TWI768981B - Battery assembly, battery module and method for manufacturing the battery assembly - Google Patents

Abstract

A battery assembly includes a circuit board and a battery cell. The circuit board includes a first dielectric layer, a second dielectric layer, a film, a bus bar, a first heat dissipation copper block, a fuse, and a second heat dissipation copper block. The film is disposed between the first dielectric layer and the second dielectric layer and includes a plurality of cavities. The first heat dissipation copper block and the bus bar are disposed on the first dielectric layer. The second heat dissipation copper block and the fuse are disposed on the second dielectric layer. The circuit board includes successive heat dissipation areas and bending areas. The heat dissipating area and the bending area are surrounded to form an accommodating groove. The bus bar, the first heat dissipation copper block, the fuse, and the second heat dissipation copper block are all disposed in the heat dissipation area. The bus bar and the first heat dissipation copper block are disposed toward the accommodating groove. The battery cell is disposed in the accommodating groove and is electrically connected to the circuit board through the bus bar. The present disclosure also provides a battery module and a method for manufacturing the battery assembly.

Description

Battery pack, battery module, and method for making battery pack

The present application relates to the field of battery heat dissipation, and in particular, to a battery assembly, a battery module and a manufacturing method of the battery assembly.

Batteries are an important source of power for some devices, such as electric vehicles. In order to meet the high power requirements of the equipment, it is usually necessary to assemble multiple cells to form a large battery module. In order to ensure the safety of high-power battery modules, the battery modules need to have overcurrent protection and thermal management functions.

In an existing battery module, currents of multiple cells are usually combined through a bus bar, a fuse is installed to achieve overcurrent protection of the battery module, and a heat dissipation pipe is additionally installed to dissipate heat from the battery module. The busbars, fuses, and heat pipes are all independent components, and additional space is required for accommodating them. In addition, the existing heat pipes are arranged at both ends of the cell, which cannot meet the heat dissipation requirements of the battery module when using high power.

Therefore, it is necessary to provide a battery assembly with small arrangement space and fast heat dissipation, so as to solve the above technical problems.

The present application also provides a battery module.

The present application also provides a manufacturing method of a battery assembly.

A battery assembly includes a circuit board and a battery core, the circuit board includes a first dielectric layer, a second dielectric layer, a film, a bus bar, a first heat-dissipating copper block, a fuse and a second heat-dissipating copper block, and the film is located on the first medium There are multiple spaced cavities between the layer and the second dielectric layer; the first heat dissipation copper block and the busbar are located on the surface of the first dielectric layer away from the second dielectric layer; the second heat dissipation copper block The block and the fuse are located on the surface of the second dielectric layer away from the first dielectric layer; wherein, the circuit board includes a heat dissipation area and a bending area that are successively and spaced in sequence, and the heat dissipation area is connected to the bending area. The folding area is surrounded by an accommodating slot, the bus bar, the first heat dissipation copper block, the fuse and the second heat dissipation copper block are all located in the heat dissipation area, the bus bar and the first heat dissipation copper block are all located in the heat dissipation area. The heat-dissipating copper block is disposed toward the accommodating groove; the battery core is located in the accommodating groove and is electrically connected to the circuit board through the bus bar.

In some embodiments, the battery assembly further includes a first thermal conductive sheet and a second thermal conductive sheet, the first thermal conductive sheet is located on the surface of the first medium layer facing the cavity, and the second thermal conductive sheet is located on the surface of the first medium layer facing the cavity. The second dielectric layer faces the surface of the cavity.

In some embodiments, the battery assembly further includes a monitoring element connected to the fuse.

In some embodiments, the bus bar and the connecting piece are correspondingly arranged in the same heat dissipation area.

In some embodiments, the cavity is also filled with liquid.

A battery module, comprising the battery components, the number of the battery components is at least two, wherein the second heat dissipation copper block of one battery component and the surface of the battery cell of the adjacent battery component connect.

