CN117641847A - Efficient heat dissipation structure of miniature photovoltaic inverter - Google Patents
Efficient heat dissipation structure of miniature photovoltaic inverter Download PDFInfo
- Publication number
- CN117641847A CN117641847A CN202311632781.1A CN202311632781A CN117641847A CN 117641847 A CN117641847 A CN 117641847A CN 202311632781 A CN202311632781 A CN 202311632781A CN 117641847 A CN117641847 A CN 117641847A
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- heat
- heat conduction
- heat dissipation
- photovoltaic inverter
- circuit board
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- 230000017525 heat dissipation Effects 0.000 title claims description 88
- 239000000919 ceramic Substances 0.000 claims abstract description 55
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000011889 copper foil Substances 0.000 claims abstract description 25
- 230000005855 radiation Effects 0.000 claims abstract description 7
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims description 44
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000006355 external stress Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20945—Thermal management, e.g. inverter temperature control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/56—Power conversion systems, e.g. maximum power point trackers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
Abstract
The utility model relates to a photovoltaic inverter's field specifically discloses a miniature photovoltaic inverter's high-efficient heat radiation structure, it includes the radiator housing, radiator housing inside is provided with the circuit board, install the device that generates heat on the circuit board, be provided with the heat conduction ceramic part between circuit board and the radiator housing, the heat conduction ceramic part is close to one side laminating of circuit board and has outer heat conduction bed course, one side and radiator housing laminating of circuit board are kept away from to the heat conduction ceramic part, the circuit board surface is provided with naked copper foil, naked copper foil extends to the device bottom that generates heat, outer heat conduction bed course is laminated with naked copper foil, the heat conduction ceramic part is provided with the recess that supplies the device male that generates heat, the recess diapire is connected with interior heat conduction bed course, interior heat conduction bed course is laminated with the device that generates heat. The heat radiation structure of the micro photovoltaic inverter is provided with two heat transfer channels, and the heat conduction ceramic piece with excellent heat conductivity is used as a main heat conduction medium, so that efficient heat radiation of the micro photovoltaic inverter is realized.
Description
Technical Field
The application relates to the field of photovoltaic inverters, in particular to a high-efficiency heat dissipation structure of a miniature photovoltaic inverter.
Background
The photovoltaic inverter is used for converting direct current output by the photovoltaic solar panel into alternating current meeting grid-connected conditions, and is an important component of a photovoltaic power system. The miniature photovoltaic inverter has the advantages of small size, light weight and convenient installation and use, but because the high-power photovoltaic module is continuously pushed out, the power required to be output by a single channel of the miniature photovoltaic inverter is larger and larger, so that the condition that a circuit board or an electronic component is damaged due to incapability of radiating in time is easy to occur.
According to the reliability theory 10 degree rule, from room temperature, every 10 degrees of temperature rise, the service life is halved, so that efficient heat dissipation design is very important. In the related art, the miniature photovoltaic inverter comprises a heat dissipation shell and a circuit board arranged in the heat dissipation shell, wherein a plurality of heating devices are arranged on the circuit board, and a heat dissipation structure consisting of a heat conduction gasket and heat conduction mud is arranged between the heating devices and the heat dissipation shell. The heating device mainly comprises an IGBT module, a transformer and other electric components which are easy to heat, and heat generated by the heating device is transferred to the heat dissipation shell through the heat conduction gasket and the heat conduction mud, so that heat dissipation is realized.
Because the heat conductivity coefficient of the heat conducting gasket and the heat conducting mud is generally lower, and the thickness of the heat conducting gasket is generally set to be at least 1mm for avoiding electrical insulation failure caused by breakage of the heat conducting gasket in the actual assembly process, the heat radiating structure cannot transfer the heat of the heating device onto the heat radiating shell quickly, so that the temperature of the heating device cannot be effectively reduced no matter how the heat radiating capacity of the heat radiating shell is, the temperature difference between the heat radiating shell and the heating device is about 20 ℃, the heat radiating requirement of the high-power micro inverter cannot be met, and the heat radiating requirement of the high-power micro inverter is to be improved.
Disclosure of Invention
In order to improve heat dissipation efficiency, the application provides a high-efficiency heat dissipation structure of a miniature photovoltaic inverter.
The application provides a miniature photovoltaic inverter's high-efficient heat radiation structure adopts following technical scheme:
the utility model provides a miniature photovoltaic inverter's high-efficient heat radiation structure, includes the heat dissipation shell, the inside circuit board that is provided with of heat dissipation shell, install the device that generates heat on the circuit board, be provided with the heat conduction ceramic part between circuit board and the heat dissipation shell, the heat conduction ceramic part is close to the laminating of one side of circuit board and has outer heat conduction bed course, the heat conduction ceramic part is kept away from one side and the heat dissipation shell laminating of circuit board, the circuit board surface is provided with naked copper foil, naked copper foil extends to the device bottom that generates heat, outer heat conduction bed course is laminated with naked copper foil, the thickness of outer heat conduction bed course is less than 1mm.
By adopting the technical scheme, the packaging surfaces of the heating devices are all insulating materials and have poor heat conductivity in practice, and on the contrary, the heat conductivity of the welding spots and the peripheral exposed copper foil of the heating devices is good, so that the heat in the heating devices is more easily transferred out through the welding spots and the exposed copper foil.
In addition, the heat conduction efficiency is related to the thickness and the heat conductivity coefficient of the heat conducting medium. The heat conducting ceramic piece has excellent heat conductivity, can be used as a main medium to be filled between the heat dissipation shell and the circuit board, and greatly reduces the heat resistance from the heating device to the heat dissipation shell; the thermal conductivity of the outer thermal conductive pad layer is generally reduced, and the thermal conduction efficiency can be improved by reducing the thickness. Based on the mechanism, the heat of the heating device can be rapidly dissipated through the ways of the exposed copper foil, the outer heat conducting cushion layer, the heat conducting ceramic piece and the heat dissipation shell, so that efficient heat dissipation is realized.
The main function of the outer heat conducting cushion layer is to ensure that heat is smoothly conducted from the exposed copper foil to the heat conducting ceramic piece, and the air thermal resistance caused by micro-unevenness of two contact surfaces is eliminated. The heat conducting ceramic piece also has excellent insulating property, and improves the electrical safety of the micro photovoltaic inverter.
Optionally, the heat conduction ceramic part is provided with the recess that supplies the heating device to insert, the recess diapire is connected with interior heat conduction bed course, interior heat conduction bed course is laminated with the heating device, interior heat conduction bed course's thickness is less than 1mm.
By adopting the technical scheme, a second heat dissipation path is formed, namely, heat dissipated from the surface of the heating device is transferred to the outside through the inner heat conduction cushion layer, the heat conduction ceramic piece and the heat dissipation shell. The two heat dissipation paths act together to realize efficient heat dissipation of the miniature photovoltaic inverter.
Optionally, the thickness of the inner thermally conductive pad layer is less than 0.5mm.
By adopting the technical scheme, the heat-conducting ceramic piece has excellent insulating property and can be completely attached to the exposed copper foil, so that the potential electrical safety hazard caused by the breakage of the heat-conducting gasket in the traditional heat-radiating structure can be eliminated. Based on the above, the thickness of the inner heat conduction cushion layer is far smaller than 1mm in the traditional structure as much as possible, and the heat conduction efficiency can be obviously improved.
Optionally, the outer heat-conducting cushion layer and the inner heat-conducting cushion layer are made of heat-conducting silicone rubber, heat-conducting silicone grease or heat-conducting gel.
Through adopting above-mentioned technical scheme, three materials all can effectively fill the clearance between two contact surfaces, and then reduce thermal contact resistance, improve thermal conduction efficiency.
