CN117693697A

CN117693697A - Optical module

Info

Publication number: CN117693697A
Application number: CN202280051619.8A
Authority: CN
Inventors: 吴涛; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2021-09-24
Filing date: 2022-06-15
Publication date: 2024-03-12
Also published as: CN113885143B; CN113885143A

Abstract

A light module includes a lower housing, an upper housing, a circuit board, a substrate, and a light emitting device. The upper shell covers the lower shell to form a cavity; the circuit board is arranged in the cavity and comprises a yielding hole; the substrate is arranged at the position of the abdication hole and comprises a substrate body, a bearing platform and a heat conduction component. The bearing platform is arranged on one side of the substrate body, which is close to the upper shell, one end of the heat conducting component is connected with the bearing platform, and the other end of the heat conducting component is connected with the upper shell to conduct heat. The light emitting device comprises a light emitting component and a silicon light chip, and the light emitting component and the silicon light chip are arranged on the same side of the substrate.

Description

Optical module

The present application claims a chinese patent application No. 202111121659.9 filed 24 at 2021, 09; and priority of chinese patent application No. 202122324284.8 filed 24 at 09 at 2021, the entire contents of which are incorporated herein by reference.

Technical Field

The disclosure relates to the technical field of optical communication, and in particular relates to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video conference, etc., the development and progress of optical communication technology are becoming more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical and electrical signals, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology.

Disclosure of Invention

An optical module is provided. The light module includes a lower housing, an upper housing, a circuit board, a substrate, and a light emitting device. The upper shell covers the lower shell to form a cavity; the circuit board is arranged in the cavity and comprises a yielding hole; the substrate is arranged at the position of the abdication hole and comprises a substrate body, a bearing platform and a heat conduction component. The bearing platform is arranged on one side of the substrate body, which is close to the upper shell, one end of the heat conducting component is connected with the bearing platform, and the other end of the heat conducting component is connected with the upper shell to conduct heat. The light emitting device comprises a light emitting component and a silicon light chip, and the light emitting component and the silicon light chip are arranged on the same side of the substrate.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that are required to be used in some embodiments of the present disclosure will be briefly described below, however, the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings for those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

fig. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of an optical module according to some embodiments;

FIG. 4 is a block diagram of another light module according to some embodiments;

fig. 5 is an exploded view of a light module according to some embodiments;

fig. 6 is a partial block diagram of an optical module according to some embodiments;

FIG. 7 is a view of the inverted structure of FIG. 6;

fig. 8 is an exploded view of a light emitting device and a circuit board according to some embodiments;

fig. 9 is a block diagram of a light emitting device according to some embodiments;

fig. 10 is an exploded view of a light emitting device according to some embodiments;

FIG. 11 is a block diagram of a substrate body according to some embodiments;

FIG. 12 is a block diagram of a mounting portion according to some embodiments;

FIG. 13 is a view of the mounting portion of FIG. 12 from another perspective;

FIG. 14 is a block diagram of yet another view of the mounting portion of FIG. 12;

fig. 15 is a cross-sectional view of an optical module according to some embodiments;

FIG. 16 is an enlarged view of a portion of FIG. 15 at box Q;

fig. 17 is a partial block diagram of a light emitting device according to some embodiments;

Fig. 18 is a top view of the light emitting device of fig. 17;

fig. 19 is an optical path diagram of the light emitting device of fig. 17;

FIG. 20 is a single optical path schematic of a light emitting device according to some embodiments;

fig. 21 is a block diagram of a light receiving device according to some embodiments;

fig. 22 is another block diagram of a light receiving device according to some embodiments;

FIG. 23 is a cross-sectional view of the optical module of FIG. 22 (the receiving optical path is shown);

FIG. 24 is an exploded view of another light module according to some embodiments;

FIG. 25 is a partial block diagram of another light module according to some embodiments;

FIG. 26 is a view of the inverted structure of FIG. 25;

FIG. 27 is an exploded view of another light emitting device and circuit board according to some embodiments;

FIG. 28 is a block diagram of another substrate body according to some embodiments;

FIG. 29 is a block diagram of another view of the substrate body of FIG. 28;

fig. 30 is a cross-sectional view of another light module according to some embodiments.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, unless the context requires otherwise, the word "comprise" and its other forms such as the third person referring to the singular form "comprise" and the present word "comprising" are to be construed as open, inclusive meaning, i.e. as "comprising, but not limited to. In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", "some examples", "and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

In describing some embodiments, expressions of "coupled" and "connected" and their derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, the term "coupled" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled (communicatively coupled)" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the disclosure herein.

A. At least one of B and C "has the same meaning as at least one of" A, B or C ", each including the following A, B and C combinations: a alone, B alone, C alone, a combination of a and B, a combination of a and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

As used herein, the term "if" is optionally interpreted to mean "when … …" or "at … …" or "in response to a determination" or "in response to detection" depending on the context. Similarly, the phrase "if determined … …" or "if detected [ stated condition or event ]" is optionally interpreted to mean "upon determining … …" or "in response to determining … …" or "upon detecting [ stated condition or event ]" or "in response to detecting [ stated condition or event ]" depending on the context.

The use of "adapted" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

As used herein, "about," "approximately" or "approximately" includes the stated values as well as average values within an acceptable deviation range of the particular values as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).

As used herein, "parallel", "perpendicular", "equal" includes the stated case as well as the case that approximates the stated case, the range of which is within an acceptable deviation range as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where the acceptable deviation range for approximately parallel may be, for example, a deviation within 5 °; "vertical" includes absolute vertical and near vertical, where the acceptable deviation range for near vertical may also be within 5, for example. "equal" includes absolute equal and approximately equal, where the difference between the two, which may be equal, for example, is less than or equal to 5% of either of them within an acceptable deviation of approximately equal.

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Since the optical signal has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost and low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform mutual conversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electric signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electric port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, realizes electric connection with an optical network terminal (for example, optical cat) through the electric port, and is mainly used for realizing power supply, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electrical signal to information processing equipment such as a computer through a network cable or Wireless-Fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6-8 kilometers), on the basis of which, if a repeater is used, it is theoretically possible to realize ultra-long-distance transmission. Thus, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following: routers, switches, computers, cell phones, tablet computers, televisions, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101 such that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100 such that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 performs mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and then input to the optical fiber 101.

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. For example, since the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103 and transmits an electrical signal from the network cable 103 to the optical module 200, the optical network terminal 100 can monitor the operation of the optical module 200 as a host computer of the optical module 200. The upper computer of the optical module 200 may include an optical line terminal (Optical Line Terminal, OLT) or the like in addition to the optical network terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

Fig. 2 is a block diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical network terminal 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a circuit board 105 (e.g., a printed circuit board (Printed Circuit Board, PCB)) disposed within the housing, a cage 106 disposed on a surface of the circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex portion such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with an electrical connector inside the cage 106, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of one optical module according to some embodiments, and fig. 4 is a block diagram of another optical module according to some embodiments; fig. 5 is an exploded view of a light module according to some embodiments. As shown in fig. 3, 4 and 5, the optical module 200 includes a housing (shell), a circuit board 300 disposed in the housing, a light emitting device 400 and a light receiving device 500.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 covering the lower housing 202 to form a cavity 206. The circuit board 300 is disposed within the cavity 206. The housing comprises two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. For example, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Alternatively, the opening 204 is located at the end of the light module 200, while the opening 205 is located at the side of the light module 200. The opening 204 is an electrical port, and a golden finger 310 (see fig. 5) of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to access the external optical fiber 101 such that the optical fiber 101 connects the light emitting device 400 and the light receiving device 500 inside the optical module 200. The circuit board 300, the light emitting device 400, the light receiving device 500, and other optoelectronic devices are located in the above-described case.

The assembly mode of combining the upper shell 201 and the lower shell 202 is adopted, so that photoelectric devices such as the circuit board 300, the light emitting device 400, the light receiving device 500 and the like are conveniently installed in the shell, and packaging protection is formed on the photoelectric devices by the upper shell 201 and the lower shell 202. In addition, the casing with split structure facilitates the deployment of the positioning component, the heat dissipating component and the electromagnetic shielding component of the circuit board 300, the light emitting device 400, the light receiving device 500 and other photoelectric devices during the assembly of these devices, and is beneficial to the implementation and production of automation.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member 203 located on an outer wall of the housing, and the unlocking member 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or release the fixed connection between the optical module 200 and the host computer.

For example, as shown in fig. 3, the unlocking member 203 is located on the outer walls of the two lower side plates 2022 of the lower case 202, or, as shown in fig. 4, the unlocking member 203 is located on the outer wall of the cover 2011 of the upper case 201. The unlocking means 203 comprises a snap-in means matching with a cage of a host computer (e.g. cage 106 of optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping component of the unlocking component 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, so as to change the connection relationship between the engaging member and the host computer, so as to release the engagement relationship between the optical module 200 and the host computer, and thus the optical module 200 can be pulled out from the cage of the host computer.

The circuit board 300 includes circuit traces, electronic components, chips, etc., and the electronic components and the chips are connected together according to a circuit design through the circuit traces to realize functions of power supply, electric signal transmission, grounding, etc. The electronic components include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips include, for example, a microprocessor (Microcontroller Unit, MCU), a laser driver chip, a limiting amplifier (Limiting Amplifier), a clock data recovery chip (Clock and Data Recovery, CDR), a power management chip (Power Management Chip), a digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; when the light emitting device 400 and the light receiving device 500 are located on the circuit board 300, the rigid circuit board can also smoothly carry the light emitting device 400 and the light receiving device 500. The hard circuit board can also be inserted into an electrical connector in the upper computer cage.

In some embodiments, the circuit board 300 further includes a gold finger 310 formed on an end surface thereof, the gold finger 310 including a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is conductively connected to an electrical connector within the cage 106 by a gold finger 310. The golden finger 310 may be disposed on only one surface of the circuit board 300 (for example, the upper surface of the circuit board 300 in fig. 5), or may be disposed on both the upper and lower surfaces of the circuit board 300, so as to adapt to the situation where the pin number is large. The golden finger 310 is configured to establish electrical connection with an upper computer to achieve power supply, grounding, I2C signal transfer, data signal transfer, and the like. Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board. For example, the rigid circuit board 300 may be connected to the light emitting device 400 and the light receiving device 500 using a flexible circuit board instead of being connected through circuit traces.

Fig. 6 is a partial block diagram of an optical module according to some embodiments. Fig. 7 is a view showing a structure of the flipped article of fig. 6. As shown in fig. 6, the light emitting device 400 and the light receiving device 500 are located on the circuit board 300, and the light emitting device 400 and the light receiving device 500 may be disposed on the same side of the circuit board 300 or may be disposed on different sides of the circuit board 300.

Of course, the light emitting device 400 and the light receiving device 500 may be indirectly connected to the circuit board 300, for example, by a flexible circuit board or an electrical connector.

The light emitting device 400 is configured to convert an electrical signal into an optical signal. The light emitting device 400 receives an electrical signal from the circuit board 300 and converts the electrical signal into an optical signal. The light emitting device 400 is connected to an external optical fiber through the first optical fiber adapter 600, and transmits an optical signal to the external optical fiber through the first optical fiber adapter 600. The light receiving device 500 is configured to convert an optical signal into an electrical signal. The light receiving device 500 is connected to the second optical fiber adapter 700 to receive an optical signal from an external optical fiber. The optical signal is converted into an electrical signal by the light receiving device 500, and then transmitted to the circuit board 300 by the light receiving device 500, and transmitted to the host computer by the golden finger 310 on the circuit board 300.

As shown in fig. 6 and 7, in some embodiments, the light emitting device 400 and the light receiving device 500 are both disposed on the same side of the circuit board 300. For example, the light emitting device 400 and the light receiving device 500 are both disposed at one side of the circuit board 300 near the upper case 201.

Fig. 8 is an exploded view of a light emitting device and a circuit board according to some embodiments, and fig. 9 is a block diagram of a light emitting device according to some embodiments.

In some embodiments, as shown in fig. 8 and 9, the light emitting device 400 includes a silicon optical chip 420 and a light emitting component 410 to achieve high-speed communication with reduced losses.

The silicon optical chip 420 is disposed on the circuit board 300 and electrically connected to the circuit board 300. For example, the silicon optical chip 420 is connected to the circuit board 300 through a metal connection line (e.g., gold wire), and the silicon optical chip 420 is flush with a side surface of the circuit board 300 near the upper case 201; when the light emitting device 400 further includes a substrate, a silicon optical chip may also be disposed on the surface of the substrate, and the substrate and the circuit board are connected by a wire.

For convenience of description, the following description will mainly refer to the directions shown in fig. 5, in which the upper case 201 is located in an upper direction, the lower case 202 is located in a lower direction, the optical port 205 is located in a left direction, the electrical port 204 is located in a right direction, the lower side plate 2022 near the light receiving device 500 is located in a front direction, and the lower side plate 2022 near the light emitting device is located in a rear direction.

In some embodiments, as shown in fig. 8, the optical module 200 further includes a digital signal processing chip 301. The digital signal processing chip 301 is disposed on the circuit board 300, and the silicon optical chip 420 (see fig. 9) is connected to the digital signal processing chip 301 through wiring on the circuit board 300. The upper computer transmits the electrical signal to the digital signal processing chip 301 via the golden finger 310 (see fig. 5), and the digital signal processing chip 301 performs data processing on the received electrical signal to generate an optical electrical modulation signal. The electrical modulation signal of the light is then transmitted to the silicon optical chip 420.

The light emitting element 410 emits light that does not carry a signal, and the silicon optical chip 420 receives the light from the light emitting element 410 and modulates the light, i.e., an electrically modulated signal of the light is loaded onto the light to form an optical signal.

As shown in fig. 8 and 9, the optical module 200 further includes a first fiber optic adapter 600. The silicon optical chip 420 and the first optical fiber adapter 600 are optically connected by the internal optical fiber 800, and the first optical fiber adapter 600 is also optically connected to the external optical fiber. The silicon optical chip 420 transmits an optical signal carrying data information to the first optical fiber adapter 600 through the internal optical fiber 800, and then to the external optical fiber through the first optical fiber adapter 600.

