CN117677460A - 激光加工方法、光学片的制造方法及激光加工装置 - Google Patents

激光加工方法、光学片的制造方法及激光加工装置 Download PDF

Info

Publication number
CN117677460A
CN117677460A CN202280051459.7A CN202280051459A CN117677460A CN 117677460 A CN117677460 A CN 117677460A CN 202280051459 A CN202280051459 A CN 202280051459A CN 117677460 A CN117677460 A CN 117677460A
Authority
CN
China
Prior art keywords
sheet
laser
laser light
polygon scanner
regions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280051459.7A
Other languages
English (en)
Chinese (zh)
Inventor
若山峻哉
松尾直之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN117677460A publication Critical patent/CN117677460A/zh
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/354Working by laser beam, e.g. welding, cutting or boring for surface treatment by melting
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems
    • G02B26/12Scanning systems using multifaceted mirrors

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
CN202280051459.7A 2021-09-30 2022-09-07 激光加工方法、光学片的制造方法及激光加工装置 Pending CN117677460A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-162148 2021-09-30
JP2021162148 2021-09-30
PCT/JP2022/033602 WO2023053879A1 (ja) 2021-09-30 2022-09-07 レーザ加工方法、光学シートの製造方法およびレーザ加工装置

Publications (1)

Publication Number Publication Date
CN117677460A true CN117677460A (zh) 2024-03-08

Family

ID=85782395

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280051459.7A Pending CN117677460A (zh) 2021-09-30 2022-09-07 激光加工方法、光学片的制造方法及激光加工装置

Country Status (4)

Country Link
KR (1) KR20240066243A (ko)
CN (1) CN117677460A (ko)
TW (1) TW202320952A (ko)
WO (1) WO2023053879A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118091932B (en) * 2024-04-28 2024-06-28 深圳活力激光技术有限公司 Laser scanning device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5841102A (en) * 1996-11-08 1998-11-24 W. L. Gore & Associates, Inc. Multiple pulse space processing to enhance via entrance formation at 355 nm
JP2014048575A (ja) * 2012-09-03 2014-03-17 Opcell Co Ltd 薄膜に多数の微少孔を高速に作成する方法とそれを用いた装置
JP6422182B2 (ja) 2014-12-04 2018-11-14 大阪シーリング印刷株式会社 レーザー加工装置
KR102450792B1 (ko) * 2016-10-04 2022-10-06 가부시키가이샤 니콘 빔 주사 장치, 패턴 묘화 장치 및 패턴 묘화 장치의 정밀도 검사 방법
WO2018175193A2 (en) * 2017-03-22 2018-09-27 Corning Incorporated Methods of separating a glass web

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118091932B (en) * 2024-04-28 2024-06-28 深圳活力激光技术有限公司 Laser scanning device

Also Published As

Publication number Publication date
WO2023053879A1 (ja) 2023-04-06
TW202320952A (zh) 2023-06-01
KR20240066243A (ko) 2024-05-14

Similar Documents

Publication Publication Date Title
TWI816767B (zh) 光學構件及其製造方法
TWI524961B (zh) 雷射處理工件
KR101107385B1 (ko) 레이저 가공 방법 및 레이저 가공품
JP2010539704A (ja) 電子材料のレーザデカール転写
CN104339081A (zh) 用于在透明材料内执行激光成丝的方法和设备
KR20110109771A (ko) Ito필름 패터닝 방법, 가요성 표시장치 제조 방법 및 가요성 표시장치
JP5786579B2 (ja) 構造物形成装置
US20230341608A1 (en) Optical member, manufacturing method therefor, and light distribution element
US20150209897A1 (en) Polarized laser for patterning of silver nanowire transparent conductive films
JPH11156568A (ja) 透明材料のマーキング方法
WO2021181766A1 (ja) 複合材の分断方法
CN101726793A (zh) 光波导路及其制造方法
CN117677460A (zh) 激光加工方法、光学片的制造方法及激光加工装置
WO2023189036A1 (ja) 光学部材の製造方法
WO2021009961A1 (ja) 複合材の分断方法
JP4647388B2 (ja) レーザ加工方法及び装置
Kim et al. Large-scale laser patterning of silver nanowire network by using patterned optical mirror mask
TW202346926A (zh) 光學構件及光學元件
Zhou et al. Enhanced photonic nanojets for submicron patterning
KR102222245B1 (ko) 실리콘계 엘라스토머의 미세 패터닝 방법, 미세 패터닝 장치, 및 미세 패터닝 칩
EP3992714A1 (en) Micropatterning method, micropatterning apparatus and micropatterning chip for silicone-based elastomer
KR102671594B1 (ko) 광학부재 및 그 제조 방법
Zhang et al. Laser processing transparent materials with nanosecond, picosecond and femtosecond pulses for industrial applications
JP2003012345A (ja) 熱線遮断ガラスの着色方法
TW202202257A (zh) 錫膏之雷射列印

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication