WO2022261971A1

WO2022261971A1 - Battery assembly, battery module, and method for manufacturing battery assembly

Info

Publication number: WO2022261971A1
Application number: PCT/CN2021/101045
Authority: WO
Inventors: 吴金成; 钟浩文; 李彪; 黄美华; 侯宁
Original assignee: 鹏鼎控股(深圳)股份有限公司; 庆鼎精密电子（淮安）有限公司
Priority date: 2021-06-18
Filing date: 2021-06-18
Publication date: 2022-12-22
Also published as: TWI768981B; TW202301733A; CN116569386A

Abstract

A battery assembly (100), comprising a circuit board (10) and a cell (70). The circuit board (10) comprises a first dielectric layer (22), a second dielectric layer (32), a film (40), a busbar (242), a first heat dissipation copper block (245), a fuse (342), and a second heat dissipation copper block (345). The film (40) is located between the first dielectric layer (22) and the second dielectric layer (32) and has a plurality of spaced cavities (45a). The first heat dissipation copper block (245) and the busbar (242) are located on the surface of the first dielectric layer (22). The second heat dissipation copper block (345) and the fuse (342) are located on the surface of the second dielectric layer (32). The circuit board (10) comprises successive heat dissipation regions (I) and bending regions (II). The heat dissipation regions (I) and the bending regions (II) define an accommodation slot (60). The busbar (242), the first heat dissipation copper block (245), the fuse (342), and the second heat dissipation copper block (345) are all located in the heat dissipation regions (I). The busbar (242) and the first heat dissipation copper block (245) are arranged facing the accommodation slot (60). The cell (70) is located in the accommodation slot (60) and is electrically connected to the circuit board (10) by means of the busbar (242). The present application further provides a battery module (200) and a method for manufacturing the battery assembly (100).

Description

Battery assembly, battery module and battery assembly manufacturing method

technical field

The present application relates to the field of battery heat dissipation, and in particular to a battery component, a battery module and a method for manufacturing the battery component.

Background technique

Batteries are an important source of power for some devices, such as electric vehicles. In order to meet the high power requirements of the device, it is usually necessary to assemble multiple cells to form a large battery module. In order to ensure the safety of the high-power battery module, the battery module needs to have over-current protection and thermal management functions.

In an existing battery module, the current of multiple cells is usually combined through a bus bar, a fuse is installed to realize overcurrent protection of the battery module, and a cooling pipe is additionally installed to dissipate heat from the battery module. Bus bars, fuses, and cooling pipes are all independent components, requiring additional space for accommodation. In addition, the existing cooling pipes are installed at both ends of the battery cells, which cannot meet the heat dissipation requirements of the battery module when it is used at high power. .

Contents of the invention

In view of this, it is necessary to provide a battery assembly with small layout space and fast heat dissipation, so as to solve the above technical problems.

The present application also provides a battery module.

The present application also provides a manufacturing method of the battery assembly.

A battery assembly, including a circuit board and an electric core. The circuit board includes a first dielectric layer, a second dielectric layer, a film, a bus bar, a first heat dissipation copper block, a fuse and a second heat dissipation copper block. The film is located on the first There are multiple spaced cavities between the dielectric layer and the second dielectric layer; the first heat dissipation copper block and the bus bar are located on the surface of the first dielectric layer away from the second dielectric layer; the second heat dissipation The copper block and the fuse are located on the surface of the second dielectric layer away from the first dielectric layer; wherein, the circuit board includes consecutive and spaced heat dissipation areas and bending areas, and the heat dissipation area and the The bending area is surrounded by an accommodation groove, the bus bar, the first heat dissipation copper block, the fuse and the second heat dissipation copper block are all located in the heat dissipation area, the bus bar and the first heat dissipation copper block are all located in the heat dissipation area. A heat dissipation copper block is arranged towards the accommodating groove; the electric core is located in the accommodating groove and is electrically connected with the circuit board through the bus bar.