A method for manufacturing a battery assembly, comprising the following steps: providing a first substrate, the first substrate comprising a first copper layer, a first dielectric layer and a plurality of first thermally conductive adhesives, the first dielectric layer is located on the first On the surface of the copper layer, a plurality of the first thermally conductive adhesives respectively penetrate through the first dielectric layer and are connected to the surface of the copper layer. The first copper layer is connected; a second substrate is provided, the second substrate includes a second copper layer, a second dielectric layer and at least one second thermally conductive adhesive, the second dielectric layer is located on the surface of the second copper layer , the second thermally conductive adhesive penetrates through the second dielectric layer and is connected to the second copper layer; a film is provided, the film includes a plurality of through holes, and the positions of the through holes are the same as those of the first thermally conductive adhesive. The positions correspond to each other; press the first substrate and the second substrate on opposite sides of the film respectively and seal the through holes, so that the through holes form cavities and form heat dissipation areas arranged at intervals in sequence and a bending area; etching the first copper layer to form a bus bar and a first heat dissipation copper block, etching the second copper layer to form a fuse and a second heat dissipation copper block to form a circuit board; placing the circuit board on the bend The folding area is bent to form an accommodating groove, and a battery cell is placed in the accommodating groove, and the battery core is electrically connected with the bus bar to form the battery assembly.

In some embodiments, the step of forming the first substrate includes: providing a single-sided copper clad laminate including the first dielectric layer and the first copper layer on the surface of the first dielectric layer; removing the A part of the first dielectric layer is exposed and the surface of the first copper layer is exposed to form a slot; a first thermal conductive glue is filled in the slot.

In some embodiments, the first substrate further includes a first thermally conductive sheet, and the step of forming the first substrate further includes attaching the first thermally conductive sheet on the surface of the first thermally conductive adhesive.

In some embodiments, "the circuit board is bent in the bending area to form an accommodating groove, and a battery cell is placed in the accommodating groove, and the battery core and the bus bar are placed in the accommodating groove. The steps of forming the battery assembly” include: connecting a connecting piece on the surface of the bus bar; adhering colloid on the surfaces of the first heat dissipation copper block and the second heat dissipation copper block; Both ends of the circuit board are bent toward the side where the connecting piece is located to form the accommodating groove; the battery core is accommodated in the accommodating groove, and the battery core passes through the connecting piece connected with the circuit board to form the battery assembly.

In the battery assembly provided by the present application, by arranging the busbars, fuses and other components on the same circuit board, the space required for additionally setting the busbars and fuses can be avoided, and the arrangement space is small; the circuit board surrounds the battery cells on multiple sides. , which can quickly dissipate the heat generated by the battery; A first heat dissipation module, a second heat dissipation module and a cavity are arranged on the circuit board to further improve the heat dissipation efficiency of the circuit board to ensure the working state of the battery assembly.

100: Battery Components

10: circuit board

20: The first substrate

21: single-sided copper clad laminate

22: The first dielectric layer

23: Slotting

24: First copper layer

242: Busbar

245: The first heat dissipation copper block

25: The first thermal paste

26: The first thermal conductive sheet

30: Second substrate

32: Second dielectric layer

34: Second copper layer

342: Fuse

345: Second heat dissipation copper block

35: The second thermal paste

36: Second thermal pad

40: Film

42: Through hole

45a, 45b: cavity

47: Protective layer

52: connecting piece

55: Monitoring components

57: Colloid

60: accommodating slot

70: battery

200: battery module

210: Bracket

I: heat dissipation area

II: Bending zone

1 is a schematic cross-sectional view of a single-sided copper clad laminate including a first dielectric layer and a first copper layer according to an embodiment of the present application.

FIG. 2 is a schematic cross-sectional view of removing a portion of the first dielectric layer shown in FIG. 1 and exposing the surface of the first copper layer to form a slot.

FIG. 3 is a schematic cross-sectional view of filling the first thermally conductive adhesive in the slot shown in FIG. 2 .

