JPH06152237A - Patch antenna system - Google Patents

Patch antenna system

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Publication number
JPH06152237A
JPH06152237A JP31415792A JP31415792A JPH06152237A JP H06152237 A JPH06152237 A JP H06152237A JP 31415792 A JP31415792 A JP 31415792A JP 31415792 A JP31415792 A JP 31415792A JP H06152237 A JPH06152237 A JP H06152237A
Authority
JP
Japan
Prior art keywords
patch antenna
pattern
down
circuit
ground conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31415792A
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Japanese (ja)
Inventor
Akihiko Oe
大江明彦
Original Assignee
Nippon Avionics Co Ltd
日本アビオニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Avionics Co Ltd, 日本アビオニクス株式会社 filed Critical Nippon Avionics Co Ltd
Priority to JP31415792A priority Critical patent/JPH06152237A/en
Publication of JPH06152237A publication Critical patent/JPH06152237A/en
Application status is Pending legal-status Critical

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00Antennas with active circuits or circuit elements integrated within them or attached to them

Abstract

PURPOSE:To facilitate the assembling of the patch antenna system by forming an antenna pattern via a dielectric board on the upper side of a ground conductor and forming a circuit pattern with circuit components mounted thereon via a dielectric board at the lower side of the ground conductor. CONSTITUTION:A multi-layer ceramic board 12 of a patch antenna system 11 of one-point feeding type is made up of 1st and 2nd dielectric boards 13, 14. An antenna pattern 4 is formed on the upper side of the board 13 by a conductor member such as a copper foil by photo etching. Furthermore, the patch antenna is formed by forming a ground conductor 5 on a lower side and the shape is rectangular or circular. A radio wave from an earth satellite is received by the antenna pattern 4 and inputted to an input terminal of a low noise amplifier 2 directly via a throughhole 16, in which the radio wave is amplified. Then the amplified signal is inputted to a reception section through a coaxial cable 23. An external undesired radio wave is blocked by a cover 20. Moreover, the length of the throughhole 16 does not almost attenuate the reception radio wave because the thickness of the board 14 is minimized.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】この発明は,人工衛星からの電波を受信するアンテナ装置等,通信システムに使われるパッチアンテナ装置に関するものである。 BACKGROUND OF THE INVENTION This invention is an antenna device and the like for receiving radio waves from a satellite, to a patch antenna device used in a communication system.

【0002】 [0002]

【従来の技術】近年,人工衛星を使用した衛星通信システムが発展し,これを使用した移動体通信システムの開発が活発に行われている。 In recent years, satellite communication system is developed using an artificial satellite, the development of the mobile communication system have been actively using it. その内,特に,船舶や自動車等の位置測定,表示を行うGPS(gloval po Among them, in particular, the position measurement, such as ships and automobiles, GPS performing display (gloval po
sitioning system)が発達している。 sitioning system) has been developed.

【0003】これ等のシステムを利用する自動車等の産業分野においては,人工衛星からの電波を受信するアンテナとしては,図3〜図5に示すように,放射素子を構成するアンテナパタ−ンが矩形状のものや,図8に示すように,円形状の小型のパッチアンテナ1が使用されている。 [0003] In industrial fields such as automobiles to use this like system, as the antenna for receiving radio waves from a satellite, as shown in FIGS. 3 to 5, the antenna pattern constituting the radiating element - is down rectangular objects or, as shown in FIG. 8, the patch antenna 1 of the circular compact is used. このパッチアンテナ1は,図3〜図5,図8に示すように,テフロン(登録商標)樹脂製の誘電体基板3 The patch antenna 1, 3-5, as shown in FIG. 8, Teflon (registered trademark) resin dielectric substrate 3
の両面に銅箔等の導電部材が形成されており,上面側の銅箔がフォトエッチングされて放射素子を構成するアンテナパタ−ン4が形成されて,誘電体基板3の裏面は地導体5となっている。 Sided are formed conductive member such as copper foil, the antenna copper foil on the upper surface constitutes a radiating element are photo-etched patterns - down 4 is formed, and the earth back surface of the dielectric substrate 3 conductors 5 It has become.

【0004】このアンテナパタ−ン4の中心点Oから5 [0004] The antenna pattern - 5 from the center point of the down 4 O
0Ωに相当する位置に給電点となる穴6が透設されており,この穴6と地導体5とは互いに絶縁部材で形成されている基板3により絶縁されている構造となっている。 0Ω and the corresponding positions are a hole 6 serving as a feeding point Toru設 to have a structure that is insulated by the substrate 3 that is formed of an insulating member to each other with the hole 6 and the ground conductor 5.
給電点用の穴6には,図5に示すように,頭部8aを備えた構造のピン8が挿入されるとともに,このピン8の頭部8aを半田付けしてアンテナパタ−ン4と電気的に接続されている。 The holes 6 of the feeding point, as shown in FIG. 5, with the pin 8 of the structure with the head 8a is inserted, the antenna pattern of the head 8a of the pin 8 by soldering - and down 4 It is electrically connected.

【0005】このパッチアンテナ1で受信された電波は非常に微弱であるため,低雑音の前置増幅器2(以下, [0005] Therefore the electric wave received by the patch antenna 1 is very weak, low noise preamplifier 2 (hereinafter,
低雑音増幅器2と記す)で増幅する必要がある。 It is necessary to amplify in referred to as a low-noise amplifier 2). そこで,図6に示すように,ピン8から同軸ケ−ブル(図示せず)を介して低雑音増幅器2に接続して,受信電波を増幅する方法が採用されている。 Therefore, as shown in FIG. 6, the pin 8 coax - connected to table (not shown) low noise amplifier 2 through a method of amplifying is employed to receive radio waves. 低雑音増幅器2は,回路基板9に回路パタ−ン(図示せず)が形成されており,この回路パタ−ンの所定部分に回路部品(図示せず)が実装され,周囲はカバ−10により覆われた構造となっている。 Low-noise amplifier 2, the circuit on the circuit board 9 patterns - down (not shown) is formed, the circuit pattern - circuit components (not shown) in a predetermined portion of the emissions are mounted, around the cover -10 and it has a covered structure by.

【0006】一方,最近では,図7に示すように,パッチアンテナ1の裏面に,図6に示す構造の低雑音増幅器2を直接固定した一体構造のものもある。 On the other hand, recently, as shown in FIG. 7, the back surface of the patch antenna 1, and some of the integral structure of fixing the low-noise amplifier 2 having a structure shown in FIG. 6 directly.

【0007】 [0007]

【発明が解決しようとする問題点】前者の形式のものは,パッチアンテナ1から低雑音増幅器2まで同軸ケ− BRIEF Problems to Solved] former type ones, coax from the patch antenna 1 to the low-noise amplifier 2 -
ブルで接続されているので,この同軸ケ−ブルの長さ(電気的位相)のずれに伴う不整合および受信電波の減衰が大であるという問題があった。 Because it is connected by Bull, the coax - length Bull mismatch and receive radio waves due to the deviation of the (electrical phase) attenuation has a problem that it is large. その上,低雑音増幅器2も回路基板上に回路パタ−ンを形成し,これに回路部品を実装する等,特別に作成しなければならず,その組立工程数も多くなるという問題があった。 Moreover, the low noise amplifier 2 also circuit on a circuit board pattern - to form a down, etc. for mounting the circuit components thereto, must be specially created, there is a problem that the number of assembling steps is also increased .

【0008】一方,後者の形式のものは,同軸ケ−ブルを用いていない分,アンテナとの不整合,受信電波の減衰はないが,前者の形式のものと同様に,低雑音増幅器2の組立,取付の手間がかかるという問題があった。 On the other hand, the latter type ones, coax - min using no table, mismatch between the antenna, there is no attenuation of the received radio wave, similar to the former type, the low-noise amplifier 2 assembly, time of mounting there is a problem that it takes.

【0009】 [0009]

【問題点を解決するための手段】この発明は,地導体と,この地導体の上面に第1の誘電体基板を介して形成されたアンテナパタ−ンとからなるパッチアンテナと, Means for Solving the problems] The present invention includes a ground conductor, a first dielectric antenna pattern is formed through the substrate to the upper surface of the ground conductor - a patch antenna composed of a down,
地導体の下面に第2の誘電体基板を介して形成された回路パタ−ンと,この回路パタ−ンとアンテナパタ−ンとを電気的に接続する手段と,回路パタ−ンに給電する同軸ケ−ブルと,回路パタ−ンにそれぞれ実装される回路部品とによりパッチアンテナ装置を構成するようにしたものである。 The second dielectric circuit formed through a substrate pattern on the lower surface of the ground conductor - and down, the circuit pattern - means for electrically connecting the emissions, the circuit pattern - - emission and the antenna pattern to power the down coax - Bull and the circuit pattern - is obtained so as to constitute a patch antenna device by a circuit component to be mounted respectively on the emissions.