In some embodiments, the battery assembly further includes a first heat conduction sheet and a second heat conduction sheet, the first heat conduction sheet is located on the surface of the first dielectric layer facing the cavity, and the second heat conduction sheet is located on the surface of the first dielectric layer facing the cavity. The second dielectric layer faces the surface of the cavity.

In some embodiments, the battery assembly further includes a monitoring element connected to the fuse.

In some implementations, the bus bar and the connecting piece are disposed correspondingly in the same heat dissipation area.

In some embodiments, the cavity is also filled with liquid.

A battery module, including the battery assembly, the number of the battery assembly is at least two, wherein the second heat dissipation copper block of one battery assembly is connected to the battery core of the adjacent battery assembly surface connection.

A method for manufacturing a battery assembly, comprising the following steps: providing a first substrate, the first substrate includes a first copper layer, a first dielectric layer, and a plurality of first thermally conductive adhesives, the first dielectric layer is located on the first On the surface of a copper layer, a plurality of first thermal conductive adhesives respectively penetrate through the first dielectric layer and connect with the first copper layer; a second substrate is provided, and the second substrate includes a second copper layer, a second A dielectric layer and at least one second thermal conductive glue, the second dielectric layer is located on the surface of the second copper layer, the second thermal conductive glue penetrates the second dielectric layer and connects with the second copper layer; providing A film, the film includes a plurality of through holes, the positions of the through holes correspond to the positions of the first heat-conducting adhesive; Side and seal the through hole, so that the through hole forms a cavity, forming heat dissipation areas and bending areas arranged at intervals in sequence; etching the first copper layer to form a bus bar and the first heat dissipation copper block, etching the second copper layer layer to form a fuse and a second heat dissipation copper block to form a circuit board; the circuit board is bent in the bending area to form a receiving groove, and a cell is placed in the receiving groove, The battery cells are electrically connected to the busbars to form the battery assembly.

In some embodiments, the step of forming the first substrate includes: providing a single-sided copper clad board, including the first dielectric layer and the first copper layer on the surface of the first dielectric layer; removing the A part of the first dielectric layer exposes the surface of the first copper layer to form a slot; filling the slot with first thermal conductive adhesive.

In some embodiments, the first substrate further includes a first thermally conductive sheet, and the step of forming the first substrate further includes affixing the first thermally conductive sheet on the surface of the first thermally conductive adhesive.

In some embodiments, "bending the circuit board at the bending area forms a receiving groove, and places an electric core in the receiving groove, and the electric core and the bus bar Electrical connection, so as to form the step of "battery assembly" includes: connecting a connecting piece on the surface of the bus bar; bonding colloid on the surface of the first heat dissipation copper block and the second heat dissipation copper block; The two ends of the circuit board are bent toward the side where the connecting piece is located to form the accommodating groove; connected with the circuit board to form the battery assembly.

The battery assembly provided by this application can avoid the space required for additional bus bars and fuses by arranging bus bars, fuses and other components on the same circuit board, and the arrangement space is small; the circuit board surrounds the battery cells on multiple sides , can quickly dissipate the heat generated by the battery cell; at the same time, the first heat dissipation module, the second heat dissipation module and the cavity are arranged on the circuit board to further improve the heat dissipation efficiency of the circuit board to ensure the working state of the battery assembly.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a single-sided copper-clad laminate including a first dielectric layer and a first copper layer provided by an embodiment of the present application.

FIG. 2 is a schematic cross-sectional view of removing part of the first dielectric layer shown in FIG. 1 and exposing the surface of the first copper layer to form a slot.

FIG. 3 is a schematic cross-sectional view of filling the first thermal conductive glue in the slot shown in FIG. 2 .

FIG. 4 is a schematic cross-sectional view of attaching a first heat-conducting sheet on the surface of the first heat-conducting adhesive shown in FIG. 3 .

FIG. 5 is a schematic cross-sectional view of a second substrate provided by an embodiment of the present application.

FIG. 6 is a schematic cross-sectional view of the film provided by the embodiment of the present application.

