mechanical connection between the first circuit board 31 and the second circuit board 32 can be improved, the structural stability and the reliability of the circuit board assembly 30 can be improved, and the reliability of the electronic device 100 can be improved, and the electronic device 100 can be further improved.
In some embodiments, referring to fig. 6, the first tube segment 3611 is disposed spaced apart from the frame plate 33. In this way, on the one hand, the stress on the first pipe segment 3611 can be effectively prevented from being transferred to the frame plate 33, so that the stress (such as welding stress) between the frame plate 33 and the first circuit board 31 and the stress between the frame plate 33 and the second circuit board 32 can be effectively reduced, the structural stability of the circuit board assembly 30 can be further improved, on the other hand, the occupied area of the first pipe segment 3611 can be reduced, and the effective layout area of the circuit board assembly 30 can be ensured.
With continued reference to fig. 5 in combination with fig. 6, the first radiating pipe 361 further includes a second pipe segment 3612, and the second pipe segment 3612 is located circumferentially outward of the frame plate 33. In this way, the second pipe segment 3612 can block external stress, so that the welding point between the frame plate 33 and the first circuit board 31 and the welding point between the frame plate 33 and the second circuit board 32 are prevented from cracking and failing under the action of the external stress, and the reliability of the electrical connection and the mechanical connection between the first circuit board 31 and the second circuit board 32 can be improved.
Further, referring to fig. 6, the second tube segment 3612 is disposed spaced apart from the frame plate 33. In this way, the transmission of stresses on the second pipe segment 3612 to the frame plate 33 can be avoided, and the blocking effect of the second pipe segment 3612 can be further improved.
With continued reference to fig. 6, the second tube segment 3612 may be wrapped around the outer periphery of the portion of the frame plate 33. In this case, the second pipe segment 3612 may be non-annular. It will be appreciated that in other embodiments, the second tube segment 3612 may be disposed about a perimeter of the frame plate 33. In this case, the second pipe segment 3612 may be annular.
In some embodiments, second tube segment 3612 communicates with first tube segment 3611. Specifically, the first flow path L1 in the first pipe segment 3611 communicates with the first flow path L1 in the second pipe segment 3612. In this way, the cooling medium Q can flow between the first pipe segment 3611 and the second pipe segment 3612, which can prolong the flow path of the cooling medium Q, and is beneficial to further improving the heat exchange efficiency between the cooling medium Q and the first circuit board 31 and the heat exchange efficiency between the cooling medium Q and the second circuit board 32, so that the heat dissipation efficiency of the heat generating device 3021 can be further improved, and the temperature of the heat generating device 3021 can be reduced.
Specifically, referring to fig. 6, the frame plate 33 includes a first outer peripheral surface 33d and a first inner peripheral surface 33e that face each other. The first inner peripheral surface 33e may constitute an inner wall surface of the accommodation chamber 301 a. The frame plate 33 is provided with a relief notch 33c. The escape notch 33c penetrates the first inner peripheral surface 33e and the first outer peripheral surface 33d of the frame plate 33, and the first pipe segment 3611 penetrates the escape notch 33c. In this way, a portion of the first pipe segment 3611 can be disposed in the accommodating cavity 301a, and communication between the first pipe segment 3611 and the second pipe segment 3612 can be achieved, so that the heat dissipation efficiency of the heat generating device 3021 can be improved while ensuring reliable support of the first pipe segment 3611 to the first circuit board 31 and the second circuit board 32.
It is to be appreciated that in other embodiments, first tube segment 3611 and second tube segment 3612 can be independent of each other and not in communication. Or in other embodiments, the first radiating pipe 361 may not include one of the first pipe segment 3611 and the second pipe segment 3612.
In some embodiments, referring to fig. 5, the first radiating pipe 361 may be welded to the first driving pump 371 by means of the second pipe segment 3612. In this way, the first drive pump 371 may be located outside the receiving chamber 301a, facilitating assembly and maintenance of the first drive pump 371.
Referring to fig. 5-6, the second tube segment 3612 includes a first extension segment 3612a. The first extension 3612a is located between the first circuit board 31 and the second circuit board 32. In some embodiments, referring to fig. 8, fig. 8 is a cross-sectional view of the circuit board assembly 30 shown in fig. 6 taken along line A-A. The first extension 3612a includes a first portion 3612a1 and a second portion 3612a2, the first portion 3612a1 and the second portion 3612a2 are arranged in the circumferential direction of the frame plate 33, and the first flow passage L1 in the first portion 3612a1 communicates with the first flow passage L1 in the second portion 3612a 2.
Referring to fig. 8, opposite end surfaces of the first portion 3612a1 in the first direction (e.g., the Z-axis direction in fig. 8) may be fixedly connected to the first circuit board 31 and the second circuit board 32, respectively. In this way, the connection area between the first radiating pipe 361 and the first circuit board 31 and the connection area between the first radiating pipe 361 and the second circuit board 32 can be further increased, the heat conduction efficiency between the first circuit board 31 and the first radiating pipe 361 and the heat conduction efficiency between the second circuit board 32 and the first radiating pipe 361 can be further improved, and the connection reliability between the first circuit board 31 and the second circuit board 32 can be further improved.
The second portion 3612a2 has a dimension in the first direction that is less than the dimension of the first portion 3612a 1. The first drive pump 371 is stacked with the second portion 3612a2 in the first direction. In some embodiments, referring to fig. 8, first portion 3612a1 is fixedly coupled to first circuit board 31 and first drive pump 371 is fixedly coupled between first portion 3612a1 and second circuit board 32. The second portion 3612a2 defines a mounting space with the second circuit board 32, in which the first drive pump 371 is disposed. Thus, on the one hand, the second portion 3612a2 and the first driving pump 371 can jointly support the first circuit board 31 and the second circuit board 32, so that the structural stability of the circuit board assembly 30 can be improved; on the other hand, the structural compactness of the circuit board assembly 30 can be improved, so that the layout of the circuit board assembly 30 is more reasonable, the whole volume of the circuit board assembly 30 can be reduced, the assembly of the circuit board assembly 30 in the electronic equipment 100 with limited space can be realized conveniently, and the miniaturization design of the electronic equipment 100 can be realized conveniently; in still another aspect, during assembly, the first driving pump 371 and the first radiating pipe 361 may be assembled into a single body, and then the first driving pump 371 and the first radiating pipe 361 may be assembled to the first circuit board 31 or the second circuit board 32 integrally, so that the assembly process can be simplified, and the assembly efficiency can be improved.
In other embodiments, the second portion 3612a2 may be fixedly coupled to the second circuit board 32 and the first drive pump 371 may be fixedly coupled between the second portion 3612a2 and the first circuit board 31.
It is understood that in still other embodiments, the first driving pump 371 and the first radiating pipe 361 may be arranged in a second direction, wherein the second direction is perpendicular to the first direction. That is, the second direction is perpendicular to the Z-axis direction. In this case, the first extension 3612a may not include the second portion 3612a2 described above. Or in still other embodiments, the first driving pump 371 may also be disposed in a stacked relationship with the heat dissipation portion 3612b mentioned below in the first direction. In this case, the first extension 3612a may not include the second portion 3612a2 described above as well.
In some embodiments, referring to fig. 8, the first circuit board 31 is provided with a first grounding structure P1, and the second circuit board 32 is provided with a second grounding structure P2. The first grounding structure P1 and the second grounding structure P2 may be grounding pads.
The first extension segment 3612a is provided with a third grounding structure P3 and a fourth grounding structure P4. The third grounding structure P3 is electrically connected to the fourth grounding structure P4, the third grounding structure P3 is electrically connected to the first grounding structure P1, and the fourth grounding structure P4 is electrically connected to the second grounding structure P2. The third grounding structure P3 and the fourth grounding structure P4 may be grounding pads. Or when the first radiating pipe 361 is a metal pipe, the pipe wall of the first radiating pipe 361 may constitute the third and fourth ground structures P3 and P4.
For example, referring to fig. 6 and 8, the first grounding structures P1 and the third grounding structures P3 are plural, the first grounding structures P1 are arranged at intervals in the circumferential direction of the frame plate 33, and the third grounding structures P3 are arranged at intervals in the circumferential direction of the frame plate 33.
Specifically, in this embodiment, the first portion 3612a1 and the second portion 3612a2 are each provided with a third grounding structure P3, and the first portion 3612a1 and the second portion 3612a2 are each provided with a fourth grounding structure P4. Wherein, the third grounding structure P3 on the first portion 3612a1 may be soldered to the first grounding structure P1 to achieve electrical connection, and the fourth grounding structure P4 on the first portion 3612a1 may be soldered to the second grounding structure P2 to achieve electrical connection. The third grounding structure P3 on the second portion 3612a2 and the first grounding structure P1 may be electrically connected by soldering, and the fourth grounding structure P4 on the second portion 3612a2 and the second grounding structure P2 may be electrically connected by other electrical connection structures.
