CN117652214A - 柔性石墨结构 - Google Patents
柔性石墨结构 Download PDFInfo
- Publication number
- CN117652214A CN117652214A CN202280047393.4A CN202280047393A CN117652214A CN 117652214 A CN117652214 A CN 117652214A CN 202280047393 A CN202280047393 A CN 202280047393A CN 117652214 A CN117652214 A CN 117652214A
- Authority
- CN
- China
- Prior art keywords
- graphite
- sheet
- stretchable
- flexible
- graphite sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/20—Graphite
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/043—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/251—Organics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2021-0090382 | 2021-07-09 | ||
| KR1020210090382A KR20230009680A (ko) | 2021-07-09 | 2021-07-09 | 플렉서블 흑연 구조체 |
| PCT/KR2022/009844 WO2023282659A1 (en) | 2021-07-09 | 2022-07-07 | Flexible graphite structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117652214A true CN117652214A (zh) | 2024-03-05 |
Family
ID=84800777
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280047393.4A Pending CN117652214A (zh) | 2021-07-09 | 2022-07-07 | 柔性石墨结构 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230019938A1 (https=) |
| EP (1) | EP4367987A4 (https=) |
| JP (1) | JP2024532630A (https=) |
| KR (1) | KR20230009680A (https=) |
| CN (1) | CN117652214A (https=) |
| WO (1) | WO2023282659A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12328845B2 (en) * | 2021-12-20 | 2025-06-10 | Meta Platforms Technologies, Llc | Thermal conduit for electronic device |
| KR20240117391A (ko) | 2023-01-25 | 2024-08-01 | 주식회사 엘지에너지솔루션 | 난연 플레이트를 포함하는 전지 모듈 |
| KR20250042996A (ko) * | 2023-09-21 | 2025-03-28 | 삼성전자주식회사 | 방열 부재, 방열 부재 제조 방법 및 그것을 포함하는 전자 장치 |
| KR102913580B1 (ko) * | 2024-06-27 | 2026-01-16 | (주)세경하이테크 | 방열 성능이 향상된 백커버 및 그 제조방법 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11291372A (ja) * | 1998-04-07 | 1999-10-26 | Mitsui Chem Inc | 伸縮性不織布積層体 |
| WO2002066245A1 (en) * | 2000-11-02 | 2002-08-29 | Graftech Inc. | Flexible graphite sheet having increased isotropy |
| CN103193222B (zh) * | 2007-05-17 | 2015-08-12 | 株式会社钟化 | 石墨膜及石墨复合膜 |
| JP5292031B2 (ja) * | 2008-09-12 | 2013-09-18 | 株式会社タイカ | 曲面発熱体用冷感パッド積層体およびその用途品 |
| US8992807B2 (en) * | 2010-01-14 | 2015-03-31 | Samsung Techwin Co., Ltd. | Method of manufacturing deformation-capable graphene sheet, deformation-capable graphene sheet, and device using the same |
| EP3050845B1 (en) * | 2013-09-26 | 2021-04-21 | Kaneka Corporation | Graphite sheet, method for producing same, laminated board for wiring, graphite wiring material, and method for producing wiring board |
| US10985416B2 (en) * | 2016-07-01 | 2021-04-20 | Panasonic Intellectual Property Management Co., Ltd. | Thermal conduction sheet and secondary battery pack using same |
| CN110249423B (zh) * | 2017-02-02 | 2023-04-04 | 株式会社钟化 | 层间热接合构件、层间热接合方法、层间热接合构件的制造方法 |
| CN110192274A (zh) * | 2017-02-06 | 2019-08-30 | 松下知识产权经营株式会社 | 热传导片以及多重热传导片 |
| JP7167909B2 (ja) * | 2017-03-02 | 2022-11-09 | 東洋紡株式会社 | 導電性ペーストおよびそれを用いた伸縮性配線、伸縮性配線を有する衣服型電子機器 |
| JP6870538B2 (ja) * | 2017-08-30 | 2021-05-12 | トヨタ自動車株式会社 | 放熱シート |
| CN109699151B (zh) * | 2017-10-20 | 2020-02-14 | 华为技术有限公司 | 膜状散热构件、可折弯显示装置以及终端设备 |
| WO2019142082A1 (en) * | 2018-01-22 | 2019-07-25 | Neograf Solutions, Llc | A graphite article and method of making same |
-
2021
- 2021-07-09 KR KR1020210090382A patent/KR20230009680A/ko not_active Ceased
-
2022
- 2022-07-07 EP EP22838011.9A patent/EP4367987A4/en active Pending
- 2022-07-07 CN CN202280047393.4A patent/CN117652214A/zh active Pending
- 2022-07-07 US US17/859,149 patent/US20230019938A1/en active Pending
- 2022-07-07 WO PCT/KR2022/009844 patent/WO2023282659A1/en not_active Ceased
- 2022-07-07 JP JP2024500194A patent/JP2024532630A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2024532630A (ja) | 2024-09-09 |
| EP4367987A1 (en) | 2024-05-15 |
| KR20230009680A (ko) | 2023-01-17 |
| US20230019938A1 (en) | 2023-01-19 |
| WO2023282659A1 (en) | 2023-01-12 |
| EP4367987A4 (en) | 2025-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN117652214A (zh) | 柔性石墨结构 | |
| CN113012579B (zh) | 显示模组及显示装置 | |
| KR102412160B1 (ko) | 접이식 표시 장치 | |
| CN109699151B (zh) | 膜状散热构件、可折弯显示装置以及终端设备 | |
| TW202143515A (zh) | 壓電元件及壓電揚聲器 | |
| CN113516924A (zh) | 一种显示模组及电子设备 | |
| JPWO2018142879A1 (ja) | 熱伝導シートおよび多重熱伝導シート | |
| CN114730534A (zh) | 显示器用基板 | |
| CN110072165A (zh) | 显示设备 | |
| KR101457797B1 (ko) | 방열시트 및 그 제조방법 | |
| JP2024532630A5 (https=) | ||
| Yu et al. | Buckling analysis of stiff thin films suspended on a substrate with tripod surface relief structure | |
| CN113999621B (zh) | 散热膜和电子设备 | |
| CN115700063A (zh) | 压电元件 | |
| TWI788769B (zh) | 導熱結構與電子裝置 | |
| CN101785102B (zh) | 具有发热部的装置 | |
| KR20190118305A (ko) | 도파민이 결합된 그래파이트를 이용한 열전도성 시트 및 그 제조 방법 | |
| CN116312230B (zh) | 显示面板及显示装置 | |
| WO2022000615A1 (zh) | 一种基于相变材料的移动终端退热贴 | |
| CN105792618A (zh) | 一种五金支架和移动终端 | |
| TWI781525B (zh) | 導熱黏著結構與電子裝置 | |
| JP2004200586A (ja) | 冷却装置および冷却装置を有する電子機器 | |
| JP2018019001A (ja) | フィルム状熱伝導部材及び電子機器筐体 | |
| CN114828536A (zh) | 导热结构与电子装置 | |
| CN114823574A (zh) | 导热结构与电子装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |