CN218163460U - Shielding case, mainboard and electronic equipment - Google Patents

Abstract

The embodiment of the application belongs to the technical field of terminal equipment, and particularly relates to a shielding case, a mainboard and electronic equipment. The embodiment of the application aims at solving the problem that the assembly of the mainboard is complex. The shield cover, the mainboard and the electronic equipment provided by the embodiment have the advantages that the shield cover and the shield frame are of an integrated structure, the shield cover is provided with the glue applying port penetrating through the shield cover, and the glue applying port is used for filling heat conducting glue between the shield cover and the electronic device. Compare for split type structure with shielding lid and shielding frame, the mainboard that this embodiment provided need not to establish the shielding housing on the shielding frame again when the assembly, has simplified the complexity of mainboard assembly.

Description

Shielding case, mainboard and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of terminal equipment, in particular to a shielding case, a mainboard and electronic equipment.

Background

Electronic equipment (such as cell-phone, panel computer etc.) generally has the mainboard, and the mainboard includes circuit board, electron device and shield cover, and electron device sets up on the circuit board, and the shield cover includes shielding frame and shielding lid, and the shielding frame encloses the outside of establishing at electron device, and the shielding lid is established at the one end that the shielding frame deviates from the circuit board to realize the electromagnetic shield. The heat conducting glue is filled between the shielding cover and the electronic device, and heat can be transferred to the shielding cover from the electronic device through the heat conducting glue, so that the heat dissipation of the electronic device is realized. During assembly, the electronic device and the shielding frame are installed on the circuit board, then the heat conducting glue is coated on the electronic device, and then the shielding cover is arranged on the shielding frame to complete installation.

However, during assembly, the heat-conducting glue is coated on the electronic device, and then the shielding cover is installed, so that the assembly of the main board is complicated.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a shielding case, a mainboard and electronic equipment, and aims to solve the problem that the assembly of the mainboard is complex.

On one hand, the embodiment of the application provides a shielding case which is covered on the surface of a circuit board, and an electronic device is arranged on the surface of the circuit board; the shielding cover comprises a shielding frame and a shielding cover, the shielding frame is surrounded to form a shielding cavity, one end of the shielding frame is connected with the surface of the circuit board, the shielding frame is surrounded to be arranged on the outer side of the electronic device, and an opening is formed in one end, deviating from the circuit board, of the shielding frame. The shielding cover is arranged at one end of the shielding frame, which is far away from the circuit board, and the shielding cover blocks the opening. The shielding cover and the shielding frame are of an integral structure. The shielding cover is provided with Shi Jiaokou penetrating through the shielding cover, heat-conducting glue is filled between the shielding cover and the electronic equipment through the glue applying port, and the heat-conducting glue is attached to the electronic device and the shielding cover.

In some embodiments, which may include the above embodiments, the shielding cage further includes a shielding film affixed on a surface of the shielding cover facing away from the circuit board, the shielding film enclosing Shi Jiaokou. The shielding film can prevent external electromagnetic signals from entering the shielding case through the glue applying port, so that the work of the electronic equipment is prevented from being influenced, meanwhile, the electromagnetic signals in the shielding case can be prevented from being transmitted outwards through the glue applying port, further, the influence on other devices in the electronic equipment is avoided, and the electromagnetic shielding effect of the shielding case is improved.

In some embodiments, which may include the above embodiments, the thermally conductive paste is further filled in the paste applying opening, and the thermally conductive paste is attached to the shielding film. So set up, can also be with the heat transfer to the shielding film that electron device produced through the heat conduction glue, and then in the shielding film transmission reaches external environment to improve the radiating effect to electron device.

In some embodiments, which may include the above-mentioned embodiments, the thickness of the shielding film may be smaller than the thickness of the shielding cover, so that the thickness of the shielding cover to which the shielding film is attached in the direction perpendicular to the circuit board is smaller than the thicknesses of the shielding cover and the shielding frame of the split structure in the direction perpendicular to the circuit board, so as to reduce the thickness of the main plate, and facilitate miniaturization of the electronic device.

In some embodiments, which may include the above-described embodiments, the shielding film may include a metal shielding layer attached to an adhesive layer, which is adhered to the shielding cover, thereby fixing the metal shielding layer to the shielding cover.

In some embodiments, which may include the above-described embodiments, the shield case further includes a dividing portion provided in the glue applying opening, the dividing portion dividing the glue applying opening into the glue applying area in a projection of the shield cover onto the circuit board. So set up, when filling the heat conduction glue, can follow the regional extending direction of glueing and coat the heat conduction glue gradually, the coating of heat conduction glue is more even, and then has increased the area of contact between heat conduction glue and electron device and the shielding lid, has improved heat transfer rate.

In some embodiments, which may include the embodiments described above, the size application region is "S" shaped. Along this gluey regional coating heat-conducting glue of gluey, can further improve the homogeneity of heat-conducting glue coating, and then make the heat-conducting glue of coating be full of between electron device and the shielding lid, increased the area of contact between heat-conducting glue and electron device and the shielding lid, improved heat transfer rate.

In some embodiments, which may include the above embodiments, the glue applying opening includes a first sidewall and a second sidewall that are oppositely disposed, the partition includes a first partition, a second partition, and a third partition that are spaced apart and located between the first sidewall and the second sidewall, one ends of the first partition and the second partition are connected to the first sidewall, and the other ends of the first partition and the second partition have a gap with the second sidewall; the third separation sheet is positioned between the first separation sheet and the second separation sheet, one end of the third separation sheet is connected with the second side wall, and a gap is formed between the other end of the third separation sheet and the first side wall; glue applying regions are formed between the first separating sheet and the side wall of the glue applying opening, between the second separating sheet and the side wall of the glue applying opening, and between the third separating sheet and the first separating sheet and the second separating sheet.

So set up, first minute spacer, second spacer and third minute spacer separate into the glueing region of "S" shape with glueing mouth, simple structure and the preparation of being convenient for.

In some embodiments, which may include the above embodiments, the shield can further includes a first connection portion, a second connection portion, and a third connection portion. The other end of first minute spacer is connected through first connecting portion between the one end of third minute spacer, and the other end of third minute spacer passes through the second connecting portion with the one end of second spacer to be connected, and the other end of second spacer passes through the third connecting portion to be connected with the lateral wall between first lateral wall and the second lateral wall. With this arrangement, the first connecting portion can fix the other end of the first division piece to prevent the first division piece from bending; similarly, the second connecting portion may fix the other end of the third division sheet to prevent the third division sheet from being bent; the third fixing portion may fix the other end of the second separator to prevent the second separator from being bent.

In some embodiments, which may include the above-described embodiments, the size application region is in the shape of a "loop". So set up, the portion of separating is divided into the gluey region of roughly "returning" font with gluey mouth of executing to further improve the homogeneity of heat-conducting glue coating, and then make the heat-conducting glue of coating be full of between electron device and the shielding lid, increased the area of contact between heat-conducting glue and electron device and the shielding lid, improved heat transfer rate.

In some embodiments, which may include the above embodiments, the partition comprises: the glue applying opening is connected with a fixed side wall of the glue applying opening, the first separating sheet, the second separating sheet, the third separating sheet, the fourth separating sheet and the fifth separating sheet are connected in sequence, one end of the first separating sheet is in projection on the circuit board with the fixed side wall of the glue applying opening connected with the shielding cover, the projection of the first separating sheet is parallel to the extending direction of the projection of the third separating sheet, and the second separating sheet, the fourth separating sheet and the fifth separating sheet are located between the first separating sheet and the third separating sheet; the second separation sheet and the fourth separation sheet are oppositely arranged, the fourth separation sheet is close to the fixed side wall, a gap is formed between one end, away from the third separation sheet, of the fourth separation sheet and the first separation sheet, the fifth separation sheet extends towards the second separation sheet, and a gap is formed between the fifth separation sheet and the second separation sheet; glue applying regions are formed between the first separating sheet and the side wall of the glue applying opening, between the second separating sheet and the side wall of the glue applying opening, between the third separating sheet and the side wall of the glue applying opening, and between the fifth separating sheet and the first separating sheet, the second separating sheet and the third separating sheet.

So set up, first minute spacer, second spacer, third minute spacer, fourth minute spacer and fifth minute spacer are "back" font with gluey regional separation, simple structure and the preparation of being convenient for.

In some embodiments, which may include the above-described embodiments, the shield can further includes a first connection portion, a second connection portion, a third connection portion, a fourth connection portion, a fifth connection portion, and a sixth connection portion. The position that first separation piece is close to the second separation piece has and glue the mouth through first connecting portion connection between the lateral wall, the position that the second separation piece is close to the third separation piece is passed through the second connecting portion with Shi Jiaokou's lateral wall and is connected, the position that the third separation piece is close to the fourth separation piece is passed through the third connecting portion with Shi Jiaokou's lateral wall and is connected, the fifth separation piece passes through the fourth connecting portion and connects first separation piece, the fifth separation piece passes through the fifth connecting portion and connects the second separation piece, the fifth separation piece passes through the sixth connecting portion and connects the third separation piece. With this arrangement, the connecting portions can prevent the dividing plates from warping.

In some embodiments, which may include the above-described embodiments, the shield case further includes a cutting structure provided at a position where the partition portion is connected to the side wall of the glue inlet, the cutting structure being configured to separate the partition portion from the side wall of the glue inlet by an external force. So set up, when carrying out electronic equipment's maintenance, can follow and cut the structure and make separation portion and shielding lid separation, and then will separate the portion and take off by gluey mouth to take off electronic device on by the circuit board, and then made things convenient for electronic equipment's maintenance and maintenance.

In some embodiments, which may include the above embodiments, the cutting structure includes a cutting slot on the divider.

On the other hand, an embodiment of the present application further provides a motherboard, including:

a circuit board;

an electronic device disposed on a surface of the circuit board;

a shield case as described above;

the heat conduction glue is filled between the shielding cover and the electronic device through the glue applying opening, and the heat conduction glue is attached to the shielding cover and the electronic device.

On the other hand, an embodiment of the present application further provides an electronic device, including: the casing and mainboard as above, the mainboard sets up on the casing.

The shield cover, mainboard and electronic equipment that this application embodiment provided, shielding lid and shielding frame structure as an organic whole, the shielding is covered and is provided with the gluey mouth of applying glue that runs through it, and gluey mouth is used for filling heat-conducting glue between to shielding lid and electron device. Compare for split type structure with shielding lid and shielding frame, the mainboard that this embodiment provided need not to establish the shielding lid again on shielding frame when the assembly, has simplified the complexity of mainboard assembly.

Drawings

FIG. 1 is a schematic structural diagram of a motherboard in the related art;

fig. 2 is a first top view of a main board provided in the embodiment of the present application;

FIG. 3 isbase:Sub>A cross-sectional view taken along line A-A of FIG. 2;

fig. 4 is a second top view of the main board provided in the embodiment of the present application;

FIG. 5 is a cross-sectional view taken along line B-B of FIG. 4;

fig. 6 is a third top view of the main board provided in the embodiment of the present application;

FIG. 7 is a cross-sectional view taken along line C-C of FIG. 6;

fig. 8 is a fourth top view of the main board provided in the embodiment of the present application;

FIG. 9 is a cross-sectional view taken along line D-D of FIG. 8;

fig. 10 is a fifth top view of a main board provided in an embodiment of the present application;

FIG. 11 is a cross-sectional view taken along line E-E of FIG. 10;

fig. 12 is a sixth top view of a main board provided in an embodiment of the present application;

fig. 13 is a seventh top view of the main board provided in the embodiment of the present application;

FIG. 14 is a sectional view taken along line F-F of FIG. 13;

fig. 15 is an eighth top view of the main board provided in the embodiment of the present application;

fig. 16 is a top view nine of the main board provided in the embodiment of the present application.

Description of reference numerals:

100: a main board;

101: a circuit board;

102: an electronic device;

103: a shield frame;

104: a shield cover;

105: heat conducting glue;

106: a shielding cavity;

107: a shielding film;

108: a shield case;

110: a partition portion;

111: a first separation sheet;

112: a second separator;

113: a third subparagraph;

114: a first connection portion;

115: a second connecting portion;

116: a third connecting portion;

117: cutting the structure;

118: a fourth partition sheet;

119: a fifth partition;

121: a fourth connecting portion;

122: a fifth connecting part;

123: a sixth connecting portion;

1041: shi Jiaokou;

1042: a first side wall;

1043: a second side wall;

1044: the side wall is fixed.

Detailed Description

Referring to fig. 1, an electronic device such as a mobile phone and a tablet computer generally includes a main board 100, where the main board 100 includes a circuit board 101 and an electronic device 102 disposed on the circuit board 101, and a circuit on the circuit board 101 is connected to the electronic device 102 to implement a corresponding function. In order to avoid that an external electromagnetic signal affects the operation of the electronic device 102 and to avoid that an electromagnetic signal generated by the electronic device 102 affects the operation of other devices in the electronic apparatus, generally, the main board 100 is provided with the shielding cover 108, the shielding cover 108 includes a shielding frame 103 and a shielding cover 104, one end of the shielding frame 103 is connected to the main board 100, the shielding frame 103 is disposed around the electronic device 102, the shielding cover 104 is disposed on the shielding frame 103, so that the shielding frame 103 and the shielding cover 104 are disposed to form a closed space, and the shielding frame 103 and the shielding cover 104 are both made of metal, so that electromagnetic shielding can be achieved through the shielding frame 103 and the shielding cover 104, that is, electromagnetic waves outside the space are prevented from entering and electromagnetic waves inside the space are prevented from radiating outwards.

When the electronic device 102 has a large volume (for example, the electronic device 102 is a Central Processing Unit (CPU), etc.), in order to improve the connection strength between the electronic device 102 and the circuit board 101, a spot is generally dispensed at a solder joint between the electronic device 102 and the circuit board 101 to prevent the solder joint from cracking when the electronic device 102 falls or is subjected to an external force. Correspondingly, the shielding frame 103 and the shielding cover 104 are configured as a split structure, that is, during assembly, the electronic device 102 and the shielding frame 103 are mounted on the circuit board 101, an opening is formed at one end of the shielding frame 103, which is away from the circuit board 101, glue is dispensed to a solder joint between the electronic device 102 and the circuit board 101 through the opening, and then the shielding cover 104 is covered on the shielding frame 103.

The electronic device 102 has a large heat value during operation, and in order to realize heat dissipation of the electronic device 102, the heat conducting glue 105 is arranged between the shielding cover 104 and the electronic device 102, the heat conducting glue 105 is in contact with both the electronic device 102 and the shielding cover 104, and heat generated by the electronic device 102 can be transferred to the shielding cover 104 through the heat conducting glue 105 and transferred to the external environment through the shielding cover 104, so that heat dissipation of the electronic device 102 is realized. Accordingly, when mounting, the electronic device 102 and the shielding frame 103 need to be mounted on the circuit board 101, then the thermal conductive adhesive 105 is coated on the electronic device 102, and then the shielding cover 104 is covered on the shielding frame 103, which results in a complicated assembly of the motherboard 100.

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides an electronic device, which may include a mobile phone, a tablet computer, a smart watch, a VR, an AR, an earphone and other terminal devices, but the electronic device may also be other devices, and this embodiment does not limit this.

Referring to fig. 2, the electronic device includes a housing (not shown) and a main board 100, wherein the main board 100 is disposed in the housing. As shown in fig. 3 (fig. 3 isbase:Sub>A cross-sectional view taken alongbase:Sub>A-base:Sub>A in fig. 2), and the main board 100 includesbase:Sub>A circuit board 101 and electronic devices 102 disposed on the circuit board 101. It is understood that the circuit board 101 may include a core board and a circuit layer disposed on the core board, the circuit layer having a certain pattern. The electronic device 102 is disposed on a surface of the circuit board 101, and the electronic device 102 is connected to a wiring layer on the circuit board 101 so that the electronic device 102 can perform a corresponding function. Illustratively, the electronic device 102 may include: flash memory (abbreviated as flash memory), operating memory (operating memory), and Central Processing Unit (CPU).

In the above implementation, the circuit board 101 may be a Printed Circuit Board (PCB), and accordingly, the electronic device 102 may be mounted on the circuit board 101 by means of a patch, so that the main board 100 is a Printed Circuit Board Assembly (PCBA).

With continued reference to fig. 3, the main board 100 in this embodiment further includes a shielding case 108, the shielding case 108 includes a shielding frame 103 and a shielding cover 104, the shielding frame 103 is enclosed to form a shielding cavity 106, one end of the shielding frame 103 is connected to the surface of the circuit board 101, the shielding frame 103 is enclosed outside the electronic device 102, that is, the electronic device 102 is located in the shielding cavity 106, and one end of the shielding frame 103 facing away from the circuit board 101 has an opening. The shield cover 104 is located at an end of the shield frame 103 facing away from the circuit board 101, and the shield cover 104 closes the opening. The shielding cover 104 and the shielding frame 103 are an integral structure, and it is understood that the integral structure means that the shielding cover 104 and the shielding frame 103 are manufactured by the same integral molding process, and are not assembled together after being manufactured separately. For example, the plate member may be punched, and the integrated shield cover 104 and shield frame 103 are directly obtained after punching; of course, the integrated shielding cover 104 and shielding frame 103 may be directly formed by casting; this may simplify the manufacturing of the shield 108.

It should be noted that the shielding frame 103 and the shielding cover 104 may be made of metal such as copper white, stainless steel, etc., so that the shielding cover 108 may prevent external electromagnetic signals from entering the shielding cavity 106, and prevent the electromagnetic signals in the shielding cavity 106 from being transmitted to the outside, thereby achieving electromagnetic shielding. In this way, it is avoided that the external electromagnetic signal affects the operation of the electronic device 102, and meanwhile, it is also avoided that the electromagnetic signal generated by the electronic device 102 affects the operation of other devices in the electronic apparatus.