In this way, grounding points (for example, grounding points) can be formed between the first extension section 3612a and the first circuit board 31 and between the first extension section 3612a and the second circuit board 32 respectively, on one hand, functional welding points between the frame board 33 and the first circuit board 31 and functional welding points between the frame board 33 and the second circuit board 32 can be shielded by the grounding points, the functional welding points can be reinforced and protected, the risk of cracking and failure caused by external stress of the functional welding points can be further reduced, and the connection reliability between the first circuit board 31 and the second circuit board 32 is ensured; on the other hand, the frame plate 33 corresponding to the first extension 3612a is not required to be provided with a grounding pad, so that the widths of the two opposite end faces of the frame plate 33 in the Z-axis direction can be reduced, the area occupied by the frame plate 33 by the first circuit board 31 and the second circuit board 32 can be reduced, the effective layout area of the circuit board assembly 30 can be ensured, and the number of electronic components 302 on the circuit board assembly 30 can be increased.
It is understood that the frame sections where the first extending sections 3612a are not provided on the circumferential outer side of the frame plate 33 may be respectively formed with ground pads between the frame plate 33 and the first circuit board 31 and between the frame plate 33 and the second circuit board 32 to improve the shielding effect.
In order to facilitate outward dissipation of heat absorbed by the cooling medium Q, referring back to fig. 5-6, the second pipe segment 3612 includes a heat dissipation portion 3612b, where the heat dissipation portion 3612b is configured to be thermally connected to the housing 20 of the electronic device 100. In some embodiments, the orthographic projection of the heat sink portion 3612b on the first reference plane does not overlap with the orthographic projection of the first circuit board 31 on the first reference plane. Wherein the first reference plane is perpendicular to the first direction. In this way, the end surface of the heat dissipating portion 3612b in the Z-axis direction may be exposed to the first circuit board 31, so that the heat conducting connection between the heat dissipating portion 3612b and the housing 20 is facilitated, and the difficulty of the heat conducting connection between the first heat dissipating tube 361 and the housing 20 can be reduced.
In some embodiments, referring to fig. 5-6, the heat dissipation portion 3612b may be located at a circumferential outer side of the first circuit board 31. In this case, the heat dissipation part 3612b may be fixedly connected to the second circuit board 32. In other embodiments, the first circuit board 31 may be provided with a first avoidance hole, and the heat dissipation portion 3612b may be opposite to the first avoidance hole. In this way, the end surface of the heat dissipating portion 3612b in the Z-axis direction can be exposed to the first circuit board 31 as well.
It will be appreciated that in other embodiments, the front projection of the heat dissipating portion 3612b on the first reference plane may not overlap with the front projection of the second circuit board 32 on the first reference plane. For example, the heat dissipation portion 3612b may be located on the outer side of the second circuit board 32 in the circumferential direction, and the heat dissipation portion 3612b may be fixedly connected to the first circuit board 31. Alternatively, the second circuit board 32 may be provided with a second avoiding hole, and the heat dissipation portion 3612b may be opposed to the second avoiding hole. In this way, the end surface of the heat dissipating portion 3612b in the Z-axis direction may be exposed to the second circuit board 32, which also facilitates the heat conductive connection between the heat dissipating portion 3612b and the housing 20.
Specifically, in this embodiment, the heat radiating portion 3612b and the first extending section 3612a are arranged in the circumferential direction of the frame plate 33. A first flow passage L1 may be formed in the heat dissipation portion 3612b, and the first flow passage L1 in the heat dissipation portion 3612b communicates with the first flow passage L1 in the first extension portion 3612a. In this case, the heat radiating portion 3612b constitutes one of the second pipe sections 3612. It will be appreciated that in other embodiments, the heat-dissipating segment may also comprise the entire second tube segment 3612, i.e., the second tube segment 3612 may not include the first extension segment 3612a.
In other embodiments, the heat dissipating portion 3612b may also be located circumferentially outward of the first extending section 3612 a. In this case, the first flow path L1 may or may not be formed in the heat radiating portion 3612 b. As long as it is ensured that the orthographic projection of the heat dissipating portion 3612b on the first reference plane does not overlap with at least one of the orthographic projection of the first circuit board 31 on the first reference plane and the orthographic projection of the second circuit board 32 on the first reference plane.
Referring to fig. 9, fig. 9 is an assembly schematic diagram of the circuit board assembly 30 shown in fig. 5 and the housing 20 of the electronic device 100. The heat sink 3612b is thermally conductively connected to the middle plate 212 of the housing 20. Illustratively, a first interface thermally conductive material 91 is disposed between heat sink 3612b and midplane 212. The first interface thermally conductive material 91 includes, but is not limited to, a thermally conductive adhesive, a thermally conductive gasket, a thermally conductive film, and the like. In this way, the heat on the cooling medium Q can be transferred to the middle frame 21 through the first heat dissipation tube 361 and the first interface heat conduction material 91, and be dissipated outwards through the middle frame 21, so that the heat of the heat generating device 3021 can be dissipated outwards timely, which is beneficial to improving the heat dissipation efficiency of the heat generating device 3021.
It is understood that in other embodiments, the heat dissipating portion 3612b may be thermally conductively connected to at least one of the bezel 211 and the back cover 22.
In order to further improve the heat dissipation efficiency of the heat generating device 3021, please continue to refer to fig. 9, a second interface thermal conductive material 92 is disposed between the heat generating device 3021 and the first shielding case 34, and a third interface thermal conductive material 93 is disposed between the first shielding case 34 and the housing 20. The second interface thermal conductive material 92 and the third interface thermal conductive material 93 may each include, but are not limited to, thermal conductive glue, thermal conductive pads, thermal conductive films, and the like. For example, the second interface thermal conductive material 92 and the third interface thermal conductive material 93 may be thermal conductive glue.
In this way, the heat generated by the heat generating device 3021 can be transferred to the outside via the following heat dissipation path a and heat dissipation path b: heat dissipation path a: heat generated by the heat generating device 3021 → the first circuit board 31 → the first heat radiating pipe 361 → the cooling medium Q → the first interface heat conducting material 91 → the middle plate 212 → air; heat dissipation path b: heat generated by heat generating device 3021→second interface conductive material 92→first shield 34→third interface conductive material 93→midplane 212→air. Thereby, three-dimensional heat dissipation can be realized, which is advantageous in improving the heat dissipation efficiency of the heat generating device 3021 and improving the heat dissipation performance of the circuit board assembly 30 and the electronic apparatus 100.
In other embodiments, the first radiating pipe 361 may also be thermally conductively connected to the housing 20 through the first shield 34. Specifically, referring to fig. 10, fig. 10 is another assembly schematic diagram of the circuit board assembly 30 shown in fig. 5 and the housing 20 of the electronic device 100.
The first shield case 34 includes a shield cover 341, a shield side frame 342, and an extension 343, the shield side frame 342 is fixedly connected to the shield cover 341, and a shield space for accommodating the electronic component 302 is defined between the shield side frame 342 and the shield cover 341. For example, the shield side frame 342 may be disposed around the outer edge of the shield cover 341. The extension portion 343 is fixedly connected to the shield side frame 342, and at least a portion of the extension portion 343 is located at the circumferential outer side of the first circuit board 31. The heat dissipation portion 3612b is thermally conductively connected to the extension portion 343. In this way, the heat generated by the heat generating device 3021 can be transferred to the outside via the following heat dissipation path c and heat dissipation path b: heat dissipation path c: heat generated by the heat generating device 3021, the first circuit board 31, the first radiating pipe 361, the cooling medium Q, the first shielding case 34, the third interface heat conducting material 93, the middle plate 212 and air; heat dissipation path b: heat generated by heat generating device 3021→second interface conductive material 92→first shield 34→third interface conductive material 93→midplane 212→air. Thereby, the heat of the heat generating device 3021 is also facilitated to be emitted outward, which is advantageous in improving the heat radiation efficiency of the heat generating device 3021 and improving the heat radiation performance of the circuit board assembly 30 and the electronic apparatus 100.
It will be appreciated that in other embodiments, the first radiating pipe 361 may also be thermally conductively connected to the housing 20 through at least one of the second shield 35 and the circuit board holder 50. When the first radiating pipe 361 is thermally coupled to the case 20 through the second shield 35, the structure of the second shield 35 may be designed with reference to the structure of the first shield 34, which will not be described in detail herein.
