CN116569386A

CN116569386A - Battery assembly, battery module and manufacturing method of battery assembly

Info

Publication number: CN116569386A
Application number: CN202180057759.1A
Authority: CN
Inventors: 吴金成; 钟浩文; 李彪; 黄美华; 侯宁
Original assignee: Peng Ding Polytron Technologies Inc; Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Current assignee: Peng Ding Polytron Technologies Inc; Avary Holding Shenzhen Co Ltd; Qing Ding Precision Electronics Huaian Co Ltd
Priority date: 2021-06-18
Filing date: 2021-06-18
Publication date: 2023-08-08
Also published as: TW202301733A; TWI768981B; WO2022261971A1

Abstract

A battery assembly (100) includes a circuit board (10) and a battery cell (70), the circuit board (10) including a first dielectric layer (22), a second dielectric layer (32), a film (40), a bus bar (242), a first heat dissipating copper block (245), a fuse (342) and a second heat dissipating copper block (345), the film (40) being located between the first dielectric layer (22) and the second dielectric layer (32) and having a plurality of spaced cavities (45 a); the first heat dissipation copper block (245) and the bus bar (242) are positioned on the surface of the first dielectric layer (22); the second heat dissipation copper block (345) and the fuse (342) are positioned on the surface of the second dielectric layer (32); the circuit board (10) comprises a heat dissipation area (I) and a bending area (II) which are continuous in sequence, wherein the heat dissipation area (I) and the bending area (II) are enclosed to form a containing groove (60), a bus bar (242), a first heat dissipation copper block (245), a fuse (342) and a second heat dissipation copper block (345) are all positioned in the heat dissipation area (I), and the bus bar (242) and the first heat dissipation copper block (245) are arranged towards the containing groove (60); the battery cell (70) is positioned in the accommodating groove (60) and is electrically connected with the circuit board (10) through the busbar (242). The application also provides a battery module (200) and a manufacturing method of the battery assembly (100).

Description

Battery assembly, battery module and manufacturing method of battery assembly

Technical Field

The application relates to the field of battery heat dissipation, in particular to a battery assembly, a battery module and a manufacturing method of the battery assembly.

Background

Batteries are an important source of power for some devices, such as electric automobiles. To meet the high power requirements of the device, it is often necessary to assemble a plurality of battery cells to form a large battery module. In order to ensure the safety of the high-power battery module, the battery module needs to have overcurrent protection and thermal management functions.

In the existing battery module, the current of a plurality of battery cells is generally converged through a busbar, a fuse is installed to realize overcurrent protection of the battery module, and a radiating tube is additionally installed to radiate the battery module. The busbar, the fuse and the radiating tube are all independent components, and an additional space is required for accommodating the busbar, and in addition, the existing radiating tube is arranged at two ends of the battery cell, so that the radiating requirement of the battery module in high-power use cannot be met.

Disclosure of Invention

In view of the foregoing, it is necessary to provide a battery assembly with small arrangement space and fast heat dissipation to solve the above-mentioned technical problems.

The application also provides a battery module.

The application also provides a manufacturing method of the battery assembly.

A battery assembly comprises a circuit board and a battery core, wherein the circuit board comprises a first dielectric layer, a second dielectric layer, a film, a busbar, a first heat dissipation copper block, a fuse and a second heat dissipation copper block, and the film is positioned between the first dielectric layer and the second dielectric layer and provided with a plurality of cavities with intervals; the first heat dissipation copper block and the busbar are positioned on the surface, away from the second dielectric layer, of the first dielectric layer; the second heat dissipation copper block and the fuse are positioned on the surface, away from the first dielectric layer, of the second dielectric layer; the circuit board comprises a heat dissipation area and a bending area which are sequentially and continuously arranged at intervals, wherein the heat dissipation area and the bending area are surrounded to form a containing groove, the busbar, the first heat dissipation copper block, the fuse and the second heat dissipation copper block are all positioned in the heat dissipation area, and the busbar and the first heat dissipation copper block are arranged towards the containing groove; the battery cell is positioned in the accommodating groove and is electrically connected with the circuit board through the busbar.

In some embodiments, the battery assembly further includes a first thermally conductive sheet located on a surface of the first dielectric layer facing the cavity and a second thermally conductive sheet located on a surface of the second dielectric layer facing the cavity.

In some embodiments, the battery assembly further comprises a monitoring element connected to the fuse.

In some embodiments, the busbar and the connecting piece are disposed in the same heat dissipation area.

In some embodiments, the cavity is also filled with a liquid.

A battery module comprises at least two battery modules, wherein the second heat dissipation copper block of one battery module is connected with the surface of the battery cell of the adjacent battery module.

A method of making a battery assembly comprising the steps of: providing a first substrate, wherein the first substrate comprises a first copper layer, a first dielectric layer and a plurality of first heat-conducting adhesives, the first dielectric layer is positioned on the surface of the first copper layer, and the plurality of first heat-conducting adhesives respectively penetrate through the first dielectric layer and are connected with the first copper layer; providing a second substrate, wherein the second substrate comprises a second copper layer, a second dielectric layer and at least one second heat-conducting adhesive, the second dielectric layer is positioned on the surface of the second copper layer, and the second heat-conducting adhesive penetrates through the second dielectric layer and is connected with the second copper layer; providing a film, wherein the film comprises a plurality of through holes, and the positions of the through holes correspond to the positions of the first heat conducting glue; the first substrate and the second substrate are respectively pressed on two opposite sides of the film and the through holes are sealed, so that the through holes form cavities, and a heat dissipation area and a bending area which are sequentially arranged at intervals are formed; etching the first copper layer to form a busbar and a first heat dissipation copper block, and etching the second copper layer to form a fuse and a second heat dissipation copper block, thereby forming a circuit board; and bending the circuit board in the bending area to form a containing groove, and placing a battery cell in the containing groove, wherein the battery cell is electrically connected with the busbar, so that the battery assembly is formed.

In some embodiments, the step of forming the first substrate includes: providing a single-sided copper-clad plate, wherein the single-sided copper-clad plate comprises the first dielectric layer and the first copper layer positioned on the surface of the first dielectric layer; removing part of the first dielectric layer and exposing the surface of the first copper layer to form a slot; and filling the grooves with first heat-conducting glue.

In some embodiments, the first substrate further comprises a first heat conductive sheet, and the step of forming the first substrate further comprises attaching the first heat conductive sheet to the surface of the first heat conductive adhesive.

In some embodiments, the step of bending the circuit board at the bending region to form a receiving groove, and placing a battery cell in the receiving groove, where the battery cell is electrically connected to the bus bar, so as to form the battery assembly includes: connecting a connecting sheet on the surface of the busbar; bonding colloid on the surfaces of the first heat dissipation copper block and the second heat dissipation copper block; bending two ends of the circuit board towards one side where the connecting sheet is located to form the accommodating groove; and the battery cell is accommodated in the accommodating groove and is connected with the circuit board through the connecting sheet, so that the battery assembly is formed.

According to the battery assembly, the assemblies such as the bus bars and the fuses are all arranged on the same circuit board in a centralized mode, so that the space required by additionally arranging the bus bars and the fuses can be avoided, and the arrangement space is small; the circuit board surrounds the battery cell in multiple sides, so that heat generated by the battery cell can be rapidly dissipated; meanwhile, the first heat dissipation module, the second heat dissipation module and the cavity are arranged on the circuit board, so that the heat dissipation efficiency of the circuit board is further improved, and the working state of the battery assembly is guaranteed.

Drawings

Fig. 1 is a schematic cross-sectional view of a single-sided copper-clad plate including a first dielectric layer and a first copper layer according to an embodiment of the present application.

Fig. 2 is a schematic cross-sectional view of the first dielectric layer shown in fig. 1 removed and exposing a surface of the first copper layer to form a trench.

Fig. 3 is a schematic cross-sectional view of the first heat-conductive paste filled in the grooves shown in fig. 2.

Fig. 4 is a schematic cross-sectional view of the first heat conductive sheet attached to the surface of the first heat conductive adhesive shown in fig. 3.

Fig. 5 is a schematic cross-sectional view of a second substrate according to an embodiment of the present disclosure.

Fig. 6 is a schematic cross-sectional view of a film provided in an embodiment of the present application.

Fig. 7 is a schematic cross-sectional view illustrating sequential placement of the first substrate shown in fig. 4, the film shown in fig. 6, and the second substrate shown in fig. 5.

Fig. 8 is a schematic cross-sectional view of the first substrate film and the second substrate shown in fig. 7.

Fig. 9 is a schematic cross-sectional view of a circuit board obtained by etching the first copper layer and the second copper layer shown in fig. 8.

Fig. 10 is a schematic cross-sectional view of a protective layer formed on the surface of the circuit board shown in fig. 9.

Fig. 11 is a schematic cross-sectional view showing a connection piece attached to the surface of the busbar shown in fig. 10.

Fig. 12 is a schematic cross-sectional view of the attachment of a monitoring element to the fuse shown in fig. 11.

Fig. 13 is a schematic cross-sectional view of the surface adhesive glue of the first heat dissipation copper block and the second heat dissipation copper block shown in fig. 12.

Fig. 14 is a schematic cross-sectional view of the battery assembly obtained by bending the circuit board shown in fig. 13 to form a receiving groove and connecting a battery cell in the receiving groove.

Fig. 15 is a schematic cross-sectional view of a battery module obtained after two battery modules shown in fig. 14 are connected to each other.

Fig. 16 is a schematic cross-sectional view of a battery module including a holder according to an embodiment of the present application.

Description of the main reference signs

Battery assembly	100
Circuit board	10
First substrate	20
Single-sided copper-clad plate	21
A first dielectric layer	22
Slotting	23

First copper layer	24
Bus bar	242
First radiating copper block	245
First heat-conducting glue	25
First heat conducting fin	26
Second substrate	30
A second dielectric layer	32
Second copper layer	34
Fuse wire	342
Second heat dissipation copper block	345
Second heat-conducting glue	35
Second heat conducting fin	36
Film sheet	40
Through hole	42
Cavity cavity	45a、45b
Protective layer	47
Connecting sheet	52
Monitoring element	55
Colloid	57
Accommodating groove	60
Battery cell	70
Battery module	200
Support frame	210
Heat dissipation area	I
Bending region	II

The following detailed description will further illustrate the application in conjunction with the above-described figures.

Detailed Description

In order that the above-recited objects, features and advantages of the present application will be more clearly understood, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description. In addition, embodiments of the present application and features of the embodiments may be combined with each other without conflict. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, and the described embodiments are merely some, rather than all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes all and any combination of one or more of the associated listed items.

In various embodiments of the present application, for ease of description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical coupling, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which change accordingly when the absolute position of the object to be described changes.

Referring to fig. 1 to 14, an embodiment of the present application provides a method for manufacturing a battery assembly 100, which includes the following steps:

step S1: referring to fig. 1 to 4, a first substrate 20 is provided, the first substrate 20 includes a first copper layer 24, a first dielectric layer 22 and a plurality of first heat conductive adhesives 25, the first dielectric layer 22 is located on the surface of the first copper layer 24, and the plurality of first heat conductive adhesives 25 respectively penetrate through the first dielectric layer 22 and are connected with the first copper layer 24.

The material of the first dielectric layer 22 may be one of flexible materials such as Polyimide (PI), liquid crystal polymer (liquid crystal polymer, LCP), and modified polyimide (modified polyimide, MPI), so as to facilitate bending in the subsequent process. In this embodiment, the material of the first dielectric layer 22 is polyimide.

In some embodiments, the first substrate 20 further includes a plurality of first heat conductive fins 26, where the first heat conductive fins 26 are disposed on a surface of the first heat conductive glue 25 facing away from the first copper layer 24. The plurality of first heat-conducting adhesives 25 are arranged at intervals, the plurality of first heat-conducting fins 26 are also arranged at intervals, and the first heat-conducting adhesives 25 and the first heat-conducting fins 26 which are arranged at intervals are convenient for bending in the subsequent process; the first heat conductive sheet 26 is provided so as to transfer heat rapidly.

The material of the first heat conductive sheet 26 is a material with good heat conductive performance, including but not limited to metal, carbon material, etc., and in this embodiment, the material of the first heat conductive sheet 26 is copper.

In some embodiments, the first substrate 20 may be formed by:

step S101: referring to fig. 1, a single-sided copper-clad laminate 21 is provided, which includes the first dielectric layer 22 and the first copper layer 24 disposed on the surface of the first dielectric layer 22.

Step S102: referring to fig. 2, a portion of the first dielectric layer 22 is removed and a surface of the first copper layer 24 is exposed to form a trench 23.

The slot 23 penetrates the first dielectric layer 22 along the stacking direction of the first copper layer 24 and the first dielectric layer 22. The number of the slots 23 is plural. The position of the slot 23 is related to the position of the cavities 45a, 45b to be formed later.

Step S103: referring to fig. 3, the slot 23 is filled with a first heat-conducting glue 25.