With continued reference to fig. 3, in the present embodiment, a gap is formed between the shielding lid 104 and the electronic device 102, and the main board 100 further includes a thermal conductive adhesive 105, where the thermal conductive adhesive 105 is filled between the shielding lid 104 and the electronic device 102, that is, the thermal conductive adhesive 105 is filled in the gap. The thermal conductive adhesive 105 is attached to the electronic device 102 and the shielding cover 104, and the thermal conductive adhesive 105 can transfer heat generated by the electronic device 102 to the shielding cover 104 so as to transfer the heat to the external environment through the shielding cover 104, thereby realizing heat dissipation of the electronic device 102 and avoiding the phenomenon that the electronic device 102 is too high in temperature and the work of the electronic device 102 is affected.

For example, the thermal conductive paste 105 may include silicone or the like, and when the thermal conductive paste 105 is coated on the electronic device 102, the paste is in a gel shape and has a certain fluidity, so that the thermal conductive paste 105 can fill the gap between the shielding cover 104 and the electronic device 102, so as to increase the contact area between the thermal conductive paste 105 and the electronic device 102 and the shielding cover 104, and further increase the heat transfer rate.

With continued reference to fig. 3, in the above implementation, the shielding cover 104 is provided with a glue applying port 1041 penetrating through the shielding cover 104, and the glue applying port 1041 is used for filling the heat conductive glue 105, that is, the heat conductive glue 105 is filled between the shielding cover 104 and the electronic device through Shi Jiaokou 1041. With such an arrangement, when the motherboard 100 is assembled, the electronic device 102 and the shielding case 108 can be mounted on the circuit board 101, and then the heat-conducting glue 105 is filled between the shielding cover 104 and the electronic device 102 through the glue applying port 1041, thereby reducing the assembling difficulty of the motherboard 100.

It is understood that the projection of the glue applying opening 1041 on the circuit board 101 may be in a regular shape such as a rectangle, a circle, etc., and of course, the projection of the glue applying opening 1041 on the circuit board 101 may also be in other irregular shapes, which is not limited in this embodiment.

The main board 100, the shielding cover 104 and the shielding frame 103 provided in this embodiment are an integrated structure, the shielding cover 104 is provided with a glue applying opening 1041 penetrating through the shielding cover 104, and the glue applying opening 1041 is used for filling the heat conducting glue 105 between the shielding cover 104 and the electronic device 102. Compared with the split structure of the shielding cover 104 and the shielding frame 103, the main board 100 provided by the embodiment does not need to cover the shielding cover 104 on the shielding frame 103 during assembly, thereby simplifying the assembly complexity of the main board 100.

With reference to fig. 1, in the shielding cover 104 and the shielding frame 103 of the split structure in the related art, a bent plate 1045 is disposed on an outer periphery of the shielding cover 104, the bent plate 1045 surrounds the shielding frame 103, and during assembly, an end of the shielding frame 103 away from the circuit board 101 needs to be inserted into a space surrounded by the bent plate 1045; the end of the shielding frame 103 away from the circuit board 101 is generally bent to form a pick-up sheet 1031, and when the shielding frame 103 is mounted, the pick-up sheet 1031 is sucked by a suction nozzle (SMT suction nozzle) of a chip mounter, so that the shielding frame 103 is mounted on the circuit board 101. Thus after the assembly of the shield cover 104 is completed, the shield cover 104 covers an end of the shield frame 103 facing away from the circuit board 101, and the thickness of the shield cover 108 in the direction perpendicular to the circuit board 101 is the sum of the dimension L1 of the shield frame 103 in the direction perpendicular to the circuit board 101, the thickness L2 of the grasping pieces 1031, and the thickness L3 of the shield cover 104. Compared with this, as shown in fig. 3, in the shielding cover 104 and the shielding frame 103 of the integral structure in the embodiment, the grabbing piece 1031 shown in fig. 1 is not required to be provided, that is, the thickness of the shielding cover 108 in the direction perpendicular to the circuit board 101 is the sum of the dimension L1 of the shielding frame 103 in the direction perpendicular to the circuit board 101 and the thickness L3 of the shielding cover 104, so that the thickness of the whole shielding cover 108 in the direction perpendicular to the circuit board 101 (about 0.2 mm) can be reduced, and further, the thicknesses of the motherboard 100 and the electronic device can be reduced, and meanwhile, the volumes of the motherboard 100 and the electronic device can be reduced, which is convenient for realizing the miniaturization of the circuit device. Moreover, the shielding frame 103 and the shielding cover 104 having an integral structure do not need to be provided with the bending plate 1045 and the catching piece 1031 shown in fig. 1, so that the weight of the shielding cover 108 can be reduced, and the main board 100 and the electronic device can be lightened.

On the other hand, as shown in fig. 1, when the shielding cover 104 and the shielding frame 103 of the split structure are installed, the shielding cover 104 needs to be fastened to the shielding frame 103, and the shielding cover 104 needs to be fastened, which may cause an excessive pressure and further damage the motherboard 100 and devices thereon. In the embodiment of the present application, as shown in fig. 3, in the assembling process of the shielding frame 103 and the shielding cover 104 which are integrally structured, the shielding cover 104 does not need to be buckled, and the main board 100 and devices thereon can be prevented from being damaged.

Referring to fig. 5, where fig. 5 is a cross-sectional view taken along the direction B-B in fig. 4, the shielding cover 108 provided by this embodiment further includes a shielding film 107, the shielding film 107 is attached to a surface of the shielding cover 104 facing away from the circuit board 101, and the shielding film 107 blocks the glue applying opening 1041. It can be understood that the shielding film 107 may include a copper foil, a silver foil, and other metal materials to prevent external electromagnetic signals from entering the shielding case 108 through the glue applying opening 1041, and further avoid affecting the operation of the electronic device, and simultaneously prevent the electromagnetic signals in the shielding case 108 from being transmitted through the glue applying opening 1041, and further avoid causing an impact on other devices in the electronic device, and improve the electromagnetic shielding effect of the shielding case 108.

In the above implementation manner, the thickness of the shielding film 107 may be smaller than that of the shielding cover 104, so that the thickness of the shielding case 108 to which the shielding film 107 is attached in the direction perpendicular to the circuit board 101 is smaller than those of the shielding cover 104 and the shielding frame 103 in the split structure in the direction perpendicular to the circuit board 101, so as to reduce the thickness of the motherboard 100, and facilitate the miniaturization of the electronic device.

With continued reference to fig. 5, in some embodiments, the thermally conductive glue 105 is also filled in the glue applying opening 1041, and the thermally conductive glue 105 is attached to the shielding film 107. With this arrangement, the heat generated by the electronic device 102 can be transferred to the shielding film 107 through the thermal conductive adhesive 105, and further transferred to the external environment through the shielding film 107, so as to improve the heat dissipation effect on the electronic device 102.

In other embodiments, the shielding film 107 may include a metallic shielding layer attached to an adhesive layer that is adhered to the shielding lid 104 to secure the metallic shielding layer to the shielding lid 104. The metal shielding layer may be made of copper foil, silver foil or other metal to realize electromagnetic shielding.

It is understood that, when the motherboard 100 is assembled, the electronic device 102 and the shielding frame 103 may be mounted on the circuit board 101, wherein the electronic device 102 and the shielding frame 103 may be connected to the circuit board 101 by soldering. Further, when the electronic device 102 has a large volume (for example, the electronic device 102 is a Central Processing Unit (CPU), etc.), before the shielding frame 103 is mounted, a connection glue (underfil) may be filled at a solder joint between the electronic device 102 and the circuit board 101 to improve the connection strength between the electronic device 102 and the circuit board 101, so as to avoid solder joint cracking caused by dropping of the electronic device or mechanical stress. And then the heat-conducting glue 105 is filled between the electronic device 102 and the shielding cover 104 through Shi Jiaokou 1041, for example, the heat-conducting glue 105 can be dispensed through a dispenser, and the diameter of a dispensing needle of the dispenser is generally 2mm, so that part of the heat-conducting glue 105 protrudes from the glue dispensing opening 1041 while the heat-conducting glue 105 is filled in the glue dispensing opening 1041. Then, the shielding film 107 is covered on the shielding cover 104, in the process, the shielding film 107 is attached to the heat-conducting glue 105 in the glue applying opening 1041 under the action of an external force, and the shielding film 107 presses the heat-conducting glue 105 in the glue applying opening 1041, so that the heat-conducting glue 105 between the shielding cover 104 and the electronic device 102 flows along the gap between the shielding cover 104 and the electronic device 102, the volume of the heat-conducting glue 105 between the electronic device 102 and the shielding cover 104 is increased, the contact area between the electronic device 102 and the shielding cover 104 and the heat-conducting glue 105 is increased, and further the heat transfer rate is increased. In the above process, the excess thermal paste 105 between the shielding film 107 and the shielding cover 104 may be pressed out of the shielding film 107 and removed.

In the related art, as shown in fig. 1, since one end of the shielding frame 103 away from the circuit board 101 is bent to form the grasping piece 1031, when the thermal conductive adhesive 105 is coated, the grasping piece 1031 blocks the thermal conductive adhesive 105, and thus the thermal conductive adhesive 105 coated between the electronic device 102 and the shielding cover 104 is less (the thermal conductive adhesive 105 is difficult to cover the whole surface of the electronic device 102), so that the heat transfer rate from the electronic device 102 to the shielding cover 104 is slow, and the heat dissipation effect of the electronic device 102 is poor. In this embodiment, referring to fig. 5, in the integrated shielding cover 108, when the shielding film 107 is covered on the shielding cover 104, the shielding film 107 is attached to the thermal conductive adhesive 105 in the adhesive applying opening 1041, and the shielding film 107 presses the thermal conductive adhesive 105 in the adhesive applying opening 1041, so that the thermal conductive adhesive 105 between the shielding cover 104 and the electronic device 102 flows along the gap between the shielding cover 104 and the electronic device 102, so as to increase the volume of the thermal conductive adhesive 105 between the electronic device 102 and the shielding cover 104, and further increase the heat transfer rate.

In some embodiments, the motherboard 100 further includes a heat dissipation structure (not shown), and accordingly, the shielding film 107 is attached to the heat dissipation structure to transfer heat to the heat dissipation structure, thereby achieving rapid heat dissipation of the electronic device 102. Illustratively, the heat dissipation structure may include a heat sink to which the corresponding shielding film 107 is attached.

Referring to fig. 6, in the present embodiment, the shielding cover 108 further includes a partition portion 110 disposed in the glue applying opening 1041, and in the projection of the shielding cover 104 on the circuit board 101, the partition portion 110 partitions the glue applying opening 1041 into a glue applying area (e.g., an area corresponding to a dotted line in fig. 6). So set up, when filling heat-conducting glue 105, can follow the regional extending direction of glueing and coat heat-conducting glue 105 gradually, heat-conducting glue 105's coating is more even, and then has increased the area of contact between heat-conducting glue 105 and electron device 102 and the shielding lid 104, has improved heat transfer rate.

Further, in the projection of the shielding cover 104 on the circuit board 101, the glue applying region may extend in a bending manner, so that the uniformity of the application of the thermal conductive glue 105 may be further improved, the contact area between the thermal conductive glue 105 and the electronic device 102 and the shielding cover 104 may be increased, and the heat transfer rate may be improved.

It is understood that the specific shape of the partition 110 and the glue applying area is not limited in this embodiment, as long as the thermal conductive glue 105 can be uniformly coated, and the structure of the partition 110 will be described in several scenes:

scene one

With continued reference to fig. 6, in the present scenario, in the projection of the shielding cover 104 on the circuit board 101, the glue applying area (the area corresponding to the dashed line in fig. 6) into which the glue applying port 1041 is divided by the dividing portion 110 is substantially "S" shaped. With this arrangement, the thermal conductive adhesive 105 is coated along the glue applying region, so that the uniformity of coating of the thermal conductive adhesive 105 can be further improved, the coated thermal conductive adhesive 105 is filled between the electronic device 102 and the shielding cover 104, the contact area between the thermal conductive adhesive 105 and the electronic device 102 and the shielding cover 104 is increased, and the heat transfer rate is improved.