FIG. 7 is a schematic cross-sectional view of placing the first substrate shown in FIG. 4 , the film shown in FIG. 6 , and the second substrate shown in FIG. 5 in sequence.

FIG. 8 is a schematic cross-sectional view of laminating the first substrate film and the second substrate shown in FIG. 7 .

FIG. 9 is a schematic cross-sectional view of a circuit board obtained after etching the first copper layer and the second copper layer shown in FIG. 8 .

FIG. 10 is a schematic cross-sectional view of forming a protective layer on the surface of the circuit board shown in FIG. 9 .

FIG. 11 is a schematic cross-sectional view of connecting a connecting piece on the surface of the bus bar shown in FIG. 10 .

Fig. 12 is a schematic cross-sectional view of connecting a monitoring element to the fuse shown in Fig. 11 .

FIG. 13 is a schematic cross-sectional view of the adhesive glue on the surfaces of the first heat dissipation copper block and the second heat dissipation copper block shown in FIG. 12 .

FIG. 14 is a schematic cross-sectional view of a battery assembly obtained by bending the circuit board shown in FIG. 13 to form an accommodating groove, and connecting a battery cell in the accommodating groove.

FIG. 15 is a schematic cross-sectional view of a battery module obtained after two battery assemblies shown in FIG. 14 are connected to each other.

FIG. 16 is a schematic cross-sectional view of a battery module including a bracket provided by an embodiment of the present application.

Description of main component symbols

电池组件 battery pack	100100
电路板 circuit board	1010
第一基板 first substrate	2020
单面覆铜板Single-sided copper clad laminate	21twenty one
第一介质层first dielectric layer	22twenty two
开槽slotting	23twenty three

第一铜层first copper layer	24twenty four
汇流排 busbar	242242
第一散热铜块The first heat sink copper block	245245
第一导热胶No.1 Thermal Conductive Adhesive	2525
第一导热片first thermal pad	2626
第二基板 second substrate	3030
第二介质层second dielectric layer	3232
第二铜层 second copper layer	3434
保险丝 fuse	342342
第二散热铜块Second cooling copper block	345345
第二导热胶Second Thermal Adhesive	3535
第二导热片Second thermal pad	3636
胶片 film	4040
通孔through hole	4242
空腔 cavity	45a、45b45a, 45b
保护层The protective layer	4747
连接片Connecting piece	5252
监控元件 monitoring element	5555
胶体 colloid	5757
容置槽 storage tank	6060
电芯 Batteries	7070
电池模组 battery module	200200
支架 bracket	210210
散热区cooling zone	II
弯折区bending area	IIII

The following specific embodiments will further illustrate the present application in conjunction with the above-mentioned drawings.

detailed description

In order to more clearly understand the above objects, features and advantages of the present application, the present application will be described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. A lot of specific details are set forth in the following description to facilitate a full understanding of the application, and the described implementations are only a part of the implementations of the application, but not all of the implementations. Based on the implementations in this application, all other implementations obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application. As used herein, the term "and/or" includes all and any combinations of one or more of the associated listed items.

In each embodiment of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the specification and claims of the present application is not limited to physical or mechanical connection, no matter it is direct or indirect. of. "Up", "Down", "Above", "Bottom", "Left", "Right" and so on are only used to indicate the relative positional relationship. When the absolute position of the described object changes, the relative positional relationship is also corresponding Change.

Please refer to FIG. 1 to FIG. 14 , the embodiment of the present application provides a method for manufacturing a battery assembly 100, including the following steps:

Step S1: Please refer to FIG. 1 to FIG. 4, providing a first substrate 20, the first substrate 20 includes a first copper layer 24, a first dielectric layer 22 and a plurality of first thermally conductive adhesives 25, the first dielectric layer 22 is located on the surface of the first copper layer 24 , and a plurality of the first thermal conductive adhesives 25 respectively penetrate through the first dielectric layer 22 and connect with the first copper layer 24 .

