KR20040031805A - A single unit antenna rf module forbluetooth - Google Patents

Abstract

PURPOSE: An antenna integrated RF module is provided to achieve improved productivity and reducing manufacturing costs by simplifying the board structure and board assembly process. CONSTITUTION: An antenna integrated RF module comprises a module board(10) having a side mounted with a semiconductor chip(111) and a flash memory(112) and the other side where a ground portion(12) is formed; a connection unit(20) extended in a vertical direction from the outer end of the module board toward a main board(P) in such a manner that the components of the module board do not contact the upper surface of the main board; and a patch antenna(30) grounded to the ground portion of the module board, wherein the patch antenna has a patch electrode(31) arranged in the ground portion of the module board and connected to the components of the main board through a strip line so as to transmit/receive a data file.

Description

Antenna integrated RF module for Bluetooth {A SINGLE UNIT ANTENNA RF MODULE FORBLUETOOTH}

The present invention relates to an RF module that is integrally mounted to the antenna to be installed in the Bluetooth, more specifically, to reduce the occupied space of the antenna to be installed on the module substrate can be miniaturized design of the finished product, work by simplifying the board structure and assembly process The present invention relates to an antenna integrated RF module for Bluetooth, which has been greatly improved to improve productivity and increase the transmit / receive rate of the antenna to further improve product performance.

In general, Bluetooth is one communication means that can replace mechanically weak and inconvenient wired cable between communication devices, which enables instant networking and voice communication between small mobile devices such as mobile phones and PDAs and laptops. On the other hand, the scope of application is expanding to a variety of devices such as digital cameras, digital camcorders, joysticks, PDAs, as well as mobile phones, wireless headsets, LAN access point.

This Bluetooth consists of a small PCB with an RF module, baseband processor, flash and its peripheral circuitry and antenna for easy mounting on the motherboard.

That is, the semiconductor chip 111, the flash memory 112, and various types of chip components 113 are mounted on the top surface of the Bluetooth main board P as shown in Figs. 1A and 1B. The printed circuit board (PCB) 110 printed with various printed patterns, and harmful electromagnetic waves generated from electronic components on the PCB 110 are prevented from being radiated to the outside while protecting them on the PCB 110. An RF module (Radio Frequency Module) 100 consisting of a cover 120 to be assembled in, and an antenna for transmitting and receiving a wideband signal were installed.

In addition, as shown in FIG. 2, a rectangular chip antenna may be more easily connected between the semiconductor chip 111 mounted on the PCB 110 and the antenna mounted on the main board P. FIG. The RF module 100, which is integrally assembled and assembled on the PCB 110 on which the semiconductor chip 111 is mounted, has been used in the main board P of Bluetooth.

However, when the main board P is designed to miniaturize the Bluetooth, the occupied area of the antenna mounted on the main board P and the chip anna 130 mounted on the PCB 110 occupy the occupied area. There was a limiting problem in miniaturizing the parts.

In addition, assembling the cover 120 on the PCB 110 in the line for assembling the RF module 100, the lead 124 is formed to extend directly below and to the left and right edges of the cover 120 and The grooves 114 formed in the center of the plurality of grooves 114 coated with a copper film are formed in a semi-circular cross section at left and right edges of the PCB 10 and are easily connected to the main board P. After the correspondence, solder (S) was formed by soldering with a lead solder (Pb) powder, tin (Sn) powder and a special solder (FLUX) by a cream soldering method using a cream solder liquid. In addition, the lead 128 formed on the front and rear edges of the cover 120 and another groove 128 of the PCB 110 are also soldered to form the soldering portion S by the same cream soldering method as described above. The cover 120 was assembled on 110.

However, in the conventional operation of assembling the cover 120 on the PCB 110 as described above, after soldering the PCB 110 first on the main board P, each lead of the cover 120 ( Soldering the 124 and 128 to the grooves 114 and 118 is very cumbersome and complicated, which lowers the productivity of the work and increases the manufacturing cost.

In addition, the cream soldering operation has a problem that the front and rear, left and right borders of the PCB 110 and the electronic components mounted on the PCB 110 are damaged by the cream solder liquid or damaged by the heat source generated during soldering.

In addition, by reducing the height of the RF module 100 by the height of the cover 120 assembled to the PCB 110, there was a limitation in designing a miniaturized Bluetooth finished product.

Therefore, the present invention has been proposed to solve the conventional problems as described above, the object of which is to reduce the occupied space occupied by the antenna mounted on the module substrate can be miniaturized the product, reducing the number of assembly parts to reduce the manufacturing cost The price competitiveness of the finished product can be increased, and the antenna integrated RF module for Bluetooth can be improved to improve the product performance by increasing the transmit / receive rate of the antenna.

Figure 1 (a) (b) is an exploded view and assembly view showing an RF module employed in the general Bluetooth,

2 is an assembly diagram in which a chip antenna is installed in an RF module employed in a general Bluetooth device;

3 is a configuration diagram showing a first embodiment of an antenna integrated RF module for Bluetooth according to the present invention;

Figure 4 is a block diagram showing a second embodiment of the antenna integrated RF module for Bluetooth according to the present invention.

Explanation of symbols on the main parts of the drawings

10 ...... Module board 10a ..... LTCC

20 ..... Connections 12, 12a ... Ground

14 ...... Terminal electrode 15 .....

21 ...... ceramic terminal 24 ..... surface electrode

30 .. fetch antenna 31 ..... fetch electrode

P ....... Mainboard C ...... Connector

As a technical configuration for achieving the above object, the present invention,

In the Bluetooth having a connector connected to the data transmission and reception unit at one end of the motherboard to be mounted on the data transmission and reception unit of information communication devices such as PC, PDA and printer, to wirelessly transmit and receive data files,

A module substrate having a semiconductor chip and a flash memory mounted on one side thereof and a ground portion formed on the other side thereof;

A connection portion extending vertically vertically from the outer end of the module board to the main board so that the parts of the module board correspond to each other while maintaining a predetermined interval not contacting the upper surface of the main board;

And a fetch antenna which is grounded to the ground of the module substrate and has a fetch electrode connected to a part of the main substrate and a stripline on the ground of the module substrate to transmit and receive data files. By providing an antenna integrated RF module.

Hereinafter, the present invention will be described in more detail.

3 is a block diagram showing a first embodiment of an antenna integrated RF module for Bluetooth according to the present invention, the RF module 1 of the present invention is a short-range communication means for transmitting and receiving data files in the wireless communication period; It is equipped on the main board (P) consisting of a module substrate 10, the connecting portion 20 and the pech antenna 30 to enable the miniaturization of the, and to lower the manufacturing cost.

That is, the main board (P) is equipped with a connector (C) connected to the data transmission and reception unit at one end so as to be mounted on the data transmission and reception unit of information communication devices such as PC, PDA and printer to wirelessly transmit and receive data files. It is housed in a casing S constituting the appearance of Bluetooth.

In addition, a semiconductor chip 111 and a flash memory 112 are mounted on one side of the module substrate 10, and the other side of the module substrate 10 is a ground part 12 that is a ground electrode such that the fetch antenna 30 is connected to the ground. ) Is formed.

Here, the module substrate 10 is a printed wiring board having a conductor pattern formed on at least three layers, including a surface conductor layer separated and bonded by an insulating material between layers, and the printed wiring board (PCB) is made of a phenol resin insulating plate or an epoxy resin insulating plate. It is equipped with a multilayer board manufactured by attaching a thin plate of copper or the like on one side, and then etching it according to the wiring pattern of the circuit to form a necessary circuit and drilling holes for attaching and mounting components.

In addition, the connecting portion 20 disposed between the module substrate 10 and the main board P may include electronic components such as a semiconductor chip 111 and a flash memory 112 mounted on one side of the module substrate 10. Ceramic member connecting the module substrate 10 and the main board (P) with each other so that they are located on a vertical line while maintaining a predetermined interval (about 1.3mm) does not contact the upper surface of the main board (P) to be.

In addition, the connection part 20 is connected to the lower end of the conductive pattern formed on the upper surface of the main board (P), the terminal electrode 14 and the upper end formed on the outer edge surface of the module substrate 10 A plurality of surface electrodes 24 to be soldered are formed on an outer surface thereof, and ceramics are formed in a rectangular frame shape so as to surround the semiconductor chip 111, the flash memory 112, and the chip parts provided on the module substrate 10. It may be equipped with a dummy terminal 21.