The first heat-conducting glue 25 is used for quick heat conduction and also plays a role in adhesion.

Step S104: referring to fig. 4, the first heat conductive sheet 26 is attached to the surface of the first heat conductive adhesive 25.

Step S2: referring to fig. 5, a second substrate 30 is provided, the second substrate 30 includes a second copper layer 34, a second dielectric layer 32, and at least one second thermal conductive adhesive 35, the second dielectric layer 32 is located on the surface of the second copper layer 34, and the second thermal conductive adhesive 35 penetrates through the second dielectric layer 32 and is connected to the second copper layer 34.

The material of the second dielectric layer 32 may be one of the above flexible materials.

The thicknesses of the first dielectric layer 22 and the second dielectric layer 32 may be 12.5 μm to 25 μm, respectively, so as to facilitate bending in the subsequent process.

In some embodiments, the second substrate 30 further includes at least one second heat conductive sheet 36, where the second heat conductive sheet 36 is located on a surface of the second heat conductive adhesive 35 facing away from the second copper layer 34, and the second heat conductive sheet 36 is disposed corresponding to at least one first heat conductive sheet 26. The material of the second heat conductive sheet 36 includes, but is not limited to, metal, carbon material, etc.

The step of forming the second substrate 30 may be substantially the same as the step of forming the first substrate 20, and other methods of forming the second substrate 30 may be employed.

Step S3: referring to fig. 6, a film 40 is provided, the film 40 includes a plurality of through holes 42, and the positions of the through holes 42 correspond to the positions of the first heat conductive adhesive 25.

Step S4: referring to fig. 7 and 8, the first substrate 20 and the second substrate 30 are respectively pressed on two opposite sides of the film 40 and the through holes 42 are sealed, so that the through holes 42 form cavities 45a to form heat dissipation areas I and bending areas II which are sequentially arranged at intervals.

Along the stacking direction of the first substrate 20, the film 40, and the second substrate 30, the area corresponding to the first heat-conducting glue 25 and/or the second heat-conducting glue 35 is the heat dissipation area I, and the bending area II is located between two adjacent heat dissipation areas I.

In some embodiments, the first copper layer 24 and the second copper layer 34 are both located on the surface facing away from the film 40, the first heat conducting fin 26 and the second heat conducting fin 36 are both located in the through hole 42, and the first heat conducting fin 26 and the second heat conducting fin 36 located in the through hole 42 are used for rapid heat transfer.

In some embodiments, the number of through holes 42 is greater than the number of first thermally conductive sheets 26, thereby forming a plurality of cavities 45a, 45b such that the inflection zone II also has the cavities 45b. The cavities 45a and 45b are filled with air, and the heat dissipation performance of the air is better than that of the first medium layer 22 and the second medium layer 32, so that the heat dissipation performance can be improved due to the arrangement of the cavities 45a and 45 b; on the other hand, the partial cavity 45b is provided to facilitate bending in the subsequent process.

In some embodiments, a liquid, such as water, may be injected into the cavity 45a to further increase the heat dissipation efficiency.

In some embodiments, the number of the cavities 45a, 45b located in the same heat dissipation area I or the same bending area II is not limited to one, but may be plural, and the plural cavities 45a, 45b are spaced by the film 40. The distance between two adjacent cavities 45a and 45b is greater than or equal to 1mm, and a certain glue overflow space is reserved due to glue overflow in the subsequent pressing process.

The thickness of the film 40 may be between 100 μm and 300 μm to ensure that the first dielectric layer 22 and the second dielectric layer 32 are not interconnected by being too close to each other during subsequent bending.

Step S5: referring to fig. 9, the first copper layer 24 is etched to form the bus bars 242 and the first heat dissipation copper block 245, and the second copper layer 34 is etched to form the fuse 342 and the second heat dissipation copper block 345, thereby forming the circuit board 10.

The first copper layer 24 and the second copper layer 34 are removed in the bending region II, so that the bending region II is easily bent in the subsequent process.

The first copper layer 24 and the second copper layer 34 located in the heat dissipation area I are partially etched. Wherein, the bus bar 242 is used for electrically connecting with the battery cell 70 (refer to fig. 14); the fuse 342 is used for electrically connecting with the battery cell 70, and blocking the current in the battery cell 70 when a certain threshold value is exceeded, so as to protect the battery cell 70; the first heat dissipation copper block 245 and the second heat dissipation copper block 345 are used for contacting the battery cell 70, so as to quickly transfer out the heat generated by the battery cell 70.

