CN117156791A

CN117156791A - Electronic equipment

Info

Publication number: CN117156791A
Application number: CN202310204965.1A
Authority: CN
Inventors: 杨帆; 王晓岩; 蒋一彤; 郭学平
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2023-02-22
Filing date: 2023-02-22
Publication date: 2023-12-01
Anticipated expiration: 2043-02-22
Also published as: CN117156791B

Abstract

The embodiment of the application provides electronic equipment, which at least comprises a middle frame and a component assembly, wherein the component assembly comprises a component body and a shielding assembly covered outside the component body, the middle frame is positioned at one side of the shielding assembly, which is away from the component body, at least one heat conduction structural member is arranged on at least one of the shielding assembly and the middle frame, and the melting point of the heat conduction structural member is 40-60 ℃, so that the problem of poor heat dissipation performance of a chip in the electronic equipment in the prior art can be reduced or avoided, the heat dissipation requirement of the electronic equipment can be met, and the service performance of the electronic equipment can be improved.

Description

Electronic equipment

Technical Field

The embodiment of the application relates to the technical field of terminals, in particular to electronic equipment.

Background

At present, electronic equipment such as computers and mobile phones are indistinguishable from our lives, are visible everywhere in life, and greatly improve the living standard of people. With the gradual miniaturization development of electronic equipment, the integration degree and the assembly density of electronic components in the electronic equipment are required to be continuously improved, so that the electronic equipment is provided with a powerful use function, and meanwhile, the working power consumption and the heating value of the electronic equipment are also greatly increased, and the heat dissipation requirement of the electronic equipment on the electronic components is also increased.

Taking an electronic component as an example of a chip, in the existing electronic device, in order to avoid interference of other electronic components in the electronic device to the chip, a shielding component is generally covered outside the chip to isolate the chip from the outside, but the heat dissipation performance of the chip is affected to a certain extent. Therefore, in the related art, in order to solve the problem of poor heat dissipation of the chip, a heat conducting gel layer (for example, a heat conducting paste) is generally disposed between the shielding component and the middle frame of the mobile phone, and then the heat generated by the chip is conducted to the middle frame of the mobile phone through the heat conducting gel layer after passing through the shielding component.

However, in the above solution, the heat dissipation performance of the chip is still poor, and the heat dissipation requirement cannot be met, which easily affects the service performance of the electronic device.

Disclosure of Invention

The application provides electronic equipment, which can alleviate or avoid the problem of poor heat dissipation performance of chips in the electronic equipment in the prior art, and can meet the heat dissipation requirement of the electronic equipment, so that the service performance of the electronic equipment can be improved.

An embodiment of the present application provides an electronic device, including at least: a middle frame and a component assembly; the component assembly includes: the middle frame is positioned at one side of the shielding component, which is away from the component body; at least one heat conduction structural member is arranged on at least one of the shielding assembly and the middle frame, and the melting point of the heat conduction structural member is 40-60 ℃.

According to the electronic equipment provided by the embodiment of the application, one or more heat-conducting structural members with the melting point of 40-60 ℃ are arranged on the shielding component, or one or more heat-conducting structural members with the melting point of 40-60 ℃ are arranged on the middle frame, or one or more heat-conducting structural members with the melting point of 40-60 ℃ are respectively arranged on the shielding component and the middle frame, and the heat-conducting structural members are solid at normal temperature and can keep a certain shape in the production process and have processability, and in the working process of the electronic equipment, the heat-conducting structural members can be heated and melted to be converted into liquid, the liquid heat-conducting structural members can absorb heat generated by heating of the electronic equipment, and good wetting can be formed by melting interfaces contacted with the heat-conducting structural members, so that the diffusion of the heat is enhanced.

Therefore, after heat generated by the component body is transferred to the shielding assembly covered outside the component body or further transferred to the middle frame, the heat conduction structural member with the melting point of 40-60 ℃ can enhance heat conduction, and a good heat dissipation effect is achieved. Therefore, through the arrangement, the heat transfer efficiency of the shielding assembly and the middle frame can be increased, so that the heat dissipation effect of the component body can be improved, the problem that the heat dissipation performance of the component body in the electronic equipment in the prior art is poor is solved or avoided, the heat dissipation requirement of the electronic equipment can be met, and the service performance of the electronic equipment is further improved.

In one possible implementation, the number of the heat-conducting structural members is one; the orthographic projection of the heat conduction structural member on the middle frame is at least partially overlapped with the orthographic projection of the component body on the middle frame.

The orthographic projection of the heat conduction structural member on the middle frame is at least partially overlapped with the orthographic projection of the component body on the middle frame, so that a heat transfer path between the heat conduction structural member and the component body can be relatively shortened, and the heat dissipation effect of the component body can be further improved to a greater extent.

In one possible implementation manner, the number of the heat conducting structural members is a plurality, and the plurality of the heat conducting structural members are distributed on the shielding assembly or the middle frame at intervals; and at least one orthographic projection of the heat conduction structural member in the plurality of heat conduction structural members on the middle frame is at least partially overlapped with orthographic projection of the component body on the middle frame.

Through with a plurality of heat conduction structure spare interval distribution on shielding subassembly or center, like this, the quantity of heat conduction structure spare on shielding subassembly or the center increases, and the heat transfer that components and parts body produced is behind shielding subassembly or the center, and a plurality of heat conduction structure spare can strengthen heat conduction to a greater extent to can play better heat dissipation effect. In addition, through designing the orthographic projection of at least one heat conduction structural member in a plurality of heat conduction structural members on the middle frame to at least partially overlap with the orthographic projection of the component body on the middle frame, the heat transfer path between at least one heat conduction structural member and the component body can be ensured to be relatively shortened, and then the radiating effect of the component body can be improved to a greater extent.

In one possible implementation, the orthographic projection of each heat conducting structural member on the middle frame is located in the orthographic projection of the component body on the middle frame.

Through all designing the orthographic projection of every heat conduction structure on the center as being located the orthographic projection of components and parts body on the center, the orthographic projection of every heat conduction structure all is located the orthographic projection region of components and parts body promptly, can guarantee like this that the heat transfer route between the whole and components and parts body of heat conduction structure shortens relatively, and then can improve the radiating effect of components and parts body to a greater extent.

In one possible implementation, the material used for the heat conductive structural member includes one or more of tin, indium, bismuth, and gallium.

In one possible implementation, a connection layer is provided between the thermally conductive structure and the shielding assembly or the middle frame.

Through being provided with the articulamentum between heat conduction structure and shielding subassembly, heat conduction structure can be connected on shielding subassembly through the articulamentum to this realizes the connection between heat conduction structure and the shielding subassembly, through being provided with the articulamentum between heat conduction structure and center, heat conduction structure can be connected on the center through the articulamentum, with this realizes the connection between heat conduction structure and the center.

In one possible implementation manner, a projection area of the connection layer on the middle frame is smaller than a projection area of the component body on the middle frame.

Because the heat conduction structural member passes through the tie-layer to be connected on shielding subassembly or center, the projection area of tie-layer on center is less than the projection area of components and parts body on center, can ensure to a great extent that the projection area of heat conduction structural member on shielding subassembly or center is located components and parts body in the projection area on shielding subassembly or center, can guarantee like this that the heat transfer route between heat conduction structural member and the components and parts body shortens relatively, and then can improve the radiating effect of components and parts body to a greater extent.

In one possible implementation, the connection layer includes: at least one connection point; at least one connection point is arranged between each heat conduction structural member and the shielding assembly or the middle frame; and the shape of the connecting point is any one of a circle, a rectangle or a triangle.

In one possible implementation, when the connection layer includes a plurality of connection points, the plurality of connection points are distributed in an array. By designing the connection layer to include a plurality of connection points, the connection performance between the heat conduction structural member and the shielding assembly or the middle frame can be increased, and further the connection reliability between the heat conduction structural member and the shielding assembly or the middle frame can be ensured.

In one possible implementation, the connection layer is a plating layer or an adhesive layer.

In one possible implementation, the plating layer is made of one or more of nickel, copper, tin, zinc, silver and gold.

In one possible implementation, at least one heat-conducting structural member is arranged on the side, facing away from the shielding component, of the middle frame; the heat conduction structural members positioned on one surface of the middle frame, which is away from the shielding assembly, are first heat conduction structural members, and a first connecting layer is arranged between each first heat conduction structural member and the middle frame.

Like this, be equipped with at least one first heat conduction structure on the one side that the center deviates from shielding assembly, be provided with first tie coat between every first heat conduction structure and the center, first heat conduction structure can be connected on the one side that the center deviates from shielding assembly through first tie coat.

In one possible implementation manner, at least one heat conducting structural member is arranged on one surface of the middle frame facing the shielding assembly; the heat conduction structural members positioned on one surface of the middle frame, facing the shielding assembly, are second heat conduction structural members, and a second connecting layer is arranged between each second heat conduction structural member and the middle frame.

Like this, be equipped with at least one second heat conduction structure on the one side of middle frame towards shielding subassembly, be provided with the second tie coat between every second heat conduction structure and the middle frame, the second heat conduction structure can be connected on the one side of middle frame towards shielding subassembly through the second tie coat.

In one possible implementation manner, at least one heat conducting structural member is arranged on one surface of the shielding assembly, which faces away from the component body; the heat conduction structural members positioned on one surface of the shielding component, which is far away from the component body, are third heat conduction structural members, and a third connecting layer is arranged between each third heat conduction structural member and the shielding component.

Like this, be equipped with at least one third heat conduction structure on the one side that shielding assembly deviates from the components and parts body, be provided with the third tie coat between every third heat conduction structure and the shielding assembly, the third heat conduction structure can be connected on the one side that shielding assembly deviates from components and parts body through the third tie coat.

In one possible implementation manner, a first heat conducting glue layer is arranged between the middle frame and the shielding component; at least one of the second and third thermally conductive structures is encased within the first thermally conductive adhesive layer.

Because the second heat conduction structure is located the center towards shielding assembly's one side, the third heat conduction structure is located shielding assembly and deviates from the one side of components and parts body, second heat conduction structure and third heat conduction structure are located between center and the shielding assembly, through being provided with first heat conduction glue film between center and the shielding assembly, if the second heat conduction structure parcel is in first heat conduction glue film, first heat conduction glue film can prevent that the second heat conduction structure of melting when electronic equipment work generates heat from flowing everywhere, and then can ensure that the second heat conduction structure can not overflow to other regions when electronic equipment work generates heat and arouse electronic equipment short circuit inefficacy.

If the third heat conduction structural member is wrapped in the first heat conduction adhesive layer, the first heat conduction adhesive layer can prevent the melted third heat conduction structural member from flowing everywhere when the electronic equipment works and heats, and further can ensure that the third heat conduction structural member cannot overflow to other areas to cause short circuit failure of the electronic equipment when the electronic equipment works and heats.

If the second heat conduction structural member and the third heat conduction structural member are wrapped in the first heat conduction adhesive layer, the first heat conduction adhesive layer can prevent the second heat conduction structural member and the third heat conduction structural member which are melted when the electronic equipment works and heats from flowing everywhere, and further can ensure that the second heat conduction structural member and the third heat conduction structural member cannot overflow to other areas to cause short circuit failure of the electronic equipment when the electronic equipment works and heats.

In one possible implementation manner, the orthographic projection of the second heat conduction structural member on the component body at least partially overlaps with the orthographic projection of the first heat conduction adhesive layer on the component body; the orthographic projection of the third heat conduction structural member on the component body is at least partially overlapped with the orthographic projection of the first heat conduction adhesive layer on the component body.

The orthographic projection of the second heat conduction structural member on the component body and the orthographic projection of the first heat conduction adhesive layer on the component body are at least partially overlapped, so that the second heat conduction structural member can be ensured to be at least partially wrapped in the first heat conduction adhesive layer, and the first heat conduction adhesive layer can prevent the second heat conduction structural member which is melted when the electronic equipment works and heats from flowing everywhere. The orthographic projection of the third heat conduction structural member on the component body and the orthographic projection of the first heat conduction adhesive layer on the component body are at least partially overlapped, so that the third heat conduction structural member can be ensured to be at least partially wrapped in the first heat conduction adhesive layer, and the first heat conduction adhesive layer can prevent the third heat conduction structural member which is melted when the electronic equipment works and heats from flowing everywhere.

In one possible implementation manner, the orthographic projection of the second heat conduction structural member on the component body is located in the orthographic projection of the first heat conduction adhesive layer on the component body; the orthographic projection of the third heat conduction structural member on the component body is positioned in the orthographic projection of the first heat conduction adhesive layer on the component body.

The orthographic projection of the second heat conduction structural member on the component body is positioned in the orthographic projection of the first heat conduction adhesive layer on the component body, so that the second heat conduction structural member can be ensured to be completely wrapped in the first heat conduction adhesive layer, and further the first heat conduction adhesive layer can completely prevent the second heat conduction structural member which is melted when the electronic equipment works and heats from flowing everywhere. The orthographic projection of the third heat conduction structural member on the component body is positioned in the orthographic projection of the first heat conduction adhesive layer on the component body, so that the third heat conduction structural member can be ensured to be completely wrapped in the first heat conduction adhesive layer, and the first heat conduction adhesive layer can be further used for completely preventing the third heat conduction structural member melted when the electronic equipment works and heats from flowing everywhere.

In one possible implementation manner, the total thickness of the second heat conduction structural member and the second connection plating layer is smaller than or equal to the thickness of the first heat conduction adhesive layer; and the total thickness of the third heat conduction structural member and the third connecting coating is smaller than or equal to the thickness of the first heat conduction adhesive layer.

Through designing the total thickness of second heat conduction structure and second connection cladding material to be less than or equal to the thickness of first heat conduction glue film, can avoid taking place the problem that first heat conduction glue film can not wrap up second heat conduction structure and second connection cladding material. Through designing the total thickness of third heat conduction structure and third connection cladding material to be less than or equal to the thickness of first heat conduction glue film, can avoid taking place the problem that first heat conduction glue film can not wrap up third heat conduction structure and third connection cladding material.

In one possible implementation manner, at least one heat conducting structural member is arranged on one surface of the shielding assembly, which faces the component body; the heat conduction structural members positioned on one surface of the shielding component, which is far away from the component body, are fourth heat conduction structural members, and a fourth connecting layer is arranged between each fourth heat conduction structural member and the shielding component.

Like this, be equipped with at least one fourth heat conduction structure on the one side of shielding subassembly orientation components and parts body, be provided with the fourth tie coat between every fourth heat conduction structure and the shielding subassembly, the fourth heat conduction structure can be connected on the one side of shielding subassembly orientation components and parts body through the fourth tie coat.

In one possible implementation manner, a second heat conducting glue layer is arranged between the shielding assembly and the component body; the fourth heat conduction structural member is wrapped in the second heat conduction adhesive layer.

Because the fourth heat conduction structural member is located shielding assembly and is located the one side of components and parts body, the fourth heat conduction structural member is located between shielding assembly and the components and parts body, through being provided with the second heat conduction glue film between shielding assembly and components and parts body, if fourth heat conduction structural member parcel is in the second heat conduction glue film, the fourth heat conduction structural member that melts when the electronic equipment work generates heat flows everywhere in the second heat conduction glue film, and then can ensure that the fourth heat conduction structural member can not overflow to other regions when the electronic equipment work generates heat and arouse electronic equipment short circuit inefficacy.

In one possible implementation, the total thickness of the fourth heat conductive structural member and the fourth connection layer is less than or equal to the thickness of the second heat conductive adhesive layer.

Through designing the total thickness of fourth heat conduction structure and fourth connection cladding material to be less than or equal to the thickness of second heat conduction glue film, can avoid taking place the problem that second heat conduction glue film can not wrap up fourth heat conduction structure and fourth connection cladding material.

In one possible implementation, the method further includes: a circuit board; the component assembly is positioned on the circuit board, and the circuit board is positioned on one side of the component body, which is away from the shielding assembly; the circuit board and the shielding assembly enclose to form a containing cavity, and the component body is positioned in the containing cavity.

The component body is located the holding chamber that forms is enclosed to circuit board and shielding subassembly, can separate component body and other electronic components in the electronic equipment, and then can avoid other electronic components in the electronic equipment to cause the interference to the component body.

Drawings

Fig. 1 is a schematic diagram of an overall structure of an electronic device according to an embodiment of the present application;

fig. 2 is a schematic diagram of a split structure of an electronic device according to an embodiment of the present application;

FIG. 3 is a schematic cross-sectional view of a circuit board and component assembly of an electronic device according to the prior art;

fig. 4 is a schematic cross-sectional structure of a circuit board and a component assembly in an electronic device according to an embodiment of the application;

fig. 5 is a schematic cross-sectional structure of a middle frame and a heat conductive structural member in an electronic device according to an embodiment of the present application;

fig. 6 is a schematic cross-sectional view of a circuit board, a component assembly and a middle frame in an electronic device according to an embodiment of the application;

fig. 7 is a top view of a component body and a connection layer in an electronic device according to an embodiment of the present application;

fig. 8 is a top view of a component body and a connection layer in an electronic device according to an embodiment of the present application;

fig. 9 is a top view of a component body and a connection layer in an electronic device according to an embodiment of the present application;

fig. 10 is a top view of a component body and a connection layer in an electronic device according to an embodiment of the present application;

fig. 11 is a top view of a component body and a connection layer and a first thermal conductive adhesive layer in an electronic device according to an embodiment of the application;

fig. 12 is a top view of a component body and a connection layer and a first thermal conductive adhesive layer in an electronic device according to an embodiment of the present application;

Fig. 13 is a top view of a component body and a connection layer and a first thermal conductive adhesive layer in an electronic device according to an embodiment of the application;

fig. 14 is a schematic cross-sectional view of a middle frame, a component assembly and a shielding frame in an electronic device according to an embodiment of the application;

fig. 15A is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a middle frame in an electronic device according to an embodiment of the present application;

fig. 15B is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a middle frame in an electronic device according to an embodiment of the present application;

fig. 15C is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a middle frame in an electronic device according to an embodiment of the present application;

fig. 15D is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a middle frame in an electronic device according to an embodiment of the present application;

fig. 15E is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a middle frame in an electronic device according to an embodiment of the present application;

fig. 16A is a schematic cross-sectional view illustrating a step of disposing a heat conductive structure on a middle frame in an electronic device according to an embodiment of the present application;

fig. 16B is a schematic cross-sectional view illustrating a step of disposing a heat conductive structure on a middle frame in an electronic device according to an embodiment of the present application;

Fig. 16C is a schematic cross-sectional view illustrating a step of disposing a heat conductive structure on a middle frame in an electronic device according to an embodiment of the present application;

fig. 17A is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a middle frame in an electronic device according to an embodiment of the present application;

fig. 17B is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a middle frame in an electronic device according to an embodiment of the present application;

fig. 17C is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a middle frame in an electronic device according to an embodiment of the present application;

fig. 17D is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a middle frame in an electronic device according to an embodiment of the present application;

fig. 17E is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a middle frame in an electronic device according to an embodiment of the present application;

fig. 17F is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a middle frame in an electronic device according to an embodiment of the present application;

fig. 18A is a schematic cross-sectional view illustrating a step of disposing a heat conductive structure on a middle frame in an electronic device according to an embodiment of the present application;

fig. 18B is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a middle frame in an electronic device according to an embodiment of the present application;

Fig. 18C is a schematic cross-sectional view illustrating a step of disposing a heat conductive structure on a middle frame in an electronic device according to an embodiment of the present application;

fig. 18D is a schematic cross-sectional view illustrating a step of disposing a heat conductive structure on a middle frame in an electronic device according to an embodiment of the present application;

fig. 18E is a schematic cross-sectional view illustrating a step of disposing a heat conductive structure on a middle frame in an electronic device according to an embodiment of the present application;

fig. 18F is a schematic cross-sectional view illustrating a step of disposing a heat conductive structure on a middle frame in an electronic device according to an embodiment of the present application;

fig. 19 is a schematic cross-sectional view of an electronic device according to an embodiment of the present application, where a heat conductive structural member is disposed on a middle frame;

fig. 20A is a schematic cross-sectional view illustrating steps when a heat conductive structural member is disposed on each of a middle frame and a shielding component in an electronic device according to an embodiment of the present application;

fig. 20B is a schematic cross-sectional view illustrating a step of providing a heat conductive structure on both the middle frame and the shielding component in the electronic device according to an embodiment of the present application;

fig. 20C is a schematic cross-sectional view illustrating a step of providing a heat conductive structure on both the middle frame and the shielding component in the electronic device according to an embodiment of the present application;

Fig. 20D is a schematic cross-sectional view illustrating a step of providing a heat conductive structure on both the middle frame and the shielding component in the electronic device according to an embodiment of the present application;

fig. 20E is a schematic cross-sectional view illustrating a step of providing a heat conductive structure on both the middle frame and the shielding component in the electronic device according to an embodiment of the present application;

fig. 21A is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a shielding component in an electronic device according to an embodiment of the present application;

fig. 21B is a schematic cross-sectional view illustrating a step of disposing a heat conductive structural member on a shielding component in an electronic device according to an embodiment of the present application;

fig. 21C is a schematic cross-sectional view illustrating a step of disposing a heat conductive structure on a shielding component in an electronic device according to an embodiment of the present application;

fig. 21D is a schematic cross-sectional view illustrating a step of disposing a heat conductive structure on a shielding component in an electronic device according to an embodiment of the present application;

fig. 21E is a schematic cross-sectional view illustrating a step of disposing a heat conductive structure on a shielding component in an electronic device according to an embodiment of the present application;

fig. 22 is a schematic cross-sectional view of an electronic device according to an embodiment of the present application, where a heat conductive structure is disposed on a sub-circuit board;

Fig. 23 is a schematic cross-sectional structure of an electronic device according to an embodiment of the present application, in which a heat conductive structural member is disposed on a side of a metal case facing a circuit board;

fig. 24 is a schematic cross-sectional structure diagram of an electronic device according to an embodiment of the present application, where a heat conductive structural member is disposed on a surface of a metal case facing a circuit board and a surface of a shielding component facing away from the circuit board.

Reference numerals illustrate:

100-mobile phone; 110-middle frame; 111-frames;

112-a metal middle plate; 120-component assembly; 121-a component body;

122-shielding assembly; 1221-shielding frame; 1222-a shield cover;

1223-receiving chamber; 130-a thermally conductive structural member; 131-a first thermally conductive structural member;

132-a second thermally conductive structural member; 133-a third thermally conductive structural member; 134-fourth thermally conductive structural member;

1301-integral heat conducting structural member; 140-a connection layer; 1401-connection point;

141-a first connection layer; 1411-a first connection point; 142-a second connection layer;

1421-a second connection point; 143-a third connection layer; 1431-a third connection point;

144-fourth connection layer; 1441-fourth connection point; 145-a fifth connection layer;

1451-fifth connection point; 151-a first heat conducting glue layer; 1511-a first part;

1512-second part; 152-a second heat conducting glue layer; 1521-a third portion;

1522-fourth part; 160-a circuit board; 161-a sub-circuit board;

162-frame plate; 170-a display screen; 171-opening holes;

180-cell; 190-rear cover; 210-a liquid metal layer;

220-sealing foam; 230-other devices; 240-an insulating layer;

241-opening; 250-metal shell; 251-a third heat conducting glue layer.

Detailed Description

The terminology used in the description of the embodiments of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application, as will be described in detail with reference to the accompanying drawings.

Embodiments of the present application provide an electronic device, which may include, but is not limited to, mobile or fixed terminals such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, an intercom, a Point of sale (POS) device, a personal digital assistant (personal digital assistant, PDA), a wearable device, a virtual reality device, a wireless U-disc, a bluetooth sound/earphone, or a vehicle-mounted front-mounted, a vehicle recorder, a security device, and the like.

The mobile phone 100 is taken as an example of the electronic device. The mobile phone 100 provided in the embodiment of the present application may be a curved screen mobile phone or a flat screen mobile phone, and in the embodiment of the present application, a flat screen mobile phone is taken as an example for explanation. Fig. 1 and fig. 2 show an overall structure and a split structure of a mobile phone 100, respectively, and a display screen 170 of the mobile phone 100 provided in the embodiment of the application may be a water drop screen, a Liu Haibing screen, a full screen or a hole digging screen (see fig. 1), for example, an opening 171 is formed on the display screen 170, and the following description will take the hole digging screen as an example.

In this embodiment of the present application, the mobile phone 100 may at least include: a display 170, a rear cover 190, a circuit board 160 and a battery 180 between the display 170 and the rear cover 190. The battery 180 typically has a battery interface (not shown) electrically connected to the circuit board 160.

In some examples, referring to fig. 2, the mobile phone 100 may further include a middle frame 110, wherein the circuit board 160 may be disposed on the middle frame 110, for example, the circuit board 160 may be disposed on a side of the middle frame 110 facing the rear cover 190 (as shown in fig. 2), or the circuit board 160 may be disposed on a side of the middle frame 110 facing the display 170, and the display 170 and the rear cover 190 are located on both sides of the middle frame 110, respectively. The battery 180 may be provided on a side of the middle frame 110 facing the rear cover 190 (as shown in fig. 2), or the battery 180 may be provided on a side of the middle frame 110 facing the display 170, for example, a side of the middle frame 110 facing the rear cover 190 may have a battery compartment (not shown) in which the battery 180 is mounted.

The battery 180 may be connected to the charge management module and the circuit board 160 through a power management module, where the power management module receives input from the battery 180 and/or the charge management module and supplies power to the processor, the internal memory, the external memory, the display 170, the camera module, the communication module, and the like. The power management module can also be used for monitoring parameters such as battery capacity, battery cycle times, battery health status (leakage, impedance) and the like. In other embodiments, the power management module may also be disposed in the processor of the circuit board 160. In other embodiments, the power management module and the charge management module may be disposed in the same device.

When the mobile phone 100 is a flat screen mobile phone, the display 170 may be an Organic Light-Emitting Diode (OLED) display or a liquid crystal display (Liquid Crystal Display, LCD), and when the mobile phone 100 is a curved screen mobile phone, the display 170 may be an OLED display.

With continued reference to fig. 2, middle frame 110 may include a metal middle plate 112 and a rim 111, rim 111 disposed one revolution around the outer circumference of metal middle plate 112. In general, the rim 111 may include a top side, a bottom side, a left side, and a right side, which enclose the rim 111 in a square ring structure. The material of the metal middle plate 112 may include, but is not limited to, aluminum plate, aluminum alloy, stainless steel, steel-aluminum composite die-casting plate, titanium alloy, magnesium alloy, etc. The frame 111 may be a metal frame, a ceramic frame, or a glass frame. When the bezel 111 is a metal bezel, the material of the metal bezel may include, but is not limited to, aluminum alloy, stainless steel, steel aluminum composite die cast plate, titanium alloy, or the like. The metal middle plate 112 and the frame 111 may be clamped, welded, glued or integrally formed, or the metal middle plate 112 and the frame 111 may be fixedly connected by injection molding.

The rear cover 190 may be a metal rear cover, a glass rear cover, a plastic rear cover, or a ceramic rear cover, and in the embodiment of the present application, the material of the rear cover 190 is not limited, and is not limited to the above example.

It should be noted that, in some examples, the back cover 190 of the mobile phone 100 may be connected to the bezel 111 to form a Unibody back cover, for example, the mobile phone 100 may include: display 170, metal midplane 112, and battery cover, which may be a back cover formed by integrally molding (Unibody) bezel 111 and back cover 190, such that circuit board 160 and battery 180 are located in the space enclosed by metal midplane 112 and the battery cover.

In addition, a plurality of electronic components are generally disposed on the circuit board 160, and the circuit board 160 may supply power to the electronic components, for example, a chip, a processor, an antenna module, a bluetooth module, a Wireless-Fidelity (WiFi) module, a global positioning system (Global Positioning System, GPS) module, a power supply, a charging module, or a camera operation module may be generally disposed on the circuit board 160.

In order to avoid interference between multiple electronic components, a shielding component is generally covered on the outer part of a single electronic component to isolate the electronic component from the outside, but this affects the heat dissipation performance of the electronic component to a certain extent.

In the related art, in order to solve the problem of poor heat dissipation of electronic components, a heat conducting gel layer (for example, a heat conducting paste) is generally disposed between the shielding component 122 and the middle frame 110 of the mobile phone 100, and then heat generated by the electronic components is conducted to the middle frame 110 through the heat conducting gel layer after passing through the shielding component 122, but the heat conductivity is improved, the size of the filler is increased or the cost is increased due to the use of a material with higher heat conductivity.

Alternatively, as shown in fig. 3, a liquid metal layer 210 is disposed between the electronic component (i.e., the component body 121) and the shielding assembly 122, and the liquid metal is a better heat conducting material, and has a heat conductivity of typically tens of W/mK, and has better contact to the material interface in the liquid state, and better caulking capability. However, the liquid metal is a metal material at a relatively high temperature, and is liable to overflow to cause short-circuiting of the electronic component or the circuit board 160. For example, in fig. 3, a sealing foam 220 is generally disposed on a side of the component body 121 facing the liquid metal layer 210 of the other component 230.

However, in the mobile phone 100, the heat conduction gap is very small, so that the structure is difficult to seal, and the application of liquid metal is limited. Liquid metal is difficult to apply in small structural spaces, requires special protection in assembly process and structure, or is easy to overflow to cause failure short circuit of electronic components or circuit board 160.

Based on the above, the embodiment of the application provides the electronic equipment, and the electronic equipment is provided with at least one heat conduction structural member on at least one of the shielding component and the middle frame, wherein the melting point of the heat conduction structural member is 40-60 ℃, and after heat generated by the component body is transferred to the shielding component covered outside the component body or further transferred to the middle frame, the heat conduction of the heat conduction structural member with the melting point of 40-60 ℃ can be enhanced, so that a good heat dissipation effect is achieved. Therefore, the problem that the heat dissipation performance of the component body such as a chip in the electronic equipment in the prior art is poor can be reduced or avoided, the heat dissipation effect of the component body is improved, and then the heat dissipation requirement of the electronic equipment can be met, so that the use performance of the electronic equipment can be improved.

The following describes a specific structure of the electronic device by taking specific embodiments as examples, and referring to the accompanying drawings.

The embodiment of the application provides an electronic device, taking the electronic device as a mobile phone 100 as an example, the mobile phone 100 at least may include: middle frame 110 and components assembly 120, wherein, referring to fig. 4, components assembly 120 may include: the device comprises a device body 121 and a shielding assembly 122, wherein the shielding assembly 122 is covered outside the device body 121, and the middle frame 110 is located at one side of the shielding assembly 122 away from the device body 121.

The component body 121 may be, for example, a connector, an electronic transformer, a relay, a laser device, a package device, a biometric module, a processor, a memory, a power module, etc., wherein the memory may be a Double Data Rate (DDR) memory. The component body 121 may also be, for example, a System On Chip (SOC) element, a main power management chip (power management unit, PMU), a radio frequency chip (radio frequencyintegrated circuit, RF IC), a radio frequency power amplifier (radio frequency power amplifier, RFPA), a wireless fidelity (wireless fidelity, WIFI) chip, a secondary PMU, and the like. The component body 121 may be a single component or may be stacked. The SOC component and DDR memory may be stacked to form a package-on-package (package on package, poP) component. The SOC element and the DDR memory may be provided separately.

The shielding assembly 122 may include: a shielding frame 1221 and a shielding cover 1222, wherein, one end of the shielding frame 1221 facing away from the shielding cover 1222 is fixedly connected with the circuit board 160, and the shielding cover 1222 is located between the component body 121 and the middle frame 110. In addition, in some embodiments, a sealing foam 220 may be further disposed between the shielding frame 1221 and the shielding cover 1222.

In the embodiment of the present application, at least one heat conducting structural member 130 is disposed on at least one of the shielding component 122 and the middle frame 110, and the melting point of the heat conducting structural member 130 may be 40-60 ℃. That is, in the electronic device, one or more heat conductive structural members 130 having a melting point of 40-60 ℃ are provided on the shielding member 122, or one or more heat conductive structural members 130 having a melting point of 40-60 ℃ are provided on the middle frame 110, or one or more heat conductive structural members 130 having a melting point of 40-60 ℃ are provided on the shielding member 122 and the middle frame 110, respectively.

Because the melting point of the heat conducting structural member 130 is 40-60 ℃, the heat conducting structural member 130 is solid at normal temperature, the heat conducting structural member 130 can be ensured to keep a certain shape in the production process, and has processability, and in the working process of the electronic equipment, the heat conducting structural member 130 can be heated, melted and converted into a liquid state, and the liquid heat conducting structural member 130 can absorb heat generated by heating of the electronic equipment, so that the embodiment of the application can utilize the phase change of the low-melting-point heat conducting structural member 130 to absorb the heat emitted by the component body 121, realize the short-time heat storage effect, reduce the thermal resistance on a heat transfer path, and also can form good wetting by melting an interface contacted with the heat conducting structural member, and strengthen the heat diffusion.

In this way, after the heat generated by the component body 121 is transferred to the shielding component 122 covered outside the component body 121 or further transferred to the middle frame 110, the heat conduction structure 130 with the melting point of 40-60 ℃ can enhance heat conduction, and plays a good role in heat dissipation. Therefore, through the above-mentioned setting, can help increasing shielding assembly 122 and the heat transfer efficiency of center 110 to can improve the radiating effect of components and parts body 121, alleviate or avoid the relatively poor problem of heat dispersion of components and parts body 121 among the prior art electronic equipment, and then can satisfy electronic equipment's heat dissipation demand, further promote electronic equipment's performance.

The melting point of the heat conductive structure 130 may be 40 ℃, 45 ℃, 50 ℃, 55 ℃, 60 ℃, or the like, which is not limited by the embodiment of the present application, and is not limited to the above examples.

It is understood that in the embodiment of the present application, the number of the heat conductive structures 130 may be one, and the front projection of the heat conductive structures 130 on the middle frame 110 at least partially overlaps the front projection of the component body 121 on the middle frame 110.

That is, the front projection of the heat conducting structural member 130 on the middle frame 110 and the front projection of the component body 121 on the middle frame 110 may be all overlapped, or may be partially overlapped, and the front projection of the heat conducting structural member 130 on the middle frame 110 and the front projection of the component body 121 on the middle frame 110 are overlapped, so that the heat transfer path between the heat conducting structural member 130 and the component body 121 can be relatively shortened, and further, the heat dissipation performance and the heat dissipation efficiency between the component body 121 and the heat conducting structural member 130 can be further improved, thereby improving the heat dissipation effect of the component body 121 to a greater extent, and better meeting the heat dissipation requirement of the mobile phone 100.

Alternatively, in some embodiments, the number of thermally conductive structures 130 may be plural, and the plurality of thermally conductive structures 130 may be spaced apart on the shielding assembly 122 or the middle frame 110. Through distributing a plurality of heat conduction structural members 130 on shielding subassembly 122 or center 110 at intervals, like this, the quantity of heat conduction structural members 130 on shielding subassembly 122 or the center 110 increases, and the heat that components and parts body 121 produced is after the heat transfer to shielding subassembly 122 or center 110, and a plurality of heat conduction structural members 130 can strengthen heat conduction to a greater extent to can play better heat dissipation effect.

Moreover, an orthographic projection of at least one thermally conductive structure 130 of the plurality of thermally conductive structures 130 onto the middle frame 110 at least partially overlaps an orthographic projection of the component body 121 onto the middle frame 110. By designing the orthographic projection of at least one heat conducting structural member 130 of the plurality of heat conducting structural members 130 on the middle frame 110 to at least partially overlap with the orthographic projection of the component body 121 on the middle frame 110, the heat transfer path between the at least one heat conducting structural member 130 and the component body 121 can be ensured to be relatively shortened, and the heat dissipation effect of the component body 121 can be further improved to a greater extent.

In one possible implementation, the front projection of each heat-conducting structure 130 on the middle frame 110 is located within the front projection of the component body 121 on the middle frame 110. Through designing the orthographic projection of each heat conduction structural member 130 on the middle frame 110 to be located in the orthographic projection of the component body 121 on the middle frame 110, namely, the orthographic projection of each heat conduction structural member 130 is located in the orthographic projection area of the component body 121, the heat transfer path between the whole heat conduction structural member 130 and the component body 121 can be ensured to be relatively shortened, and then the heat dissipation effect of the component body 121 can be improved to a greater extent.

It should be noted that, in the embodiment of the present application, the material used for the heat conductive structural member 130 may include one or more of tin, indium, bismuth and gallium. For example, the material used for the heat-conducting structural member 130 may be tin, indium, bismuth or gallium, or the material used for the heat-conducting structural member 130 may be a composite material of any two or more of tin, indium, bismuth and gallium, which is not limited in this embodiment of the present application.

In particular, the thermally conductive structure 130 may be a liquid metal having a melting point of 40-60 ℃, which refers to an amorphous, flowable liquid metal that may be considered as a mixture of a positive ion fluid and free electron gas. Liquid metal plays an important role in ensuring cooling or promoting heat conduction. The liquid metal may be mercury, for example.

In addition, in the embodiment of the present application, a connection layer 140 is provided between the heat conductive structural member 130 and the shielding assembly 122 or between the heat conductive structural member 130 and the middle frame 110. By providing the connection layer 140 between the heat conducting structural member 130 and the shielding assembly 122, the heat conducting structural member 130 can be connected to the shielding assembly 122 through the connection layer 140, so as to realize connection between the heat conducting structural member 130 and the shielding assembly 122, and by providing the connection layer 140 between the heat conducting structural member 130 and the middle frame 110, the heat conducting structural member 130 can be connected to the middle frame 110 through the connection layer 140, so as to realize connection between the heat conducting structural member 130 and the middle frame 110.

In one possible implementation, the projected area of the connection layer 140 on the middle frame 110 may be smaller than the projected area of the component body 121 on the middle frame 110. Because the heat conduction structural member 130 is connected to the shielding component 122 or the middle frame 110 through the connection layer 140, the projection area of the connection layer 140 on the middle frame 110 is smaller than the projection area of the component body 121 on the middle frame 110, the projection area of the heat conduction structural member 130 on the shielding component 122 or the middle frame 110 can be ensured to be positioned in the projection area of the component body 121 on the shielding component 122 or the middle frame 110 to a great extent, and thus the heat transfer path between the heat conduction structural member 130 and the component body 121 can be ensured to be relatively shortened, and the heat dissipation effect of the component body 121 can be further improved to a greater extent.

It is understood that, in an embodiment of the present application, as shown in fig. 5, the connection layer 140 may include: at least one connection point 1401, wherein at least one connection point 1401 is provided between each heat conductive structure 130 and shielding assembly 122, or at least one connection point 1401 is provided between each heat conductive structure 130 and middle frame 110.

Specifically, one, two, three, four or more connection points 1401 may be provided between each heat conductive structure 130 and the shielding assembly 122, and likewise, one, two, three, four or more connection points 1401 may be provided between each heat conductive structure 130 and the middle frame 110.

In addition, it is understood that in the embodiment of the present application, the shape of the connection point 1401 is any one of a circle, a rectangle, or a triangle. The specific shape of the connection point 1401 is not limited to the above example, and the connection function can be achieved.

When the connection layer 140 may include a plurality of connection points 1401, that is, a plurality of connection points 1401 are provided between the heat conductive structural member 130 and the shielding assembly 122 or a plurality of connection points 1401 are provided between each of the heat conductive structural members 130 and the middle frame 110, the plurality of connection points 1401 may be distributed in an array. By designing the connection layer 140 to include a plurality of connection points 1401, the connection performance between the heat conductive structural member 130 and the shielding assembly 122 or the middle frame 110 can be increased, and thus the connection reliability between the heat conductive structural member 130 and the shielding assembly 122 or the middle frame 110 can be ensured.

The connection layer 140 may be a plating layer or an adhesive layer.

When the connection layer 140 is a plating layer, the plating layer may be made of a metal material, and in particular, the plating layer may be made of one or more of nickel, copper, tin, zinc, silver, and gold. For example, the plating layer may be made of nickel, copper, tin, zinc, silver or gold, or the plating layer may be made of a composite material of any two or more of nickel, copper, tin, zinc, silver and gold.

When the connection layer 140 is an adhesive layer, the adhesive layer may be an adhesive layer, for example, the adhesive layer may be a black adhesive, a white adhesive, a fog adhesive, or an adhesive material or an adhesive tape. Of course, in some embodiments, the risk of separation between the thermally conductive structure 130 and the shielding assembly 122 or between the thermally conductive structure 130 and the middle frame 110 may also be reduced by increasing the tackiness of the adhesive layer.

It should be noted that, the specific materials of the plating layer or the bonding layer in the embodiment of the present application are not limited, and the embodiment is not limited to the above examples, and the embodiment is within the scope of the present application as long as the embodiment can perform the bonding function.

In an embodiment of the present application, as shown in fig. 6, the specific placement of the heat conductive structural member 130 and the connection layer 140 may include, but is not limited to, the following several possible implementations:

one possible implementation is: at least one heat conducting structural member 130 is arranged on the side, facing away from the shielding assembly 122, of the middle frame 110, the heat conducting structural member 130 located on the side, facing away from the shielding assembly 122, of the middle frame 110 is used as a first heat conducting structural member 131, and a first connecting layer 141 is arranged between each first heat conducting structural member 131 and the middle frame 110.

In this way, at least one first heat-conducting structural member 131 is disposed on a side of the middle frame 110 facing away from the shielding component 122, and a first connection layer 141 is disposed between each first heat-conducting structural member 131 and the middle frame 110, where the first heat-conducting structural member 131 can be connected to a side of the middle frame 110 facing away from the shielding component 122 through the first connection layer 141.

The first connection layer 141 may include: at least one first connection point 1411 is provided, wherein at least one first connection point 1411 is provided between each first heat conductive structure 131 and the middle frame 110. Specifically, one, two, three, four or more first connection points 1411 may be provided between each of the first heat conductive structural members 131 and the middle frame 110.

The first connection point 1411 is any one of a circular shape (see fig. 7), a rectangular shape (see fig. 8 and 10), an elongated shape (see fig. 9), or a triangular shape. Also, as shown in fig. 7 to 9, when the first connection layer 141 includes a plurality of first connection points 1411, that is, a plurality of first connection points 1411 are disposed between the first heat conductive structural member 131 and the middle frame 110, the plurality of first connection points 1411 may be distributed in an array. Alternatively, the first connection point 1411 may be an integral solder joint covering a middle region of the component body 121.

Another possible implementation is: at least one heat conducting structural member 130 is disposed on a side of the middle frame 110 facing the shielding component 122, the heat conducting structural member 130 disposed on a side of the middle frame 110 facing the shielding component 122 is used as a second heat conducting structural member 132, and a second connection layer 142 is disposed between each second heat conducting structural member 132 and the middle frame 110.

Thus, at least one second heat-conducting structural member 132 is disposed on a side of the middle frame 110 facing the shielding assembly 122, and a second connection layer 142 is disposed between each second heat-conducting structural member 132 and the middle frame 110, and the second heat-conducting structural member 132 can be connected to the side of the middle frame 110 facing the shielding assembly 122 through the second connection layer 142.

The second connection layer 142 may include: at least one second connection point 1421 is provided, wherein at least one second connection point 1421 is provided between each second thermally conductive structural member 132 and the middle frame 110. Specifically, one, two, three, four, or more second connection points 1421 may be provided between each second heat conductive structural member 132 and the middle frame 110.

The second connection point 1421 has any one of a circular shape, a rectangular shape, and a triangular shape. Moreover, when the second connection layer 142 includes a plurality of second connection points 1421, that is, a plurality of second connection points 1421 are disposed between the second heat conductive structural member 132 and the middle frame 110, the plurality of second connection points 1421 may be distributed in an array.

Yet another possible implementation is: at least one heat conducting structural member 130 is arranged on one surface of the shielding assembly 122, which faces away from the component body 121, the heat conducting structural member 130 positioned on one surface of the shielding assembly 122, which faces away from the component body 121, is used as a third heat conducting structural member 133, and a third connecting layer 143 is arranged between each third heat conducting structural member 133 and the shielding assembly 122.

In this way, at least one third heat conduction structural member 133 is disposed on a surface of the shielding component 122 facing away from the component body 121, a third connection layer 143 is disposed between each third heat conduction structural member 133 and the shielding component 122, and the third heat conduction structural member 133 can be connected to a surface of the shielding component 122 facing away from the component body 121 through the third connection layer 143.

The third connection layer 143 may include: at least one third connection point 1431 is provided between each third heat conductive structure 133 and the middle frame 110. Specifically, one, two, three, four or more third connection points 1431 may be provided between each third heat conductive structure 133 and the middle frame 110.

The third connection point 1431 is any one of a circular shape, a rectangular shape, or a triangular shape. Furthermore, when the third connection layer 143 includes a plurality of third connection points 1431, that is, a plurality of third connection points 1431 are disposed between the third heat conductive structure 133 and the middle frame 110, the plurality of third connection points 1431 may be distributed in an array.

Yet another possible implementation is: at least one heat conducting structural member 130 is arranged on the surface, facing the component body 121, of the shielding assembly 122, the heat conducting structural member 130 located on the surface, facing away from the component body 121, of the shielding assembly 122 is used as a fourth heat conducting structural member 134, and a fourth connecting layer 144 is arranged between each fourth heat conducting structural member 134 and the shielding assembly 122.

In this way, at least one fourth heat conduction structural member 134 is disposed on a surface of the shielding component 122 facing the component body 121, and a fourth connection layer 144 is disposed between each fourth heat conduction structural member 134 and the shielding component 122, where the fourth heat conduction structural member 134 can be connected to a surface of the shielding component 122 facing the component body 121 through the fourth connection layer 144.

The fourth connection layer 144 may include: at least one fourth connection point 1441 is provided between each fourth thermally conductive structure 134 and the middle frame 110, wherein at least one fourth connection point 1441 is provided. Specifically, one, two, three, four, or more fourth connection points 1441 may be provided between each fourth thermally conductive structure 134 and the middle frame 110.

The fourth connection point 1441 is any one of a circle, a rectangle, or a triangle. Furthermore, when the fourth connecting layer 144 includes a plurality of fourth connecting points 1441, that is, a plurality of fourth connecting points 1441 are disposed between the fourth heat conductive structural member 134 and the middle frame 110, the plurality of fourth connecting points 1441 may be distributed in an array.

It should be noted that, in the embodiment of the present application, only any one of the first heat conduction structural member 131, the second heat conduction structural member 132, the third heat conduction structural member 133 and the fourth heat conduction structural member 134 may be provided, or any two or three of the first heat conduction structural member 131, the second heat conduction structural member 132, the third heat conduction structural member 133 and the fourth heat conduction structural member 134 may be provided at the same time, however, in some embodiments, the first heat conduction structural member 131, the second heat conduction structural member 132, the third heat conduction structural member 133 and the fourth heat conduction structural member 134 may be provided at the same time, and the embodiment of the present application is not limited thereto.

On the basis of the above embodiment, as shown in fig. 7, a first thermal conductive adhesive layer 151 may be disposed between the middle frame 110 and the shielding member 122. By providing the first heat conductive adhesive layer 151 between the middle frame 110 and the shielding member 122, the heat transfer capability between the middle frame 110 and the shielding member 122 can be further improved, and thus the heat dissipation effect of the component body 121 can be improved.

As shown in fig. 11, the front projection of the connection layer 140 on the component body 121 may at least partially overlap with the front projection of the first thermal conductive adhesive layer 151 on the component body 121. That is, the front projection of the connection layer 140 on the component body 121 may be overlapped with the front projection of the first thermal conductive adhesive layer 151 on the component body 121, or may be partially overlapped.

Alternatively, as shown in fig. 12 and 13, the front projection of the connection layer 140 on the component body 121 may not overlap with the front projection of the first thermal adhesive layer 151 on the component body 121, for example, the front projection of the connection layer 140 on the component body 121 may be located inside the front projection area of the first thermal adhesive layer 151 on the component body 121.

That is, the first heat conductive adhesive layer 151 may partially cover the second heat conductive structural member 132 or the third heat conductive structural member 133, or may be coated on the peripheral area of the second heat conductive structural member 132 or the third heat conductive structural member 133, which is not limited in the embodiment of the present application.

At least one of the second and third heat conductive structures 132 and 133 may be encased within the first heat conductive adhesive layer 151. For example, the second heat conductive structural member 132 may be wrapped in the first heat conductive adhesive layer 151, or the third heat conductive structural member 133 may be wrapped in the first heat conductive adhesive layer 151, or both the second heat conductive structural member 132 and the third heat conductive structural member 133 may be wrapped in the first heat conductive adhesive layer 151.

Because the second heat conduction structural member 132 is located on the side of the middle frame 110 facing the shielding component 122, the third heat conduction structural member 133 is located on the side of the shielding component 122 facing away from the component body 121, the second heat conduction structural member 132 and the third heat conduction structural member 133 are located between the middle frame 110 and the shielding component 122, and if the second heat conduction structural member 132 is wrapped in the first heat conduction structural member 151, the first heat conduction structural member 151 can prevent the second heat conduction structural member 132 melted during the operation heating of the electronic equipment from flowing everywhere, so that the second heat conduction structural member 132 can not overflow to other areas to cause the short circuit failure of the electronic equipment during the operation heating of the electronic equipment can be ensured.

If the third heat conduction structural member 133 is wrapped in the first heat conduction adhesive layer 151, the first heat conduction adhesive layer 151 can prevent the third heat conduction structural member 133 melted during the operation and heating of the electronic device from flowing everywhere, and further can ensure that the third heat conduction structural member 133 cannot overflow to other areas to cause the short circuit failure of the electronic device during the operation and heating of the electronic device.

If the second heat conduction structural member 132 and the third heat conduction structural member 133 are wrapped in the first heat conduction adhesive layer 151, the first heat conduction adhesive layer 151 can prevent the second heat conduction structural member 132 and the third heat conduction structural member 133 which are melted when the electronic equipment works and heats from flowing everywhere, and further can ensure that the second heat conduction structural member 132 and the third heat conduction structural member 133 can not overflow to other areas to cause short circuit failure of the electronic equipment when the electronic equipment works and heats.

Alternatively, in some embodiments, the first heat conductive adhesive layer 151 may avoid the second heat conductive structural member 132 and the third heat conductive structural member 133, for example, the first heat conductive adhesive layer 151 may include a first portion 1511 and a second portion 1512 that are spaced apart from each other, and the second heat conductive structural member 132 and the third heat conductive structural member 133 may be located within the space formed by the first portion 1511 and the second portion 1512, where the first heat conductive adhesive layer 151 still can function to block the second heat conductive structural member 132 and the third heat conductive structural member 133 from flowing around.

In an embodiment of the present application, the orthographic projection of the second heat conductive structural member 132 on the component body 121 may at least partially overlap with the orthographic projection of the first heat conductive adhesive layer 151 on the component body 121.

The orthographic projection of the second heat conduction structural member 132 on the component body 121 and the orthographic projection of the first heat conduction adhesive layer 151 on the component body 121 are at least partially overlapped, so that at least part of the second heat conduction structural member 132 can be ensured to be wrapped in the first heat conduction adhesive layer 151, and the first heat conduction adhesive layer 151 can prevent the melted second heat conduction structural member 132 from flowing everywhere when the electronic equipment works and heats.

The orthographic projection of the third heat-conducting structural member 133 on the component body 121 may at least partially overlap with the orthographic projection of the first heat-conducting adhesive layer 151 on the component body 121, and the orthographic projection of the third heat-conducting structural member 133 on the component body 121 and the orthographic projection of the first heat-conducting adhesive layer 151 on the component body 121 may at least partially overlap, so that it may be ensured that at least part of the third heat-conducting structural member 133 is wrapped in the first heat-conducting adhesive layer 151, and further the first heat-conducting adhesive layer 151 may prevent the melted third heat-conducting structural member 133 from flowing everywhere when the electronic device heats during working.

In one possible implementation, the orthographic projection of the second heat conductive structural member 132 on the component body 121 may be located within the orthographic projection of the first heat conductive adhesive layer 151 on the component body 121. The orthographic projection of the second heat conduction structural member 132 on the component body 121 is located in the orthographic projection of the first heat conduction adhesive layer 151 on the component body 121, so that the second heat conduction structural member 132 can be ensured to be completely wrapped in the first heat conduction adhesive layer 151, and further the first heat conduction adhesive layer 151 can completely prevent the melted second heat conduction structural member 132 from flowing everywhere when the electronic equipment works and heats.

The orthographic projection of the third heat conductive structural member 133 on the component body 121 may be located in the orthographic projection of the first heat conductive adhesive layer 151 on the component body 121. The orthographic projection of the third heat conduction structural member 133 on the component body 121 is located in the orthographic projection of the first heat conduction adhesive layer 151 on the component body 121, so that the third heat conduction structural member 133 can be ensured to be completely wrapped in the first heat conduction adhesive layer 151, and further the first heat conduction adhesive layer 151 can completely prevent the melted third heat conduction structural member 133 from flowing everywhere when the electronic equipment works and heats.

In addition, the total thickness of the second heat conductive structural member 132 and the second connection plating layer may be equal to or less than the thickness of the first heat conductive adhesive layer 151. By designing the total thickness of the second heat conductive structural member 132 and the second connection plating layer to be equal to or less than the thickness of the first heat conductive adhesive layer 151, it is possible to avoid the problem that the first heat conductive adhesive layer 151 cannot wrap the second heat conductive structural member 132 and the second connection plating layer.

The total thickness of the third heat conductive structural member 133 and the third connection plating layer may be equal to or less than the thickness of the first heat conductive adhesive layer 151. By designing the total thickness of the third heat conductive structural member 133 and the third connection plating layer to be equal to or less than the thickness of the first heat conductive adhesive layer 151, it is possible to avoid the problem that the first heat conductive adhesive layer 151 cannot wrap the third heat conductive structural member 133 and the third connection plating layer.

In addition, in the embodiment of the present application, a second thermal conductive adhesive layer 152 may be disposed between the shielding assembly 122 and the component body 121. By providing the second thermal conductive adhesive layer 152 between the shielding member 122 and the component body 121, the heat transfer capability between the shielding member 122 and the component body 121 can be further improved, and thus the heat dissipation effect of the component body 121 can be improved.

The fourth thermally conductive structure 134 may be encased within a second thermally conductive adhesive layer 152. Because the fourth heat conduction structural member 134 is located on the surface of the shielding component 122 facing the component body 121, the fourth heat conduction structural member 134 is located between the shielding component 122 and the component body 121, and the second heat conduction adhesive layer 152 is arranged between the shielding component 122 and the component body 121, if the fourth heat conduction structural member 134 is wrapped in the second heat conduction adhesive layer 152, the second heat conduction adhesive layer 152 can prevent the fourth heat conduction structural member 134 melted during the working and heating of the electronic equipment from flowing everywhere, and further can ensure that the fourth heat conduction structural member 134 cannot overflow to other areas to cause the short circuit failure of the electronic equipment during the working and heating of the electronic equipment.

Alternatively, in some embodiments, the second thermal conductive adhesive layer 152 may avoid the fourth thermal conductive structural member 134, for example, the second thermal conductive adhesive layer 152 may include a third portion 1521 and a fourth portion 1522 that are spaced apart from each other, and the fourth thermal conductive structural member 134 may be located in the space formed by the third portion 1521 and the fourth portion 1522, where the second thermal conductive adhesive layer 152 may still function to block the fourth thermal conductive structural member 134 from flowing around.