Illustratively, the glue applying opening 1041 includes a first sidewall 1042 and a second sidewall 1043 oppositely disposed, that is, the first sidewall 1042 and the second sidewall 1043 are not adjacent; illustratively, when the projection of the glue hole 1041 on the circuit board 101 is rectangular, the first sidewall 1042 and the second sidewall 1043 are sidewalls corresponding to two parallel sides of the rectangle, and of course, when the glue hole 1041 has other shapes, the first sidewall 1042 and the second sidewall 1043 are two opposite sidewalls.

Accordingly, the partition 110 includes a first partition 111, a second partition 112, and a third partition 113 between the first and second sidewalls 1042 and 1043, one ends of the first and second partitions 111 and 112 are connected to the first sidewall 1042, the other ends of the first and second partitions 111 and 112 extend toward the second sidewall 1043, and a gap is formed between the other ends of the first and second partitions 111 and 112 and the second sidewall 1043. The third partition 113 is disposed between the first partition 111 and the second partition 112, one end of the third partition 113 is connected to the second side wall 1043, the other end of the third partition 113 extends toward the first side wall 1042, and a gap is provided between the other end of the third partition 113 and the first side wall 1042. Accordingly, a glue applying region is formed between the first separation sheet 111 and the sidewall of the glue applying opening 1041, between the second separation sheet 112 and the sidewall of the glue applying opening 1041, and between the third separation sheet 113 and the first separation sheet 111 and the second separation sheet 112. With this arrangement, the first separating sheet 111, the second separating sheet 112, and the third separating sheet 113 separate the glue applying opening 1041 into an "S" -shaped glue applying region (region corresponding to the dotted line in fig. 6), and the structure is simple and the manufacturing is convenient.

In this scenario, the first separating sheet 111, the second separating sheet 112, and the third separating sheet 113 may be integrated with the shielding cover 104, and for example, the shielding cover 104 and the first separating sheet 111, the second separating sheet 112, and the third separating sheet 113 on the shielding cover 104 may be formed by stamping or casting. Further, first separation piece 111, second separation piece 112 and third separation piece 113 can all be the rectangle piece, that is to say first separation piece 111, second separation piece 112 and the projection of third separation piece 113 on circuit board 101 can all be the rectangle, so set up, the preparation of shielding lid 104 has been made things convenient for to the separation piece of regular shape.

In this embodiment, the shielding cover 108 further includes a first connecting portion 114, a second connecting portion 115, and a third connecting portion 116. The other end of the first partition 111 is connected to one end of the third partition 113 by a first connection portion 114, the other end of the third partition 113 is connected to one end of the second partition 112 by a second connection portion 115, and the other end of the second partition 112 is connected to the side wall between the first side wall 1042 and the second side wall 1043 by a third connection portion 116. So configured, the first connection portion 114 may fix the other end of the first division sheet 111 to prevent the first division sheet 111 from being bent; similarly, the second connection portion 115 may fix the other end of the third division plate 113 to prevent the third division plate 113 from being bent; the third fixing portion may fix the other end of the second separator 112 to prevent the second separator 112 from being bent.

For example, the first connection portion 114, the second connection portion 115, and the third connection portion 116 may be in a sheet shape, and the first connection portion 114, the second connection portion 115, and the third connection portion 116 are also integrated with the shielding cover 104 to further simplify the manufacturing difficulty.

With continued reference to fig. 6, in the present scenario, the shielding case 108 further includes a cutting structure 117, and the cutting structure 117 is disposed at a position where the partition 110 is connected to the side wall of the glue applying opening 1041, and is used for separating the partition 110 from the side wall of the glue applying opening 1041 under the action of an external force. With such an arrangement, when the electronic device is maintained, the partition 110 can be separated from the shielding cover 104 along the cutting structure 117, and then the partition 110 can be taken down from the glue applying opening 1041, so that the electronic device 102 can be taken down from the circuit board 101, and the maintenance and repair of the electronic device are facilitated.

Specifically, the cutting structure 117 may be disposed between the first separator 111 and the first sidewall 1042, between the second separator 112 and the second sidewall 1043, and between the third separator 113 and the second sidewall 1043.

In some embodiments, a portion of the first connection portion 114 is connected to the second sidewall 1043, and a portion of the second connection portion 115 is connected to the first sidewall 1042; accordingly, a cutting structure 117 may be disposed between the first connection portion 114 and the second sidewall 1043, between the second connection portion 115 and the first sidewall 1042, and between the third connection portion 116 and the sidewalls between the first sidewall 1042 and the second sidewall 1043, so as to facilitate the detachment of the first partition 111, the second partition 112, and the third partition 113.

It is understood that after the electronic device 102 is removed from the circuit board 101, a repaired or new electronic device 102 can be remounted on the circuit board 101 through the glue applying opening 1041; then, the thermal conductive paste 105 is filled between the electronic device 102 and the shielding cover 104 through the paste applying port 1041, and the shielding film 107 is attached, thereby completing maintenance or repair of the electronic apparatus.

In the above implementation, the cutting structure 117 may include a cutting groove on the partition 110; of course, in other implementations, the cutting structure 117 may also include a crease in the divider 110.

The assembly process of the motherboard 100 in this scenario is: as shown in fig. 7, the shield 108 and the electronic device 102 are first mounted on the circuit board. As shown in fig. 8, the thermal conductive paste 105 is then applied along the paste application region partitioned by the partition 110, and a part of the thermal conductive paste 105 protrudes from the paste application port 1041 (as shown in fig. 9, in which fig. 9 is a cross-sectional view taken along the direction D-D in fig. 8). As shown in fig. 10, the shielding film 107 is then covered on the shielding cover 104, and the thermally conductive adhesive 105 can be pressed by the shielding film 107, so that the thermally conductive adhesive 105 flows between the shielding cover 104 and the electronic device 102, thereby increasing the volume of the thermally conductive adhesive 105 between the shielding cover 104 and the electronic device 102; in the above process, the shielding film 107 may also press the excess thermal conductive paste 105 between the shielding film 107 and the shielding cover 104 to the outside of the shielding film 107, so that the shielding film 107 is attached to the shielding cover 104 (as shown in fig. 11, where fig. 11 is a cross-sectional view taken along the direction E-E in fig. 10).