FIG. 4 is a schematic cross-sectional view of attaching a first thermally conductive sheet on the surface of the first thermally conductive adhesive shown in FIG. 3 .

FIG. 5 is a schematic cross-sectional view of a second substrate provided by an embodiment of the present application.

FIG. 6 is a schematic cross-sectional view of a film provided in an embodiment of the present application.

FIG. 7 is a schematic cross-sectional view of placing the first substrate shown in FIG. 4 , the film shown in FIG. 6 , and the second substrate shown in FIG. 5 in order.

FIG. 8 is a schematic cross-sectional view of laminating the first substrate film and the second substrate shown in FIG. 7 .

FIG. 9 is a schematic cross-sectional view of a circuit board obtained by etching the first copper layer and the second copper layer shown in FIG. 8 .

FIG. 10 is a schematic cross-sectional view of forming a protective layer on the surface of the circuit board shown in FIG. 9 .

FIG. 11 is a schematic cross-sectional view of connecting a connecting piece to the surface of the bus bar shown in FIG. 10 .

FIG. 12 is a schematic cross-sectional view of connecting a monitoring element to the fuse shown in FIG. 11 .

FIG. 13 is a schematic cross-sectional view of the adhesive on the surfaces of the first heat-dissipating copper block and the second heat-dissipating copper block shown in FIG. 12 .

14 is a schematic cross-sectional view of a battery assembly obtained by bending the circuit board shown in FIG. 13 to form an accommodating groove, and connecting a battery cell in the accommodating groove.

FIG. 15 is a schematic cross-sectional view of a battery module obtained after two battery assemblies shown in FIG. 14 are connected to each other.

FIG. 16 is a schematic cross-sectional view of a battery module including a bracket according to an embodiment of the present application.

In order to more clearly understand the above objects, features and advantages of the present application, the present application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features of the embodiments may be combined with each other unless there is conflict. Many specific details are set forth in the following description to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the present application are for the purpose of describing particular embodiments only, and are not intended to limit the present application. As used herein, the term "and/or" includes all and any combinations of one or more of the associated listed items.

In the various embodiments of the present application, for the convenience of description rather than limitation of the present application, the term "connection" used in the description of the patent application of the present application and the scope of the patent application is not limited to physical or mechanical connections, whether direct or indirect of. "Up", "Down", "Above", "Down", "Left", "Right", etc. are only used to indicate the relative positional relationship. When the absolute position of the described object is changed, the relative positional relationship will also correspond accordingly. Change.

Referring to FIGS. 1 to 14 , an embodiment of the present application provides a method for fabricating a battery assembly 100 , including the following steps:

Step S1: Referring to FIGS. 1 to 4, a first substrate 20 is provided, the first substrate 20 includes a first copper layer 24, a first dielectric layer 22 and a plurality of first thermally conductive adhesives 25, the first dielectric layer 22 is located on the surface of the first copper layer 24 , and a plurality of the first thermally conductive adhesives 25 respectively penetrate through the first dielectric layer 22 and are connected to the first copper layer 24 .

The material of the first dielectric layer 22 can be selected from flexible materials such as polyimide (PI), liquid crystal polymer (LCP), and modified polyimide (MPI). One of the flexible materials to facilitate bending in the subsequent process. In this embodiment, the material of the first dielectric layer 22 is polyimide.

In some embodiments, the first substrate 20 further includes a plurality of first thermally conductive sheets 26 , and the first thermally conductive sheets 26 are disposed on the surface of the first thermally conductive adhesive 25 facing away from the first copper layer 24 . A plurality of the first thermally conductive adhesives 25 are arranged at intervals, and a plurality of the first thermally conductive sheets 26 are also arranged at intervals. The first thermally conductive adhesives 25 and the first thermally conductive sheets 26 are arranged at intervals to facilitate subsequent Bending during the manufacturing process; the arrangement of the first heat conducting sheet 26 facilitates rapid heat transfer.

Wherein, the material of the first thermally conductive sheet 26 is a material with good thermal conductivity, including but not limited to metal, carbon materials, etc. In this embodiment, the material of the first thermally conductive sheet 26 is copper.

In some embodiments, the first substrate 20 may be formed by the following steps:

Step S101 : Referring to FIG. 1 , a single-sided copper clad laminate 21 is provided, including the first dielectric layer 22 and the first copper layer 24 on the surface of the first dielectric layer 22 .

Step S102 : Referring to FIG. 2 , part of the first dielectric layer 22 is removed to expose the surface of the first copper layer 24 to form the slot 23 .

The slot 23 penetrates the first dielectric layer 22 along the stacking direction of the first copper layer 24 and the first dielectric layer 22 . The number of the slots 23 is plural. The position of the slot 23 is related to the position of the cavities 45a and 45b to be formed subsequently.

Step S103 : referring to FIG. 3 , fill the first thermal conductive adhesive 25 in the slot 23 .

The first thermally conductive adhesive 25 is used for rapid heat conduction and also plays a bonding role.

Step S104 : referring to FIG. 4 , attach the first thermal conductive sheet 26 to the surface of the first thermal conductive adhesive 25 .

Step S2 : referring to FIG. 5 , a second substrate 30 is provided, the second substrate 30 includes a second copper layer 34 , a second dielectric layer 32 and at least one second thermally conductive adhesive 35 , the second dielectric layer 32 is located on the the surface of the second copper layer 34 , the second thermally conductive adhesive 35 penetrates through the second dielectric layer 32 and is connected to the second copper layer 34 .

The material of the second dielectric layer 32 may be one of the above-mentioned flexible materials.

The thicknesses of the first dielectric layer 22 and the second dielectric layer 32 may be 12.5 μm-25 μm, respectively, to facilitate bending in subsequent processes.

In some embodiments, the second substrate 30 further includes at least one second thermally conductive sheet 36 , the second thermally conductive sheet 36 is located on the surface of the second thermally conductive adhesive 35 away from the second copper layer 34 , wherein, The second thermally conductive sheet 36 is disposed corresponding to at least one of the first thermally conductive sheets 26 . The material of the second thermal conductive sheet 36 includes, but is not limited to, metal, carbon material, and the like.

The steps of forming the second substrate 30 may be substantially the same as the steps of forming the first substrate 20 , and other methods of forming the second substrate 30 may also be used.

Step S3 : referring to FIG. 6 , a film 40 is provided. The film 40 includes a plurality of through holes 42 , and the positions of the through holes 42 correspond to the positions of the first thermally conductive adhesive 25 .

Step S4: Referring to FIG. 7 and FIG. 8, press the first substrate 20 and the second substrate 30 on opposite sides of the film 40 and seal the through holes 42, so that the through holes 42 are sealed. The hole 42 forms a cavity 45a, and forms a heat dissipation area I and a bending area II which are arranged at intervals in sequence.

Wherein, along the stacking direction of the first substrate 20 , the film 40 and the second substrate 30 , the area corresponding to the first thermally conductive adhesive 25 and/or the second thermally conductive adhesive 35 is the The heat dissipation area I, the bending area II is located between two adjacent heat dissipation areas I.

In some embodiments, the first copper layer 24 and the second copper layer 34 are both located on the surface away from the film 40 , and the first thermally conductive sheet 26 and the second thermally conductive sheet 36 are both located on the surface of the film 40 . In the through hole 42 , the first heat conducting sheet 26 and the second heat conducting sheet 36 located in the through hole 42 are used for rapid heat transfer.

In some embodiments, the number of the through holes 42 is greater than the number of the first thermally conductive sheets 26 , so as to form a plurality of cavities 45a and 45b, so that the bending region II also has the cavity 45b. The cavities 45a and 45b are filled with air. Since the heat dissipation performance of the air is better than the heat dissipation performance of the first dielectric layer 22 and the second dielectric layer 32, the setting of the cavities 45a and 45b can improve the heat dissipation performance; on the other hand, Part of the cavity 45b is provided to facilitate bending in the subsequent manufacturing process.