【0010】 [0010]

【作用】パッチアンテナ1と低雑音増幅器2とが,多層プリント基板にハイブリットに形成されているので,人工衛星からの電波は,パッチアンテナのアンテナパタ− [Action] patch antenna 1 and a low-noise amplifier 2 and is formed in the hybrid multilayer printed circuit board, a radio wave from an artificial satellite, a patch antenna the antenna pattern -
ン4で受信され,スル−ホ−ル16を介して直接低雑音増幅器2の入力端に入力して増幅され,同軸ケ−ブル2 Received at down 4, sul - Ho - amplified directly input to the input terminal of the low noise amplifier 2 via the Le 16, coax - Bull 2
3から受信部(図示せず)に入力され,受信電波が減衰することはない。 3 is input to the receiving unit (not shown) from the received radio wave is never attenuated.

【0011】 [0011]

【発明の実施例1】この発明の第1の実施例を,図1に基づいて詳細に説明する。 EXAMPLE 1 OF THE INVENTION The first embodiment of the present invention will be described in detail with reference to FIG. なお,従来例と同一名称のものは,同一符号を用いその説明を省略する。 Incidentally, those of the conventional example having the same name, and a description thereof will be omitted using the same reference numerals. 図1は,1 Figure 1, 1
点給電形のパッチアンテナ装置11を示すもので,多層セラミック基板(又は,多層プリント基板)12は第1 Shows a patch antenna device 11 of the point feeder type, multi-layer ceramic substrate (or a multilayer printed circuit board) 12 is first
の誘電体基板13と第2の誘電体基板14とにより構成されており,第1の誘電体基板13の上面には,フォトエッチングによりアンテナパタ−ン4が銅箔等の導電体部材で形成されており,下面には地導体5が形成されてパッチアンテナ1が構成されている。 The dielectric substrate 13 and is constituted by a second dielectric substrate 14, on the upper surface of the first dielectric substrate 13, an antenna pattern by photoetching - forming emissions 4 in conductive member such as copper foil are, the patch antenna 1 ground conductor 5 is formed on the lower surface is formed. パッチアンテナ1 Patch antenna 1
の形状は,従来例の図3〜図5に示すように,矩形状であってもよくあるいは,図8に示すように,円形状であっても良い。 The shape, as shown in FIGS. 3 to 5 in the conventional example, may be a rectangular shape or, as shown in FIG. 8, may be a circular shape.

【0012】この円形状のパッチアンテナ1の場合には,円の直径で共振周波数f L ,f Hが決まり,図3〜 [0012] If this circular patch antenna 1 of the resonant frequency f L by a circle with a diameter determines the f H, Figure 3
図5に示す矩形状のパッチアンテナ1の場合には,対角線の長さにより共振周波数f L ,f Hが決定される。 In the case of the rectangular patch antenna 1 shown in FIG. 5, the resonance frequency f L, f H is determined by the length of the diagonal line. この共振周波数f L ,f Hに基づいて,図9に示すように,使用周波数f 0が決定される。 The resonance frequency f L, based on the f H, as shown in FIG. 9, using the frequency f 0 is determined. 円形状のパッチアンテナ1の場合には,第1の誘電体基板13の厚さh,比誘電率ε r ,使用周波数f 0 ,光速C,パッチアンテナの半径aとすると,一般に,a=(1.8C/2πf 0 In the case of circular patch antenna 1, the thickness h of the first dielectric substrate 13, the dielectric constant epsilon r, using the frequency f 0, the speed of light C, and the radius a of the patch antenna, generally, a = ( 1.8C / 2πf 0
√ε r )−(1.39h/π)で表され,この式から第1の誘電体基板13の厚さhが決定される。 √ε r) - is represented by (1.39h / π), the thickness h of the first dielectric substrate 13 is determined from this equation. 矩形状のパッチアンテナ1の場合も同様にして第1の誘電体基板1 A first dielectric substrate in the same manner in the case of the rectangular patch antenna 1 1
3の厚さhが決定される。 3 of thickness h is determined.

【0013】このパッチアンテナの地導体5の下面には,第2の誘電体基板14を介して低雑音増幅器2の回路パタ−ン15が形成されている。 [0013] On the lower surface of the ground conductor 5 of the patch antenna, the second dielectric substrate 14 circuit of the low noise amplifier 2 via the pattern - down 15 is formed. 16は給電点となるスル−ホ−ルで,アンテナパタ−ン4の中心点から50 16 is a feeding point Sul - Ho - Le, the antenna pattern - 50 from the center point of the emission 4
Ωに対応する位置に開設されており,アンテナパタ−ン4と低雑音増幅器2の入力端に対応する回路パタ−ン1 Ω are opened in a position corresponding to the antenna pattern - emissions 4 and circuit pattern corresponding to an input port of the LNA 2 - down 1
5部分とが電気的に接続されている。 5 parts and are electrically connected. なお,このスル− It should be noted that this Sul -
ホ−ル16の位置,直径,長さは基本的にはアンテナの特性で決定される。 E - Position Le 16, diameter, length is basically determined by the characteristics of the antenna. 但し,スル−ホ−ル16の長さは, However, sul - Ho - length Le 16,
抵抗成分とインダクタンス成分とがあるので,第2の誘電体基板14の厚みを薄くした方がそれだけ受信電波の減衰が少なくなるから,第2の誘電体基板14は可能な限り薄く形成される。 Since there is a resistance component and an inductance component, because the attenuation of the second dielectric correspondingly receive radio waves better to reduce the thickness of the substrate 14 is reduced, it is thin as possible second dielectric substrate 14. この際,多層プリント配線板12 In this case, the multi-layer printed wiring board 12
の強度は第1の誘電体基板13で補強されている。 Strength is reinforced by the first dielectric substrate 13.

【0014】17は低雑音増幅器2を構成する回路部品のFET,18はキャパシタ,19は抵抗器で,それぞれ回路パタ−ン15の所定箇所にそれぞれ実装されている。 [0014] 17 circuit components FET, 18 constituting the low-noise amplifier 2 capacitor, 19 a resistor, respectively circuit patterns - are respectively mounted on a predetermined position of the emission 15. 20は低雑音増幅器2の部分を覆うカバ−で,銅, Hippo 20 covering a portion of the low-noise amplifier 2 -, copper,
鉄・ニッケル・コバルト合金(コバ−ル)等で形成されており,回路パタ−ン15のア−スパタ−ン21に半田22により半田付けされている。 Iron-nickel-cobalt alloy - is formed by (edge ​​LE) or the like, circuit patterns - down 15 A of - Spata - is soldered by a solder 22 to down 21. 23は同軸ケ−ブルで,低雑音増幅器2の出力端に接続されている。 23 coax - Bull, is connected to an output terminal of the low noise amplifier 2. 24は同軸ケ−ブルのコネクタである。 24 coax - is a connector of the cable.

【0015】このように構成されているので,人工衛星からの電波は,パッチアンテナ1のアンテナパタ−ン4 [0015] because it is configured in this manner, radio waves from an artificial satellite, the patch antenna 1 antenna pattern - down 4
で受信され,スル−ホ−ル16を介して直接低雑音増幅器2の入力端に入力して増幅され,同軸ケ−ブル23から受信部(図示せず)に入力される。 In is received, sul - Ho - amplified directly input to the input terminal of the low noise amplifier 2 via the Le 16, coax - input from table 23 to the receiving unit (not shown). この際,外部からの不要電波は,カバ−20により阻止される。 In this case, unnecessary electric wave from the outside is blocked by the cover 20. 又,スル−ホ−ル16の長さは,第2の誘電体基板14が可能な限り薄く形成されているので,受信電波の減衰はほとんど無視することができる。 Further, sulfinpyrazone - Ho - length Le 16, since the second dielectric substrate 14 is thin as possible, the attenuation of the received radio wave can be almost ignored.

【0016】 [0016]

【発明の実施例2】図2は,この発明の第2の実施例で,電磁結合形のパッチアンテナ装置31を示すもので,パッチアンテナ1は,第1のアンテナパタ−ン4の上面に第3の誘電体基板32を介して第2のアンテナパタ−ン33が形成された構造となっており,他の部分は,上記実施例と同様である。 2 Example 2 of the Invention, in the second embodiment of the present invention, shows a patch antenna device 31 of the electromagnetic coupling type, the patch antenna 1, the first antenna pattern - on the upper surface of the down 4 the third of the second antenna pattern via the dielectric substrate 32 - has a down 33 is formed structure, other portions are the same as the above embodiment.