Optionally, the thickness of the outer thermally conductive pad layer is less than 0.5mm.
By adopting the technical scheme, the heat-conducting ceramic piece has excellent insulating property and can be completely attached to the exposed copper foil, so that the potential electrical safety hazard caused by the breakage of the heat-conducting gasket in the traditional heat-radiating structure can be eliminated. Based on the above, the thickness of the outer heat conduction cushion layer is far smaller than 1mm in the traditional structure as much as possible, and the heat conduction efficiency can be obviously improved.
Optionally, a heat-conducting mud layer is arranged on one side of the heat-conducting ceramic piece, which is close to the heat-radiating shell.
By adopting the technical scheme, the heat conduction mud layer can cover the surface with micro unevenness. Thereby the heat dissipation shell is fully contacted with the heat conduction ceramic piece, and further the heat conduction effect is improved. In addition, the heat conducting mud layer can be compressed to a very low thickness, so that the heat conducting efficiency is remarkably improved.
Optionally, the thickness of the heat conducting mud layer is less than 0.2mm.
By adopting the technical scheme, the thickness of the heat conduction mud layer is very thin, so that even if the heat conduction coefficient of the heat conduction mud layer is not high, the heat efficient conduction is not affected.
Optionally, the thermal conductivity of the thermally conductive ceramic member is greater than 50W/(m×k).
By adopting the technical scheme, the heat-conducting ceramic piece has excellent heat conductivity, and is a basis for realizing efficient heat dissipation of the miniature photovoltaic inverter.
Optionally, the outer wall of the heat dissipation shell is provided with a plurality of heat dissipation fins.
Through adopting above-mentioned technical scheme, increase the area of contact of heat dissipation shell and air, improve the radiating effect.
Optionally, the heat conducting ceramic piece is connected with the heat dissipation shell through a fastening screw.
By adopting the technical scheme, the heat conduction ceramic piece is ensured to be in close contact with the heat dissipation shell, and the assembly is convenient.
In summary, the present application has the following beneficial effects:
1. two heat transfer channels are formed between the heating device and the heat dissipation shell, namely the channels along the heating device, the exposed copper foil, the outer heat conduction pad layer, the heat conduction ceramic piece and the heat dissipation shell, and the channels along the surface of the heating device, the inner heat conduction pad layer, the heat conduction ceramic piece and the heat dissipation shell act together to realize the efficient heat dissipation of the micro photovoltaic inverter;
2. through the arrangement of the heat conducting ceramic piece, the heat conducting ceramic piece has excellent heat conductivity and insulativity, can be used as a main heat conducting medium between a heating device and a heat dissipation shell, greatly reduces the heat resistance of the heat dissipation shell conducted by the heating device, improves the heat dissipation efficiency, and can be used as an insulating medium between the heating device and the heat dissipation shell, meets the electrical safety requirement, and enables an inner heat conducting cushion layer and an outer heat conducting cushion layer to be designed thinner;
3. by arranging the inner heat conducting cushion layer, the outer heat conducting cushion layer and the heat conducting mud layer, on one hand, errors formed by self tolerances of the heat radiating shell, the heat conducting ceramic piece, the circuit board and the heating device are eliminated, the heat transfer interface is ensured to be in good contact, external stress can not be applied to the circuit board and the heating device, and the stress applied to the heating device and the circuit board is only the elasticity of the inner heat conducting cushion layer and the outer heat conducting cushion layer, and is far lower than the damage stress of the electronic device and the circuit board; on the other hand, the interface material is used for filling two contact surfaces, so that air thermal resistance caused by microscopic unevenness of the two contact surfaces is eliminated.
Drawings
Fig. 1 is an exploded schematic view of a high-efficiency heat dissipation structure of a micro photovoltaic inverter according to an embodiment of the present disclosure at a first viewing angle;
FIG. 2 is an enlarged schematic view of area A of FIG. 1;
fig. 3 is an exploded view of the efficient heat dissipation structure of the micro photovoltaic inverter according to the embodiment of the present application at a second viewing angle;
fig. 4 is an enlarged schematic view of region B in fig. 3.
Reference numerals illustrate: 1. a heat dissipation housing; 11. a heat radiation fin; 2. a circuit board; 3. a heat generating device; 4. a thermally conductive ceramic member; 41. a groove; 5. an outer thermally conductive pad layer; 6. bare copper foil; 7. an inner thermally conductive pad layer; 8. a heat conductive mud layer; 9. and (5) fastening a screw.
Detailed Description
The present application is described in further detail below in conjunction with figures 1-4.
The embodiment of the application discloses a high-efficiency heat dissipation structure of a miniature photovoltaic inverter.
Referring to fig. 1, the efficient heat dissipation structure of the micro photovoltaic inverter comprises a heat dissipation shell 1, a circuit board 2 arranged in the heat dissipation shell 1, a plurality of heating devices 3 welded on one side of the circuit board 2, and a heat conduction ceramic piece 4 arranged between the circuit board 2 and the heat dissipation shell 1, wherein one side, far away from the circuit board 2, of the heat conduction ceramic piece 4 is attached to the heat dissipation shell 1. The heat generated by the heating device 3 can be conducted to the heat dissipation case 1 through the heat conductive ceramic member 4 and then dissipated to the outside.
Referring to fig. 1, the outer wall of the heat dissipation case 1 is fixedly connected with a plurality of heat dissipation fins 11 arranged at intervals, so that the contact area between the heat dissipation case 1 and air is increased, and the heat conducted to the heat dissipation case 1 can be rapidly dissipated. In this embodiment, the heat dissipation case 1 is made of aluminum alloy, and has good thermal conductivity, and in other embodiments, the heat dissipation case 1 may also be made of other metal materials or engineering plastic materials.
Referring to fig. 1 and 2, the surface of the circuit board 2 is fixedly connected with a bare copper foil 6, the bare copper foil 6 extends to the bottom of the heating device 3, namely, one side of the heating device 3, which is close to the circuit board 2, of the heating device 3, so that heat generated by the heating device 3 can be conducted out through the insulating packaging surface of the heating device 3, and can be conducted out through welding spots and the bare copper foil 6, and the heat conduction effect of the bare copper foil 6 is more obvious.
Referring to fig. 1, the heat conductive ceramic member 4 is made of a common heat conductive ceramic material such as boron nitride and silicon carbide, and has excellent heat conductivity, preferably a heat conductive ceramic material with a heat conductivity coefficient of more than 50W/(m×k). Specifically, in the embodiment of the present application, the heat conductive ceramic member 4 is made of a commercially available heat conductive ceramic material with a heat conductivity coefficient of up to 240W/(m×k) and a breakdown voltage of up to 15 KV/mm. The heat conducting ceramic piece 4 with high heat conductivity coefficient is used as a main heat conducting medium between the heating device 3 and the heat radiating shell 1, so that the heat resistance of the heat radiating shell 1 conducted from the heating device 3 is greatly reduced, the heat radiating efficiency is improved, and the electric safety requirement can be met.
Referring to fig. 1 and 2, the heat conductive ceramic member 4 has a square plate structure, an outer heat conductive pad layer 5 is bonded between the heat conductive ceramic member 4 and the circuit board 2, the outer heat conductive pad layer 5 is provided with a through hole through which the heating device 3 passes, and the outer heat conductive pad layer 5 is bonded to the exposed copper foil 6. Therefore, a first heat dissipation channel is formed between the heat generating device 3 and the heat dissipation housing 1, i.e. a channel along the heat generating device 3, the exposed copper foil 6, the outer heat conducting pad layer 5, the heat conducting ceramic member 4 to the heat dissipation housing 1.