The material of the first medium layer 22 can be selected from polyimide (polyimide, PI), liquid crystal polymer (liquid crystal polymer, LCP) and modified polyimide (modified polyimide, MPI) and other flexible materials. One of the permanent materials to facilitate bending in subsequent processes. In this embodiment, the material of the first dielectric layer 22 is polyimide.

In some embodiments, the first substrate 20 further includes a plurality of first heat conduction sheets 26 , and the first heat conduction sheets 26 are disposed on the surface of the first heat conduction adhesive 25 away from the first copper layer 24 . A plurality of the first thermally conductive adhesives 25 are arranged at intervals, and a plurality of the first thermally conductive sheets 26 are also arranged at intervals. The first thermally conductive adhesives 25 and the first thermally conductive sheets 26 are arranged at intervals to facilitate subsequent Bending during the manufacturing process; the setting of the first heat conducting sheet 26 facilitates rapid heat transfer.

Wherein, the material of the first heat conducting sheet 26 is a material with good thermal conductivity, including but not limited to metal, carbon material, etc. In this embodiment, the material of the first heat conducting sheet 26 is copper.

In some embodiments, the first substrate 20 can be formed by the following steps:

Step S101 : Referring to FIG. 1 , a single-sided copper-clad board 21 is provided, including the first dielectric layer 22 and the first copper layer 24 on the surface of the first dielectric layer 22 .

Step S102 : referring to FIG. 2 , removing part of the first dielectric layer 22 and exposing the surface of the first copper layer 24 to form a slot 23 .

The slot 23 penetrates through the first dielectric layer 22 along the stacking direction of the first copper layer 24 and the first dielectric layer 22 . The number of the slots 23 is multiple. The position of the slot 23 is related to the positions of the

cavities

45a, 45b to be formed later.

Step S103 : Please refer to FIG. 3 , filling the slot 23 with the first thermally conductive glue 25 .

The first heat-conducting adhesive 25 is used for rapid heat conduction and also plays a role of bonding.

Step S104 : Please refer to FIG. 4 , stick the first heat conduction sheet 26 on the surface of the first heat conduction adhesive 25 .

Step S2: Please refer to FIG. 5, provide a second substrate 30, the second substrate 30 includes a second copper layer 34, a second dielectric layer 32 and at least one second thermal conductive glue 35, the second dielectric layer 32 is located on the The surface of the second copper layer 34 , the second thermally conductive adhesive 35 penetrates through the second dielectric layer 32 and connects with the second copper layer 34 .

The material of the second dielectric layer 32 can be one of the flexible materials mentioned above.

The thicknesses of the first dielectric layer 22 and the second dielectric layer 32 can be 12.5 μm-25 μm respectively, so as to facilitate bending in the subsequent manufacturing process.

In some embodiments, the second substrate 30 further includes at least one second heat conduction sheet 36, the second heat conduction sheet 36 is located on the surface of the second heat conduction adhesive 35 away from the second copper layer 34, wherein, The second heat conducting sheet 36 is disposed corresponding to at least one of the first heat conducting sheets 26 . The material of the second heat conducting sheet 36 includes but not limited to metal, carbon material and the like.

The steps of forming the second substrate 30 may be substantially the same as the steps of forming the first substrate 20 , and other methods of forming the second substrate 30 may also be used.

Step S3 : Please refer to FIG. 6 , provide a film 40 , the film 40 includes a plurality of through holes 42 , and the positions of the through holes 42 correspond to the positions of the first thermally conductive glue 25 .

Step S4: Please refer to FIG. 7 and FIG. 8 , respectively pressing the first substrate 20 and the second substrate 30 on opposite sides of the film 40 and sealing the through hole 42 so that the through hole 42 is sealed. The hole 42 forms a cavity 45a, forming a heat dissipation area I and a bending area II arranged at intervals in sequence.

Wherein, along the stacking direction of the first substrate 20, the film 40 and the second substrate 30, the area corresponding to the first thermal conductive glue 25 and/or the second thermal conductive glue 35 is the In the heat dissipation area I, the bending area II is located between two adjacent heat dissipation areas I.

In some embodiments, both the first copper layer 24 and the second copper layer 34 are located on the surface away from the film 40, and the first heat conducting sheet 26 and the second heat conducting sheet 36 are located on the surface In the through hole 42 , the first heat conduction sheet 26 and the second heat conduction sheet 36 located in the through hole 42 are used for rapid heat transfer.

In some embodiments, the number of the through holes 42 is greater than the number of the first heat conducting sheet 26, thereby forming a plurality of

cavities

45a, 45b, so that the bending region II also has the cavities 45b. The

cavities

45a, 45b are filled with air. Since the heat dissipation performance of the air is better than that of the first dielectric layer 22 and the second dielectric layer 32, the setting of the

cavities

45a, 45b can improve the heat dissipation performance; on the other hand, The setting of the partial cavity 45b facilitates bending in the subsequent manufacturing process.

In some embodiments, liquid, such as water, may also be injected into the cavity 45a to further improve heat dissipation efficiency.

In some embodiments, the number of

cavities

45a, 45b located in the same heat dissipation zone I or the same bending zone II is not limited to one, and there may be

multiple cavities

45a, 45b passing through the film 40 interval. The distance between two

adjacent cavities

45a, 45b is greater than or equal to 1 mm, and a certain amount of glue overflow space is reserved because there will be glue overflow in the subsequent lamination process.

The thickness of the film 40 may be 100 μm-300 μm, so as to ensure that the first dielectric layer 22 and the second dielectric layer 32 will not be connected to each other due to too close distance during the subsequent bending process.

Step S5: Please refer to FIG. 9, etch the first copper layer 24 to form the bus bar 242 and the first heat dissipation copper block 245, etch the second copper layer 34 to form the fuse 342 and the second heat dissipation copper block 345, thereby forming the circuit board 10 .

Both the first copper layer 24 and the second copper layer 34 located in the bending area II are removed to facilitate the bending of the bending area II in the subsequent manufacturing process.

The first copper layer 24 and the second copper layer 34 located in the heat dissipation area I are partially etched. Wherein, the bus bar 242 is used for electrical connection with the battery cell 70 (please refer to FIG. 14); The current is used to protect the battery cell 70; the first heat dissipation copper block 245 and the second heat dissipation copper block 345 are used to contact the battery cell 70 to quickly transfer the heat generated by the battery cell 70.

The thickness of the first copper layer 24 is greater than or equal to 35 μm, so as to ensure the range of the current passing after converging.

In some embodiments, please refer to FIG. 10 , the manufacturing method further includes the step of forming a protective layer 47, the protective layer 47 is located at the periphery of the bus bar 242 and the fuse 342, for protecting the bus bar 242 and the fuse 342.

Step S6: Please refer to FIG. 11 to FIG. 14 , bend the circuit board 10 in the bending zone II to form an accommodating groove 60 , place a cell 70 in the accommodating groove 60 , The battery cell 70 is electrically connected to the bus bar 242 to form the battery assembly 100 .

In some embodiments, step S6 may be formed by the following steps:

Step S601 : Please refer to FIG. 11 , connect a connecting piece 52 on the surface of the bus bar 242 .

The material of the connecting sheet 52 needs to be conductive, including but not limited to nickel sheet.

Step S602 : Please refer to FIG. 12 , connect the monitoring element 55 to the fuse 342 .

The monitoring element 55 is used to monitor the working condition of the battery cell 70 and transmit it to an electrically connected battery management system (Battery Management System, BMS) (not shown), so that the battery management system can control the battery according to the working condition of the battery. working status.

Step S603 : Please refer to FIG. 13 , glue glue 57 on the surfaces of the first heat dissipation copper block 245 and the second heat dissipation copper block 345 .

The colloid 57 is any material capable of bonding, such as cured glue.

Step S604 : Referring to FIG. 14 , bend both ends of the circuit board 10 toward the side where the connecting piece 52 is located to form the accommodating groove 60 .