【0017】このように構成されているので,人工衛星からの電波は,第2のアンテナパタ−ン33に誘導され,誘電体基板32を介して第1のアンテナパタ−ン4 [0017] Since the thus constructed, radio waves from an artificial satellite, a second antenna pattern - is induced emission 33, the first antenna pattern via the dielectric substrate 32 - down 4
に誘導され,上記実施例と同様に,スル−ホ−ル16を介して直接低雑音増幅器2の入力端に入力して増幅され,同軸ケ−ブル23を介して受信部に入力する。 Is induced, as in the above embodiment, - e - amplified directly input to the input terminal of the low noise amplifier 2 via the Le 16, coax - input to the receiving unit via the table 23.

【0018】 [0018]

【発明の効果】この発明は,地導体と,この地導体の上面に第1の誘電体基板を介して形成されたアンテナパタ−ンとからなるパッチアンテナと,地導体の下面に第2 Effects of the Invention The present invention, the ground conductor and the first dielectric antenna pattern is formed through the substrate to the upper surface of the ground conductor - a patch antenna composed of a down, the second on the lower surface of the ground conductor
の誘電体基板を介して形成された回路パタ−ンと,この回路パタ−ンとアンテナパタ−ンとを電気的に接続する手段と,回路パタ−ンに給電する同軸ケ−ブルと,回路パタ−ンにそれぞれ実装される回路部品とにより構成されているので,構造が簡単であるとともに,組立工程数が少なくなり,コストも安くなる。 Dielectric circuit formed through a substrate pattern - down and, the circuit patterns - means for electrically connecting the emissions, the circuit pattern - - emission and the antenna pattern coax to power the down - and Bull circuit pattern - which is configured by a circuit component to be mounted respectively on the emissions, as well as the structure is simple, the number of assembling steps is reduced, cost is cheaper. その上,低雑音増幅器等の前置増幅器部分のみならず受信部分全体をもハイブリット構造でパッチアンテナと同一の誘電体基板に組み込むことが出来るので,小型の受信機としての利用分野が大幅に拡大される。 Moreover, since the low-noise amplifier or the like of the preamplifier portion not only receives partial whole can be incorporated into the same dielectric substrate and the patch antenna with hybrid structure, Field of as a small receiver greatly expanded It is. 又,スル−ホ−ルによりアンテナパタ−ンと回路パタ−ンとが接続されているので,直径と長さの比を適当に選択することによりS/N比を向上させることができる。 Further, sulfinpyrazone - Ho - emission and the circuit pattern - - antenna pattern by Le because emissions and is connected, it is possible to improve the S / N ratio by appropriately selecting the ratio of the diameter and length.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】この発明の第1の実施例を示す要部断面図である。 1 is a fragmentary cross-sectional view showing a first embodiment of the present invention.

【図2】この発明の第2の実施例を示す要部断面図である。 Figure 2 is a fragmentary cross-sectional view showing a second embodiment of the present invention.

【図3】従来のパッチアンテナの平面図である。 FIG. 3 is a plan view of a conventional patch antenna.

【図4】図3に示すパッチアンテナの裏面図である。 4 is a rear view of the patch antenna shown in FIG.

【図5】図3に示すパッチアンテナの要部断面図である。 Figure 5 is a fragmentary cross-sectional view of the patch antenna shown in FIG.

【図6】従来例を示す展開斜視図である。 6 is an exploded perspective view showing a conventional example.

【図7】従来例を示す斜視図である。 7 is a perspective view showing a conventional example.

【図8】従来のパッチアンテナの平面図である。 FIG. 8 is a plan view of a conventional patch antenna.