Referring to fig. 19, the silicon optical chip 420 includes a combiner 425, a plurality of modulators 426, and an optical waveguide 427. The combiner 425 is configured to combine light with different wavelengths to form a path of optical waveguide signal, which is beneficial to realizing single-mode optical fiber multichannel signal transmission and improving optical communication efficiency. The input terminals of the plurality of modulators 426 receive the outgoing light of the light emitting element 410 and modulate the outgoing light into modulated light. The combiner 425 is connected to the plurality of modulators 426 via an optical waveguide 427.

Fig. 10 is an exploded view of a light emitting device according to some embodiments. As shown in fig. 10 and 17, in some embodiments, the light emitting assembly 410 includes a laser group 411, a collimating lens group 412, and a converging lens group 413.

The laser group 411 is configured to emit a laser beam that does not carry data information. For example, the laser group 411 is a distributed feedback (Distributed Feed Back, DFB) laser group 411, and the side surface of the DFB laser group 411 has a light outlet, and the emitted laser is a laser with a larger divergence angle.

The light emitting device 400 adopts the silicon optical chip 420 to realize the modulation and the wave combination of multiple paths of lasers, and has higher integration level and simple assembly. A high power DFB laser group 411 is employed to provide sufficient optical power for the light emitting device 400. And, the DFB laser group 411 can normally operate in a larger temperature range without temperature control, reducing the use of optoelectronic devices, and thus reducing the cost of the optical module 200.

The collimating lens group 412 is disposed on the light-emitting path of the laser group 411. The collimator lens group 412 is configured to collimate the laser light beam emitted from the laser group 411 into a parallel laser light beam.

The converging lens group 413 is disposed on the light-emitting path of the collimating lens group 412. The condensing lens group 413 is configured to condense the parallel laser beams to form a spot. The input end of the silicon optical chip 420 is disposed at the focal point of the light spot of the converging lens group 413 and is configured to receive the converging light of the converging lens group 413. The converging light enters the silicon optical chip 420 through the input end of the silicon optical chip 420, is modulated by a modulator to form a laser signal carrying data information, and then is combined into a beam of laser signal by a combiner 425. The beam of laser light signal is transmitted to an external optical fiber through the output end of the silicon optical chip 420.

In some embodiments, the light emitting assembly 410 further includes a set of optical isolators 414 (see fig. 17). An optical isolator group 414 is located between the collimating lens group 412 and the converging lens group 413 and is configured to allow the outgoing light of the collimating lens group 412 to pass through in one direction, so as to avoid that the light is reflected by interfaces of different media and returned to the laser group 411 by the original path.

The input end of the silicon optical chip 420 is an optical waveguide 427, and the end face of the input end of the silicon optical chip 420 is obliquely arranged, so that an included angle of a preset angle exists between the end face of the input end of the silicon optical chip 420 and the end face of the output end of the light emitting component 410.

As shown in fig. 10, the light emitting device 400 further includes a wedge prism 422. The wedge prism 422 is disposed at the input end of the silicon photo chip 420. The inclined surface of the wedge prism 422 is connected with the input end of the silicon optical chip 420, and the surface of one side of the wedge prism 422 away from the inclined surface is perpendicular to the laser beam. The inclined plane of the wedge prism and the input end of the silicon optical chip 420 can be connected through optical cement, and the refractive index of the optical cement is between the refractive index of the wedge prism 422 and the refractive index of the silicon optical chip 420 so as to realize the matching of the refractive indexes of the three; in this way, the coupling efficiency of the input end light of the silicon optical chip 420 is advantageously improved.

In some embodiments, the one side surface of wedge prism 422 is provided with (e.g., coated with) an optical anti-reflection film; the optical anti-reflection film can prevent the reflected light generated at the output end of the silicon optical chip 420 from passing through the wedge prism 422, so as to avoid the influence on the light efficiency caused by that a part of light emitted by the light emitting component 410 is reflected by the input end of the silicon optical chip 420 and returns along the original path.

The transmission paths of the laser light or the laser light signal in the light emitting device 400 are as follows: the laser group 411 emits laser beams which do not carry data information, the laser beams are collimated by the collimating lens group 412 to form parallel laser beams, the parallel laser beams reach the converging lens group 413 after passing through the optical isolator group 414, and the parallel laser beams enter the silicon optical chip 420 after being converged into light spots by the converging lens group 413; the light spot is modulated by modulator 426 to form a modulated laser signal, which is then fed into combiner 425 and finally transmitted to first fiber optic adapter 600 via first internal optical fiber 800 connected by first fiber optic connector 423.

As shown in fig. 8, the circuit board 300 includes relief holes 320. As shown in fig. 10, the light emitting device 400 further includes a substrate 430. A portion of the substrate 430 is coupled to the upper case 201, and another portion of the substrate 430 is embedded in the relief hole 320.

Materials for substrate 430 include, but are not limited to, tungsten copper, kovar (e.g., iron-nickel or iron-nickel-cobalt), cold rolled carbon steel (Steel Plate Cold rolled Commercial, SPCC), copper, etc., to facilitate transfer of heat generated by the photovoltaic device to substrate 430.

Fig. 11 is a block diagram of a substrate body according to some embodiments.

As shown in fig. 10 and 11, the substrate 430 includes a substrate body 435. The substrate body 435 includes an emitter sub-substrate body 431 and a chip sub-substrate body 432. The emitter sub-substrate body 431 and the chip sub-substrate body 432 are both in cuboid structures, the emitter sub-substrate body 431 and the chip sub-substrate body 432 are connected at one side close to each other, and a preset included angle theta (shown in fig. 18) is arranged at the connecting position, namely the emitter sub-substrate body 431 and the chip sub-substrate body 432 are positioned in the same plane but not on the same straight line; for example, in fig. 18, the emitter sub-substrate body 431 is located on a straight line O, and the chip sub-substrate body is located on a straight line O'. The predetermined angle θ is beneficial for the light emitted from the light emitting component 410 to enter the input end of the silicon optical chip 420.

The side surfaces of the connection parts of the emission sub-substrate body 431 and the chip sub-substrate body 432 are flush, so that the light emitting component 410 and the silicon optical chip 420 can be conveniently installed and positioned.

The chip sub-substrate body 432 and the emitter sub-substrate body 431 may be a single piece or separate pieces.

As shown in fig. 11, the substrate body 435 includes a first stopper 433. The first limiting part 433 is disposed at an edge of the emission sub-substrate body 431. A side surface (e.g., an upper surface) of the first stopper 433 near the upper case 201 is lower than a side surface (e.g., an upper surface) of the sub-substrate body 431 near the upper case 201, and the upper surface of the first stopper 433 is connected with a side surface (e.g., a lower surface) of the circuit board 300 far from the upper case 201 to achieve connection between the substrate body 435 and the circuit board 300.

The first limiting part 433 is disposed around an edge of the emission sub-substrate body 431, and the first limiting part 433 includes a first sub-emission limiting part 4331, a second sub-emission limiting part 4332, and a third sub-emission limiting part 4333.