In one possible implementation, the total thickness of the fourth heat conductive structural member 134 and the fourth connection layer 144 may be less than or equal to the thickness of the second heat conductive adhesive layer 152. By designing the total thickness of the fourth heat conductive structural member 134 and the fourth connection plating layer to be equal to or less than the thickness of the second heat conductive adhesive layer 152, the problem that the second heat conductive adhesive layer 152 cannot wrap the fourth heat conductive structural member 134 and the fourth connection plating layer can be avoided.

In addition, in the embodiment of the present application, the electronic device may further include: the circuit board 160, wherein the component assembly may be located on the circuit board 160, and the circuit board 160 is located on a side of the component body 121 facing away from the shielding assembly 122.

The circuit board 160 may be a printed circuit board 160 (printed circuit board, PCB), a flexible circuit board 160, an integrated circuit (or chip). In the embodiment of the present application, the circuit board 160 is taken as a PCB for illustration. Depending on the number of component bodies 121 carried on the circuit board 160, the circuit board 160 may be a single-sided board, which may refer to a single-sided component-carrying circuit board 160, or a double-sided component-carrying circuit board 160. Depending on the type of component body 121 carried on the circuit board 160, the circuit board 160 may be a Radio Frequency (RF) board or an application processor (application processor, AP) board, where the RF board may be used to carry RFIC, RFPA, WIFI chips or the like. The AP board may be used, for example, to carry SOC components, DDR memory, PMUs, auxiliary PMUs, etc.

The circuit board 160 and the component body 121 may be fixed by solder. The solder can be used for mechanical connection and/or electrical connection, and the shape of the solder can be spherical, polyhedral, ellipsoidal, truncated cone, chamfer, bar and the like, and the embodiment of the application does not limit the shape of the solder.

In addition, the circuit board 160 and the shielding assembly 122 may jointly enclose a housing cavity 1223 (see fig. 4), and the component body 121 is located in the housing cavity 1223. The component body 121 is located in the accommodating cavity 1223 formed by enclosing the circuit board 160 and the shielding component 122, so that the component body 121 can be isolated from other electronic components in the electronic equipment, and further, the interference of the other electronic components in the electronic equipment to the component body 121 can be avoided

In some embodiments, the accommodating cavity 1223 may be a closed cavity, so that the component body 121 is located in the closed cavity, and further, the influence of external conditions on the component body 121 can be avoided, for example, oxidation corrosion of the component body 121 caused by air can be avoided.

In addition, the second heat conduction structural member 132 and the third heat conduction structural member 133 may be an integral piece, that is, the second heat conduction structural member 132 and the third heat conduction structural member 133 may together form an integral heat conduction structural member 1301 (see fig. 14), specifically, the second heat conduction structural member 132 and the third heat conduction structural member 133 contact each other in the assembly process, and after being heated, melt to form the integral heat conduction structural member 1301 that is mutually communicated. Through setting the second heat conduction structural member 132 and the third heat conduction structural member 133 as an integral part, the structural strength of the integral heat conduction structural member 1301 can be improved, and the heat conduction speed between the middle frame 110 and the shielding assembly 122 can be improved, so that the heat dissipation efficiency of the component body 121 is further improved.

An integral heat conducting structural member 1301 may also be disposed between the component body 121 and the shielding component 122, in fig. 14, a fifth connection layer 145 is disposed on a surface of the component body 121 facing the shielding component 122, a fourth connection layer 144 is disposed on a surface of the shielding component 122 facing the component body 121, and the heat conducting structural member disposed on the fifth connection layer 145 and the fourth heat conducting structural member disposed on the fourth connection layer 144 may form an integral heat conducting structural member 1301 together. In this way, the heat conduction speed between the component body 121 and the shield member 122 can be increased.

The fifth connection layer 145 may include: at least one fifth connection point 1451 is provided, wherein at least one fifth connection point 1451 is provided between the heat conductive structure on the fifth connection layer 145 and the middle frame 110. In particular, one, two, three, four or more fifth connection points 1451 may be provided between the heat conductive structure 134 and the middle frame 110 on the fifth connection layer 145.

The fifth connection point 1451 is any one of circular, rectangular, or triangular in shape. Furthermore, when the fifth connection layer 145 includes a plurality of fifth connection points 1451, that is, a plurality of fifth connection points 1451 are disposed between the heat conductive structural member on the fifth connection layer 145 and the middle frame 110, the plurality of fifth connection points 1451 may be distributed in an array.

In addition, the process steps of several methods of manufacturing the thermally conductive structure 130 on the middle frame 110 or the shielding assembly 122 are described in the embodiments of the present application. Specifically, the heat conductive structural member 130 is provided on the middle frame 110 as an example.

The first method of making the thermally conductive structure 130 is: first, as shown in fig. 15A, a middle frame 110 is provided, a connection layer 140 is disposed on one surface of the middle frame 110 (see fig. 15B), specifically, an integrally platable layer may be formed on the middle frame 110, next, as shown in fig. 15C, an insulating layer 240 is disposed on a surface of the connection layer 140 facing away from the middle frame 110, an opening 241 is formed on the insulating layer 240 to expose the connection layer 140 (see fig. 15D), and then, as shown in fig. 15E, a heat conducting structural member 130 is disposed in the opening 241, for example, a heat conducting structural member 130 may be formed by printing solder paste or reflowing a spot tin.

The second method of making the thermally conductive structure 130 is: first, as shown in fig. 16A, a middle frame 110 is provided, a connection layer 140 is disposed on one surface of the middle frame 110 (see fig. 16B), specifically, a platable solder layer may be disposed by using an electric welding process to form the connection layer 140, then, as shown in fig. 16C, a heat conductive structural member 130 is directly disposed on a surface of the connection layer 140 facing away from the middle frame 110, for example, a printed solder paste or a spot tin reflow manner may be used to form the heat conductive structural member 130.

The third method for manufacturing the heat conductive structural member 130 is: firstly, as shown in fig. 17A, the middle frame 110 is provided, insulating layers 240 are provided on both sides of the middle frame 110 (see fig. 17B), an opening 241 is provided on one of the insulating layers 240 (see fig. 17C), after development or laser treatment, the insulating layers are washed with acid or water, then, as shown in fig. 17D, a connection point 1401 is provided in the opening 241, at this time, the connection point 1401 is a welding point, specifically, a platable layer may be provided by using an electroplating process to form the connection point 1401, then, a heat conducting structural member 130 is provided on a side of the connection point 1401 facing away from the middle frame 110 in a manner of printing solder paste or spot tin reflow (see fig. 17E), finally, as shown in fig. 17F, the insulating layers 240 may be removed according to actual requirements.

The fourth method for manufacturing the heat conductive structural member 130 is: first, as shown in fig. 18A, the middle frame 110 is provided, insulating layers 240 are provided on both sides of the middle frame 110 (see fig. 18B), an opening 241 is provided in one of the insulating layers 240 (see fig. 18C), after development or laser treatment, the insulating layers are washed with acid or water, then, as shown in fig. 18D, a connection point 1401 is provided in the opening 241, at this time, the connection point 1401 is a welding point, specifically, a platable layer may be provided by using an electroplating process to form the connection point 1401, then, a heat conductive structural member 130 is provided on a side of the connection point 1401 facing away from the middle frame 110 in a co-deposition or layered electroplating manner (see fig. 18E) or a partial thermocompression bonding manner (see fig. 18F), and finally, the insulating layers 240 are removed.

A fifth method of making the thermally conductive structure 130 is: the heat conductive structural member 130 is directly and partially adhered to the middle frame 110, specifically, the connection layer 140 is an adhesive layer, and as shown in fig. 19, the heat conductive structural member 130 is connected to the middle frame 110 through the adhesive layer.

The following describes the process for preparing the second heat conductive structural member 132, the third heat conductive structural member 133 and the fourth heat conductive structural member 134 when the first heat conductive adhesive layer 151 and the second heat conductive adhesive layer 152 cover the second heat conductive structural member 132, the third heat conductive structural member 133 and the fourth heat conductive structural member 134.

First, as shown in fig. 20A, a second heat conductive adhesive layer 152 is disposed on a surface of the component body 121 facing away from the circuit board 160, then, as shown in fig. 20B, a third heat conductive structural member 133 and a fourth heat conductive structural member 134 are disposed on two surfaces of the shielding cover 1222, and the shielding cover 1222 is connected to the shielding frame 1221, meanwhile, a middle frame 110 (see fig. 20C) provided with the second heat conductive structural member 132 is provided, then, as shown in fig. 20D, a first heat conductive adhesive layer 151 is disposed on a surface of the middle frame 110 having the second heat conductive structural member 132, and finally, the middle frame 110 is assembled to form a plate-type structure shown in fig. 20E.

Next, a process for manufacturing the second heat conductive structural member 132, the third heat conductive structural member 133, and the fourth heat conductive structural member 134 is described when the first heat conductive adhesive layer 151 and the second heat conductive adhesive layer 152 avoid the second heat conductive structural member 132, the third heat conductive structural member 133, and the fourth heat conductive structural member 134.

First, as shown in fig. 21A, a third portion 1521 and a fourth portion 1522 are disposed on a side of the component body 121 facing away from the circuit board 160, then, as shown in fig. 21B, a third heat conductive structural member 133 and a fourth heat conductive structural member 134 are disposed on both sides of the shield cover 1222, respectively, the third heat conductive structural member 133 and the fourth heat conductive structural member 134 do not interfere with each other with the third portion 1521 and the fourth portion 1522, and the shield cover 1222 is connected to the shield frame 1221 while providing the middle frame 110 (see fig. 21C), then, as shown in fig. 21D, a first portion 1511 and a second portion 1512 are disposed on a side of the middle frame 110, and finally, the middle frame 110 is assembled to form a plate-type structure shown in fig. 21E.

In some embodiments, as shown in fig. 22, the electronic device may further include: the sub-circuit board 161 and the frame board 162, and the circuit board 160 may jointly enclose to form a accommodating cavity 1223, and the component body 121 is located in the accommodating cavity 1223. That is, the sub-circuit board 161 and the frame board 162 replace the original shielding component 122, at this time, the side of the frame board 162 facing away from the component body 121 may be provided with the third heat conduction structural member 133, and the side of the frame board 162 facing toward the component body 121 may be provided with the fourth heat conduction structural member 134.

In addition, the heat-conducting structure member 130 may be applied to the inside of the chip package, for example, in fig. 23, the heat-conducting structure member 130 may be disposed on a side of the metal shell 250 facing the chip (i.e., the component body 121), or in fig. 24, the heat-conducting structure member 130 may be disposed on both a side of the metal shell 250 facing the chip (i.e., the component body 121) and a side of the metal shell 250 facing away from the chip (i.e., the component body 121).

In addition, in the embodiment of the present application, a third thermal conductive adhesive layer 251 may be disposed between the metal case 250 and the component body 121. By providing the third heat conductive adhesive layer 251 between the metal case 250 and the component body 121, the heat transfer capability between the metal case 250 and the component body 121 can be further improved, and thus the heat dissipation effect of the component body 121 can be improved.

The heat conductive structure 130 may be encased within a third heat conductive glue layer 251. Because the heat conduction structural member 130 is located on the surface of the metal shell 250 facing the component body 121, the heat conduction structural member 130 is located between the metal shell 250 and the component body 121, and the third heat conduction adhesive layer 251 is arranged between the metal shell 250 and the component body 121, if the heat conduction structural member 130 is wrapped in the third heat conduction adhesive layer 251, the third heat conduction adhesive layer 251 can prevent the melted heat conduction structural member 130 from flowing everywhere when the electronic equipment works and heats, and further can ensure that the heat conduction structural member 130 cannot overflow to other areas to cause short circuit failure of the electronic equipment when the electronic equipment works and heats.

Alternatively, in some embodiments, the third heat conductive adhesive layer 251 may avoid the heat conductive junction member 130, for example, the third heat conductive adhesive layer 251 may include a fifth portion and a sixth portion (not shown) that are spaced apart from each other, and the heat conductive structural member 130 may be located in a space formed by the fifth portion and the sixth portion, where the third heat conductive adhesive layer 251 may still function to block the heat conductive structural member 130 from flowing around.

It should be noted that, in the embodiment of the present application, the heat conductive structural member 130 may also be disposed on the support of the circuit board 160 and the vapor chamber in the mobile phone 100, which is not limited in the embodiment of the present application.

It should be understood that the structure illustrated in the embodiments of the present application is not limited to the specific embodiment of the mobile phone 100. In other embodiments of the application, the handset 100 may include more or fewer components than shown, or certain components may be combined, or certain components may be split, or different arrangements of components. For example, the cell phone 100 may also include cameras (e.g., front and rear cameras) and flash lights.

In describing embodiments of the present application, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "coupled" should be construed broadly, and may be, for example, fixedly coupled, indirectly coupled through an intermediary, in communication between two elements, or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to specific circumstances.

The embodiments of the application may be implemented or realized in any number of ways, including as a matter of course, such that the apparatus or elements recited in the claims are not necessarily oriented or configured to operate in any particular manner. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more unless specifically stated otherwise.

The terms first, second, third, fourth and the like in the description and in the claims and in the above-described figures, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the application described herein may be implemented, for example, in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "may include" and "have," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: the foregoing embodiments are merely for illustrating the technical solution of the embodiments of the present application, and are not limited thereto, and although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical schemes described in the foregoing embodiments may be modified or some or all of the technical features may be replaced equivalently, and these modifications or replacements do not make the essence of the corresponding technical schemes deviate from the scope of the technical schemes of the embodiments of the present application.

Claims

1. An electronic device, comprising at least:

a middle frame and a component assembly;

the component assembly includes: the middle frame is positioned at one side of the shielding component, which is away from the component body;

at least one heat conduction structural member is arranged on at least one of the shielding assembly and the middle frame, and the melting point of the heat conduction structural member is 40-60 ℃.

2. The electronic device of claim 1, wherein the number of thermally conductive structures is one;

the orthographic projection of the heat conduction structural member on the middle frame is at least partially overlapped with the orthographic projection of the component body on the middle frame.

3. The electronic device of claim 1, wherein the number of thermally conductive structures is a plurality, the plurality of thermally conductive structures being spaced apart on the shield assembly or the center;

and at least one orthographic projection of the heat conduction structural member in the plurality of heat conduction structural members on the middle frame is at least partially overlapped with orthographic projection of the component body on the middle frame.

4. The electronic device of any of claims 1-3, wherein an orthographic projection of each of the thermally conductive structures on the center is within an orthographic projection of the component body on the center.

5. The electronic device of any of claims 1-4, wherein the thermally conductive structure is made of a material comprising one or more of tin, indium, bismuth, and gallium.

6. The electronic device of any of claims 1-5, wherein a connection layer is provided between the thermally conductive structure and the shielding assembly or the center.

7. The electronic device of claim 6, wherein a projected area of the connection layer on the center is smaller than a projected area of the component body on the center.

8. The electronic device of claim 6 or 7, wherein the connection layer comprises: at least one connection point;

at least one connection point is arranged between each heat conduction structural member and the shielding assembly or the middle frame;

and the shape of the connecting point is any one of a circle, a rectangle or a triangle.

9. The electronic device of claim 8, wherein when the connection layer includes a plurality of connection points, the plurality of connection points are distributed in an array.

10. The electronic device of any of claims 6-9, wherein the connection layer is a plating layer or an adhesive layer.

11. The electronic device of claim 10, wherein the plating layer is made of one or more of nickel, copper, tin, zinc, silver, and gold.

12. The electronic device of any one of claims 6-11, wherein at least one of the thermally conductive structures is disposed on a side of the center frame facing away from the shielding assembly;

the heat conduction structural members positioned on one surface of the middle frame, which is away from the shielding assembly, are first heat conduction structural members, and a first connecting layer is arranged between each first heat conduction structural member and the middle frame.

13. The electronic device of any one of claims 6-12, wherein at least one of the thermally conductive structures is disposed on a side of the center toward the shielding assembly;

the heat conduction structural members positioned on one surface of the middle frame, facing the shielding assembly, are second heat conduction structural members, and a second connecting layer is arranged between each second heat conduction structural member and the middle frame.

14. The electronic device of claim 13, wherein at least one of the thermally conductive structures is disposed on a side of the shielding assembly facing away from the component body;

the heat conduction structural members positioned on one surface of the shielding component, which is far away from the component body, are third heat conduction structural members, and a third connecting layer is arranged between each third heat conduction structural member and the shielding component.

15. The electronic device of claim 14, wherein a first layer of thermally conductive adhesive is disposed between the middle frame and the shielding assembly;

at least one of the second and third thermally conductive structures is encased within the first thermally conductive adhesive layer.

16. The electronic device of claim 15, wherein an orthographic projection of the second thermally conductive structure on the component body at least partially overlaps an orthographic projection of the first thermally conductive glue layer on the component body;

The orthographic projection of the third heat conduction structural member on the component body is at least partially overlapped with the orthographic projection of the first heat conduction adhesive layer on the component body.

17. The electronic device of claim 16, wherein an orthographic projection of the second thermally conductive structure on the component body is within an orthographic projection of the first thermally conductive adhesive layer on the component body;

the orthographic projection of the third heat conduction structural member on the component body is positioned in the orthographic projection of the first heat conduction adhesive layer on the component body.

18. The electronic device of any of claims 15-17, wherein a total thickness of the second thermally conductive structural member and the second connection plating layer is less than or equal to a thickness of the first thermally conductive adhesive layer;

and the total thickness of the third heat conduction structural member and the third connecting coating is smaller than or equal to the thickness of the first heat conduction adhesive layer.

19. The electronic device of any one of claims 6-18, wherein at least one of the thermally conductive structures is disposed on a side of the shielding assembly facing the component body;

the heat conduction structural members positioned on one surface of the shielding component, which is far away from the component body, are fourth heat conduction structural members, and a fourth connecting layer is arranged between each fourth heat conduction structural member and the shielding component.

20. The electronic device of claim 19, wherein a second layer of thermally conductive glue is disposed between the shielding assembly and the component body;

the fourth heat conduction structural member is wrapped in the second heat conduction adhesive layer.

21. The electronic device of claim 20, wherein a total thickness of the fourth thermally conductive structural member and the fourth connection layer is less than or equal to a thickness of the second thermally conductive adhesive layer.

22. The electronic device of any one of claims 1-21, further comprising: a circuit board; the component assembly is positioned on the circuit board, and the circuit board is positioned on one side of the component body, which is away from the shielding assembly;

the circuit board and the shielding assembly enclose to form a containing cavity, and the component body is positioned in the containing cavity.