【図9】パッチアンテナのインピ−ダンス特性図である。 [9] of the patch antenna Inpi - it is a dance characteristic diagram.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 パッチアンテナ 2 低雑音増幅器 4 アンテナパタ−ン 5 地導体 11 パッチアンテナ装置 13 第1の誘電体基板 14 第2の誘電体基板 15 回路パタ−ン 16 スル−ホ−ル 31 パッチアンテナ装置 1 patch antenna 2 a low noise amplifier 4 antenna pattern - down 5 ground conductor 11 patch antenna device 13 first dielectric substrate 14 and the second dielectric substrate 15 circuit pattern - down 16 - E - le 31 patch antenna device

Claims (6)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 地導体と,この地導体の上面に第1の誘電体基板を介して形成された放射素子となるアンテナパタ−ンとからなるパッチアンテナと,前記地導体の下面に第2の誘電体基板を介して形成された回路パタ−ンと,この回路パタ−ンと前記アンテナパタ−ンとを電気的に接続する手段と,前記回路パタ−ンに給電する同軸ケ−ブルと,前記回路パタ−ンにそれぞれ実装される回路部品とを備えたことを特徴とするパッチアンテナ装置。 1. A ground conductor and the antenna pattern on the upper surface of the ground conductor becomes the first dielectric radiating element formed over a substrate - a patch antenna composed of a down, the second on the lower surface of the ground conductor and down, the circuit pattern - - circuit pattern formed through the dielectric substrate and means for electrically connecting the emissions, the circuit pattern - - ting the antenna pattern and Blu - coax to power down , the circuit pattern - patch antenna device being characterized in that a circuit component to be mounted respectively on the emissions.
  2. 【請求項2】 前記アンテナパタ−ンと前記回路パタ− Wherein said antenna pattern - ting the circuit pattern -
    ンとをスル−ホ−ルで電気的に接続したことを特徴とする請求項1に記載のパッチアンテナ装置。 Sul and down - Ho - patch antenna device according to claim 1, characterized in that electrically connected in Le.
  3. 【請求項3】 前記アンテナパ−ンの上面に,第3の誘電体基板を介して第2のアンテナパタ−ンを形成したことを特徴とする請求項1および請求項2にそれぞれ記載のパッチアンテナ装置。 Wherein the Antenapa - on the upper surface of the down, through the third dielectric substrate second antenna pattern - a patch antenna according respectively to claims 1 and 2, characterized in that the formation of the down apparatus.
  4. 【請求項4】 前記パッチアンテナの導体側下面に,前記回路パタ−ンをハイブリットに形成したことを特徴とする請求項1から請求項3のいずれかに記載のパッチアンテナ装置。 Wherein the conductor side lower surface of the patch antenna, the circuit pattern - patch antenna device according to any one of claims 3 to emissions from claim 1, characterized in that formed in the hybrid.
  5. 【請求項5】 前記回路パタ−ンと前記実装される回路部品とにより前置増幅器を構成したことを特徴とする請求項1から請求項3のいづれかに記載のパッチアンテナ装置。 Wherein said circuit pattern - ting patch antenna device according to either of claims 1 to 3, characterized in that to constitute a pre-amplifier by a circuit component to be the mounting.
  6. 【請求項6】 前記回路パタ−ンと前記実装される回路部品とにより受信部を構成したことを特徴とする請求項1から請求項4のいづれかに記載のパッチアンテナ装置。 Wherein said circuit pattern - ting patch antenna device according to claim 1, characterized in that to constitute a receiving unit to either of claims 4 by the circuit component to be the mounting.
JP31415792A 1992-10-29 1992-10-29 Patch antenna system Pending JPH06152237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31415792A JPH06152237A (en) 1992-10-29 1992-10-29 Patch antenna system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31415792A JPH06152237A (en) 1992-10-29 1992-10-29 Patch antenna system

Publications (1)

Publication Number Publication Date
JPH06152237A true JPH06152237A (en) 1994-05-31

Family

ID=18049929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31415792A Pending JPH06152237A (en) 1992-10-29 1992-10-29 Patch antenna system

Country Status (1)

Country Link
JP (1) JPH06152237A (en)

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WO2002063333A3 (en) * 2001-02-03 2002-12-12 Bosch Gmbh Robert Device for the transmission and/or reception of radar beams with a coplanar supply network
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US7180440B2 (en) 2001-02-03 2007-02-20 Robert Bosch Gmbh Integrated circuit for a radar device in a hermetically sealed housing comprising a patch antenna formed from a bent component from sheet metal
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US7928910B2 (en) 2005-03-31 2011-04-19 Semiconductor Energy Laboratory Co., Ltd. Wireless chip and electronic device having wireless chip
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US9564688B2 (en) 2005-03-31 2017-02-07 Semiconductor Energy Laboratory Co., Ltd. Wireless chip and electronic device having wireless chip
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