CN209241423U - Conveying alignment adjusting mechanism for silicon wafer packaging - Google Patents
Conveying alignment adjusting mechanism for silicon wafer packaging Download PDFInfo
- Publication number
- CN209241423U CN209241423U CN201821686727.XU CN201821686727U CN209241423U CN 209241423 U CN209241423 U CN 209241423U CN 201821686727 U CN201821686727 U CN 201821686727U CN 209241423 U CN209241423 U CN 209241423U
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- CN
- China
- Prior art keywords
- plate
- silicon wafer
- bull stick
- conveying
- movable plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 34
- 239000010703 silicon Substances 0.000 title claims abstract description 34
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 244000309464 bull Species 0.000 claims description 27
- 238000012546 transfer Methods 0.000 claims description 19
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 26
- 238000013461 design Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a conveying alignment adjusting mechanism for silicon wafer packaging, which comprises a rectangular groove plate, a conveying belt, a supporting plate, a motor, an L-shaped frame, a rectangular groove, a rotating rod, a movable plate, a contact plate, a mounting groove, a rotating roller, a spring and a push plate, wherein the conveying belt is arranged inside the rectangular groove plate, the motor is fixed at the right part of the front end surface of the rectangular groove plate, the rectangular groove is respectively arranged at the front part and the rear part of the upper end surface of the rectangular groove plate, the rotating rod is arranged inside the rectangular groove, the movable plate is sleeved on the rotating rod, the supporting plate is fixed at the upper end of the movable plate, the L-shaped frame is arranged inside the supporting plate, the contact plate is fixed inside the L-shaped frame, the mounting groove is processed at the lower end surface of the contact plate, the rotating roller is arranged inside the mounting groove, the push plate is fixed at the lower end of, the stability is good, and the reliability is high.
Description
Technical field
The utility model is a kind of conveying alignment adjustment mechanism for silicon wafer packaging, belongs to silicon wafer packaging facilities field.
Background technique
Currently, crystalline silicon material (including polysilicon and monocrystalline silicon) is most important photovoltaic material, and occupation rate of market exists
90% or more, and it is also still the mainstay material of solar battery in quite long one period from now on, polycrystalline silicon material
Production technology is rested in for a long time in beauty, day, moral etc. 3 national hands, forms the situation of technology blockage, corner on the market, polycrystalline
The demand of silicon mostlys come from semiconductor and solar battery, and silicon wafer after processing is completed, needs to carry out packing and transporting to silicon wafer,
Existing silicon wafer mostly uses universal conveying mechanism to convey silicon wafer, is easy during transportation when being packed
There is the not concordant situation of silicon wafer, needs manually to be adjusted, greatly increase the workload of staff.
Utility model content
In view of the deficienciess of the prior art, the utility model aim is to provide a kind of conveying alignment for silicon wafer packaging
Adjustment mechanism, to solve the problems mentioned in the above background technology, the utility model are easy to use, realize when silicon wafer conveys certainly
The function of dynamic alignment, stability is good, high reliablity.
To achieve the goals above, the utility model is achieved through the following technical solutions: a kind of be used for silicon wafer packet
The conveying of dress is aligned adjustment mechanism, including rectangle frid, conveyer belt, support plate, baffle, motor, L-type frame, rectangular channel, bull stick,
Movable plate, contact plate, mounting groove, transfer roller, spring and push plate, the conveyer belt are mounted on rectangular channel intralamellar part, the motor
It is fixed on rectangular channel front edge of board face right part, rectangle frid upper surface front and rear part offers rectangular channel, the bull stick installation
Inside rectangular channel, the bull stick is extended to outward on the outside of rectangle frid, and the movable plate is sleeved on bull stick, the movement
Plate is arranged inside rectangular channel, and the support plate is fixed on movable plate upper end, and the L-type frame is arranged on the inside of support plate, described
Contact plate is fixed on the inside of L-type frame, and side, the baffle are fixed on contact plate right end, institute on the conveyor belt for the contact plate setting
It states contact plate lower end surface and is machined with mounting groove, the transfer roller is mounted on inside mounting groove, and side on the conveyor belt is arranged in the transfer roller,
The spring is embedded in rear and front end face in mounting groove respectively, and the push plate is fixed on lower spring end, and the transfer roller setting is pushing away
On the downside of plate, the transfer roller rear and front end passes through push plate and is connected with spring.
Further, the conveyer belt right end is connected by shaft coupling with motor power output shaft, and the motor passes through
Conducting wire is connected with external power supply, and switch is provided on conducting wire.
Further, the bull stick is connected by bearing with rectangle frid, and the bearing is embedded in rectangular channel intralamellar part.
Further, rectangle frid lower end surface quadrangle is respectively and fixedly provided with support leg, and the support leg lower end surface is pasted
There is square rubber pad.
Further, through-hole, the through-hole annular and bull stick ring are machined at movable plate end face outside center
Shape side is threaded, and the movable plate is connected by screw thread with bull stick.
The utility model has the beneficial effects that a kind of conveying for silicon wafer packaging of the utility model is aligned adjustment mechanism,
The utility model by addition rectangle frid, conveyer belt, support plate, baffle, motor, L-type frame, rectangular channel, bull stick, movable plate,
Contact plate, mounting groove, transfer roller, spring and push plate, the design achieves the functions of automatic aligning when silicon wafer conveying, solve existing
Some silicon wafers mostly use universal conveying mechanism to convey silicon wafer when being packed, and are easy during transportation
The not concordant situation of existing silicon wafer, needs the problem of being manually adjusted, greatly increasing the workload of staff.
Because being added to bearing, the design is convenient for rotating bull stick, and because being added to support leg, which is convenient for rectangle
Frid is supported, and because being added to screw thread, convenient for moving to movable plate, the utility model is easy to use for the design, is realized
The function of automatic aligning when silicon wafer conveying, stability is good, high reliablity.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other spies of the utility model
Sign, objects and advantages will become more apparent upon:
Fig. 1 is a kind of structural schematic diagram of the conveying alignment adjustment mechanism for silicon wafer packaging of the utility model；
Fig. 2 is a kind of right view of the conveying alignment adjustment mechanism for silicon wafer packaging of the utility model；
Fig. 3 is the schematic diagram in the portion A in a kind of conveying alignment adjustment mechanism for silicon wafer packaging of the utility model；
In figure: 1- rectangle frid, 2- conveyer belt, 4- support plate, 5- baffle, 6- motor, 7-L type frame, 8- rectangular channel, 9-
Bull stick, 10- movable plate, 11- contact plate, 12- mounting groove, 13- transfer roller, 14- spring, 15- push plate.
Specific embodiment
To be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, below
In conjunction with specific embodiment, the utility model is further described.
Fig. 1-Fig. 3 is please referred to, the utility model provides a kind of technical solution: a kind of conveying alignment tune for silicon wafer packaging
Complete machine structure, including rectangle frid 1, conveyer belt 2, support plate 4, baffle 5, motor 6, L-type frame 7, rectangular channel 8, bull stick 9, movable plate
10, contact plate 11, mounting groove 12, transfer roller 13, spring 14 and push plate 15, conveyer belt 2 are mounted on inside rectangle frid 1, motor 6
It is fixed on 1 front end face right part of rectangle frid, 1 upper surface front and rear part of rectangle frid offers rectangular channel 8, and bull stick 9 is mounted on square
Inside shape slot 8, bull stick 9 extends to 1 outside of rectangle frid outward, and movable plate 10 is sleeved on bull stick 9, and movable plate 10 is arranged
Inside rectangular channel 8, support plate 4 is fixed on 10 upper end of movable plate, and for the setting of L-type frame 7 in 4 inside of support plate, contact plate 11 is fixed
In 7 inside of L-type frame, the setting of contact plate 11 is fixed on 11 right end of contact plate, 11 lower end surface of contact plate in 2 upside of conveyer belt, baffle 5
It is machined with mounting groove 12, transfer roller 13 is mounted on inside mounting groove 12, and the setting of transfer roller 13 is inlayed respectively in 2 upside of conveyer belt, spring 14
The rear and front end face in mounting groove 12, push plate 15 are fixed on 14 lower end of spring, and the setting of transfer roller 13 is in 15 downside of push plate, transfer roller
13 rear and front ends pass through push plate 15 and are connected with spring 14, in use, user of service should be first according to the ruler of silicon wafer to be conveyed
The very little position to contact plate 11 is adjusted, and user of service first holds bull stick 9 and rotates clockwise, and bull stick 9 rotates clockwise band
Dynamic movable plate 10 moves forward, and movable plate 10, which moves forward, drives support plate 4 to move forward, and support plate 4, which moves forward, drives L
Type frame 7 move forward, L-type frame 7 move forward drive contact plate 11 move forward, contact plate 11 move forward drive baffle 5 to
Preceding movement, when baffle 5 moves forward to suitable position, stop rotating bull stick 9, carries out to realize to 11 position of contact plate
The function of adjustment, because push plate 15 is connected by spring 14 with rectangle frid 1, transfer roller 13 is acted in the elastic force of spring 14
Lower holding is contacted with the 2 upper surface moment of conveyer belt, to realize the sliding friction conversion between contact plate 11 and conveyer belt 2
For the function of rolling friction, then silicon wafer to be conveyed is placed on 2 upper end of conveyer belt by user of service, and then user of service opens electricity
Machine 6, the work driving conveying belt 2 of motor 6 are moved to the left, and conveyer belt 2, which is moved to the left, drives silicon wafer to be moved to the left, and conveyer belt 2 is to the left
Mobile that transfer roller 13 is driven to rotate clockwise, then silicon wafer is aligned to 11 inside of contact plate by baffle 5, to realize silicon wafer conveying
When automatic aligning function.
2 right end of conveyer belt is connected by shaft coupling with 6 power output shaft of motor, and motor 6 passes through conducting wire and external power supply
It is connected, and is provided with switch on conducting wire, the design achieves the functions of being controlled motor 6.
Bull stick 9 is connected by bearing with rectangle frid 1, and bearing is embedded in inside rectangle frid 1, and the design achieves right
The function that bull stick 9 rotates.
1 lower end surface quadrangle of rectangle frid is respectively and fixedly provided with support leg, and support leg lower end surface is pasted with square rubber pad, this sets
Meter realizes the function being supported to rectangle frid 1.
Through-hole is machined at 10 end face outside center of movable plate, through-hole annular and 9 annular side of bull stick are machined with
Screw thread, movable plate 10 are connected by screw thread with bull stick 9, and the design achieves mobile function is carried out to movable plate 10.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above, for
For those skilled in the art, it is clear that the present invention is not limited to the details of the above exemplary embodiments, and without departing substantially from this
In the case where the spirit or essential attributes of utility model, the utility model can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by institute
Attached claim rather than above description limit, it is intended that will fall within the meaning and scope of the equivalent elements of the claims
All changes are embraced therein.It should not treat any reference in the claims as limiting related right
It is required that.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (5)
1. it is a kind of for silicon wafer packaging conveying be aligned adjustment mechanism, including rectangle frid (1), conveyer belt (2), support plate (4),
Baffle (5), motor (6), L-type frame (7), rectangular channel (8), bull stick (9), movable plate (10), contact plate (11), mounting groove (12),
Transfer roller (13), spring (14) and push plate (15), it is characterised in that: the conveyer belt (2) is mounted on rectangle frid (1) inside,
The motor (6) is fixed on rectangle frid (1) front end face right part, and rectangle frid (1) the upper surface front and rear part offers square
Shape slot (8), the bull stick (9) are mounted on rectangular channel (8) inside, and the bull stick (9) extends to rectangle frid (1) outside outward
Side, the movable plate (10) are sleeved on bull stick (9), and movable plate (10) setting is internal in rectangular channel (8), the support plate
(4) it is fixed on movable plate (10) upper end, on the inside of support plate (4), the contact plate (11) is fixed on L for L-type frame (7) setting
On the inside of type frame (7), on the upside of conveyer belt (2), the baffle (5) is fixed on contact plate (11) right side for contact plate (11) setting
End, contact plate (11) lower end surface are machined with mounting groove (12), and the transfer roller (13) is mounted on mounting groove (12) inside, described
On the upside of conveyer belt (2), the spring (14) is embedded in the interior rear and front end face of mounting groove (12) respectively, described for transfer roller (13) setting
Push plate (15) is fixed on spring (14) lower end, and transfer roller (13) setting is on the downside of push plate (15), two before and after the transfer roller (13)
End is connected by push plate (15) with spring (14).
2. a kind of conveying for silicon wafer packaging according to claim 1 is aligned adjustment mechanism, it is characterised in that: described defeated
Band (2) right end is sent to be connected by shaft coupling with motor (6) power output shaft, the motor (6) passes through conducting wire and external power supply
It is connected, and is provided with switch on conducting wire.
3. a kind of conveying for silicon wafer packaging according to claim 1 is aligned adjustment mechanism, it is characterised in that: described turn
Bar (9) is connected by bearing with rectangle frid (1), and it is internal that the bearing is embedded in rectangle frid (1).
4. a kind of conveying for silicon wafer packaging according to claim 1 is aligned adjustment mechanism, it is characterised in that: the square
Shape frid (1) lower end surface quadrangle is respectively and fixedly provided with support leg, and the support leg lower end surface is pasted with square rubber pad.
5. a kind of conveying for silicon wafer packaging according to claim 1 is aligned adjustment mechanism, it is characterised in that: the shifting
Through-hole is machined at movable plate (10) end face outside center, the through-hole annular and bull stick (9) annular side are machined with spiral shell
Line, the movable plate (10) are connected by screw thread with bull stick (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821686727.XU CN209241423U (en) | 2018-10-18 | 2018-10-18 | Conveying alignment adjusting mechanism for silicon wafer packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821686727.XU CN209241423U (en) | 2018-10-18 | 2018-10-18 | Conveying alignment adjusting mechanism for silicon wafer packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209241423U true CN209241423U (en) | 2019-08-13 |
Family
ID=67525260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821686727.XU Expired - Fee Related CN209241423U (en) | 2018-10-18 | 2018-10-18 | Conveying alignment adjusting mechanism for silicon wafer packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209241423U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117755583A (en) * | 2024-02-22 | 2024-03-26 | 江苏优众微纳半导体科技有限公司 | multi-station automatic sucking and processing device for electronic chip |
-
2018
- 2018-10-18 CN CN201821686727.XU patent/CN209241423U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117755583A (en) * | 2024-02-22 | 2024-03-26 | 江苏优众微纳半导体科技有限公司 | multi-station automatic sucking and processing device for electronic chip |
| CN117755583B (en) * | 2024-02-22 | 2024-05-10 | 江苏优众微纳半导体科技有限公司 | Multi-station automatic sucking and processing device for electronic chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190813 Termination date: 20211018 |