The first sub-emission limiting portion 4331 is disposed at one side (e.g., front side) of the emission sub-substrate body 431. A side surface (e.g., an upper surface) of the first sub-emission stopper 4331, which is adjacent to the upper case 201, is connected to a lower surface of the circuit board 300.

The second sub-emission limiting portion 4332 is disposed on a side (e.g., left side) of the emission sub-substrate body 431 away from the chip sub-substrate body 432. A side surface (e.g., an upper surface) of the second sub-emission stopper 4332, which is close to the upper case 201, is connected to a lower surface of the circuit board.

The third sub-emission limiting portion 4333 is disposed on a side (e.g., a rear side) of the emission sub-substrate body 431 away from the first sub-emission limiting portion. A side surface (e.g., an upper surface) of the third sub-emission stopper 4333, which is close to the upper case 201, is connected to a lower surface of the circuit board 300.

In this way, the substrate body 435 can support the circuit board 300 through the first sub-emission limiting portion 4331, the second sub-emission limiting portion 4332, and the third sub-emission limiting portion 4333.

In some embodiments, the first sub-emission limiter 4331, the second sub-emission limiter 4332, and the third sub-emission limiter 4333 are the same in height.

Note that the same height refers to that the first sub-emission limiting portion 4331, the second sub-emission limiting portion 4332, and the third sub-emission limiting portion 4333 are all located in the same plane on one side surface close to the upper case 201.

In some embodiments, the height equality may further comprise: in the thickness direction of the emission sub-substrate body 431, the thicknesses of the first sub-emission limiting portion 4331, the second sub-emission limiting portion 4332, and the third sub-emission limiting portion 4333 are equal.

The first sub-emission limiting portion 4331, the second sub-emission limiting portion 4332, and the third sub-emission limiting portion 4333 are connected to each other. Of course, a certain gap may exist between the first sub-emission limiting portion 4331, the second sub-emission limiting portion 4332, and the third sub-emission limiting portion 4333.

The emitter sub-substrate body 431 includes a relief hole 4311. The escape aperture 4311 is configured to escape the optoelectronic device.

The substrate body 435 further includes a second stop 434. The second limiting portion 434 is disposed at an edge of the chip sub-substrate body 432 and is configured to connect the substrate body 435 with the circuit board 300. One side surface (e.g., upper surface) of the second limiting portion 434, which is close to the upper case 201, is lower than one side surface (e.g., upper surface) of the chip sub-substrate body 432, which is close to the upper case 201, and the upper surface of the second limiting portion 434 is connected with the lower surface of the circuit board 300.

The second limiting part 434 is disposed around the edge of the chip sub-substrate body 432, and the second limiting part 434 includes a first sub-chip limiting part 4341, a second sub-chip limiting part 4342, and a third sub-chip limiting part 4343.

The first sub-chip limiting portion 4341 is disposed on one side (e.g., front side) of the chip sub-substrate body 432. One side surface (e.g., an upper surface) of the first sub-chip spacing portion 4341, which is adjacent to the upper case 201, is connected to the lower surface of the circuit board 300.

The second sub-chip limiting part 4342 is disposed at a side (e.g., right side) of the chip sub-substrate body 432 away from the emitter sub-substrate body 431. One side surface (e.g., an upper surface) of the second sub-chip limiting part 4342, which is close to the upper case 201, is connected to the lower surface of the circuit board 300.

The third sub-chip limiting portion 4343 is disposed on a side (e.g., a rear side) of the chip sub-substrate body 432 away from the first sub-chip limiting portion 4341. A side surface (e.g., an upper surface) of the third sub-chip spacing portion 4343, which is adjacent to the upper case 201, is connected to a lower surface of the circuit board 300.

In this way, the support of the circuit board 300 by the substrate body 435 can be achieved by the first sub-chip spacing portion 4341, the second sub-chip spacing portion 4342, and the third sub-chip spacing portion 4343.

In some embodiments, the first, second, and third sub-chip limiter 4341, 4342, 4343 are the same height.

Note that the same height refers to that the first sub-chip limiting portion 4341, the second sub-chip limiting portion 4342, and the third sub-chip limiting portion 4343 are all located in the same plane on one side surface close to the upper case 201.

In some embodiments, the height equality may further comprise: in the thickness direction of the chip sub-substrate body 432, the thicknesses of the first sub-chip limiting portion 4341, the second sub-chip limiting portion 4342, and the third sub-chip limiting portion 4343 are equal.

In some embodiments, the first sub-chip limiter 4341, the second sub-chip limiter 4342, and the third sub-chip limiter 4343 are connected to each other. Of course, a certain gap may exist between the first sub-chip limiter 4341, the second sub-chip limiter 4342, and the third sub-chip limiter 4343.

The first spacing portion 433 and the second spacing portion 434 have the same height, i.e. the upper surface of the first spacing portion 433 and the upper surface of the second spacing portion 434 are also located in the same plane.

In some embodiments, the height equality may further comprise: in the thickness direction of the substrate body 435, the first stopper 433 and the second stopper 434 have the same thickness.

Each corner of the substrate body 435 is provided with rounded corners. A side wall (e.g., left side wall) of the emitter sub-substrate body 431 away from the chip sub-substrate body 432 is disposed close to the optical port 205 and abuts against a side of the relief hole 320 of the circuit board 300.

As shown in fig. 10, the substrate 430 further includes a mounting portion 440, the mounting portion 440 being disposed at a side (e.g., upper side) of the emission sub-substrate body 431 near the upper case 201 and configured to carry the light emitting assembly 410.

The substrate body 435 and the mounting portion 440 may be a single piece or separate pieces. The substrate body 435 and the mounting portion 440 may be connected by bonding (e.g., heat conductive adhesive), or welding, so as to increase the contact area between the substrate body 435 and the mounting portion 440, and improve the heat transfer efficiency and connection stability between the substrate body 435 and the mounting portion 440.

In some embodiments, the material of the mounting portion includes, but is not limited to, tungsten copper, kovar (e.g., iron nickel alloy or iron nickel cobalt alloy), cold rolled carbon steel, copper, and the like.

Fig. 12 is a structural view of a mounting portion according to some embodiments, fig. 13 is a structural view of the mounting portion shown in fig. 12 from another perspective, and fig. 14 is a structural view of the mounting portion shown in fig. 12 from yet another perspective.

In some embodiments, as shown in fig. 12-14, the mounting portion 440 includes a load carrying platform 441 and a thermally conductive member 446.

The carrying platform 441 is disposed on the upper side of the emissive sub-substrate body 431 and is configured to carry the laser assembly 411 and the collimating lens assembly 412.

The heat conductive member 446 is disposed on a side (e.g., upper side) of the loading platform 441 near the upper case 201, and one end of the heat conductive member 446 is connected to the upper case 201, so that heat generated from the light emitting assembly 410 can be conducted to the upper case 201.

The heat conductive member 446 includes a first support plate 442 and a second support plate 443.

In some embodiments, the first support plate 442 and the second support plate 443 are perpendicular to the plane of the load platform 441, and the load platform 441 is located between the first support plate 442 and the second support plate 443. The laser set 411 and the collimating lens set 412 are disposed on the carrying platform 441.