In some embodiments, a liquid, such as water, can be injected into the cavity 45a to further improve the heat dissipation efficiency.

In some embodiments, the number of cavities 45a, 45b located in the same heat dissipation area I or the same bending area II is not limited to one, but may also be multiple, and the film 40 passes between the multiple cavities 45a, 45b interval. The distance between the two adjacent cavities 45a and 45b is greater than or equal to 1 mm. Since there will be glue overflowing in the subsequent pressing process, a certain overflowing space is reserved.

The thickness of the film 40 may be 100 μm-300 μm, so as to ensure that the first dielectric layer 22 and the second dielectric layer 32 will not be connected to each other because the distance is too close in the subsequent bending process.

Step S5 : Referring to FIG. 9 , etching the first copper layer 24 to form the bus bar 242 and the first heat dissipation copper block 245 , etching the second copper layer 34 to form the fuse 342 and the second heat dissipation copper block 345 , thereby forming the circuit board 10 .

Both the first copper layer 24 and the second copper layer 34 located in the bending region II are removed to facilitate the bending of the bending region II in the subsequent process.

The first copper layer 24 and the second copper layer 34 in the heat dissipation area I are partially etched. Wherein, the bus bar 242 is used for electrical connection with the battery cell 70 (refer to FIG. 14 ); the fuse 342 is used for electrical connection with the battery cell 70 , and when a certain threshold value is exceeded, the fuse 70 is blocked in the battery cell 70 . The current is used to protect the battery core 70; the first heat dissipation copper block 245 and the second heat dissipation copper block 345 are used to contact the battery core 70, and quickly transfer the heat generated by the battery core 70.

The thickness of the first copper layer 24 is greater than or equal to 35 μm, so as to ensure the size of the current passing through the bus.

In some embodiments, please refer to FIG. 10 , the manufacturing method further includes the step of forming a protective layer 47 , the protective layer 47 is located on the periphery of the bus bar 242 and the fuse 342 for protecting the bus bar 242 and the fuse 342.

Step S6 : Please refer to FIGS. 11 to 14 , bend the circuit board 10 in the bending area II to form an accommodating groove 60 , and place a battery cell 70 in the accommodating groove 60 , The battery cells 70 are electrically connected to the bus bars 242 to form the battery assembly 100 .

In some embodiments, step S6 may be formed by the following steps:

Step S601 : referring to FIG. 11 , connect a connecting piece 52 on the surface of the bus bar 242 .

The material of the connecting piece 52 needs to be conductive, including but not limited to nickel piece.

Step S602 : referring to FIG. 12 , connect the monitoring element 55 to the fuse 342 .

The monitoring element 55 is used to monitor the working condition of the battery cell 70 and transmit it to an electrically connected battery management system (Battery Management System, BMS) (not shown), so that the battery management system can control the working condition of the battery according to the working condition of the battery. working status.

Step S603 : Please refer to FIG. 13 , adhering the colloid 57 on the surfaces of the first heat dissipation copper block 245 and the second heat dissipation copper block 345 .

The colloid 57 is any material capable of bonding, such as curing glue.

Step S604 : Referring to FIG. 14 , the two ends of the circuit board 10 are bent toward the side where the connecting piece 52 is located to form the accommodating groove 60 .

Bending along the area where the bending area II is located, the connecting piece 52 and the first heat-dissipating copper block 245 face the accommodating slot 60 , and the fuse 342 and the second heat-dissipating copper block 345 are located away from each other. one side of the accommodating groove 60 .

Step S605 : Please refer to FIG. 14 again, the battery cell 70 is accommodated in the accommodating slot 60 , and the battery cell 70 is connected to the circuit board 10 through the connecting piece 52 , thereby forming the Battery pack 100.