In other embodiments, referring to fig. 11-12, fig. 11 and 12 are schematic structural diagrams of a circuit board assembly 30 according to other embodiments of the present application. The circuit board assembly 30 in fig. 11 and 12 is different from the circuit board assembly 30 shown in fig. 5 in that in the circuit board assembly 30 shown in fig. 11 and 12, the first communication hole L1a and the second communication hole L1b of the first flow path L1 are formed at both ends of the extension direction of the first radiating pipe 361, respectively. Specifically, the first radiating pipe 361 has a sub-flow passage therein. For example, the first radiating pipe 361 may be formed as a meander-extended metal pipe.
In still other embodiments, referring to fig. 13, fig. 13 is a schematic structural diagram of a circuit board assembly 30 according to still other embodiments of the present application. The circuit board assembly 30 in the present embodiment is different from the circuit board assembly 30 in the embodiment shown in fig. 3 in that the circuit board assembly 30 in the present embodiment includes a second flow path L2 for accommodating the cooling medium Q in addition to the first circuit board 31, the second circuit board 32, the frame plate 33, and the heat generating device 3021. It is understood that the second flow path L2 herein may be applied to the circuit board assembly 30 in any of the embodiments of the present application. For example, in the case where the circuit board assembly 30 includes the second flow path L2, the circuit board assembly 30 may include the first radiating pipe 361 or may not include the first radiating pipe 361.
Specifically, at least a portion of the second flow passage L2 is located in the frame plate 33. That is, it may be that the entire second flow passage L2 is located in the frame plate 33, or that one portion of the second flow passage L2 is located in the frame plate 33 and another portion of the second flow passage L2 is located outside the frame plate 33. The cooling medium Q is provided in the second flow path L2, and can flow in the second flow path L2. The cooling medium Q in the present embodiment may be designed with reference to the cooling medium Q in any of the above embodiments.
In this way, heat generated when the heat generating device 3021 is operated can be transferred to the cooling medium Q via at least one of the first circuit board 31 and the second circuit board 32, so that the heat generated by the heat generating device 3021 can be absorbed by the cooling medium Q. Because the cooling medium Q can flow in the second flow path L2, heat on the heat generating device 3021 can be timely taken away by the cooling medium Q, active heat dissipation is achieved, the temperature rise amplitude of the cooling medium Q can be effectively reduced, the heat exchange efficiency between the cooling medium Q and the first circuit board 31 and the heat exchange efficiency between the cooling medium Q and the second circuit board 32 are facilitated to be accelerated, the heat dissipation efficiency of the heat generating device 3021 can be improved, heat accumulation in or around the heat generating device 3021 is avoided, the reliability of the heat generating device 3021 is facilitated to be improved, and the power consumption of the heat generating device 3021 is reduced. Meanwhile, the temperature sensing degree of the electronic equipment 100 is reduced, the endurance time of the electronic equipment 100 can be prolonged, the reliability of the whole machine of the electronic equipment 100 can be improved, and the user experience is improved.
In addition, in the circuit board assembly 30 in the embodiment, at least a portion of the second flow channel L2 is disposed on the frame plate 33, so that the internal circuit structures of the first circuit board 31 and the second circuit board 32 do not need to be changed, and the internal space of the first circuit board 31 and the second circuit board 32 does not need to be occupied, which is beneficial to reducing the overall volume of the circuit board assembly 30, simplifying the processing technology of the circuit board assembly 30, and reducing the cost of the circuit board assembly 30.
Thus, the circuit board assembly 30 in this embodiment can reduce the overall volume of the circuit board assembly 30 while improving the heat dissipation efficiency of the heat generating device 3021, and has simple process, smart design and low processing cost.
In order to further improve the heat dissipation efficiency of the heat generating device 3021, please refer to fig. 13 in combination with fig. 14, fig. 14 is a top view of the circuit board assembly 30 shown in fig. 13 after hiding the first circuit board 31. Specifically, the plan view shown in fig. 14 is a schematic view of the second circuit board 32 as seen from the frame plate 33. The orthographic projection of the second flow path L2 on the first reference plane overlaps with the orthographic projection of the heat generating device 3021 on the first reference plane. The first reference plane is perpendicular to the first direction (i.e., the Z-axis direction in fig. 14). In this way, at least part of the second flow path L2 is ensured to be opposite to the heat generating device 3021, so that the heat transfer path between the heat generating device 3021 and the second flow path L2 can be shortened, which is beneficial to improving the heat conduction efficiency, and reducing the heat loss, thereby effectively improving the heat dissipation efficiency of the circuit board assembly 30.
In some embodiments, referring to fig. 13, the dimension of the second flow channel L2 in the first direction is a first dimension h1, and the first dimension h1 is greater than or equal to 0.3mm and less than or equal to 1mm. That is, the height of the second flow channel L2 is 0.3mm to 1mm. By way of example, the first dimension h1 may be 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, etc. In this way, the smoothness of the flow of the cooling medium Q in the second flow passage L2 can be ensured.
Referring to fig. 14, the second flow channel L2 has a second dimension w1 in the second direction, and the second dimension w1 is greater than or equal to 0.3mm and less than or equal to 2mm. The second direction is perpendicular to the first direction, and the second direction is perpendicular to the flow direction of the cooling medium Q. The second direction may be a width direction of the second flow path L2. For example, when the cooling medium Q flows in the Y-axis direction, the second direction may be parallel to the X-axis direction. Illustratively, the second dimension w1 may be 0.3mm、0.4mm、0.5mm、0.6mm、0.7mm、0.8mm、0.9mm、1mm、1.1mm、1.2mm、1.3mm、1.4mm、1.5mm、1.6mm、1.7mm、1.8mm、1.9mm、2mm or the like. In this way, the smoothness of the flow of the cooling medium Q in the second flow passage L2 can be ensured, and the volume of the second flow passage L2 can be advantageously increased, so that the heat exchange efficiency of the heat generating device 3021 and the cooling medium Q can be increased.
In some embodiments, referring to fig. 14, the second flow path L2 includes a plurality of third sub-flow paths L21 disposed at intervals in the second direction. The spacing between two adjacent third sub-flow passages L21 in the second direction is a first spacing d1, and the first spacing d1 is greater than or equal to 0.2mm. Illustratively, the third spacing d3 may be 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.8mm, 1mm, etc. In this way, the overall structural strength of the frame plate 33 can be ensured.
In some embodiments, referring to fig. 13-14, the circuit board assembly 30 further includes a second drive pump 372, the second drive pump 372 for driving the cooling medium Q to flow within the second flow path L2. The second drive pump 372 includes, but is not limited to, a micro pump such as an electromagnetic pump, a piezoelectric ceramic pump, a mechanical pump, and the like. In this way, the flow rate of the cooling medium Q can be increased to increase the heat exchange efficiency between the cooling medium Q and the first circuit board 31 and the heat exchange efficiency between the cooling medium Q and the second circuit board 32, so that the heat exchange efficiency between the cooling medium Q and the heat generating device 3021 can be increased, the heat dissipation efficiency of the heat generating device 3021 can be increased, and the temperature of the heat generating device 3021 can be reduced.
Specifically, referring to fig. 15, fig. 15 is a schematic diagram illustrating communication between the second driving pump 372 and the second flow path L2 in the circuit board assembly 30 shown in fig. 13. The second drive pump 372 includes a third pump port 3721 and a fourth pump port 3722. One of the third pump port 3721 and the fourth pump port 3722 is a second pump inlet, and the other is a second pump outlet. In this embodiment, the third pump port 3721 is taken as the second pump inlet, and the fourth pump port 3722 and the second pump outlet are taken as examples.
The circuit board assembly 30 further includes a third communication hole L2a and a fourth communication hole L2b, the third communication hole L2a and the fourth communication hole L2b each communicate with the second flow path L2, and the third communication hole L2a communicates with the third pump port 3721, and the fourth communication hole L2b communicates with the fourth pump port 3722. The third communication hole L2a may be oriented the same as the fourth communication hole L2 b. In this embodiment, the third communication hole L2a and the fourth communication hole L2b are each formed on the frame plate 33. Illustratively, the third and fourth communication holes L2a, L2b each extend through the first end face 33a of the frame plate 33. Of course, in other embodiments, the third communication hole L2a and the fourth communication hole L2b may each penetrate one of the first end face 33a, the first outer peripheral face 33d, and the first inner peripheral face 33e of the frame plate 33.
In some embodiments, referring to fig. 13, the second driving pump 372 is disposed on a side surface of the first circuit board 31 facing away from the second circuit board 32. Specifically, referring to fig. 15, the second driving pump 372 is provided with a first connection pad P5, the first circuit board 31 is provided with a second connection pad P6, and the first connection pad P5 and the second connection pad P6 are soldered by a second solder joint structure H2. The forming process of the second solder joint structure H2 and other solder joint structures mentioned below may be the same as the forming process of the first solder joint structure H1, and will not be described herein.
On the basis of this, in order to achieve communication between the third pump port 3721 and the third communication hole L2a, referring to fig. 15, the first circuit board 31 is provided with a first through hole 313. Specifically, the first circuit board 31 includes a first bearing surface 311 and a second bearing surface 312 opposite to each other, and the first bearing surface 311 faces away from the frame plate 33. The first through hole 313 penetrates the first bearing surface 311 and the second bearing surface 312.
Both ends of the first through hole 313 communicate with the third pump port 3721 and the third communication hole L2a, respectively. In some embodiments, referring to fig. 15, the first connection pad P5 surrounds the periphery of the third pump opening 3721, and the second connection pad P6 is disposed on the first bearing surface 311 and surrounds the periphery of the first through hole 313. The second connection pad P6 and the second pad structure H2 define a second communication channel K2 therebetween, and the third pump port 3721 communicates with the first through hole 313 through the second communication channel K2. The first and second connection pads P5 and P6 may each have a ring shape. By way of example, the first and second connection pads P5 and P6 may be circular, square, elliptical, irregularly shaped, etc.
In this way, by welding the first connection pad P5 and the second connection pad P6, not only the second driving pump 372 and the first circuit board 31 can be fixed, but also the third pump port 3721 and the first through hole 313 can be communicated, and the structure is simple and the design is ingenious.
On the basis of this, in order to avoid the second communication channel K2 being blocked by solder during the soldering process, referring to fig. 15, a third solder mask 393 is disposed on a surface of the first connection pad P5 facing the second connection pad P6, and the third solder mask 393 is located at a circumferential inner side of the second solder joint structure H2. That is, the third solder resist layer 393 is located at a side of the second pad structure H2 near the third communication channel K3. A fourth solder resist layer 394 is provided on the surface of the second connection pad P6 facing the first connection pad P5. The fourth solder mask 394 is located circumferentially inward of the second solder joint structure H2. The third solder mask 393 and the fourth solder mask 394 may be inks. Illustratively, both the third and fourth solder masks 393, 394 may be annular, which may improve the barrier effect of the third and fourth solder masks 393, 394.
In order to improve the sealing performance of the second communication channel K2, referring to fig. 15, a second sealant C2 is filled between the second driving pump 372 and the first circuit board 31. The second sealant C2 may surround the outer circumference of the second pad structure H2. In this case, at least one of the first and second connection pads P5 and P6 may also have a non-loop shape. In this way, leakage of the cooling medium Q can be avoided, corrosion of the components such as the electronic component 302 by the cooling medium Q can be avoided, and corrosion resistance of the circuit board assembly 30 and the electronic device 100 can be improved.
Further, in order to achieve communication between the first through hole 313 and the third communication hole L2a, please continue to refer to fig. 15, the circuit board assembly 30 further includes a third connection pad P7 and a fourth connection pad P8. The third connection pad P7 is disposed on the second bearing surface 312 and surrounds the outer periphery of the first through hole 313. The fourth connection pad P8 is provided to the frame plate 33 and surrounds the outer periphery of the third communication hole L2 a. The third connection pad P7 is connected with the fourth connection pad P8 through the third pad structure H3, and a third communication channel K3 is defined among the third connection pad P7, the fourth connection pad P8 and the third pad structure H3. The first through hole 313 communicates with the third communication hole L2a through the third communication passage K3. In this way, the third pump port 3721 and the third communication hole L2a can communicate through the second communication passage K2, the first through hole 313 and the third communication passage K3 in this order.
On this basis, in order to avoid the solder blocking the third communication passage K3, a fifth solder resist layer 395 is provided on the third connection pad P7, and a sixth solder resist layer 396 is provided on the fourth connection pad P8. The structures of the third connection pad P7 and the fourth connection pad P8 may be designed with reference to the second connection pad P6 and the first connection pad P5, respectively, and the structures of the fifth solder resist layer 395 and the sixth solder resist layer 396 may be designed with reference to the third solder resist layer 393 and the fourth solder resist layer 394, respectively, which will not be described in detail herein.
In addition, in order to simplify the structure of the circuit board assembly 30, the communication manner between the fourth pump port 3722 and the fourth communication hole L2b may be the same as the communication manner between the third pump port 3721 and the third communication hole, which will not be described herein.
In some embodiments, referring to fig. 15, a second protection layer 3131 is disposed on a wall surface of the first via 313. The second protective layer 3131 may be metal-plated. The second protective layer 3131 may cover the entire hole wall surface of the first through hole 313, or may cover a portion of the hole wall surface of the first through hole 313. Thus, the cooling medium Q is prevented from being immersed in the first circuit board 31, and the circuit inside the first circuit board 31 is prevented from being shorted, so that the reliability of the circuit board assembly 30 can be improved.
On this basis, in order to enhance the shielding effect of the second shielding layer 3131, both ends of the second shielding layer 3131 are connected to the second and third connection pads P6 and P7, respectively.
In some embodiments, referring to fig. 16, fig. 16 is a partial cross-sectional view of the frame plate 33 of the circuit board assembly 30 of fig. 13. The frame plate 33 includes a first plate body 331 and a second plate body 332, and the first plate body 331 and the second plate body 332 are stacked. For example, the first plate 331 and the second plate 332 may be stacked in the first direction.
The first plate 331 and the second plate 332 may each have a plate shape. Referring to fig. 16, the first plate 331 includes a first surface 3311, and the second plate 332 includes a second surface 3321, where the first surface 3311 and the second surface 3321 are opposite.
The first surface 3311 is provided with a first recess 3312 recessed in a direction away from the second plate 332 and the second surface 3321 is provided with a second recess 3322 recessed in a direction away from the first plate 331. The first recess 3312 is opposite and in communication with the second recess 3322 to define a first cavity 333 between the first plate 331 and the second plate 332. Specifically, a first cavity 333 is defined between the groove wall surface of the first groove 3312 and the groove wall surface of the second groove 3322. In this embodiment, the cooling medium Q is accommodated in the first cavity 333. That is, the first cavity 333 is formed as the second flow path L2. Thus, after the first plate 331 is fixedly connected with the second plate 332, the second flow channel L2 can be formed on the frame plate 33, which is simple in structure and convenient to process.
It will be appreciated that in other embodiments, only the first groove 3312 may be provided on the first plate 331, and the second groove 3322 may not be provided on the second plate 332, in which case the groove wall surface of the first groove 3312 and the second surface 3321 of the second plate 332 may be surrounded by the first cavity 333. In still other embodiments, the second grooves 3322 may be provided only on the second plate 332, and the first grooves 3312 may not be provided on the first plate 331. In this case, a first cavity 333 is defined between the wall surface of the second recess 3322 and the first surface 3311 of the first plate 331. In this way, a second flow path L2 can also be defined between the first plate 331 and the second plate 332.
In some embodiments, both the first plate 331 and the second plate 332 may be insulators. Illustratively, the material of the first plate 331 may include at least one of a resin and glass fiber. The flame retardant rating of the first plate 331 may be FR4. The material of the second plate 332 may be designed with reference to the material of the first plate 331. The material of the second plate 332 may be the same as that of the first plate 331, or may be different from that of the first plate 331.
On this basis, the first protection layer 335 may be disposed on the wall surface of the first groove 3312 and the wall surface of the second groove 3322. The first protective layer 335 may be a metal plating. In this way, the cooling medium Q can be prevented from corroding the first plate body 331 and the second plate body 332, so that a short circuit of the lines inside the frame plate 33 can be avoided, and the reliability of the circuit board assembly 30 can be improved.
It will be appreciated that in other embodiments, one of the first plate 331 and the second plate 332 may be provided as an insulating member, and the other of the first plate 331 and the second plate 332 may be provided as a metal member. In still other embodiments, both the first plate 331 and the second plate 332 may also be provided as metal pieces.
In order to fix the first plate 331 and the second plate 332, referring to fig. 16, a first pad 3313 is disposed on the first surface 3311, a second pad 3323 is disposed on the second surface 3321, and the first pad 3313 and the second pad 3323 are welded and fixed. On this basis, in order to improve the sealability of the first cavity 333, a third sealant C3 may be further filled between the first plate 331 and the second plate 332.
Referring to fig. 16, a frame plate 33 is provided with a metallized via 334, and the first circuit board 31 and the second circuit board 32 are electrically connected through the metallized via 334. The metallized via 334 is spaced from the second flow path L2 by a second spacing d2 in the second direction, and in some embodiments, the second spacing d2 is greater than or equal to 0.2mm in order to ensure structural strength of the frame plate 33. Specifically, in the second direction, the pitch between the metallized via 334 and each third sub-runner L21 is greater than or equal to 0.2mm. Illustratively, the second spacing d2 may be 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.8mm, 1mm, etc.