For example, the second supporting plate 443 is symmetrically disposed with the first supporting plate 442, so that the laser set 411 and the collimating lens set 412 are disposed on the carrying platform 441.

The heat conductive member 446 further includes a heat conductive plate 444. The heat conductive plate 444 is disposed on top of the first and second support plates 442 and 443. A side surface (e.g., an upper surface) of the heat conductive plate 444, which is adjacent to the upper case 201, is coupled to an inner wall of the upper case 201 to facilitate heat transfer. A side surface (a lower surface) of the heat conductive plate 444 remote from the upper case 201 is connected to the optical isolator group 414 and the condensing lens group 413.

The laser group 411 in the light emitting device 400 is the main heat generating source. The laser group 411 is connected with the mounting portion 440, so that a small part of heat generated by the laser group 411 is conducted to the substrate body 435 through the mounting portion 440 and then conducted to the outside of the optical module 200 through the lower housing 202; most of the heat generated by the laser set 411 is conducted to the first support plate 442 and the second support plate 443 connected to the carrying platform 441 through the carrying platform 441, and then conducted to the top heat conduction plate 444 through the first support plate 442 and the second support plate 443; the heat of the heat conductive plate 444 is conducted to the upper case 201; since the outside of the upper case 201 is connected to the cage 106, heat can be emitted via the heat sink 107.

The upper case 201 further includes a heat conductive protrusion 2012 (see fig. 15), and the heat conductive protrusion 2012 is disposed on an inner wall of the cover 2011 and connected to the heat conductive plate 444, so as to improve heat dissipation efficiency.

Materials for thermally conductive bump 2012 include, but are not limited to, tungsten copper, kovar (e.g., iron-nickel or iron-nickel-cobalt), cold rolled carbon steel, copper, and the like. The thermally conductive boss 2012 and the cover 2011 may be an integral piece or a separate piece.

The optical module in some embodiments of the present disclosure dissipates heat by means of the mounting portion 440 instead of the semiconductor refrigerator (Thermo Electric Cooler, TEC), so that the arrangement of the semiconductor refrigerator is omitted, the number of use of the optoelectronic devices is reduced, and cost reduction is facilitated.

As shown in fig. 12 to 14, the mounting portion 440 further includes a first extension plate 4412 and a second extension plate 4413. The first extension plate 4412 is disposed on a side of the first support plate 442 close to the chip sub-substrate body 432, and the second extension plate 4413 is disposed on a side of the second support plate 443 close to the chip sub-substrate body 432. The first extension plate 4412 and the second extension plate 4413 are connected to the emitter sub-substrate body 431. The first extension plate 4412 and the second extension plate 4413 are parallel to the upper surface of the emitter substrate body 431, which is beneficial to increasing the contact area between the substrate body 435 and the mounting portion 440 and improving the structural stability.

In some embodiments, the first extension plate 4412 and the emitter sub-substrate body 431, and the second extension plate 4413 and the emitter sub-substrate body 431 are connected by bonding (such as bonding by a heat conductive adhesive) or welding.

As shown in fig. 13, the mounting portion 440 includes a mounting hole 445. The mounting holes 445 are located in the orthographic projection of the heat conductive plate 444 on the carrier platform 441. The mounting holes 445 correspond to the positions of the escape holes 4311 (see fig. 11) to facilitate the mounting of the light emitting assembly 410.

The bottom surface of the wedge prism 422 is a plane, and the wedge prism 422 is disposed on one side (upper side) of the first extension plate 4412 and the second extension plate 4413 near the upper case 201 to realize the arrangement of the light emission path.

The mounting portion 440 also includes a third extension plate 4411. The third extension plate 4411 is disposed at a side of the second support plate 443 remote from the first support plate 442. The third extension plate 4411 is configured to carry a first optical fiber connector 423, one end of the first optical fiber connector 423 being connected to the first internal optical fiber 800, and the other end of the first optical fiber connector 423 being connected to the silicon optical chip 420.

In some embodiments, the first support plate 442 and the second support plate 443 are rectangular plate structures. Alternatively, as shown in fig. 13, the second support plate 443 includes a trapezoidal plate 4431 and a rectangular plate 4432. The inclined end surface of the trapezoid plate 4431 is provided near the upper case 201, and linearly increases in the direction in which the inclined end surface extends from the emitter sub-substrate body 431 toward the chip sub-substrate body 432, and one side of the trapezoid plate 4431 near the chip sub-substrate body 432 is connected to the rectangular plate 4432, respectively. A side of the rectangular plate 4432 adjacent to the upper case 201 is connected to the heat conductive plate 444. Fig. 15 is a cross-sectional view of an optical module, and fig. 16 is a partial enlarged view at a frame Q in fig. 15, according to some embodiments. As shown in fig. 15 and 16, the laser set 411 is disposed on the carrying platform 441, and the left side of the carrying platform 441 is adjacent to the circuit board 300.

It should be noted that the adjacent means that the left side of the carrying platform 441 has a gap or contacts with the circuit board 300.

In some embodiments, the light emitting assembly 410 further includes a ceramic substrate 415, the ceramic substrate 415 being disposed between the laser group 411 and the carrier platform 441, a surface of the ceramic substrate 415 being provided with (e.g., etched) circuitry configured to power the laser group 411. One end of the circuit is provided with a gold wire which is connected with the circuit board 300, and the other end of the circuit is connected with the laser group 411 to realize the electric connection between the laser group 411 and the circuit board 300.

In the mounting process, the light emitting module 410 is first mounted to the mounting portion 440. That is, the laser group 411, the collimator lens group 412, and the optical isolator group 414 and the condensing lens group 413 are mounted on the side surface (the lower surface) of the heat conduction plate 444 away from the upper case 201 through the mounting holes 445, and then the mounting portion 440 is connected to the emitter substrate body 431. The wedge prism 422 is disposed at one side of the first and second extension plates 4412 and 4413 near the upper case 201, the inclined surface of the wedge prism 422 is connected to the input end of the silicon optical chip 420, and then the first optical fiber connector 423 is connected to the output end of the silicon optical chip 420.

The upper side of the chip sub-substrate body 432 is provided with a silicon optical chip 420, the input end of the silicon optical chip 420 is arranged towards the optical port 205, and each edge of the chip sub-substrate body 432 is arranged flush with each edge of the silicon optical chip 420.

In some embodiments, as shown in fig. 9, a silicon optical drive chip 428 is disposed on a side (e.g., upper side) of the silicon optical chip 420 adjacent to the upper case 201. The silicon optical chip 420 may be packaged as one chip with the silicon optical drive chip 428; alternatively, the silicon optical chip 420 and the silicon optical drive chip are two separate chips.

Fig. 17 is a partial block diagram of a light emitting device according to some embodiments, fig. 18 is a top view of the light emitting device of fig. 17, and fig. 19 is an optical path diagram of the light emitting device of fig. 17.

As shown in fig. 17 to 19, the light emitting assembly 410 may be provided with a plurality of laser signal channels. The number of channels of the laser group 411, the collimator lens group 412, the optical isolator group 414, and the converging lens group 413 corresponds to one another, and the number of channels may be set as needed, for example, the number of channels is 1, 2, 3, or 4, or the like.