The first heat-dissipating copper block 245 facing the accommodating groove 60 is connected to the battery core 70 through the glue 57 , thereby fixing the battery core 70 in the accommodating groove 60 . The second heat-dissipating copper block 345 facing away from the accommodating slot 60 is used for connecting with the other cell 70 , so as to transfer the heat of the other cell 70 . The arrangement of the first heat dissipation copper block 245 and the second heat dissipation copper block 345 is beneficial to increase the contact between the battery cell 70 and the first heat dissipation copper block 245 and the second heat dissipation copper block 345 area to improve heat dissipation.

Referring to FIG. 14 , the present application further provides a battery assembly 100 , which includes at least one circuit board 10 and at least one battery cell 70 , the circuit board 10 has an accommodating slot 60 , and the battery cell 70 is accommodated in the container placed in the slot 60 and electrically connected to the circuit board 10 . The battery cell 70 includes a positive electrode tab (not shown in the figure). mark) and a negative electrode tab (not shown), the positive electrode tab and the negative electrode tab are used for electrical connection with the circuit board 10 .

The circuit board 10 includes a heat dissipation area I and a bending area II that are successively and spaced apart. The heat dissipation area I and the bending area II are surrounded to form the accommodating groove 60 , wherein the bending area is II corresponds to the corner area of the cell 70 .

The circuit board 10 includes a first dielectric layer 22 , a second dielectric layer 32 , a film 40 , a fuse 342 , a bus bar 242 , a first heat dissipation copper block 245 and a second heat dissipation copper block 345 .

The material of the first dielectric layer 22 and the second dielectric layer 32 may be selected from flexible materials such as polyimide, liquid crystal polymer, and modified polyimide.

The film 40 is located between the first dielectric layer 22 and the second dielectric layer 32, and the film 40 is used to bond and support the first dielectric layer 22 and the second dielectric layer 32 so as to be in the first dielectric layer 22 and the second dielectric layer 32. A cavity 45 a is formed between a dielectric layer 22 and the second dielectric layer 32 .

The cavity 45a is at least located in the heat dissipation area I, and the cavity 45a is filled with air. Since the heat dissipation performance of the air is better than the heat dissipation performance of the first dielectric layer 22 and the second dielectric layer 32, the cavity 45a is arranged The heat dissipation performance can be improved, and the weight of the battery assembly 100 can also be reduced. In some embodiments, liquid, such as water, may also be injected into the cavity 45a located in the heat dissipation area I to further improve the heat dissipation efficiency.

In some embodiments, a cavity 45b is also provided between the first dielectric layer 22 and the second dielectric layer 32 in the bending region II, so as to facilitate the bending during the process of forming the battery assembly 100 Zone II bends.

In some embodiments, the number of cavities 45a and 45b in the same area is not limited to one, but may be multiple, and the plurality of cavities 45a and 45b are spaced by the film 40 .

The bus bar 242 and the first heat dissipation copper block 245 are located on the surface of the first dielectric layer 22 away from the second dielectric layer 32 , and the fuse 342 and the second heat dissipation copper block 345 are located on the surface of the first dielectric layer 22 away from the second dielectric layer 32 . The second dielectric layer 32 faces away from the surface of the first dielectric layer 22 , and the fuse 342 , the bus bar 242 , the first heat dissipation copper block 245 and the second heat dissipation copper block 345 are all located on the surface of the second dielectric layer 32 . Heat dissipation zone I.

The bus bars 242 correspond to the positions of the positive electrode tabs and the negative electrode tabs of the battery cells 70 respectively, so as to facilitate the electrical connection between the circuit board 10 and the battery cells 70 .

In some embodiments, the battery assembly 100 further includes a connecting piece 52, the connecting piece 52 is located on the surface of the bus bar 242 facing the battery cell 70, and is used for electrically connecting the bus bar 242 with the electrical Core 70.

The fuse 342 is located on the surface of the second dielectric layer 32 away from the bus bar 242 . In the same area, the position of the fuse 342 is set corresponding to the position of the bus bar 242 .