Referring to fig. 17, fig. 17 is a flow chart illustrating a processing method of the frame plate 33 shown in fig. 16. Specifically, the processing method of the frame plate 33 includes:
Step S100a: providing a first plate blank 331a and a second plate blank 332a;
in this embodiment, the first plate blank 331a and the second plate blank 332a are each an insulator.
Step S200a: a first groove 3312 is formed in the first plate body blank 331a, a second groove 3322 is formed in the second plate body blank 332a, and a third communication hole L2a and a fourth communication hole L2b are formed in the first plate body blank 331 a;
Specifically, the first groove 3312, the second groove 3322, the third communication hole L2a, the fourth communication hole L2b, and the like may be formed by mechanical drilling or laser drilling. In addition, in other embodiments, the third communication hole L2a and the fourth communication hole L2b may also be formed on the second plate body blank 332 a.
Step S300a: forming a first protective layer 335 on the wall surface of the first groove 3312, the wall surface of the second groove 3322, the inner wall surface of the third communication hole L2a, and the inner wall surface of the fourth communication hole L2b, and forming a first pad 3313 on the first plate blank 331a to obtain a first plate 331, and forming a second pad 3323 on the second plate blank 332a to obtain a second plate 332;
wherein, the first protective layer 335, the first pad 3313, and the second pad 3323 may be metal plating layers formed through an electroplating process. The material of the metal plating layer includes, but is not limited to, copper.
Step S400a: fixedly connecting the first bonding pad 3313 to the second bonding pad 3323, and filling a third sealant C3 between the first plate body 331 and the second plate body 332 to obtain a first frame plate blank 33f;
Specifically, the first plate 331 and the second plate 332 may be aligned, the first pad 3313 may be brought into contact with the second pad 3323, and then the first pad 3313 may be welded to the second pad 3323 by diffusion welding by heating and pressurizing the first plate 331 and the second plate 332. Next, a glue filling process is performed at the gap between the first plate 331 and the second plate 332, so as to increase the connection strength between the first plate 331 and the second plate 332.
Step S500a: the first frame plate blank 33f is subjected to processing such as punching and plating, and the structures such as the metallized via 334, the pad, and the solder resist layer are formed on the first frame plate blank 33f, resulting in the frame plate 33 having the second flow path L2.
In other embodiments, the first plate 331 and the second plate 332 may be metal members. In this case, the frame plate 33 further comprises an injection-molded layer. Referring to fig. 18, fig. 18 is a flowchart illustrating a processing method of a frame plate 33 according to another embodiment of the application. The processing method of the frame plate 33 in the present embodiment includes:
Step S100b: providing a first plate blank 331a and a second plate blank 332a; wherein, the first plate blank 331a and the second plate blank 332a are metal pieces. Illustratively, the material of the first and second plate blanks 331a, 332a may both be copper.
Step S200b: a first groove 3312 and a first through hole 3314 are formed in the first plate body blank 331a to obtain a first plate body 331, and a second groove 3322 and a second through hole 3324 are formed in the second plate body blank 332a to obtain a second plate body 332;
Step S300b: fixedly connecting the first plate body 331 to the second plate body 332, and forming a first cavity 333 by the first groove 3312 and the second groove 3322 opposite to each other, and forming a through hole 33g1 by the first through hole 3314 and the second through hole 3324 opposite to each other to obtain a second frame plate blank 33g;
specifically, the first plate 331 and the second plate 332 may be fixedly connected by welding, pressing, or the like.
Step S400b: injection molding the second frame plate blank 33g to form an injection molded layer 33i on the outer surface of the second frame plate blank 33g and in the through hole 33g1, to obtain a third frame plate blank 33h;
step S500b: the third frame plate blank 33h is subjected to processing such as punching and plating, and the structure such as the metallized via hole 334, the third communication hole L2a, the fourth communication hole L2b, the bonding pad, and the solder resist layer is formed in the third frame plate blank 33h, thereby obtaining the frame plate 33 having the second flow path L2.
In this embodiment, since the first plate body 331 and the second plate body 332 are both metal members, the heat conduction efficiency between the cooling medium Q and the frame plate 33 can be improved, so that heat dissipation can be enhanced, which is advantageous in improving the heat dissipation efficiency of the heat generating device 3021. In addition, the welding strength between the first plate 331 and the second plate 332 is also improved.
In still other embodiments, referring to fig. 19, fig. 19 is a schematic flow chart of a processing method of a frame plate 33 according to still other embodiments of the present application. The processing method of the frame plate 33 in the present embodiment is different from the processing method in the embodiment shown in fig. 18 in that, in the processing method in the present embodiment, after step S400b, further includes:
Step S600b: thinning the injection molding layer 33i so that the surface of the first plate body 331 facing away from the second plate body 332 and the surface of the second plate body 332 facing away from the first plate body 331 are exposed, thereby obtaining a fourth frame plate blank 33j;
Step S700b: the fourth frame plate blank 33j is subjected to processing such as punching and plating, and the structure such as the metallized via hole 334, the third communication hole L2a, the fourth communication hole L2b, the bonding pad, and the solder resist layer is formed in the fourth frame plate blank 33j, thereby obtaining the frame plate 33 having the second flow path L2.
Since the surface of the first plate body 331 facing away from the second plate body 332 and the surface of the second plate body 332 facing away from the first plate body 331 are exposed, the heat conduction efficiency between the cooling medium Q and the frame plate 33 can be further improved, and heat dissipation can be further enhanced.
With reference back to fig. 13 in combination with fig. 14, the circuit board assembly 30 includes a cooling structure 303. The cooling structure 303 is adapted to be in thermally conductive connection with the housing 20 of the electronic device 100. The number of cooling structure members 303 may be one or more.
Referring to fig. 13, the cooling structure 303 has a third flow path L3 therein, and the third flow path L3 communicates with the second flow path L2. Specifically, the third flow path L3 has a fifth communication hole L3a and a sixth communication hole L3b, and the fifth communication hole L3a and the sixth communication hole L3b communicate with the second flow path L2, respectively. In this way, when the cooling medium Q circulates between the third communication hole L2a and the fourth communication hole L2b of the second flow passage L2, it can flow through the third flow passage L3, so that heat absorbed by the cooling medium Q can be transferred to the housing 20 of the electronic apparatus 100 through the cooling structure 303 and dissipated outward through the housing 20, and the heat dissipation efficiency of the heat generating device 3021 can be further improved.
In some embodiments, referring to fig. 13, the cooling structure 303 is arranged in a first direction with the frame plate 33. The cooling structure 303 includes third and fourth end faces 3031, 3032 opposite in a first direction. With the fourth end facing toward the frame plate 33.
In order to facilitate a thermally conductive connection between the cooling structure 303 and the housing 20 of the electronic device 100, the cooling structure 303 may be arranged on a side of the frame plate 33 facing away from the second circuit board 32, and at least a portion of the third end face 3031 is exposed to the first circuit board 31. Specifically, the third surface 3031 may be entirely exposed to the first circuit board 31, or a portion of the third surface 3031 may be exposed to the first circuit board 31. For example, referring to fig. 13, the cooling structure 303 may be disposed on a side surface of the first circuit board 31 facing away from the second circuit board 32. In this way, the entire third face 3031 of the cooling structure 303 may be exposed to the first circuit board 31, such that a thermally conductive connection with the housing 20 may be achieved through the third face 3031.
It will be appreciated that in other embodiments, the cooling structure 303 may be disposed on a side of the frame plate 33 facing away from the first circuit board 31, and at least a portion of the third end surface 3031 may be exposed to the second circuit board 32. For example, the cooling structure 303 may be disposed on a side surface of the second circuit board 32 facing away from the first circuit board 31. In this way, the entire third face 3031 of the cooling structure 303 may be exposed to the second circuit board 32, such that a thermally conductive connection with the housing 20 may be achieved through the third face 3031.
Referring to fig. 20, fig. 20 is a schematic view of a cooling structure 303 in the circuit board assembly 30 shown in fig. 13. The cooling structure 303 includes a first split portion 303a and a second split portion 303b, the second split portion 303b being fixedly connected to the first split portion 303a. For example, the first split portion 303a and the second split portion 303b may be stacked in a first direction (e.g., a Z-axis direction in fig. 20).
The first split portion 303a is provided with a third groove 303a1, the third groove 303a1 penetrates through the surface of the first split portion 303a facing the second split portion 303b, and a third flow passage L3 is defined between the second split portion 303b and the groove wall surface of the third groove 303a 1. The second split portion 303b is provided with a fifth communication hole L3a and a sixth communication hole L3b. It is to be understood that in other embodiments, the fifth communication hole L3a and the sixth communication hole L3b may be provided in the first split portion 303a.