Accordingly, the conductive pattern formed on the upper surface of the main board (P) and the ceramic dummy terminal 21 of the rectangular frame shape in which one end of the terminal electrode 14 and the surface electrode 24 of the module substrate 10 are soldered and When the other end of the surface electrode 24 is soldered and mounted, the main board P, the module substrate 10 and the ceramic dummy terminal 21 surround the electronic components of the module substrate 10 from an external environment. Since a shield space is formed to protect, the electronic components can be safely protected from the external environment, and harmful electromagnetic waves and noise generated from the operation of the device can be prevented from being radiated to the outside.

In this case, the module substrate 10 is a plurality of grooves 114, 118 for forming a land of the copper foil layer for connecting with the main board (P) before, Since it is not necessary to form on the rear edges, the substrate structure can be simplified, and the cost of manufacturing the substrate can be reduced. In addition, the ceramic dummy terminal 21 is configured by replacing the ceramic material with a cheaper manufacturing cost than the cover 102 made of a metal material, and can be mass-produced in a rectangular frame shape as a mold product, thereby lowering the manufacturing cost of the finished product. It is possible to design.

In addition, the height of formation of the ceramic dummy terminal 21 is installed on the module substrate 10 so as to maintain a predetermined interval between the parts of the module substrate 10 and the upper surface of the main board (P) do not contact each other. It must be of higher size than the component with the highest height.

On the other hand, the fetch antenna (30) is a fetch electrode (31) provided on the upper surface of the uppermost sheet constituting the ground portion 12 by connecting the components and strip line (L) of the module substrate 10, and The ground electrode 32 provided on the lower surface of the uppermost sheet to face the fetch electrode transmits and receives a data file.

The length of the fetch electrode 31 is typically about 1/4 wavelength, and when resonance occurs, magnetic flux is generated in the vertical direction of the fetch electrode 31, and the direction of the electric force line is the open end of the fetch electrode 31. It occurs in a direction orthogonal to the magnetic flux flowing out from the, the planar shape of the fetch 31 may be provided in various shapes such as circular or pentagonal in addition to rectangular.

Here, the fetch antenna 30 may have a maximum unit area that is approximately the same as that of the plane of the module substrate 10 to increase the transmission and reception performance of the antenna.

On the other hand, Figure 4 is a block diagram showing a second embodiment of a Bluetooth antenna integrated RF module according to the present invention, the RF module (1a) of the present invention is a semiconductor chip 111, flash memory 112, etc. The module substrate mounted on the side is composed of Low Temperature Cofired Ceramic (LTCC) 10a, and the fetch electrode 31 and the ground electrode 32 constituting the fetch antenna 30 on the other side of the LTCC 10a. The ground portion 12a to be installed is formed.

The LTCC 10a is formed by using a screen printing process on a plurality of green sheet layers made of a ceramic material, internal electrodes such as Ag and Cu, which are excellent in electrical conductivity, and passive elements such as resistors, capacitors, and capacitors. The circuit is implemented, and each green sheet is laminated and manufactured by firing simultaneously at 1000 ° C. or less.

In addition, a connection part 20 disposed between the module board LTCC 10a and the main board P and connecting them is orthogonal to the upper surface of the main board P at right angles from an outer end of the LTCC 10a. It is laminated so as to extend a predetermined length in the direction, the lower end is composed of a laminated extension member 20a disposed on the upper surface of the main board (P), by the laminated extension member (20a) of the LTCC (10a) The electronic components such as the semiconductor chip 111, the flash memory 112, and the chip components mounted on one side of the semiconductor chip 111 maintain a predetermined interval (about 1.3 mm) that is not in contact with the upper surface of the main board P. It can be done.

In addition, the multilayer extension member 20a vertically covers a green sheet having a rectangular frame shape to enclose electronic components such as the semiconductor chip 111, the flash memory 112, and the chip component provided on the LTCC 10a. The lower end of the laminated extension member 20a, which is formed by stacking a plurality of layers and is continuously stacked, is flip-chip mounted via the bonding protrusions 15 formed on the upper surface of the main board P. It is mounted.

Accordingly, when the lower end of the laminated extension member 20a of the LTCC 10a is mounted through the conductive pattern and the bonding protrusion 15 formed on the upper surface of the main board P, the main board P, Since the shielding space for enclosing and protecting the electronic components of the LTCC 10a is formed by the LTCC 10a and the laminated extension member 20a, the electronic components of the LTCC 10a and the laminated extension member 20a are protected from the external environment and are generated therefrom. It is possible to prevent harmful electromagnetic waves and noise from radiating to the outside.

At this time, the formation height of the laminated extension member 20a of the LTCC 10a is in the LTCC 10a so that the components of the LTCC 10a and the upper surface of the main board P do not come into contact with each other. Among the plurality of parts to be installed, they must be of a higher size than the part having the maximum height.

On the other hand, the ground portion 12a of the LTTC 10a is provided with a fetch antenna 30 made up of a fetch electrode 31 and a ground electrode 32 which are connected to an electronic component through a strip line L. Send and receive

According to the present invention as described above, by forming a shield space surrounding the electronic components mounted on the module substrate or LTCC by a dummy terminal or laminated extension member made of ceramic material disposed between the main board and the module substrate or LTCC, Substrate mounted on the main board by the primary soldering operation by replacing the conventional metal cover which protects the electronic components from the external environment and prevents harmful electromagnetic waves and noises emitted from the operation during the operation. It eliminates the need for secondary soldering of the cover to cover the surface, and at the same time enables mass production of inexpensive ceramic materials, thereby simplifying the substrate structure and substrate assembly process to improve work productivity and reduce the manufacturing cost of finished products. Effect is obtained.

In addition, by installing a fetch antenna on the opposite side of the substrate on which the electronic component is mounted on one side, a board design that does not require a separate occupied space in which an antenna is installed on the same plane of the main board and the substrate is possible. On the other hand, since the size of the finished product can be made smaller, and the area of the fetch antenna can be increased to the same size as the other side of the substrate, the effect of remarkably improving the performance of the antenna is obtained.

While the invention has been shown and described with respect to specific embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit or scope of the invention as set forth in the claims below. I would like to clarify that knowledge is easy to know.

Claims (9)

In the Bluetooth having a connector connected to the data transmission and reception unit at one end of the motherboard to be mounted on the data transmission and reception unit of information communication devices such as PC, PDA and printer, to wirelessly transmit and receive data files, A module substrate having a semiconductor chip and a flash memory mounted on one side thereof and a ground portion formed on the other side thereof; A connection portion extending vertically vertically from the outer end of the module board to the main board so that the parts of the module board correspond to each other while maintaining a predetermined interval not contacting the upper surface of the main board; And a fetch antenna which is grounded to the ground of the module substrate and has a fetch electrode connected to a part of the main substrate and a stripline on the ground of the module substrate to transmit and receive data files. Antenna integrated RF module. The method of claim 1, The module substrate is an RF antenna module for Bluetooth, characterized in that composed of a multi-layered substrate having a conductor pattern formed on three or more layers, including a surface conductor layer separated and bonded to each other insulating material. The method of claim 1, The module substrate is fabricated by implementing a circuit by screen printing process of internal electrodes and passive elements on a plurality of green sheet layers of ceramic material, laminating each green sheet and simultaneously firing at 1000 ° C. or lower. An integrated RF antenna module for Bluetooth, characterized in that consisting of LTCC. The method of claim 1, The connection part is composed of a ceramic terminal consisting of a ceramic material formed on the outer surface of the main board and the lower end of the conductive pattern of the main board, the surface electrode is soldered and connected to the terminal electrode and the upper end of the module substrate. Bluetooth integrated RF module. The method of claim 1, And the connection part is provided in a rectangular frame shape to form a shield space that protects the semiconductor chip, flash memory and chip components provided on the module substrate from an external environment. The method of claim 1, The connection part is laminated so as to extend a predetermined length in a direction perpendicular to the upper surface of the main board from the outer end of the module substrate, the lower end is composed of a laminated extension member disposed on the upper surface of the main board Bluetooth integrated RF module. The method of claim 1, The connection part is provided with a lower forming height than a component having a maximum height among a plurality of components installed on the module substrate so as to maintain a predetermined interval between the parts of the module board and the upper surface of the main board does not contact each other. Bluetooth integrated RF module. The method of claim 1, The lower end of the connection part is an antenna integrated RF module for Bluetooth, characterized in that it is mounted by a flip chip mounting method via a bonding protrusion formed on the upper surface of the main board. The method of claim 1, The fetch antenna is an antenna integrated RF module for Bluetooth, characterized in that the same unit area as the plane of the module multilayer board is provided.