The surface of the second dielectric layer 32 located in the heat dissipation area I away from the fuse 342 is not provided with the second heat conducting sheet 36, which can prevent heat from being transferred to the fuse 342 and causing the fuse 342 to overheat.

The first heat-dissipating copper block 245 is connected to the surface of the battery core 70 to facilitate rapid heat transfer. In some embodiments, a colloid 57 may also be disposed between the first heat dissipation copper block 245 and the battery core 70 , and the colloid 57 is used to connect the first heat dissipation copper block 245 and the battery core 70 . The colloid 57 also has elasticity and can play a buffering role.

The second heat-dissipating copper block 345 is located on the surface of the second dielectric layer 32 away from the cell 70 , and the heat generated by the cell 70 passes through the first heat-dissipating copper block 245 and the cavity 45 in sequence. Finally, the heat is dissipated through the second heat dissipation copper block 345 ; the second heat dissipation module is also used for connecting with the surface of another adjacent cell 70 to dissipate the heat generated by the other cell 70 .

The first heat-dissipating copper block 245 and the first heat-conducting sheet 26 may be bonded by the first heat-conducting glue 25 . The second heat-dissipating copper block 345 and the second heat-conducting sheet 36 may be bonded by a second heat-conducting glue 35 .

In some embodiments, the battery assembly 100 further includes a first thermal conductive sheet 26 and a second thermal conductive sheet 36, the first thermal conductive sheet 26 is located on the surface of the first dielectric layer 22 facing the cavity 45a, so The second heat conducting sheet 36 is located on the surface of the second dielectric layer 32 facing the cavity 45a.

The thickness of the first thermally conductive sheet 26 and the second thermally conductive sheet 36 may be 25 μm-50 μm, so that the cavities 45a and 45b have a certain flexibility and facilitate the circuit board 10 during the manufacturing process. Bend.

In some embodiments, the battery assembly 100 further includes a monitoring element 55 , the monitoring element 55 and the fuse 342 are located on the same surface of the second dielectric layer 32 , and the monitoring element 55 is connected to the fuse 342 .

Please refer to FIGS. 15 and 16 , the present application further provides a battery module 200 , the battery assembly 100 includes at least two battery assemblies 100 , and two adjacent battery cells 70 are arranged at intervals by the circuit board 10 , The second heat dissipation copper block 345 of one of the battery assemblies 100 is connected to the surface of the cell 70 of the adjacent battery assembly 100 .

In some embodiments, the battery module 200 further includes a bracket 210 for fixing the plurality of battery assemblies 100 .

In the battery assembly 100 provided by the present application, by arranging the bus bars 242, the fuses 342 and other components on the same circuit board 10, the space required for additionally disposing the bus bars 242 and the fuses 342 can be avoided; the circuit board 10 surrounds the The battery core 70 can quickly dissipate the heat generated by the battery core 70; at the same time, a first heat dissipation module, a second heat dissipation module and a cavity 45a are arranged on the circuit board 10 to further improve the heat dissipation efficiency of the circuit board 10, so as to ensure the battery The working state of the assembly 100 .

The above embodiments are only used to illustrate the technical solutions of the present application rather than limitations. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced. Neither should depart from the spirit and scope of the technical solutions of the present application.

100: Battery Components

10: circuit board

242: Busbar

245: The first heat dissipation copper block

25: The first thermal paste

26: The first thermal conductive sheet

342: Fuse

345: Second heat dissipation copper block

35: The second thermal paste

36: Second thermal pad

45a, 45b: cavity

47: Protective layer

52: connecting piece

55: Monitoring components

57: Colloid

60: accommodating slot

70: battery

I: heat dissipation area

II: Bending zone

Claims (10)

A battery assembly, which is improved by comprising: a circuit board, comprising: a first dielectric layer; a second dielectric layer; a film, which is located between the first dielectric layer and the second dielectric layer and has a plurality of spaced spaces A cavity; a bus bar; a first heat dissipation copper block, located with the bus bar on the surface of the first dielectric layer away from the second dielectric layer; a fuse; and a second heat dissipation copper block, located with the fuse on the first dielectric layer The surface of the second dielectric layer facing away from the first dielectric layer; wherein, the circuit board includes a heat dissipation area and a bending area which are successively and spaced apart, and the heat dissipation area and the bending area are surrounded by an accommodating groove , the bus bar, the first heat dissipation copper block, the fuse and the second heat dissipation copper block are all located in the heat dissipation area, and the bus bar and the first heat dissipation copper block face the accommodating groove and a battery cell, the battery core is located in the accommodating slot and is electrically connected to the circuit board through the bus bar. The battery assembly according to claim 1, wherein the battery assembly further comprises a first heat-conducting sheet and a second heat-conducting sheet, the first heat-conducting sheet is located on a surface of the first dielectric layer facing the cavity, the The second heat conducting sheet is located on the surface of the second dielectric layer facing the cavity. The battery pack of claim 1, wherein the battery pack further comprises a monitoring element connected to the fuse. The battery assembly according to claim 1, wherein the battery assembly further comprises a connecting piece, and the bus bar and the connecting piece are correspondingly arranged in the same heat dissipation area. The battery assembly of claim 1, wherein the cavity is further filled with liquid. A battery module is improved by comprising the battery assembly according to any one of claims 1 to 4, the number of the battery assemblies is at least two, wherein the second heat dissipation copper block of one of the battery assemblies is connected to The surfaces of the cells of the adjacent battery assemblies are connected. A method for manufacturing a battery assembly, the improvement of which includes the following steps: providing a first substrate, the first substrate comprising a first copper layer, a first dielectric layer and a plurality of first thermally conductive adhesives, the first dielectric layer is located on the On the surface of the first copper layer, a plurality of the first thermally conductive adhesives respectively penetrate the first dielectric layer and are connected to the first copper layer; a second substrate is provided, and the second substrate includes a second copper layer , a second dielectric layer and at least one second thermally conductive adhesive, the second dielectric layer is located on the surface of the second copper layer, the second thermally conductive adhesive penetrates the second dielectric layer and is connected with the second copper layer connecting; providing a film, the film includes a plurality of through holes, the positions of the through holes correspond to the positions of the first thermally conductive adhesive; the first substrate and the second substrate are respectively pressed on the film The opposite sides are sealed and the through holes are sealed, so that the through holes form cavities, and heat dissipation areas and bending areas are formed at intervals in sequence; the first copper layer is etched to form the bus bar and the first heat dissipation copper block, and the etching is performed. A second copper layer is formed to form a fuse and a second heat dissipation copper block to form a circuit board; and the circuit board is bent in the bending area to form an accommodating groove, and a cell is placed in the container The battery core is electrically connected with the bus bar to form the battery assembly. The method for manufacturing a battery assembly as claimed in claim 7, wherein the step of forming the first substrate comprises: providing a single-sided copper clad laminate, including the first dielectric layer and the first copper layer on the surface of the first dielectric layer; removing part of the first dielectric layer and exposing the surface of the first copper layer , to form a slot; and filling the slot with a first thermally conductive adhesive. The method for manufacturing a battery assembly according to claim 8, wherein the first substrate further comprises a first thermally conductive sheet, and the step of forming the first substrate further comprises: attaching the first thermally conductive adhesive to the surface of the first thermally conductive adhesive. A thermally conductive sheet. The method for manufacturing a battery assembly according to claim 7, wherein "bending the circuit board in the bending area to form an accommodating groove, placing a battery cell in the accommodating groove, so that the The step of electrically connecting the battery core and the bus bar to form the battery assembly” includes: connecting a connecting piece on the surface of the bus bar; connecting the first heat dissipation copper block and the second heat dissipation copper block the surface bonding colloid; bend both ends of the circuit board toward the side where the connecting piece is located to form the accommodating groove; and accommodate the battery in the accommodating groove, so that the The battery cell is connected with the circuit board through the connecting sheet, thereby forming the battery assembly.

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