The thickness of the first copper layer 24 is greater than or equal to 35 μm to ensure the range of the current passing through after the confluence.

In some embodiments, referring to fig. 10, the method further includes a step of forming a protection layer 47, where the protection layer 47 is located at the periphery of the bus bar 242 and the fuse 342, for protecting the bus bar 242 and the fuse 342.

Step S6: referring to fig. 11 to 14, the circuit board 10 is bent at the bending region II to form a receiving groove 60, and a battery cell 70 is disposed in the receiving groove 60, and the battery cell 70 is electrically connected to the bus bar 242, thereby forming the battery assembly 100.

In some embodiments, step S6 may be formed by:

step S601: referring to fig. 11, a connecting piece 52 is connected to the surface of the bus bar 242.

The material of the connecting piece 52 needs to have a conductive effect, including but not limited to nickel.

Step S602: referring to fig. 12, a monitoring element 55 is connected to the fuse 342.

The monitoring element 55 is used for monitoring the working condition of the battery cell 70 and transmitting the working condition to an electrically connected battery management system (Battery Management System, BMS) (not shown), so that the battery management system can control the working state of the battery according to the working condition of the battery.

Step S603: referring to fig. 13, a glue 57 is adhered to the surfaces of the first heat dissipation copper block 245 and the second heat dissipation copper block 345.

The glue 57 is any material that can be used for its bonding, such as a cured glue.

Step S604: referring to fig. 14, the two ends of the circuit board 10 are bent toward the side where the connecting piece 52 is located to form the accommodating groove 60.

Bending is performed along the area where the bending area II is located, the connecting piece 52 and the first heat dissipating copper block 245 face the accommodating groove 60, and the fuse 342 and the second heat dissipating copper block 345 are located at a side facing away from the accommodating groove 60.

Step S605: referring again to fig. 14, the battery cell 70 is accommodated in the accommodating groove 60, and the battery cell 70 is connected to the circuit board 10 through the connecting piece 52, so as to form the battery assembly 100.

The first heat dissipation copper block 245 facing into the accommodating groove 60 is connected with the battery cell 70 through the colloid 57, so that the battery cell 70 is fixed in the accommodating groove 60. The second heat dissipation copper block 345 facing away from the accommodating groove 60 is used for being connected with the other battery cell 70, so that heat of the other battery cell 70 is transferred out. The arrangement of the first heat dissipation copper block 245 and the second heat dissipation copper block 345 is beneficial to increasing the contact area between the battery cell 70 and the first heat dissipation copper block 245 and the second heat dissipation copper block 345, thereby improving heat dissipation performance.

Referring to fig. 14, the present application further provides a battery assembly 100, which includes at least one circuit board 10 and at least one electric core 70, wherein the circuit board 10 has a receiving slot 60, and the electric core 70 is received in the receiving slot 60 and electrically connected to the circuit board 10. The battery cell 70 includes a positive electrode tab (not shown) and a negative electrode tab (not shown), which are electrically connected to the circuit board 10.

The circuit board 10 includes a heat dissipation area I and a bending area II, which are sequentially and continuously arranged at intervals, and the heat dissipation area I and the bending area II enclose to form the accommodating groove 60, where the bending area II corresponds to a corner area of the electrical core 70.

The circuit board 10 includes a first dielectric layer 22, a second dielectric layer 32, a film 40, a fuse 342, a bus 242, a first heat dissipating copper block 245, and a second heat dissipating copper block 345.

The material of the first dielectric layer 22 and the second dielectric layer 32 may be one of flexible materials such as polyimide, liquid crystal polymer, and modified polyimide.

The film 40 is located between the first dielectric layer 22 and the second dielectric layer 32, and the film 40 is used to bond and support the first dielectric layer 22 and the second dielectric layer 32 to form a cavity 45a between the first dielectric layer 22 and the second dielectric layer 32.

The cavity 45a is at least located in the heat dissipation area I, and the cavity 45a is filled with air, so that the heat dissipation performance of the air is better than that of the first dielectric layer 22 and the second dielectric layer 32, and the heat dissipation performance of the cavity 45a can be improved, and the weight of the battery assembly 100 can be reduced. In some embodiments, a liquid, such as water, may be injected into the cavity 45a located in the heat dissipation area I, so as to further improve heat dissipation efficiency.

In some embodiments, a cavity 45b is also provided between the first dielectric layer 22 and the second dielectric layer 32 in the inflection region II to facilitate the inflection of the inflection region II during the formation of the battery assembly 100.

In some embodiments, the number of cavities 45a, 45b in the same area is not limited to one, and may be plural, and plural cavities 45a, 45b are spaced by the film 40.

The bus 242 and the first heat dissipation copper block 245 are located on the surface of the first dielectric layer 22 facing away from the second dielectric layer 32, the fuse 342 and the second heat dissipation copper block 345 are located on the surface of the second dielectric layer 32 facing away from the first dielectric layer 22, and the fuse 342, the bus 242, the first heat dissipation copper block 245 and the second heat dissipation copper block 345 are all located in the heat dissipation area I.

The bus bars 242 respectively correspond to the positive electrode tab and the negative electrode tab of the battery cell 70, so that the circuit board 10 is electrically connected with the battery cell 70.

In some embodiments, the battery assembly 100 further includes a connecting tab 52, the connecting tab 52 being located on a surface of the bus bar 242 facing the battery cell 70 for electrically connecting the bus bar 242 with the battery cell 70.

The fuse 342 is located on the surface of the second dielectric layer 32 facing away from the bus bar 242, and in the same area, the position of the fuse 342 is set corresponding to the position of the bus bar 242.

The surface of the second dielectric layer 32 facing away from the fuse 342 at the heat dissipation area I is not provided with the second heat conducting fin 36, so that heat transferred to the fuse 342 can be prevented from overheating the fuse 342.

The first heat dissipating copper block 245 is connected to the surface of the battery cell 70, so as to transfer heat rapidly. In some embodiments, a colloid 57 may be further disposed between the first heat dissipation copper block 245 and the electrical core 70, where the colloid 57 is used to connect the first heat dissipation copper block 245 and the electrical core 70, and the colloid 57 further has elasticity and can play a role in buffering.

The second heat dissipation copper block 345 is located on the surface of the second dielectric layer 32 facing away from the battery cell 70, and the heat generated by the battery cell 70 sequentially passes through the first heat dissipation copper block 245 and the cavity 45 and finally is dissipated through the second heat dissipation copper block 345; the second heat dissipation module is further configured to be connected to a surface of another adjacent battery cell 70, and configured to dissipate heat generated by the other battery cell 70.

The first heat dissipation copper block 245 and the first heat conduction sheet 26 may be bonded by a first heat conduction glue 25. The second heat dissipation copper block 345 and the second heat conduction sheet 36 may be bonded by a second heat conduction glue 35.

In some embodiments, the battery assembly 100 further includes a first thermally conductive sheet 26 and a second thermally conductive sheet 36, the first thermally conductive sheet 26 being positioned on a surface of the first dielectric layer 22 facing the cavity 45a, and the second thermally conductive sheet 36 being positioned on a surface of the second dielectric layer 32 facing the cavity 45a.

The thicknesses of the first and second heat conductive sheets 26 and 36 may be 25 μm to 50 μm so as to facilitate the cavities 45a and 45b to have a certain flexibility and to facilitate the bending of the circuit board 10 during the manufacturing process.

In some embodiments, the battery assembly 100 further includes a monitoring element 55, the monitoring element 55 being located on the same surface of the second dielectric layer 32 as the fuse 342, the monitoring element 55 being connected to the fuse 342.

Referring to fig. 15 and 16, the present application further provides a battery module 200, where the battery module 100 includes at least two battery modules 100, and two adjacent battery cells 70 are disposed at intervals through the circuit board 10, and the second heat dissipation copper block 345 of one battery module 100 is connected to the surface of the adjacent battery cell 70 of the battery module 100.

In some embodiments, the battery module 200 further includes a bracket 210, and the bracket 210 is used to fix the plurality of battery assemblies 100.

In the battery assembly 100 provided by the present application, the bus bar 242, the fuse 342 and other assemblies are all arranged on the same circuit board 10 in a concentrated manner, so that the space required by additionally arranging the bus bar 242 and the fuse 342 can be avoided; the circuit board 10 surrounds the battery cell 70 in multiple surfaces, so that heat generated by the battery cell 70 can be rapidly dissipated; meanwhile, the first heat dissipation module, the second heat dissipation module and the cavity 45a are disposed on the circuit board 10, so as to further improve the heat dissipation efficiency of the circuit board 10, and ensure the working state of the battery assembly 100.

The above embodiments are only for illustrating the technical solution of the present application and not for limiting, and although the present application has been described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present application may be modified or substituted without departing from the spirit and scope of the technical solution of the present application.

Claims

A battery assembly, comprising:

a circuit board, comprising:

a first dielectric layer;

a second dielectric layer;

a film positioned between the first dielectric layer and the second dielectric layer and having a plurality of spaced apart cavities;

a busbar;

the first heat dissipation copper block and the busbar are positioned on the surface of the first dielectric layer, which is away from the second dielectric layer;

a fuse; and

the second heat dissipation copper block and the fuse are positioned on the surface of the second dielectric layer, which is away from the first dielectric layer;

the circuit board comprises a heat dissipation area and a bending area which are sequentially and continuously arranged at intervals, wherein the heat dissipation area and the bending area are surrounded to form a containing groove, the busbar, the first heat dissipation copper block, the fuse and the second heat dissipation copper block are all positioned in the heat dissipation area, and the busbar and the first heat dissipation copper block are arranged towards the containing groove; and

and the battery cell is positioned in the accommodating groove and is electrically connected with the circuit board through the busbar.
The battery assembly of claim 1, further comprising a first thermally conductive sheet on a surface of the first dielectric layer facing the cavity and a second thermally conductive sheet on a surface of the second dielectric layer facing the cavity.
The battery assembly of claim 1, further comprising a monitoring element coupled to the fuse.
The battery assembly of claim 1, wherein the buss bars and the connecting tabs are disposed in correspondence within the same heat dissipation area.
The battery assembly of claim 1, wherein the cavity is further filled with a liquid.
A battery module comprising the battery assembly of any one of claims 1-4, wherein the number of battery assemblies is at least two, and wherein the second heat dissipation copper block of one battery assembly is connected to the surface of the cell of an adjacent battery assembly.
A method of making a battery assembly comprising the steps of:

providing a first substrate, wherein the first substrate comprises a first copper layer, a first dielectric layer and a plurality of first heat-conducting adhesives, the first dielectric layer is positioned on the surface of the first copper layer, and the plurality of first heat-conducting adhesives respectively penetrate through the first dielectric layer and are connected with the first copper layer;

providing a second substrate, wherein the second substrate comprises a second copper layer, a second dielectric layer and at least one second heat-conducting adhesive, the second dielectric layer is positioned on the surface of the second copper layer, and the second heat-conducting adhesive penetrates through the second dielectric layer and is connected with the second copper layer;

providing a film, wherein the film comprises a plurality of through holes, and the positions of the through holes correspond to the positions of the first heat conducting glue;

the first substrate and the second substrate are respectively pressed on two opposite sides of the film and the through holes are sealed, so that the through holes form cavities, and a heat dissipation area and a bending area which are sequentially arranged at intervals are formed;

etching the first copper layer to form a busbar and a first heat dissipation copper block, and etching the second copper layer to form a fuse and a second heat dissipation copper block, thereby forming a circuit board; and

and bending the circuit board in the bending area to form a containing groove, and placing a battery cell in the containing groove, wherein the battery cell is electrically connected with the busbar, so that the battery assembly is formed.
The method of manufacturing a battery assembly according to claim 7, wherein the step of forming the first substrate includes:

providing a single-sided copper-clad plate, wherein the single-sided copper-clad plate comprises the first dielectric layer and the first copper layer positioned on the surface of the first dielectric layer;

removing part of the first dielectric layer and exposing the surface of the first copper layer to form a slot; and

and filling the grooves with first heat-conducting glue.
The method of manufacturing a battery assembly according to claim 8, wherein the first substrate further comprises a first heat conductive sheet, and the step of forming the first substrate further comprises:

and attaching the first heat conducting fin to the surface of the first heat conducting glue.
The method of claim 7, wherein the step of bending the circuit board at the bending region to form a receiving groove, and placing a battery cell in the receiving groove, the battery cell being electrically connected to the bus bar, thereby forming the battery assembly comprises:

connecting a connecting sheet on the surface of the busbar;

bonding colloid on the surfaces of the first heat dissipation copper block and the second heat dissipation copper block;

bending two ends of the circuit board towards one side where the connecting sheet is located to form the accommodating groove; and

and the battery cell is accommodated in the accommodating groove and is connected with the circuit board through the connecting sheet, so that the battery assembly is formed.