The light emitting assembly 410 of fig. 17-19 includes four laser channels, each including a laser, and a corresponding collimating lens, isolator, and converging lens.

The laser group 411 includes a first laser 4111, a second laser 4112, a third laser 4113, and a fourth laser 4114. The outgoing light of different lasers has different wavelengths.

Correspondingly, the collimator lens group 412 includes a first collimator lens 4121, a second collimator lens 4122, a third collimator lens 4123, and a fourth collimator lens 4124.

The optical isolator bank 414 includes a first optical isolator 4141, a second optical isolator 4142, a third optical isolator 4143, and a fourth optical isolator 4144.

The converging lens group 413 includes a first converging lens 4131, a second converging lens 4132, a third converging lens 4133, and a fourth converging lens 4134.

The silicon optical chip 420 includes four input ports, namely a first input port 4211, a second input port 4212, a third input port 4213 and a fourth input port 4214.

The light outlet of the first laser 4111 emits a first laser light having a wavelength λ1. The first laser is converted into a parallel beam by the first collimating lens 4121, and forms a first light spot by the first optical isolator 4141, the first converging lens 4131 and the wedge prism 422, and the first light spot enters the silicon optical chip 420 through the first input port 4211, is modulated into a first optical signal by the first modulator 4261, and enters the combiner 425 through the optical waveguide 427.

The light outlet of the second laser 4112 emits a second laser light having a wavelength λ2. The second laser beam is converted into a parallel beam by the second collimating lens 4122, and forms a second light spot by the second optical isolator 4142, the second converging lens 4132 and the wedge prism 422, and the second light spot enters the silicon optical chip 420 through the second input port 4212, is modulated into a second optical signal by the second modulator 4262, and enters the combiner 425 through the optical waveguide 427.

The light outlet of the third laser 4113 emits a third laser light having a wavelength λ3. The third laser beam is converted into a parallel beam by the third collimating lens 4123, and forms a third light spot by the third optical isolator 4143, the third converging lens 4133 and the wedge prism 422, and the third light spot enters the silicon optical chip 420 through the third input port 4213, is modulated into a third optical signal by the third modulator 4263, and enters the wave combiner 425 through the optical waveguide 427.

The light outlet of the fourth laser 4114 emits a fourth laser light having a wavelength λ4. The fourth laser beam is converted into a parallel beam by the fourth collimating lens 4124, and forms a fourth light spot by the fourth optical isolator 4144, the fourth converging lens 4134 and the wedge prism 422, and the fourth light spot enters the silicon optical chip 420 through the fourth input port 4214, is modulated into a fourth optical signal by the fourth modulator 4264, and enters the wave combiner 425 through the optical waveguide 427.

The combiner 425 combines the received first, second, third, and fourth optical signals having different wavelengths into a beam of light that is transmitted through the first fiber-optic connector 423 to the first internal optical fiber 800 and, in turn, to the first fiber-optic adapter 600.

Fig. 20 is a single optical path schematic of a light emitting device according to some embodiments.

As shown in fig. 20, the first focusing lens 4131 transmits a light beam, a gap D is formed between the light emitting surface of the wedge-shaped prism 422 and the light incident surface of the silicon optical chip 420, and the light beam sequentially passes through the light incident surface of the wedge-shaped prism 422, the light emitting surface of the wedge-shaped prism 422, the gap D, and the light incident surface of the silicon optical chip 420 to enter the silicon optical chip 420, and the light beam is refracted at the light emitting surface of the wedge-shaped prism 422 and the light incident surface of the silicon optical chip 420. The light exiting direction of the laser group 411 is parallel to the propagation direction of the light after entering the silicon photo chip 420. The input port of the silicon optical chip 420 is always located at the focal point of the light spot of the first focusing lens 4131.

In some embodiments, the light receiving device 500 employs discrete components. Fig. 21 is a block diagram of a light receiving device according to some embodiments. As shown in fig. 21, the light receiving device 500 includes an arrayed waveguide grating (Arrayed Waveguide Grating, AWG) demultiplexer 510, a laser detector 520, and a transimpedance amplifier (Trans-Impedance Amplifier, TIA) 530.

One end of the AWG demultiplexer 510 is connected to the second optical fiber adapter 700 through the second optical fiber connector 523 and the second internal optical fiber 900, receives an optical signal from outside the optical module 200, and separates an optical beam including a plurality of different wavelengths.

For example, the AWG demultiplexer 510 outputs four beams of different wavelengths. The output port of the AWG demultiplexer 510 faces the lower housing 202, and the four output light beams with different wavelengths are transmitted to the corresponding laser detectors 520, and the optical signals are converted into electrical signals by the laser detectors 520. The DSP chip on the circuit board 300 is connected with the laser detector 520 disposed on the circuit board 300 through a signal line, the current signal received by the laser detector 520 is firstly transmitted to the transimpedance amplifier 530 to be converted into a voltage signal, and amplified, and then transmitted to the DSP chip 301 through the signal line to be processed so as to extract the data information in the optical signal from the outside of the optical module 200, and finally transmitted to the optical network terminal 100 through the golden finger 310. In this manner, mounting, coupling, and circuit connection of the optoelectronic device required for the light receiving device 500 to receive signals are facilitated.

In addition to the structure of the light receiving device shown in fig. 21, the light receiving device in some embodiments of the present disclosure may use other structures. Fig. 22 is another structural view of a light receiving device according to some embodiments, and fig. 23 is a cross-sectional view of the light module shown in fig. 22 (the receiving light path is shown in the drawing).

As shown in fig. 22 and 23, the light receiving device 500 includes a support plate 560, and a light collimator 540, a light demultiplexer 550, a lens array 570, and a reflecting prism 580 disposed on the support plate 560.

The second internal optical fiber 900 connected to the second optical fiber adapter 700 is inserted into the optical collimator 540, an external optical signal is transmitted to the optical demultiplexer 550 through the optical collimator 540, one path of composite light beam is demultiplexed into four paths of light beams through the optical demultiplexer 550, each path of light beam is converged to the corresponding reflecting prism 580 through the lens array 570, the light beam is reflected at the reflecting surface of the reflecting prism 580, thereby reflecting the light beam parallel to one side surface (e.g., front surface) of the circuit board 300 into the light beam perpendicular to the surface of the circuit board 300, and the reflected light beam is incident to the laser detector 520 on the circuit board 300 to realize light reception.

The light collimator 540 includes a single-mode fiber flange 541 and a collimator 542, the second internal optical fiber 900 is inserted into the light collimator 540 through the single-mode fiber flange 541, and the collimator 542 is disposed on the light exit surface of the second internal optical fiber 900 and configured to convert the external light beam transmitted by the second internal optical fiber 900 into a collimated light beam. The light incident surface of the optical demultiplexer 550 faces the light emergent surface of the collimator 542, and is configured to demultiplex one collimated beam output by the optical collimator 540 into multiple beams (e.g., four beams) and separate beams including multiple different wavelengths. The optical demultiplexer 550 outputs multiple light beams of different wavelengths, which are respectively incident into corresponding lenses of the lens array 570 to be condensed onto the reflecting surface of the reflecting prism 580. The reflecting prisms 580 are disposed on the circuit board 300 directly above the laser detectors 520 to reflect the multiple paths of light beams transmitted to the reflecting prisms 580 into the corresponding laser detectors 520, respectively, and convert the light signals into electrical signals through the laser detectors 520.