In some embodiments, the second split portion 303b and the first split portion 303a are each separate molded pieces. That is, the first split portion 303a and the second split portion 303b are formed by machining and then fixedly connected together. Illustratively, the first and second split portions 303a, 303b may be secured by welding, bonding, or the like. In this way, the third groove 303a1 may be machined on the first split portion 303a, and then the second split portion 303b and the first split portion 303a may be fixedly connected together to form the cooling structure 303 having the third flow path L3. Thus, the difficulty in machining the third flow path L3 can be reduced.
It will be appreciated that in other embodiments, a third groove 303a1 may be provided on the first split portion 303a while a fourth groove may be provided on the second split portion 303 b. In this way, the third flow passage L3 can be defined between the first split portion 303a and the second split portion 303b as well.
In some embodiments, the first and second split portions 303a and 303b may be metal pieces, inorganic material pieces such as glass, silicon (Si), or composite material pieces containing metal, inorganic materials. These materials have good thermal conductivity and low water vapor permeability, and can improve the heat conductivity of the cooling structure 303, thereby improving the heat dissipation efficiency of the heat generating device 3021.
Referring to fig. 21, fig. 21 is a top view of the cooling structure 303 shown in fig. 20. The top view in fig. 21 is a schematic view from the first split portion 303a to the second split portion 303 b. In this embodiment, the third flow path L3 may extend along a straight line. In other embodiments, referring to fig. 22, fig. 22 is a top view of a cooling structure 303 according to other embodiments of the present application. As shown by the cooling structure 303 in fig. 22 (a) and the cooling structure 303 in fig. 22 (b), the third flow path L3 may also meander.
On the basis of any of the above embodiments, in order to facilitate the assembly of the cooling structure 303, referring to fig. 20, a third bonding pad 303c is provided on the cooling structure 303, and the cooling structure 303 may be welded and fixed to the first circuit board 31, the second circuit board 32 or the frame board 33 through the third bonding pad 303 c.
Referring to fig. 23, fig. 23 is an assembly schematic diagram of the circuit board assembly 30 shown in fig. 13 and the housing 20 of the electronic device 100. The cooling structure 303 is in thermally conductive communication with the midplane 212. Illustratively, a fourth interface thermally conductive material 94 is disposed between the cooling structure 303 and the midplane 212. The fourth interface thermal conductive material 94 includes, but is not limited to, a thermal conductive gel, a thermal conductive pad, a thermal conductive film, and the like. In this way, the heat on the cooling medium Q can be transferred to the middle frame 21 through the cooling structural member 303 and the fourth interface heat conducting material 94, and be emitted outwards through the middle frame 21, so that the heat of the heat generating device 3021 can be timely emitted outwards, which is beneficial to improving the heat dissipation efficiency of the heat generating device 3021.
It is understood that in other embodiments, the cooling structure 303 may also be thermally conductively coupled to at least one of the bezel 211, the back cover 22, the first shield 34, and the second shield 35.
In other embodiments, referring to fig. 24, fig. 24 is a top view of a circuit board assembly 30 according to other embodiments of the present application. The circuit board assembly 30 in the present embodiment is different from the circuit board assembly 30 in the embodiment shown in fig. 14 in that the number of cooling structure members 303 in the embodiment shown in fig. 14 is one, and the number of cooling structure members 303 in the present embodiment is plural. Illustratively, a plurality of cooling structure members 303 may be spaced apart along the extended path of the second flow path L2. In this way, the heat conduction area between the cooling structure 303 and the housing 20 of the electronic apparatus 100 can be increased, so that the heat radiation efficiency of the heat generating device 3021 can be improved.
The specific placement position of the cooling structure 303 may be determined according to the actual structural layout of the circuit board assembly 30, which is not specifically limited herein.
In still other embodiments, referring to fig. 25, fig. 25 is a schematic diagram illustrating an assembly of a circuit board assembly 30 and a housing 20 of an electronic device 100 according to still other embodiments of the present application. The circuit board assembly 30 in the present embodiment is different from the circuit board assembly 30 shown in fig. 13 in that the circuit board assembly 30 in the present embodiment, the second driving pump 372 is provided on the frame plate 33.
Specifically, referring to fig. 26, fig. 26 is a schematic diagram illustrating communication between the second driving pump 372 and the second flow path L2 in the circuit board assembly 30 shown in fig. 25. In this embodiment, the first connection pad P5 on the second drive pump 372 and the fourth connection pad P8 on the frame plate 33 are welded and fixed by the fourth welding spot structure H4. In this case, a fourth communication passage K4 is defined between the first connection pad P5, the fourth connection pad P8, and the fourth pad structure H4, and the third pump port 3721 and the third communication hole L2a may communicate through the fourth communication passage K4. In this way, the communication structure between the third pump port 3721 and the third communication hole L2a can be simplified, and the structure is simple and the processing is convenient.
In some embodiments, referring to fig. 25 in combination with fig. 27, fig. 27 is a top view of the circuit board assembly 30 in the assembled schematic of fig. 25. The top view shown in fig. 27 is a schematic view from the first circuit board 31 to the second circuit board 32. The second drive pump 372 is located on the side of the frame plate 33 facing away from the second circuit board 32.
On the basis of this, in order to avoid interference between the second driving pump 372 and the first circuit board 31, referring to fig. 27, the frame board 33 includes a first frame section 336, the first frame section 336 includes a first fixing portion 3361 and a first protruding portion 3362, the first fixing portion 3361 is fixedly connected between the first circuit board 31 and the second circuit board 32, the first protruding portion 3362 is located on a circumferential outer side of the first fixing portion 3361, and an orthographic projection of the first protruding portion 3362 on the first reference plane does not overlap with an orthographic projection of the first circuit board 31 on the first reference plane, and the second driving pump 372 is disposed on the first protruding portion 3362. For example, the first protruding portion 3362 may be located at a circumferential outer side of the first circuit board 31.
It will be appreciated that in other embodiments, the second driving pump 372 may be disposed on a side surface of the first protrusion 3362 facing away from the first circuit board 31. In this case, the orthographic projection of the first protruding portion 3362 on the first reference plane does not overlap with the orthographic projection of the second circuit board 32 on the first reference plane. For example, the first protruding portion 3362 may be located at a circumferential outer side of the second circuit board 32. In this way, interference between the second driving pump 372 and the second circuit board 32 can be avoided.
Further, with continued reference to fig. 25 in conjunction with fig. 27, cooling structure 303 may also be provided to frame plate 33.
Specifically, the frame plate 33 further includes a second frame section 337, and the second frame section 337 includes a second fixing portion 3371 and a second projecting portion 3372. The second fixing portion 3371 is fixedly connected between the first circuit board 31 and the second circuit board 32, and the second protruding portion 3372 may be fixedly connected to the second fixing portion 3371 and located at a circumferential outer side of the second fixing portion 3371. The orthographic projection of the second protruding portion 3372 on the first reference plane does not overlap with the orthographic projection of the first circuit board 31 on the first reference plane. The cooling structure 303 may be disposed on a side surface of the second protrusion 3372 facing away from the second circuit board 32. For example, the second protruding portion 3372 may be located at the circumferential outer side of the first circuit board 31. In this way, the third face 3031 of the cooling structure 303 may be exposed to the first circuit board 31, facilitating a thermally conductive connection between the cooling structure 303 and the housing 20.
It is understood that in other embodiments, the orthographic projection of the second protrusion 3372 on the first reference plane may not overlap with the orthographic projection of the second circuit board 32 on the first reference plane. In this case, the cooling structure 303 may be provided at a side surface of the second protrusion 3372 facing away from the first circuit board 31. In this way, the third face 3031 of the cooling structure 303 can be exposed to the second circuit board 32, also facilitating a thermally conductive connection between the cooling structure 303 and the housing 20.
It should be noted that the second driving pump 372 in this embodiment may be applied to the circuit board assembly 30 in any of the embodiments of the present application. Likewise, the location of the cooling structure 303 in this embodiment may also be applied to the circuit board assembly 30 in any of the embodiments of the present application.
In still other embodiments, referring to fig. 28, fig. 28 is a schematic partial structure of a circuit board assembly 30 according to still other embodiments of the present application. The frame plate 33 in the present embodiment is different from the circuit board assembly 30 shown in fig. 13 in that in the embodiment shown in fig. 13, the first plate body 331 and the second plate body 332 of the frame plate 33 together define the second flow path L2, whereas in the present embodiment, the frame plate 33 and the first circuit board 31 together define the second flow path L2.
