CN117755583B - Multi-station automatic sucking and processing device for electronic chip - Google Patents

Multi-station automatic sucking and processing device for electronic chip Download PDF

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Publication number
CN117755583B
CN117755583B CN202410196871.9A CN202410196871A CN117755583B CN 117755583 B CN117755583 B CN 117755583B CN 202410196871 A CN202410196871 A CN 202410196871A CN 117755583 B CN117755583 B CN 117755583B
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fixedly connected
plate
electronic chip
sliding
plates
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CN117755583A (en
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李宁
居法银
杨忻周
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Jiangsu Youzhong Micro Nano Semiconductor Technology Co ltd
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Jiangsu Youzhong Micro Nano Semiconductor Technology Co ltd
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Abstract

The invention relates to the technical field of electronic chip suction, which is used for solving the problem that a large number of electronic chips cannot be conveyed and position corrected in the process of realizing electronic chip suction by utilizing the prior art, in particular to a multi-station automatic suction processing device for electronic chips.

Description

Multi-station automatic sucking and processing device for electronic chip
Technical Field
The invention relates to the technical field of electronic chip suction, in particular to a multi-station automatic suction processing device for an electronic chip.
Background
The electronic chip is a silicon chip containing an integrated circuit, the volume is very small, often part of a computer or other electronic equipment, the main function of the chip is to process input information to obtain a required result, the chip can be divided into various types according to different application scenes, such as a logic chip, a memory chip, a microprocessor and the like, the logic chip is mainly used for logic control and digital signal processing, the memory chip is used for data storage, the microprocessor is a core component of the computer and is responsible for executing instructions and controlling the operation of the computer, and along with the continuous development of technology, the application range of the chip is wider and wider, and the chip becomes an important component of the modern electronic technology;
At present, the packaging of the electronic chip generally adopts a mode with lower automation degree, specifically, the electronic chip is firstly scattered and turned over by a flexible vibration disc, then the electronic chip is sucked by utilizing a pneumatic suction nozzle in combination with a vision technology, however, as the prior art has limitation on the correction and turning over of the chip position, the pneumatic suction nozzle can only suck a small amount of electronic chips at a time, the conveying efficiency is seriously reduced, and in addition, the traditional suction nozzle also does not have the function of automatically correcting the position of the electronic chip, the position of the electronic chip sucked by the pneumatic suction nozzle is easily deviated, and thus the electronic chip is easily damaged during placement;
In view of the above technical drawbacks, a solution is now proposed.
Disclosure of Invention
The invention aims to provide a multi-station automatic sucking and processing device for an electronic chip, which is used for solving the problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the multi-station automatic sucking and processing device for the electronic chip comprises a base, wherein the top of the base is fixedly connected with a frame, the top of the frame is fixedly connected with a supporting plate, the top of the supporting plate is fixedly provided with a bearing plate through spot welding, the bottom of the bearing plate is fixedly provided with a linear stepping track, the inside of the linear stepping track is slidably connected with a sliding plate, the inside of the linear stepping track is provided with a stepping motor for driving the sliding plate to slide, the bottom of the sliding plate is provided with a plurality of groups of connecting columns in a matrix arrangement, and the top of the connecting columns is fixedly connected with the bottom of the sliding plate;
The lower part of slide is provided with counterpoint subassembly, counterpoint subassembly includes multiunit diaphragm and multiunit axle bed, the bottom fixedly connected with slide rail of diaphragm, the inside sliding connection of slide rail has two sliding seats, the bottom fixedly connected with cover frame of sliding seat, the inside sliding connection of cover frame has stopper and splint, stopper fixed connection is on the top of splint, fixedly connected with compression spring one between stopper and the cover frame inner wall.
Further, the two ends of the transverse plate are fixed with shaft seats through spot welding, the outer sides of the shaft seats are movably connected with a first guide wheel and a second guide wheel through bearings, a second compression spring is fixedly connected between the sliding seat and the inner wall of the sliding rail, the top of the sliding seat is fixedly provided with a connecting block, and the side wall of the connecting block is fixedly connected with a rope.
Further, the bottom fixedly connected with support of diaphragm, be provided with pneumatic sucking disc in the support, pneumatic sucking disc's outside intercommunication has the air duct, the one end that pneumatic sucking disc was kept away from to the air duct communicates with outside air feed mechanism.
Further, the bottom fixedly connected with link plate of spliced pole, the one end of keeping away from the sliding seat of rope is through leading wheel one and leading wheel two and link plate bottom fixed connection, adjacent fixedly connected with link plate one between the diaphragm lateral wall, link plate one's top fixedly connected with link plate two, the bottom fixed mounting of slide has multiunit hydraulic push rod, hydraulic push rod's bottom and link plate two top fixed connection.
Further, the top of the frame is fixedly connected with a vertical plate, and a plurality of leveling components are arranged between the two vertical plates;
The leveling assembly comprises a plurality of groups of rotating rods and a plurality of groups of eccentric plates, the side walls of the vertical plates are fixedly connected with bearing frames, the rotating rods are movably connected in the bearing frames through bearings, one ends of the rotating rods are movably connected with the vertical plates through bearings, the other ends of the rotating rods are fixedly connected with the side walls of the eccentric plates, short shafts are fixedly connected between the two eccentric plates, pull rods are sleeved on the outer sides of the short shafts, and the pull rods are movably connected with the short shafts through bearings.
Further, the slope is provided with multiunit guide frame between two risers, all fixedly connected with horizontal pole between guide frame and the riser and between the adjacent guide frame, sliding connection has to support the push rod in the guide frame, the top fixedly connected with support that supports the push rod, the bottom and the support rotation of pull rod are connected, the bottom fixedly connected with of supporting the push rod is dull and stereotyped.
Further, the first and second transmission belts are installed on the inner side of the frame, a plurality of groups of bearing seats are fixedly installed on the top of the second transmission belt at equal intervals, one of the bearing seats is movably connected with a first gear and a second gear through bearings on the outer side wall of the vertical plate, the first gear is fixedly connected with the rotating rod, the first gear is in meshed connection with the second gear, and a motor for driving the second gear to rotate is installed on the outer side wall of the vertical plate.
The invention also provides a multi-station automatic sucking processing method of the electronic chip, which comprises the following steps:
Step one: the method comprises the steps that a plurality of electronic chips are placed at the top of a first conveying belt and conveyed, a motor is started, a rotating rod drives an eccentric plate to rotate under the mutual matching of a first gear and a second gear, the eccentric plate synchronously rotates through the mutual matching of the plurality of rotating rods and a short shaft, the eccentric plate further slides back and forth in a guide frame through the mutual matching of the short shaft and a pull rod, the push rod slides obliquely downwards along the guide frame and drives a flat plate to synchronously move obliquely downwards until the flat plate is in contact with the side wall of the electronic chip, the flat plate continuously corrects the position of the electronic chip, the electronic chip is always positioned on the same horizontal parallel line, and accurate suction of the electronic chip is facilitated;
Step two: when the electronic chips move to the position right below the alignment assembly, starting the hydraulic push rod, and synchronously descending the transverse plate under the action of the hydraulic push rod, so that the sliding seats and the clamping plates which are correspondingly arranged in pairs are mutually close to each other because the ropes do not have stretching characteristics until the clamping plates automatically correct and align the electronic chips which are offset, and then enabling the pneumatic sucking disc to contact with the top of the electronic chips under the action of the hydraulic push rod and suck and fix the electronic chips;
Step three: after the electronic chip is sucked, the hydraulic push rod drives the electronic chip to ascend and move to the second top of the conveying belt under the action of the sliding plate, the hydraulic push rod drives the electronic chip to descend until the electronic chip contacts with the top of the bearing seat, the pneumatic sucker releases the suction of the electronic chip and places the electronic chip on the top of the bearing seat to complete transfer, and then the conveying belt drives the electronic chip to move to a designated position through the bearing seat for further processing.
Compared with the prior art, the invention has the beneficial effects that:
When the electronic chip leveling device is used, the plurality of groups of leveling components are arranged in the vertical plate, the motor drives the plurality of groups of eccentric plates to synchronously rotate through the mutual matching of the first gear, the second gear, the rotating rod and the short shaft, and the eccentric plates realize the position correction of the electronic chips which are not positioned on the same horizontal parallel line by the mutual matching of the pull rod and the pushing rod and the obliquely arranged guide frame, so that the electronic chips are continuously corrected in position, and further the electronic chips are always positioned on the same horizontal parallel line, thereby being convenient for the accurate subsequent suction of the electronic chips.
When the electronic chip leveling device is used, the electronic chips are subjected to preliminary position correction under the action of the leveling component, the aligning component is arranged at the bottom of the sliding plate, the characteristic that a rope does not have elasticity is utilized, the hydraulic push rods and the sliding seats are ingeniously matched, so that the clamping plates corresponding to each other are mutually close to each other while descending synchronously, the electronic chips subjected to the offset correction and the alignment are automatically carried out by the clamping plates in the process of mutually leaning, the accurate suction of the electronic chips by the pneumatic suction cup is facilitated, the problem caused by the subsequent placement of the electronic chips is avoided, and meanwhile, the clamping plates which cannot be driven by electricity and have the automatic aligning function are arranged at the two sides of each pneumatic suction cup, so that the electronic chip leveling device can be used for carrying out position correction and suction on a large number of electronic chips at one time, and the conveying efficiency and the conveying integrity of the electronic chips are greatly improved.
Drawings
For the convenience of those skilled in the art, the present invention will be further described with reference to the accompanying drawings;
FIG. 1 is a side view of a support plate structure of the present invention;
FIG. 2 is a side view of a riser structure of the present invention;
FIG. 3 is a front elevational view of the overall structure of the present invention;
FIG. 4 is a top view of a splice plate I and splice plate arrangement of the present invention;
FIG. 5 is an enlarged schematic view of the area A in FIG. 1;
FIG. 6 is a top view of a slide mount according to the present invention;
FIG. 7 is a schematic block diagram of the present invention;
FIG. 8 is a cross-sectional view of a sleeve frame structure in accordance with the present invention;
Fig. 9 is a schematic view of a guide frame structure in the present invention.
Reference numerals: 1. a base; 201. a frame; 202. a support plate; 3. a carrying plate; 4. a linear stepping track; 5. a slide plate; 6. a connecting column; 7. an alignment assembly; 701. a cross plate; 702. a shaft seat; 703. a first guide wheel; 704. a second guide wheel; 705. a slide rail; 706. a sliding seat; 707. a sleeve frame; 708. a limiting block; 709. a clamping plate; 710. compressing a first spring; 711. compression spring II; 712. a joint block; 713. a rope; 8. a bracket; 9. a pneumatic chuck; 10. an air duct; 11. a connecting plate; 12. a first connecting plate; 13. a second connecting plate; 14. a hydraulic push rod; 15. a motor; 16. a riser; 17. a leveling assembly; 171. a rotating rod; 172. a eccentric plate; 173. a short shaft; 174. a pull rod; 175. a guide frame; 176. a push rod; 177. a support; 178. a flat plate; 181. a first transmission belt; 182. a second transmission belt; 19. a bearing seat; 20. a first gear; 21. a second gear; 22. a bearing bracket; 23. a cross bar.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
As shown in fig. 1-9, a multi-station automatic sucking and processing device for an electronic chip comprises a base 1, wherein a rack 201 is fixedly connected to the top of the base 1, a supporting plate 202 is fixedly connected to the top of the rack 201, a bearing plate 3 is fixedly arranged at the top of the supporting plate 202 through spot welding, a linear stepping rail 4 is fixedly arranged at the bottom of the bearing plate 3, a sliding plate 5 is slidingly connected to the inside of the linear stepping rail 4, a stepping motor for driving the sliding plate 5 to slide is arranged in the inside of the linear stepping rail 4, a plurality of groups of connecting columns 6 are arranged at the bottom of the sliding plate 5 in a matrix, and the top ends of the connecting columns 6 are fixedly connected with the bottom of the sliding plate 5;
the top of the frame 201 is fixedly connected with a vertical plate 16, and a plurality of leveling components 17 are arranged between the two vertical plates 16;
The leveling assembly 17 comprises a plurality of groups of rotating rods 171 and a plurality of groups of eccentric plates 172, the side wall of the vertical plate 16 is fixedly connected with a bearing frame 22, the rotating rods 171 are movably connected in the bearing frame 22 through bearings, one end of each rotating rod 171 is movably connected with the vertical plate 16 through bearings, the other end of each rotating rod 171 is fixedly connected with the side wall of each eccentric plate 172, a short shaft 173 is fixedly connected between the two eccentric plates 172, a pull rod 174 is sleeved on the outer side of each short shaft 173, and the pull rods 174 are movably connected with the short shafts 173 through bearings.
A plurality of groups of guide frames 175 are obliquely arranged between the two vertical plates 16, cross bars 23 are fixedly connected between the guide frames 175 and the vertical plates 16 and between the adjacent guide frames 175, pushing rods 176 are slidably connected in the guide frames 175, supporting seats 177 are fixedly connected to the tops of the pushing rods 176, the bottoms of the pull rods 174 are rotatably connected with the supporting seats 177, and flat plates 178 are fixedly connected to the bottoms of the pushing rods 176.
The inner side of the frame 201 is provided with a first transmission belt 181 and a second transmission belt 182, the top of the second transmission belt 182 is fixedly provided with a plurality of groups of bearing seats 19 at equal intervals, the outer side wall of one vertical plate 16 is movably connected with a first gear 20 and a second gear 21 through bearings, the first gear 20 is fixedly connected with a rotating rod 171, the first gear 20 is in meshed connection with the second gear 21, and the outer side wall of the vertical plate 16 is provided with a motor 15 for driving the second gear 21 to rotate.
In the specific arrangement, a plurality of electronic chips are placed on the top of the first transmission belt 181, the first transmission belt 181 drives the electronic chips to be conveyed, in order to ensure that the positions of the electronic chips in the conveying process are accurate, the motor 15 is started, the motor 15 drives the second gear 21 to rotate, the second gear 21 is meshed with the first gear 20 so as to drive the rotating rod 171 to rotate, the rotating rod 171 drives the eccentric plate 172 to synchronously rotate in the rotating process, the eccentric plate 172 drives the other eccentric plate 172 to synchronously rotate through the short shaft 173, and the eccentric plate 172 synchronously rotates through the cooperative cooperation of the plurality of rotating rods 171;
The eccentric plate 172 is matched with the pull rod 174 through the short shaft 173 in the rotating process, and then the pushing rod 176 is pulled to slide reciprocally in the guide frame 175, and because the guide frame 175 is obliquely arranged, the pushing rod 176 drives the flat plate 178 to move obliquely downwards synchronously in the obliquely downwards sliding process until the flat plate 178 contacts with the side wall of the electronic chip, a plurality of side-by-side electronic chips are pushed under the action of the flat plate 178, and a plurality of leveling assemblies 17 are arranged between the two vertical plates 16, so that the plurality of flat plates 178 continuously correct the positions of the electronic chips, and the electronic chips are always positioned on the same horizontal parallel line, thereby being convenient for accurately absorbing the electronic chips;
Example two
As shown in fig. 1-9, an alignment assembly 7 is disposed below the sliding plate 5, the alignment assembly 7 includes a plurality of groups of transverse plates 701 and a plurality of groups of shaft seats 702, a sliding rail 705 is fixedly connected to the bottom of the transverse plates 701, two sliding seats 706 are slidably connected to the inside of the sliding rail 705, a sleeve frame 707 is fixedly connected to the bottom of the sliding seats 706, a limiting block 708 and a clamping plate 709 are slidably connected to the inside of the sleeve frame 707, the limiting block 708 is fixedly connected to the top end of the clamping plate 709, and a compression spring 710 is fixedly connected between the limiting block 708 and the inner wall of the sleeve frame 707.
The two ends of the transverse plate 701 are fixed with a shaft seat 702 through spot welding, the outer side of the shaft seat 702 is movably connected with a first guide wheel 703 and a second guide wheel 704 through bearings, a second compression spring 711 is fixedly connected between the sliding seat 706 and the inner wall of the sliding rail 705, the top of the sliding seat 706 is fixedly provided with a connecting block 712, and the side wall of the connecting block 712 is fixedly connected with a rope 713;
the bottom of the transverse plate 701 is fixedly connected with a bracket 8, a pneumatic sucker 9 is arranged in the bracket 8, the outer side of the pneumatic sucker 9 is communicated with an air duct 10, and one end of the air duct 10, which is far away from the pneumatic sucker 9, is communicated with an external air supply mechanism;
The bottom fixedly connected with link plate 11 of spliced pole 6, the one end of rope 713 that keeps away from slide holder 706 is through leading wheel one 703 and leading wheel two 704 and link plate 11 bottom fixed connection, fixedly connected with link plate one 12 between the adjacent diaphragm 701 lateral wall, the top fixedly connected with link plate two 13 of link plate one 12, the bottom fixed mounting of slide 5 has multiunit hydraulic push rod 14, the bottom and the link plate two 13 top fixed connection of hydraulic push rod 14.
When the electronic chips are subjected to position correction under the action of the leveling assemblies 17, namely the electronic chips are adjusted to be on the same horizontal parallel line at the top of the first transmission belt 181, the hydraulic push rod 14 is started, the hydraulic push rod 14 drives the transverse plate 701 to synchronously descend under the mutual matching of the first connecting plate 12 and the second connecting plate 13, and the rope 713 does not have stretching characteristics, so that the rope 713 drives the sliding seat 706 to slide through the mutual matching of the first guide wheel 703, the second guide wheel 704 and the connecting block 712 in the descending process of the transverse plate 701;
At this time, the sliding seats 706 correspondingly arranged in pairs approach each other along the sliding rail 705, the sliding seats 706 correspondingly arranged in pairs also synchronously descend in the process of approaching each other until the bottom ends of the clamping plates 709 contact the top of the transmission belt 181 and squeeze the clamping plates 709, the clamping plates 709 continuously squeeze the compression spring 710 through the limiting block 708 until the two clamping plates 709 correspondingly arranged contact the side wall of the electronic chip, the two clamping plates 709 correspondingly arranged automatically correct and align the offset electronic chip, and then the pneumatic sucker 9 contacts with the top of the electronic chip under the action of the hydraulic push rod 14 and sucks and fixes the electronic chip;
The hydraulic push rod 14 drives the electronic chip to synchronously ascend through the first connecting plate 12 and the second connecting plate 13, meanwhile, the sliding seat 706 moves to the initial position under the action of the second compression spring 711, the clamping plate 709 ascends to the initial position under the action of the first compression spring 710, then the stepping motor drives the sliding plate 5 to horizontally move along the linear stepping track 4 until the electronic chip moves to the top of the second transmission belt 182, the hydraulic push rod 14 drives the transverse plate 701 and the electronic chip to synchronously descend until the electronic chip contacts with the top of the bearing seat 19, then the pneumatic sucker 9 releases the suction of the electronic chip and places the electronic chip on the top of the bearing seat 19 to finish transferring, and then the second transmission belt 182 drives the electronic chip to move to the designated position through the bearing seat 19 for further processing.
The foregoing is merely illustrative of the structures of this invention and various modifications, additions and substitutions for those skilled in the art can be made to the described embodiments without departing from the scope of the invention or from the scope of the invention as defined in the accompanying claims.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended only to assist in the explanation of the invention. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.

Claims (5)

1. The utility model provides an automatic processingequipment that absorbs of multistation of electronic chip, includes base (1), its characterized in that, the top fixedly connected with frame (201) of base (1), the top fixedly connected with backup pad (202) of frame (201), the top of backup pad (202) is fixed with loading board (3) through spot welding, the fixed mounting of the bottom of loading board (3) has straight line step track (4), the inside sliding connection of straight line step track (4) has slide (5), the inside of straight line step track (4) is provided with the step motor that is used for driving slide (5) gliding, the bottom of slide (5) is matrix arrangement has multiunit spliced pole (6), the top of spliced pole (6) is fixedly connected with slide (5) bottom;
The device is characterized in that an alignment assembly (7) is arranged below the sliding plate (5), the alignment assembly (7) comprises a plurality of groups of transverse plates (701) and a plurality of groups of shaft seats (702), a sliding rail (705) is fixedly connected to the bottom of each transverse plate (701), two sliding seats (706) are connected to the inside of each sliding rail (705) in a sliding mode, a sleeve frame (707) is fixedly connected to the bottom of each sliding seat (706), a limiting block (708) and a clamping plate (709) are connected to the inside of each sleeve frame (707) in a sliding mode, the limiting blocks (708) are fixedly connected to the top ends of the clamping plates (709), and a compression spring I (710) is fixedly connected between the limiting blocks (708) and the inner walls of the sleeve frames (707).
The bottom of the transverse plate (701) is fixedly connected with a bracket (8), a pneumatic sucker (9) is arranged in the bracket (8), an air duct (10) is communicated with the outer side of the pneumatic sucker (9), and one end, far away from the pneumatic sucker (9), of the air duct (10) is communicated with an external air supply mechanism;
the top of the frame (201) is fixedly connected with a vertical plate (16), and a plurality of leveling components (17) are arranged between the two vertical plates (16);
The leveling assembly (17) comprises a plurality of groups of rotating rods (171) and a plurality of groups of eccentric plates (172), the side walls of the vertical plates (16) are fixedly connected with a bearing frame (22), the rotating rods (171) are movably connected in the bearing frame (22) through bearings, one ends of the rotating rods (171) are movably connected with the vertical plates (16) through bearings, the other ends of the rotating rods (171) are fixedly connected with the side walls of the eccentric plates (172), short shafts (173) are fixedly connected between the two eccentric plates (172), pull rods (174) are sleeved on the outer sides of the short shafts (173), and the pull rods (174) are movably connected with the short shafts (173) through bearings;
The guide frames (175) are obliquely arranged between the two vertical plates (16), transverse rods (23) are fixedly connected between the guide frames (175) and the vertical plates (16) and between the adjacent guide frames (175), pushing rods (176) are connected in a sliding mode in the guide frames (175), supporting seats (177) are fixedly connected to the tops of the pushing rods (176), the bottoms of the pull rods (174) are rotatably connected with the supporting seats (177), and flat plates (178) are fixedly connected to the bottoms of the pushing rods (176).
2. The multi-station automatic sucking and processing device for the electronic chip according to claim 1, wherein two ends of the transverse plate (701) are fixed with a shaft seat (702) through spot welding, the outer side of the shaft seat (702) is movably connected with a first guide wheel (703) and a second guide wheel (704) through bearings, a second compression spring (711) is fixedly connected between the sliding seat (706) and the inner wall of the sliding rail (705), a connecting block (712) is fixedly arranged at the top of the sliding seat (706), and a rope (713) is fixedly connected to the side wall of the connecting block (712).
3. The multi-station automatic sucking and processing device for the electronic chip according to claim 2, wherein a connecting plate (11) is fixedly connected to the bottom of the connecting column (6), one end, far away from the sliding seat (706), of the rope (713) is fixedly connected with the bottom of the connecting plate (11) through a first guide wheel (703) and a second guide wheel (704), a connecting plate (12) is fixedly connected between the side walls of the adjacent transverse plates (701), a connecting plate two (13) is fixedly connected to the top of the connecting plate one (12), a plurality of groups of hydraulic pushing rods (14) are fixedly arranged at the bottom of the sliding plate (5), and the bottom ends of the hydraulic pushing rods (14) are fixedly connected with the top of the connecting plate two (13).
4. The multi-station automatic sucking and processing device for the electronic chip according to claim 1, wherein a first transmission belt (181) and a second transmission belt (182) are installed on the inner side of the frame (201), a plurality of groups of bearing seats (19) are fixedly installed on the top of the second transmission belt (182) at equal intervals, one outer side wall of the vertical plate (16) is movably connected with a first gear (20) and a second gear (21) through bearings, the first gear (20) is fixedly connected with the rotating rod (171), the first gear (20) is in meshed connection with the second gear (21), and a motor (15) for driving the second gear (21) to rotate is installed on the outer side wall of the vertical plate (16).
5. A multi-station automatic sucking processing method of an electronic chip, adopting the multi-station automatic sucking processing device of the electronic chip as set forth in any one of claims 1-4, comprising the steps of:
Step one: a plurality of electronic chips are placed at the top of a first transmission belt (181) and are conveyed, a motor (15) is started, a rotating rod (171) drives a eccentric plate (172) to rotate under the mutual matching of a first gear (20) and a second gear (21), the eccentric plate (172) synchronously rotates through the cooperative matching of the rotating rods (171) and a short shaft (173), the eccentric plate (172) further drives a pushing rod (176) to slide back and forth in a guide frame (175) through the mutual matching of the short shaft (173) and the pull rod (174), the pushing rod (176) slides obliquely downwards along the guide frame (175) and drives a flat plate (178) to synchronously move obliquely downwards until the flat plate (178) is in contact with the side wall of the electronic chip, and the flat plate (178) continuously corrects the position of the electronic chip, so that the electronic chip is always on the same horizontal parallel line, and is convenient for the accurate suction of the electronic chip;
Step two: when the electronic chips move to the position right below the alignment assembly (7), starting the hydraulic push rod (14), synchronously descending the transverse plate (701) under the action of the hydraulic push rod (14), and enabling the sliding seats (706) and the clamping plates (709) which are correspondingly arranged in pairs to be close to each other because the ropes (713) do not have stretching characteristics until the clamping plates (709) automatically correct and align the electronic chips which are offset, and then enabling the pneumatic sucker (9) to be in contact with the top of the electronic chips under the action of the hydraulic push rod (14) and absorb and fix the electronic chips;
Step three: after the electronic chip is sucked, the hydraulic push rod (14) drives the electronic chip to ascend and move to the top of the second transmission belt (182) under the action of the sliding plate (5), the hydraulic push rod (14) drives the electronic chip to descend until the electronic chip contacts with the top of the bearing seat (19), the pneumatic sucker (9) releases the suction of the electronic chip and places the electronic chip on the top of the bearing seat (19) to complete the transfer, and then the second transmission belt (182) drives the electronic chip to move to a designated position through the bearing seat (19) for further processing.
CN202410196871.9A 2024-02-22 2024-02-22 Multi-station automatic sucking and processing device for electronic chip Active CN117755583B (en)

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