Referring to fig. 3 and 4, a groove 41 into which the heating device 3 is inserted is formed in one side of the heat conducting ceramic piece 4, which is close to the circuit board 2, and an inner heat conducting cushion layer 7 is fixedly connected to the bottom wall of the groove 41, and the inner heat conducting cushion layer 7 is attached to the surface of the heating device 3. Thus, a second heat dissipation channel is formed between the heat generating device 3 and the heat dissipation housing 1, i.e. a channel along the surface of the heat generating device 3, the inner heat conducting pad layer 7, the heat conducting ceramic member 4 to the heat dissipation housing 1. The two heat transfer channels act together to realize efficient heat dissipation of the micro photovoltaic inverter.
Referring to fig. 4, in the embodiment of the present application, the inner heat-conducting cushion layer 7 and the outer heat-conducting cushion layer 5 are both made of heat-conducting silicone rubber, and the heat-conducting silicone rubber is added with heat-conducting filler on the basis of silicone rubber, so that the heat conductivity of the heat-conducting silicone rubber is improved, and the heat-conducting cushion layer is a common material of heat-conducting gaskets. In other embodiments, the inner thermally conductive pad layer 7 and the outer thermally conductive pad layer 5 may also be made of thermally conductive silicone grease or thermally conductive gel.
Because of the tolerance of the heat dissipation case 1, the heat conductive ceramic member 4, the circuit board 2 and the heat generating device 3 during production, it is difficult to ensure that the heat conductive ceramic member 4 is closely attached to the exposed copper foil 6, and it is also difficult to ensure that the heat conductive ceramic member 4 is closely attached to the surface of the heat generating device 3. The inner heat conduction cushion layer 7 and the outer heat conduction cushion layer 5 have elasticity, can effectively fill the gap between the two contact surfaces, eliminate air thermal resistance caused by micro unevenness of the two contact surfaces, improve heat conduction efficiency, and can not apply external stress to the circuit board 2 and the heating device 3.
Referring to fig. 4, in order to improve heat conduction efficiency, the thicknesses of the outer and inner heat conductive mats 5 and 7 are each less than 1mm, and preferably, the thicknesses of the outer and inner heat conductive mats 5 and 7 are each less than 0.5mm. The thermal conductivity of the outer thermal conductive pad layer 5 and the inner thermal conductive pad layer 7 is generally reduced, so that the thermal conduction efficiency can be improved, and efficient heat dissipation can be further ensured.
In addition, since the thermally conductive ceramic member 4 has excellent insulating properties, there is no concern about electrical safety hazards caused by breakage of the outer thermally conductive pad layer 5 and the inner thermally conductive pad layer 7, and therefore, the thicknesses of the outer thermally conductive pad layer 5 and the inner thermally conductive pad layer 7 can be made as thin as possible.
Referring to fig. 3 and 4, the heat conducting ceramic piece 4 is connected with the heat dissipation shell 1 through a fastening screw 9, a heat conducting mud layer 8 is attached between the heat conducting ceramic piece 4 and the heat dissipation shell 1, and the thickness of the heat conducting mud layer 8 is smaller than 0.2mm, in the embodiment of the application, the thickness of the heat conducting mud layer 8 is 0.1mm. The layer of heat conductive mud 8 may cover a microscopically uneven surface. Thereby the heat dissipation shell 1 and the heat conduction ceramic piece 4 are fully contacted, and the heat conduction effect is further improved.
The implementation principle of the efficient heat dissipation structure of the miniature photovoltaic inverter provided by the embodiment of the application is as follows:
the heat generated by the heating device 3 is conducted to the heat dissipation shell 1 along two heat dissipation channels and then dissipated to the outside, firstly, the heat is conducted along the channels of the heating device 3, the exposed copper foil 6, the outer heat conduction cushion layer 5, the heat conduction ceramic piece 4 and the heat dissipation shell 1, and secondly, the heat is conducted along the channels of the surface of the heating device 3, the inner heat conduction cushion layer 7, the heat conduction ceramic piece 4 and the heat dissipation shell 1, and the two heat transfer channels jointly act to realize the efficient heat dissipation of the micro photovoltaic inverter.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (10)
1. The utility model provides a miniature photovoltaic inverter's high-efficient heat radiation structure, includes heat dissipation shell (1), heat dissipation shell (1) inside is provided with circuit board (2), install heating element (3), its characterized in that on circuit board (2): be provided with heat conduction ceramic part (4) between circuit board (2) and heat dissipation shell (1), heat conduction ceramic part (4) are close to one side laminating of circuit board (2) and have outer heat conduction bed course (5), one side that circuit board (2) was kept away from to heat conduction ceramic part (4) is laminated with heat dissipation shell (1), circuit board (2) surface is provided with naked copper foil (6), naked copper foil (6) extend to heating device (3) bottom, outer heat conduction bed course (5) are laminated with naked copper foil (6), the thickness of outer heat conduction bed course (5) is less than 1mm.
2. The efficient heat dissipation structure of a micro photovoltaic inverter of claim 1, wherein: the heat conduction ceramic piece (4) is provided with a groove (41) for inserting the heating device (3), the bottom wall of the groove (41) is connected with an inner heat conduction cushion layer (7), the inner heat conduction cushion layer (7) is attached to the heating device (3), and the thickness of the inner heat conduction cushion layer (7) is smaller than 1mm.
3. The efficient heat dissipation structure of a micro photovoltaic inverter of claim 2, wherein: the thickness of the inner heat conducting cushion layer (7) is smaller than 0.5mm.
4. The efficient heat dissipation structure of a micro photovoltaic inverter of claim 2, wherein: the outer heat conduction cushion layer (5) and the inner heat conduction cushion layer (7) are made of heat conduction silicon rubber, heat conduction silicone grease or heat conduction gel.
5. The efficient heat dissipation structure of a micro photovoltaic inverter of claim 1, wherein: the thickness of the outer heat conducting cushion layer (5) is smaller than 0.5mm.
6. The efficient heat dissipation structure of a micro photovoltaic inverter of claim 1, wherein: and a heat-conducting mud layer (8) is arranged on one side of the heat-conducting ceramic piece (4) close to the heat-radiating shell (1).
7. The efficient heat dissipation structure of a micro photovoltaic inverter of claim 6, wherein: the thickness of the heat conducting mud layer (8) is smaller than 0.2mm.
8. The efficient heat dissipation structure of a micro photovoltaic inverter of claim 1, wherein: the heat conductivity coefficient of the heat conducting ceramic piece (4) is more than 50W/(m.times.K).
9. The efficient heat dissipation structure of a micro photovoltaic inverter of claim 1, wherein: the outer wall of the heat dissipation shell (1) is provided with a plurality of heat dissipation fins (11).
10. The efficient heat dissipation structure of a micro photovoltaic inverter of claim 1, wherein: the heat conducting ceramic piece (4) is connected with the heat radiating shell (1) through a fastening screw (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311632781.1A CN117641847A (en) | 2023-11-29 | 2023-11-29 | Efficient heat dissipation structure of miniature photovoltaic inverter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311632781.1A CN117641847A (en) | 2023-11-29 | 2023-11-29 | Efficient heat dissipation structure of miniature photovoltaic inverter |
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| Publication Number | Publication Date |
|---|---|
| CN117641847A true CN117641847A (en) | 2024-03-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311632781.1A Pending CN117641847A (en) | 2023-11-29 | 2023-11-29 | Efficient heat dissipation structure of miniature photovoltaic inverter |
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| Country | Link |
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| CN (1) | CN117641847A (en) |
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- 2023-11-29 CN CN202311632781.1A patent/CN117641847A/en active Pending
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