Specifically, referring to fig. 28, a first slot 3301 is formed on the frame plate 33, and the first slot 3301 penetrates a surface (i.e., the first end face 33 a) of the frame plate 33 facing the first circuit board 31. A second cavity 3302 is defined between the surface of the first circuit board 31 facing the frame board 33 and the groove wall surface of the first groove body 3301. The second cavity 3302 may constitute a second flow path L2. That is, the cooling medium Q may be directly filled in the second cavity 3302. In this case, in order to improve the sealability of the second flow path L2, a fifth connection pad P9 may be disposed on the end surface of the frame plate 33 facing the first circuit board 31, a sixth connection pad P10 may be disposed on the surface of the first circuit board 31 facing the frame plate 33, and the fifth connection pad P9 may be disposed around the notch of the first groove body 3301. The sixth connection pad P10 is hermetically connected to the fifth connection pad P9. Specifically, the fifth connection pad P9 and the sixth connection pad P10 may be hermetically connected by the fifth pad structure H5.
On this basis, in order to avoid the solder from blocking the second flow path L2, a seventh solder resist layer 397 is provided on the fifth connection pad P9, and an eighth solder resist layer 398 is provided on the sixth connection pad P10. The seventh solder mask 397 and the eighth solder mask 398 are each located circumferentially inward of the fifth solder joint structure H5.
In this way, a semi-closed flow passage can be formed on the frame plate 33, and after the frame plate 33 is welded and fixed to the first circuit board 31, a fully-closed flow passage is defined between the frame plate 33 and the first circuit board 31, and the structure is simple and the processing is convenient.
In some embodiments, referring to fig. 28, the third communication hole L2a and the fourth communication hole L2b may be through holes formed on the first circuit board 31. In this way, communication between the third communication hole L2a and the third pump port 3721 is facilitated.
Of course, in other embodiments, the third communication hole L2a and the fourth communication hole L2b may also be formed penetrating the frame plate 33. In this case, the third communication hole L2a and the fourth communication hole L2b each penetrate the end face of the frame plate 33 facing away from the first circuit board 31.
In still other embodiments, referring to fig. 29, fig. 29 is a schematic structural view of a frame plate 33 according to still other embodiments of the present application. The frame plate 33 in the present embodiment includes a frame plate body 338 and a second radiating pipe 339. The frame plate body 338 is provided with a second groove body 3381, and the second groove body 3381 penetrates through the outer surface of the frame plate body 338. Specifically, the second slot body 3381 has an open mouth located on the outer surface of the frame plate body 338, a slot bottom wall opposite to the open mouth, and a slot side wall connected between the open mouth and the slot bottom wall. For example, the second slot 3381 may extend through an end surface of the frame plate body 338 that faces the first circuit board 31 (i.e., the first end surface 33 a), or the second slot 3381 may extend through an end surface of the frame plate body 338 that faces the second circuit board 32 (i.e., the second end surface 33 b).
The second radiating pipe 339 is disposed in the second groove 3381, and a second flow passage L2 is formed in the second radiating pipe 339. In this way, the second flow passage L2 can also be formed in the frame plate 33.
In some embodiments, referring to fig. 29, a plastic layer 3382 is disposed in the second groove 3381, and the plastic layer 3382 is wrapped around at least part of the outer surface of the second radiating tube 339. In this way, the second radiating pipe 339 can be fixed in the second groove 3381 by the plastic layer 3382, and the second radiating pipe 339 can be prevented from moving.
With continued reference to fig. 29, the plastic layer 3382 includes a first plastic portion 3382a and a second plastic portion 3382b, the first plastic portion 3382a covers a surface of the second radiating tube 339 facing away from the bottom wall of the slot, and the second plastic portion 3382b is filled between the side wall of the slot and the second radiating tube 339. In this embodiment, in order to achieve communication between the third communication hole L2a and the second flow path L2, the third communication hole L2a penetrates the wall of the first molding part 3382a and the second radiating pipe 339. Similarly, in order to achieve communication between the fourth communication hole L2b and the second flow path L2, the fourth communication hole L2b penetrates the first molding portion 3382a and the second radiating pipe 339 wall.
Because the plastic layer 3382 has strong water absorption, in some embodiments, referring to fig. 29, a third protection layer 3383 is disposed on the hole wall surface of the third communication hole L2 a. The third protective layer 3383 may be a metal plating layer. In this way, the third protective layer 3383 can separate the cooling medium Q from the first molding part 3382a, so that the cooling medium Q is prevented from being immersed into the first molding part 3382a, on one hand, separation of the bonding interface between the pipe wall of the second radiating pipe 339 and the first molding part 3382 under the erosion of the cooling medium Q can be prevented, and the connection reliability between the second radiating pipe 339 and the first molding part 3382 can be improved; on the other hand, the cooling medium Q can be prevented from being absorbed by the plastic sealing layer 3382 to cause loss of the cooling medium Q, so that the service life of the circuit board assembly 30 can be prolonged while the heat dissipation effect of the circuit board assembly 30 is ensured.
In some embodiments, referring to fig. 29, the third protection layer 3383 is connected to the fourth connection pad P8. For example, the third protective layer 3383 and the fourth connection pad P8 may be formed in the same process. In this way, on the one hand, the processing process of the frame plate 33 can be simplified, and on the other hand, the coverage area of the third protective layer 3383 can be increased, and the protective effect can be further improved.
On the basis of the above embodiment, in order to further reduce the processing difficulty of the frame plate 33, the surface of the first plastic layer 3382 facing away from the bottom wall of the groove is planar. Thus, the first plastic sealing layer 3382 is convenient to be electroplated to form the fourth connecting pad P8, so that the processing difficulty of the fourth connecting pad P8 can be reduced, and the processing difficulty of the frame plate 33 can be further reduced.
Referring to fig. 30, fig. 30 is a flow chart illustrating a processing method of the frame plate 33 shown in fig. 29. The processing method of the frame plate 33 includes:
Step S100c: providing a frame plate body blank 338a;
frame plate body blank 338a is plate-shaped.
Step S200c: forming a second channel 3381 in frame plate body blank 338 a;
step S300c: the second radiating pipe 339 is assembled to the second tank 3381;
Step S400c: forming a plastic layer 3382 in the second groove body 3381, wherein the plastic layer 3382 comprises a first plastic part 3382a, and the first plastic part 3382a covers the surface of the groove bottom wall of the second radiating tube 339, which is far away from the second groove body 3381, so as to obtain a fifth frame plate blank 33k;
Step S500c: a third communication hole L2a and a fourth communication hole L2b are opened in the fifth frame plate blank 33 k; a third protective layer 3383 is formed on the hole wall surface of the third communication hole L2a and the hole wall surface of the fourth communication hole L2b, and a fourth connection pad P8 is formed on the surface of the first molding part 3382a facing away from the bottom wall of the groove.
Further, the method of processing the frame plate 33 further includes the step of forming metallized vias 334, solder masks, etc. on the fifth frame plate blank 33k, which will not be described in detail herein.
It is understood that the second radiating pipe 339 in this embodiment may be applied to the circuit board assembly 30 in any of the embodiments of the present application. Specifically, in other embodiments, the second radiating pipe 339 may be disposed in the first cavity 333 or the second cavity 3302 described above.
With reference to fig. 31, fig. 31 is a schematic diagram illustrating a circuit board assembly 30 according to still another embodiment of the present application. The circuit board assembly 30 in this embodiment is different from any of the above embodiments in that, in the circuit board assembly 30 in this embodiment, the first circuit board 31 is provided with a fourth flow channel L4, the second circuit board 32 is provided with a fifth flow channel L5, the fourth flow channel L4 is communicated with the second flow channel L2, and the fifth flow channel L5 is communicated with the second flow channel L2. In this way, the cooling medium Q can flow between the second flow passage L2, the fourth flow passage L4, and the fifth flow passage L5, and the heat radiation efficiency of the heat generating device 3021 can be further improved.
It will be appreciated that in other embodiments, the fourth flow path L4 may be provided only on the first circuit board 31 without providing the fifth flow path L5 on the second circuit board 32, or the fifth flow path L5 may be provided only on the second circuit board 32 without providing the fourth flow path L4 on the first circuit board 31. In addition, in the case where the circuit board assembly 30 includes the first flow path L1, the fourth flow path L4 and/or the fifth flow path L5 may also communicate with the first flow path L1.
In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims (25)
1. A circuit board assembly, comprising:
A first circuit board;
A second circuit board laminated and spaced apart from the first circuit board in a first direction, at least one of the first circuit board and the second circuit board being provided with a heat generating device;
The frame plate is fixedly connected between the first circuit board and the second circuit board, and a containing cavity is defined among the first circuit board, the second circuit board and the frame plate;
The first cooling tube is provided with a first flow passage, a cooling medium is arranged in the first flow passage, and at least one part of the first cooling tube is fixedly connected between the first circuit board and the second circuit board.
2. The circuit board assembly of claim 1, wherein an orthographic projection of the first radiating tube on a first reference plane overlaps an orthographic projection of the heat generating device on the first reference plane; wherein the first reference plane is perpendicular to the first direction.
3. The circuit board assembly of claim 1, comprising: the first driving pump comprises a first pump port and a second pump port, wherein one of the first pump port and the second pump port is a first pump inlet, and the other is a first pump outlet;
The first flow passage includes a first communication hole that communicates with the first pump port and a second communication hole that communicates with the second pump port.
4. A circuit board assembly according to claim 3, comprising:
the first fixing pad is arranged on the first driving pump and surrounds the periphery of the first pump port;
The second fixing pad is arranged on the first radiating pipe and surrounds the periphery of the first communication hole, the second fixing pad is fixedly connected to the first fixing pad through a first welding spot structure, and a first communication channel is defined between the first fixing pad, the second fixing pad and the first welding spot structure.
5. The circuit board assembly of claim 4, wherein a first solder mask layer is provided on a surface of the first bond pad facing the second bond pad, the first solder mask layer being located circumferentially inward of the first solder joint structure.
6. The circuit board assembly of claim 1, wherein the first radiating pipe comprises:
the first pipe section is fixedly connected between the first circuit board and the second circuit board, and at least one part of the first pipe section is positioned in the accommodating cavity; and/or
And the second pipe section is positioned on the circumferential outer side of the frame plate.
7. The circuit board assembly of claim 6, wherein the second tube segment comprises a first extension segment, the first extension segment being located between the first circuit board and the second circuit board;
The first circuit board is provided with a first grounding structure, the second circuit board is provided with a second grounding structure, the first extension section is provided with a third grounding structure and a fourth grounding structure, the third grounding structure is electrically connected with the first grounding structure, and the fourth grounding structure is electrically connected with the second grounding structure.
8. The circuit board assembly of claim 6 or 7, wherein the second tube segment comprises a heat sink portion that is orthographic projected on a first reference plane without overlapping the first circuit board; wherein the first reference plane is perpendicular to the first direction.
9. The circuit board assembly of claim 8, comprising:
The first shielding cover is arranged on one side surface of the first circuit board, which is away from the second circuit board, and a part of the first shielding cover is positioned on the circumferential outer side of the first circuit board, and the heat dissipation part is in heat conduction connection with the first shielding cover.
10. The circuit board assembly of claim 1, wherein the first radiating pipe is disposed spaced apart from the frame plate.
11. A circuit board assembly, comprising:
A first circuit board;
a second circuit board laminated and spaced apart from the first circuit board in a first direction;
The frame plate is fixedly connected between the first circuit board and the second circuit board, and a containing cavity is defined among the first circuit board, the second circuit board and the frame plate;
A second flow passage in which a cooling medium is provided, and at least a part of which is located in the frame plate;
At least one of the first circuit board and the second circuit board is provided with a heating device, and the orthographic projection of the heating device on a first reference plane is overlapped with the orthographic projection of the second flow channel on the first reference plane; wherein the first reference plane is perpendicular to the first direction.
12. The circuit board assembly of claim 11, further comprising:
The second driving pump comprises a third pump port and a fourth pump port, one of the third pump port and the fourth pump port is a second pump inlet, and the other is a second pump outlet;
the circuit board assembly comprises a third communication hole and a fourth communication hole, wherein the third communication hole and the fourth communication hole are communicated with the second flow channel, the third communication hole is communicated with the third pump port, and the fourth communication hole is communicated with the fourth pump port.
13. The circuit board assembly according to claim 12, wherein the frame plate includes a first end face that faces the first circuit board, the third communication hole and the fourth communication hole are each formed in the frame plate, and the third communication hole and the fourth communication hole are each penetrating the first end face;
the first circuit board comprises a first bearing surface and a second bearing surface which are opposite to each other, the first bearing surface faces away from the frame plate, the second driving pump is arranged on the first bearing surface, a first through hole is formed in the first circuit board, and two ends of the first through hole are respectively communicated with the third pump port and the third communication hole.
14. The circuit board assembly of claim 13, comprising:
the first connecting pad is arranged on the second driving pump and surrounds the periphery of the third pump port;
The second connection pad, the second connection pad set up in the first loading surface, and encircle the periphery of first through-hole, the second connection pad pass through second welded structure fixed connection in first connection pad, just first connection pad the second connection pad with prescribe a limit to the second communication channel between the second welded structure, the third pump mouth with first through-hole passes through the second communication channel intercommunication.
15. The circuit board assembly according to claim 13, wherein the second drive pump is provided to the frame plate, the third communication hole and the fourth communication hole are each formed in the frame plate, and the third communication hole and the fourth communication hole are each penetrating through a surface of the frame plate facing the second drive pump.
16. The circuit board assembly of claim 15, wherein the frame plate comprises:
The first fixing part is fixedly connected between the first circuit board and the second circuit board;
The second drive pump is arranged on one side of the first bulge, which is away from the second circuit board, and the orthographic projection of the first bulge on a first reference plane is not overlapped with the orthographic projection of the first circuit board on the first reference plane; wherein the first reference plane is perpendicular to the first direction.
17. The circuit board assembly according to any one of claims 11-16, wherein the frame plate comprises:
A first plate body; and
The second plate body, the second plate body with first plate body range upon range of setting, be equipped with first recess on the first plate body, in order to first plate body with inject first cavity between the second plate body, first cavity forms to the second runner, perhaps be equipped with the second cooling tube in the first cavity, have in the second cooling tube the second runner.
18. The circuit board assembly according to any one of claims 11-16, wherein the frame plate includes a first end face facing the first circuit board, a first slot is provided in the frame plate, the first slot penetrates the first end face, a second cavity is defined between the first circuit board and the first slot, the second cavity is formed as the second flow channel, or a second heat dissipation tube is provided in the second cavity, and the second heat dissipation tube has the second flow channel therein.
19. The circuit board assembly according to any one of claims 11-16, wherein the frame plate comprises:
The frame plate comprises a frame plate body, wherein a second groove body is arranged on the frame plate body and comprises an open mouth and a groove bottom wall, the open mouth is positioned on the outer surface of the frame plate body, and the groove bottom wall is opposite to the open mouth;
The second cooling pipe is internally provided with the second flow passage, and the second cooling pipe is arranged in the second groove body.
20. The circuit board assembly of claim 19, further comprising a plastic layer that fills the second slot and wraps at least a portion of an outer surface of the second heat dissipation channel.
21. The circuit board assembly of claim 20, wherein the plastic layer comprises a first plastic portion that covers a surface of the second radiating tube facing away from the bottom wall of the slot;
the frame plate is provided with a third communication hole, the third communication hole is communicated with the second flow passage, and the third communication hole penetrates through the first plastic package part and penetrates through the pipe wall of the second radiating pipe.
22. The circuit board assembly according to claim 21, further comprising a third shield layer provided on a wall surface of the third communication hole.
23. The circuit board assembly according to any one of claims 11-16, further comprising:
A cooling structure having a third flow passage therein, the third flow passage communicating with the second flow passage, the cooling structure including third and fourth end faces opposite in the first direction, the fourth end face facing the frame plate;
The cooling structural member is arranged on one side, away from the second circuit board, of the frame plate, and at least a part of the third end face is exposed out of the first circuit board.
24. The circuit board assembly of claim 23, wherein the cooling structure comprises:
A first split part; and
The second split part is fixedly connected to the first split part, and a third groove is formed in the first split part so as to define the third flow channel between the first split part and the second split part.
25. An electronic device, comprising:
A housing;
a circuit board assembly according to any one of claims 1 to 24, disposed within the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410247510.2A CN117835550B (en) | 2024-03-05 | Circuit board assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410247510.2A CN117835550B (en) | 2024-03-05 | Circuit board assembly and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117835550A CN117835550A (en) | 2024-04-05 |
| CN117835550B true CN117835550B (en) | 2024-06-28 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115103507A (en) * | 2022-06-20 | 2022-09-23 | 中航光电科技股份有限公司 | Embedded components and parts heat dissipation printing board device |
| CN116647978A (en) * | 2023-05-11 | 2023-08-25 | 苏州浪潮智能科技有限公司 | Circuit board assembly, processing method thereof, power chip assembly and electronic equipment |
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115103507A (en) * | 2022-06-20 | 2022-09-23 | 中航光电科技股份有限公司 | Embedded components and parts heat dissipation printing board device |
| CN116647978A (en) * | 2023-05-11 | 2023-08-25 | 苏州浪潮智能科技有限公司 | Circuit board assembly, processing method thereof, power chip assembly and electronic equipment |
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