Fig. 24 is an exploded structural view of another optical module in accordance with some embodiments. Fig. 25 is a partial block diagram of another light module according to some embodiments. Fig. 26 is a view showing the structure of fig. 25 after inversion.

Fig. 24 is different from fig. 5 and 9, fig. 25 is different from fig. 6 and 9, and fig. 26 is different from fig. 7 and 9 mainly in that, for the optical module in fig. 24, 25 and 26, the light emitting component 410 and the silicon optical chip 420 are located on one side surface of the circuit board 300, the mounting portion 440 is omitted, and the light receiving device 500 is located on the other opposite side surface of the circuit board 300; in the light modules of fig. 5, 6, 7 and 9, the light emitting component 410, the silicon light chip 420 and the light receiving device 500 are all located on the same surface of the circuit board 300.

Fig. 27 is an exploded view of another light emitting device and circuit board according to some embodiments.

As shown in fig. 26 and 27, the light emitting assembly 410 and the silicon optical chip 420 are disposed on a side surface (e.g., a lower surface) of the substrate body 435 remote from the upper case 201, and a side surface (e.g., an upper surface) of the substrate body 435 close to the upper case 201 is connected to the upper case 201. The digital signal processing chip 301 is disposed on the upper surface of the circuit board 300, and at this time, the digital signal processing chip 301, the light emitting component 410 and the silicon optical chip 420 are disposed on different surfaces.

Of course, according to practical needs, the digital signal processing chip 301 may also be disposed on the lower surface of the circuit board 300, where the digital signal processing chip 301, the light emitting component 410 and the silicon optical chip 420 are located on the same surface.

Fig. 28 is a block diagram of another substrate body in accordance with some embodiments, and fig. 29 is a block diagram of another view of the substrate body shown in fig. 28. Fig. 28 and 29 are different from fig. 11 mainly in that the lower surface of the first stopper 433 in fig. 28 and 29 is not coplanar with the lower surface of the emitter substrate body 431. For example, the lower surface of the first stopper 433 is higher than the lower surface of the sub-substrate body 431 with respect to the horizontal plane, and the lower surface of the first stopper 433 is connected with the upper surface of the circuit board 300. For example, the first limiting portion 433 is connected to the circuit board 300 through a solid glue.

The lower surface of the first sub-emission stopper 4331 is connected to the upper surface of the circuit board 300.

The lower surface of the second sub-emission limiting part 4332 is connected with the upper surface of the circuit board.

The lower surface of the third sub-emission stopper 4333 is connected to the upper surface of the circuit board 300.

The lower surface of the second limiting portion 434 is not coplanar with the lower surface of the chip sub-substrate body 432. For example, the lower surface of the second limiting part 434 is higher than the upper surface of the chip sub-substrate body 432 with respect to the horizontal plane, and the lower surface of the second limiting part 434 is connected with the upper surface of the circuit board 300.

The lower surface of the first sub-chip limiter 4341 is connected to the upper surface of the circuit board 300.

The lower surface of the second sub-chip limiter 4342 is connected to the upper surface of the circuit board 300.

The lower surface of the third sub-chip spacing part 4343 is connected with the upper surface of the circuit board 300, thereby realizing the fixed connection of the substrate body 435 and the circuit board 300.

The first spacing portion 433 and the second spacing portion 434 have the same height, i.e. the lower surfaces of the first spacing portion 433 and the second spacing portion 434 are located in the same plane, so that the connection between the substrate body 435 and the circuit board 300 is facilitated.

In some embodiments, the height equality may further comprise: in the thickness direction of the emission sub-substrate body 431, the first and second stopper portions 433 and 434 have the same thickness.

Fig. 30 is a cross-sectional view of another light module according to some embodiments. As shown in fig. 30, the laser group 411 is disposed on the lower surface of the substrate body 435, and the left side of the laser group 411 is adjacent to the circuit board 300.

The metal ceramic substrate 415 is arranged between the laser set 411 and the bearing platform 441, one side surface (such as the lower surface) of the metal ceramic substrate 415 far away from the upper shell 201 is flush with the lower surface of the circuit board 300, and the left end of the metal ceramic substrate 415 is as close to the circuit board 300 as possible, so that the stability of circuit connection between the circuit board 300 and the laser set 411 is improved, and the length of a gold wire is shortened.

The collimator lens group 412, the optical isolator group 414, the converging lens group 413, and the wedge prism 422 are all disposed on the lower surface of the substrate body 435.

In the mounting process, the light emitting element 410 is first mounted on the emission sub-substrate body 431. The lower surface of the chip sub-substrate body 432 is provided with the silicon optical chip 420, and each edge of the chip sub-substrate body 432 is flush with each edge of the silicon optical chip 420.

The laser group 411, collimating lens group 412, optical isolator group 414, and converging lens group 413 are mounted to an emitter substrate body 431. Then, the inclined surface of the wedge-shaped prism 422 is connected with the input end of the silicon optical chip 420, and then the wedge-shaped prism 422 and the silicon optical chip 420 are mounted on the chip sub-substrate body 432. In some embodiments of the present disclosure, the laser set 411 is disposed on the substrate body 435 so as to conduct heat generated by the laser set 411 from the substrate body 435 to the upper housing 201. The outer portion of the upper housing 201 is connected to the cage 106, which is advantageous in improving heat conduction efficiency. The inner wall of the cover plate 2011 of the upper case 201 is provided with a heat conductive protrusion 2012 (see fig. 15), and the heat conductive protrusion 2012 is connected with the upper surface of the substrate body 435, which is advantageous for improving heat dissipation efficiency.

The foregoing is merely a specific embodiment of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art who is skilled in the art will recognize that changes or substitutions are within the technical scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

An optical module, comprising:

a lower housing;

an upper housing covered on the lower housing to form a cavity between the upper housing and the lower housing;

the circuit board is arranged in the cavity and comprises a yielding hole;

a substrate disposed at the relief hole, the substrate comprising:

a substrate body;

the bearing platform is arranged on one side, close to the upper shell, of the substrate body; and

one end of the heat conducting component is connected with the bearing platform, and the other end of the heat conducting component is connected with the upper shell to conduct heat; and

a light emitting device, the light emitting device comprising:

the light emitting assembly is arranged on one side of the substrate; and

and the silicon optical chip and the light emitting component are arranged on the same side of the substrate.
The optical module of claim 1, wherein the thermally conductive member comprises:

the first supporting plate is connected with the bearing platform at one side;

the second supporting plate is connected with the bearing platform at one side; and

and one side of the heat conducting plate is connected with the other side of the first supporting plate and the other side of the second supporting plate, and the other side of the heat conducting plate is in heat conducting connection with the upper shell.
The light module of claim 2, wherein the first support plate or the second support plate is a rectangular plate.
The light module of claim 2, wherein the first support plate or the second support plate comprises:

the end face of one side, close to the upper shell, of the trapezoid plate is an inclined end face; and

the rectangular plate, the rectangular plate with trapezoidal plate is close to terminal surface connection each other, the rectangular plate be close to one side terminal surface of last casing with the heat conduction plate is connected.
The light module of claim 2, wherein the light emitting assembly comprises:

the laser set is arranged on one side, close to the upper shell, of the bearing platform and is configured to emit a plurality of laser beams;

the collimating lens group is arranged on one side, close to the upper shell, of the bearing platform, is positioned on a light-emitting light path of the laser group and is configured to collimate the laser beams into parallel laser beams respectively;

the converging lens group is arranged on one side of the heat conducting plate, which is far away from the upper shell, and is positioned on a light-emitting light path of the collimating lens group and is configured to converge the plurality of parallel laser beams into a plurality of light spots respectively; and

And an optical isolator group disposed at a side of the heat conductive plate away from the upper case, the optical isolator group being located between the collimating lens group and the converging lens group and configured to unidirectionally pass the plurality of parallel laser beams.
The optical module of claim 5, wherein the carrier platform includes mounting holes in an orthographic projection of the thermally conductive plate on the carrier platform, the optical isolator set and the converging lens set being located in the mounting holes.
The optical module of claim 6, wherein the substrate body includes a relief hole, the relief hole having a position corresponding to a position of the mounting hole.
The optical module of claim 2, wherein the substrate further comprises:

the first extension plate is arranged on one side of the first support plate, which is far away from the upper shell, and is connected with the substrate body; and

the second extension plate is arranged on one side, far away from the upper shell, of the second support plate and is connected with the substrate body.
The light module of claim 2, wherein the substrate further comprises a third extension plate disposed on a side of the second support plate remote from the first support plate;

The optical module further comprises:

a first fiber optic adapter disposed on a side of the third extension plate proximate the upper housing;

and one end of the first internal optical fiber is connected with the first optical fiber adapter, and the other end of the first internal optical fiber is connected with the silicon optical chip.
The optical module of claim 1, wherein the substrate body comprises:

the bearing platform and the heat conduction component are arranged on one side of the transmitting sub-substrate body, which is close to the upper shell; and

the chip sub-substrate body, one side of the chip sub-substrate body is connected with one side of the emitter sub-substrate body, the silicon optical chip is arranged on one side of the chip sub-substrate body close to the upper shell, wherein,

the junction of the chip sub-substrate body and the emission sub-substrate body is provided with a preset included angle so that the input end of the silicon optical chip and the optical path of the light emission component are formed.
The optical module of claim 10, wherein the substrate further comprises:

the first limiting part is arranged on the side wall of the emitter substrate body, one side surface of the first limiting part, which is close to the upper shell, is lower than one side surface of the emitter substrate, which is close to the upper shell, and one side surface of the first limiting part, which is close to the upper shell, is connected with one side surface of the circuit board, which is far away from the upper shell; and/or the number of the groups of groups,

The second limiting part is arranged on the side wall of the chip sub-substrate body, one side surface of the second limiting part, which is close to the upper shell, is lower than one side surface of the chip sub-substrate, which is close to the upper shell, and one side surface of the second limiting part, which is close to the upper shell, is connected with one side surface of the circuit board, which is far away from the upper shell.
The optical module according to any one of claims 1 to 11, further comprising a light receiving device;

the light emitting device and the light receiving device are both positioned on one side of the substrate close to the upper case; or,

the light emitting device is located at a side of the substrate away from the upper case, and the light receiving device is located at a side of the substrate close to the upper case.
An optical module, comprising:

a lower housing;

an upper housing covered on the lower housing to form a cavity between the upper housing and the lower housing;

the circuit board is arranged in the cavity and comprises a yielding hole;

the substrate is arranged at the position of the abdication hole and comprises a substrate body, the substrate body is in heat conduction connection with the upper shell, and the light emitting component is arranged at one side of the substrate body far away from the upper shell; and

A light emitting device, the light emitting device comprising:

the light emitting assembly is arranged on one side of the substrate; and

and the silicon optical chip and the light emitting component are arranged on the same side of the substrate.
The optical module of claim 13, wherein the substrate body comprises:

the light emitting assembly is arranged on one side of the emitting sub-substrate body, which is far away from the upper shell; and

the chip sub-substrate body, one side of the chip sub-substrate body is connected with one side of the emitter sub-substrate body, the silicon optical chip is arranged on one side of the chip sub-substrate body far away from the upper shell, wherein,

the junction of the chip sub-substrate body and the emission sub-substrate body is provided with a preset included angle so that the input end of the silicon optical chip is coupled with the optical path of the light emission component.
The optical module of claim 14, wherein the substrate further comprises:

the first limiting part is arranged on the side wall of the emitting sub-substrate body, one side surface of the first limiting part, which is far away from the upper shell, is higher than one side surface of the emitting sub-substrate body, which is far away from the upper shell, relative to the horizontal plane, and the surface of the first limiting part is connected with one side surface of the circuit board, which is close to the upper shell; and/or the number of the groups of groups,

The second limiting part is arranged on the side wall of the chip sub-substrate body, one side surface, far away from the upper shell, of the second limiting part is higher than one side surface, far away from the upper shell, of the chip sub-substrate body relative to the horizontal plane, and the surface of the second limiting part is connected with one side surface, close to the upper shell, of the circuit board.
The optical module of claim 15, wherein a side surface of the first and second stopper portions remote from the upper housing is located in the same plane.
The optical module of claim 15, wherein,

the first limit part includes:

the first sub-emission limiting part is arranged on one side of the emission sub-substrate body;

the second sub-emission limiting part is arranged on one side of the emission sub-substrate body, which is far away from the chip sub-substrate body; and

the third sub-emission limiting part is arranged on one side of the emission sub-substrate body, which is far away from the first sub-emission limiting part;

the second limiting portion includes:

the first sub-chip limiting part is arranged on one side of the chip sub-substrate body;

the second sub-chip limiting part is arranged on one side of the chip sub-substrate body, which is far away from the transmitting sub-substrate body; and

The third sub-chip limiting part is arranged on one side, far away from the first sub-chip limiting part, of the chip sub-substrate body.
The optical module of claim 17, wherein,

the surfaces of one side, far away from the upper shell, of the first sub-emission limiting part, the second sub-emission limiting part and the third sub-emission limiting part are all positioned in the same plane;

the first sub-chip limiting part, the second sub-chip limiting part and the third sub-chip limiting part are all located in the same plane on one side surface away from the upper shell.
The optical module of any one of claims 14 to 18, wherein the emitter sub-substrate body and the chip sub-substrate body are of unitary construction.
The optical module of claim 14, wherein the optical module further comprises:

the wedge-shaped prism is arranged on one side, far away from the upper shell, of the chip sub-substrate body, and is positioned between the light emitting component and the silicon optical chip, the inclined plane of the wedge-shaped prism is connected with the input end of the silicon optical chip, and the surface, far away from the inclined plane, of one side of the wedge-shaped prism is perpendicular to the light emitting direction of the light emitting component.