Scene two

Referring to fig. 12, the difference between this scenario and scenario one is that the shape and structure of the partition 110 are different, and in this scenario, in the projection of the shielding cover 104 on the circuit board 101, the glue applying area (e.g., the area corresponding to the dotted line in fig. 12) partitioned by the partition 110 from the glue applying port 1041 is substantially "back" shaped. With the arrangement, the coating uniformity of the thermal conductive adhesive 105 can be further improved, so that the coated thermal conductive adhesive 105 is filled between the electronic device 102 and the shielding cover 104, the contact area between the thermal conductive adhesive 105 and the electronic device 102 and the shielding cover 104 is increased, and the heat transfer rate is improved.

In this scenario, the divider 110 includes: a first division sheet 111, a second division sheet 112, a third division sheet 113, a fourth division sheet 118, and a fifth division sheet 119 connected in this order, one end of the first division sheet 111 being connected to a fixed side wall 1044 of the glue applying port 1041. That is, one end of the first division sheet 111 is connected to the fixed sidewall 1044, the other end of the first division sheet 111 is connected to one end of the second division sheet 112, the other end of the second division sheet 112 is connected to one end of the third division sheet 113, the other end of the third division sheet 113 is connected to one end of the fourth division sheet 118, and the other end of the fourth division sheet 118 is connected to the fifth division sheet 119.

In the projection of the shield cover 104 on the circuit board 101, the projection of the first division piece 111 and the projection of the third division piece 113 extend in parallel, and the second division piece 112, the fourth division piece, and the fifth division piece 119 are located between the first division piece 111 and the third division piece 113; the second separator sheet 112 and the fourth separator sheet 118 are disposed opposite to each other, the fourth separator sheet 118 is disposed near the fixed side wall 1044, a gap is provided between one end of the fourth separator sheet 118 facing away from the third separator sheet 113 and the first separator sheet 111, and the fifth separator sheet 119 extends toward the second separator sheet 112 and a gap is provided between the second separator sheet 112. Accordingly, glue applying regions (regions corresponding to dotted lines in fig. 12) are formed between the first separation sheet and 111 the side wall of the glue applying port 1041, between the second separation sheet 112 and the side wall of the glue applying port 1041, between the third separation sheet 113 and the side wall of the glue applying port 1041, and between the fifth separation sheet 119 and the first separation sheet 111, the second separation sheet 112, and the third separation sheet 113. With such an arrangement, the separating portion 110 separates the glue applying opening 1041 into a glue applying region in a substantially "return" shape, which is simple in structure and convenient to manufacture.

In this scenario, the shielding cover 108 further includes a first connection portion 114, a second connection portion 115, a third connection portion 116, a fourth connection portion 121, a fifth connection portion 122, and a sixth connection portion 123. The first separation sheet 111 is connected with the side wall of the glue applying opening 1041 through a first connecting portion 114 at a position close to the second separation sheet 112, the second separation sheet 112 is connected with the side wall of the glue applying opening 1041 through a second connecting portion 115 at a position close to the third separation sheet 113, the third separation sheet 113 is connected with the side wall of the glue applying opening 1041 through a third connecting portion 116 at a position close to the fourth separation sheet 118, the fifth separation sheet 119 is connected with the first separation sheet 111 through a fourth connecting portion 121, the fifth separation sheet 119 is connected with the second separation sheet 112 through a fifth connecting portion 122, and the fifth separation sheet 119 is connected with the third separation sheet 113 through a sixth connecting portion 123. With such an arrangement, the connecting portions can prevent the dividing plates from warping.

Illustratively, the spacers and the connecting portions may be integrally formed with the shield cover 104. The integrated structure formed by stamping or casting can reduce the processing difficulty of the shielding cover 104.

In this scenario, the shielding case 108 further includes a cutting structure 117, the cutting structure 117 is disposed at a position where the separating portion 110 is connected to the side wall of the glue applying opening 1041, and the cutting structure 117 is configured to separate the separating portion 110 from the side wall of the glue applying opening 1041 under the action of an external force. With such an arrangement, when the electronic device is maintained, the partition 110 can be separated from the shielding cover 104 along the cutting structure 117, and then the partition 110 can be taken down from the glue applying opening 1041, so that the electronic device 102 can be taken down from the circuit board 101, and the maintenance and repair of the electronic device are facilitated.

Specifically, the cutting structure 117 may be disposed at a position of the first separation sheet 111 near the fixed sidewall 1044. In some embodiments, a cut-out structure 117 is disposed on each of the first connecting portion 114, the second connecting portion 115 and the third connecting portion 116 to facilitate the detachment of each separator from the shield cover 104.

It is understood that after the electronic device 102 is removed from the circuit board 101, a repaired or new electronic device 102 may be reinstalled on the circuit board 101 through the glue inlet 1041; then, the thermal conductive paste 105 is filled between the electronic device 102 and the shielding cover 104 through the paste applying port 1041, and the shielding film 107 is attached, thereby completing maintenance or repair of the electronic apparatus.

In the above implementation, the cutting structure 117 may include a cutting groove on the partition 110; of course in other implementations, the cut out structure 117 may also include a fold on the partition 110.

Scene three

Referring to fig. 14, fig. 14 is a sectional view taken along direction F-F in fig. 13. The difference between this scenario and the scenario one and the scenario two is that two electronic devices 102 are provided in the shielding frame 103, each electronic device 102 is correspondingly provided with one glue applying opening 1041, and the shielding film 107 may cover the two glue applying openings 1041. Accordingly, the glue hole 1041 corresponding to one of the electronic devices 102 and the partition 110 in the glue hole 1041 may be the same as in scenario one, and the glue hole 1041 corresponding to the other electronic device 102 and the partition 110 in the glue hole 1041 may be the same as in scenario two.

Of course, in some implementations, as shown in fig. 15, the glue wells 1041 for the two electronic devices 102 and the dividers 110 within the glue wells 1041 may both be the same as in scenario one. Alternatively, as shown in fig. 16, the glue applying openings 1041 corresponding to the two electronic devices 102 and the partitions 110 in the glue applying openings 1041 may be the same as those in scenario two.

In other scenarios, there may be more than two electronic devices 102 located in the shielding case 108, and accordingly, one glue applying opening 1041 is correspondingly disposed on each electronic device 102, and any glue applying opening 1041 and the partition 110 in the glue applying opening may be the same as those in scenario one or two, which is not limited in this embodiment.

It should be noted that, in the description of the embodiments of the present application, unless otherwise explicitly specified or limited, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected or integrally connected; mechanical connection or electrical connection is also possible; the connection may be direct, indirect via an intermediate medium, or communication between two members. Specific meanings of the above terms in the embodiments of the present application can be understood by those skilled in the art according to specific situations.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the scope of the technical solutions of the embodiments of the present application.

Claims (16)

1. A shield case for covering a surface of a circuit board on which an electronic device is provided, comprising:

the shielding frame is arranged on the outer side of the electronic device in a surrounding mode, and the shielding cover is located at one end, away from the circuit board, of the shielding frame; the shielding cover is provided with a glue applying opening penetrating through the shielding cover; the shielding cover and the shielding frame are of an integral structure;

shi Jiaokou is used for filling a thermal conductive adhesive between the shielding cover and the electronic device, and the thermal conductive adhesive is attached to the shielding cover and the electronic device.

2. The shield of claim 1, further comprising:

the shielding film is attached to the surface, departing from the circuit board, of the shielding cover, and the shielding film seals the Shi Jiaokou.

3. The shield case according to claim 2, wherein the thermally conductive paste is further filled in the paste applying opening, and the thermally conductive paste is attached to the shield film.

4. The shielding cage of claim 3, wherein said shielding film has a thickness less than a thickness of said shielding cover.

5. The shielding cage of claim 2, wherein said shielding film comprises:

a metal shielding layer;

and the metal shielding layer is attached to the bonding layer, and the bonding layer is bonded with the shielding cover.

6. The shield according to any one of claims 1 to 5, further comprising:

the separating part is arranged in the glue applying opening, the shielding cover is arranged in the projection on the circuit board, and the separating part divides the glue applying opening into a glue applying area.

7. The shielding cage of claim 6, wherein said size application region is "S" shaped.

8. The shielding cage according to claim 7, wherein the glue applying opening comprises a first side wall and a second side wall which are oppositely arranged, the separating part comprises a first separating sheet, a second separating sheet and a third separating sheet which are positioned between the first side wall and the second side wall and are arranged at intervals, one end of the first separating sheet and one end of the second separating sheet are connected with the first side wall, and a gap is arranged between the other end of the first separating sheet and the other end of the second separating sheet and the second side wall;

the third separation sheet is positioned between the first separation sheet and the second separation sheet, one end of the third separation sheet is connected with the second side wall, and a gap is formed between the other end of the third separation sheet and the first side wall;

the glue applying regions are formed between the first separation sheet and the side wall of the glue applying opening, between the second separation sheet and the side wall of the glue applying opening, and between the third separation sheet and the first separation sheet and the second separation sheet.

9. The shield of claim 8, further comprising:

the other end of the first separation sheet is connected with one end of the third separation sheet through the first connecting part;

the other end of the third separating sheet is connected with one end of the second separating sheet through the second connecting part;

and the other end of the second separation sheet is connected with the side wall between the first side wall and the second side wall through the third connecting part.

10. The shielding cage of claim 6, wherein said glue area is in the shape of a "loop".

11. The shielding cage of claim 10, wherein said divider comprises: the glue applying opening comprises a first separating sheet, a second separating sheet, a third separating sheet, a fourth separating sheet and a fifth separating sheet which are connected in sequence, wherein one end of the first separating sheet is connected with a fixed side wall of the glue applying opening; in the projection of the shielding cover on the circuit board, the projection of the first separation sheet and the extension direction of the projection of the third separation sheet are parallel, and the second separation sheet, the fourth separation sheet and the fifth separation sheet are positioned between the first separation sheet and the third separation sheet;

the second separation sheet and the fourth separation sheet are oppositely arranged, the fourth separation sheet is arranged close to the fixed side wall, a gap is reserved between one end, away from the third separation sheet, of the fourth separation sheet and the first separation sheet, the fifth separation sheet extends towards the second separation sheet, and a gap is reserved between the fifth separation sheet and the second separation sheet;

the glue applying region is formed between the first separating sheet and the side wall of the glue applying opening, between the second separating sheet and the side wall of the glue applying opening, between the third separating sheet and the side wall of the glue applying opening, and between the fifth separating sheet and the first separating sheet, the second separating sheet and the third separating sheet.

12. The shield of claim 11, further comprising:

the first connecting part is connected between the position, close to the second separating sheet, of the first separating sheet and the side wall of the glue applying opening through the first connecting part;

the second connecting part is connected between the position, close to the third separation sheet, of the second separation sheet and the side wall of the glue applying opening through the second connecting part;

the third dividing partition is connected with the side wall of the glue applying opening through a third connecting part at a position close to the fourth dividing partition;

the fifth separation sheet is connected with the first separation sheet through the fourth connection part;

the fifth separating sheet is connected with the second separating sheet through the fifth connecting part;

and the fifth division spacer is connected with the third division spacer through the sixth connecting part.

13. The shield of claim 6, further comprising:

the cutting structure is arranged at the position where the separating part is connected with the side wall of the glue applying opening, and the cutting structure is used for separating the separating part from the side wall of the glue applying opening under the action of external force.

14. The shielding cage of claim 13, wherein said cutout structure comprises a cutout slot on said divider.

15. A motherboard, comprising:

a circuit board;

an electronic device disposed on a surface of the circuit board;

the shielding cage of any one of claims 1-14;

the heat conduction glue is filled between the shielding cover and the electronic device through the glue applying opening, and the heat conduction glue is attached to the shielding cover and the electronic device.

16. An electronic device, comprising: a housing and the main board of claim 15, the main board being disposed on the housing.

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