Bending along the area where the bending zone II is located, the connecting piece 52 and the first heat dissipation copper block 245 are facing the accommodating groove 60, and the fuse 342 and the second heat dissipation copper block 345 are located away from One side of the accommodating groove 60 .

Step S605: Please refer to FIG. 14 again, place the electric core 70 in the accommodating groove 60, and connect the electric core 70 to the circuit board 10 through the connecting piece 52, thereby forming the Battery pack 100.

The first heat dissipation copper block 245 facing into the accommodating groove 60 is connected to the battery cell 70 through the glue 57 , so as to fix the battery cell 70 in the accommodating groove 60 . The second heat dissipation copper block 345 facing away from the accommodating groove 60 is used to connect with another battery cell 70 so as to transfer heat from the other battery cell 70 . Wherein, the setting of the first heat dissipation copper block 245 and the second heat dissipation copper block 345 is beneficial to increase the contact between the battery cell 70 and the first heat dissipation copper block 245 and the second heat dissipation copper block 345 area to improve heat dissipation performance.

Please refer to FIG. 14 , the present application also provides a battery assembly 100, including at least one circuit board 10 and at least one battery cell 70, the circuit board 10 has an accommodating groove 60, and the battery cell 70 is housed in the It is accommodated in the groove 60 and electrically connected with the circuit board 10 . Wherein, the battery cell 70 includes a positive pole tab (not shown in the figure) and a negative pole tab (not shown in the figure), and the positive pole tab and the negative pole tab are used for electrical connection with the circuit board 10 .

The circuit board 10 includes a heat dissipation area I and a bending area II which are successively arranged at intervals, and the heat dissipation area I and the bending area II surround and form the accommodating groove 60, wherein the bending area II corresponds to the corner area of the battery cell 70 .

The circuit board 10 includes a first dielectric layer 22 , a second dielectric layer 32 , a film 40 , a fuse 342 , a bus bar 242 , a first heat dissipation copper block 245 and a second heat dissipation copper block 345 .

The material of the first dielectric layer 22 and the second dielectric layer 32 can be selected from one of flexible materials such as polyimide, liquid crystal polymer, and modified polyimide.

The film 40 is located between the first medium layer 22 and the second medium layer 32, and the film 40 is used to bond and support the first medium layer 22 and the second medium layer 32, so as to A cavity 45 a is formed between the first dielectric layer 22 and the second dielectric layer 32 .

The cavity 45a is at least located in the heat dissipation area I, and the cavity 45a is filled with air. Since the heat dissipation performance of the air is better than that of the first dielectric layer 22 and the second dielectric layer 32, the setting of the cavity 45a The heat dissipation performance can be improved, and the weight of the battery assembly 100 can be reduced at the same time. In some implementations, liquid, such as water, can also be injected into the cavity 45a located in the heat dissipation area I, so as to further improve heat dissipation efficiency.

In some embodiments, a cavity 45b is also provided between the first dielectric layer 22 and the second dielectric layer 32 in the bending region II, so as to facilitate the bending during the process of forming the battery assembly 100 Zone II bends.

In some implementations, the number of

cavities

45a, 45b in the same area is not limited to one, and there may be

multiple cavities

45a, 45b separated by the film 40 .

The bus bar 242 and the first heat dissipation copper block 245 are located on the surface of the first dielectric layer 22 away from the second dielectric layer 32, and the fuse 342 and the second heat dissipation copper block 345 are located on the first dielectric layer 22. The second dielectric layer 32 is away from the surface of the first dielectric layer 22, the fuse 342, the bus bar 242, the first heat dissipation copper block 245 and the second heat dissipation copper block 345 are all located in the heat dissipation area I .

The bus bars 242 respectively correspond to the positions of the positive tab and the negative tab of the battery cell 70 , so as to facilitate the electrical connection between the circuit board 10 and the battery cell 70 .

In some embodiments, the battery assembly 100 further includes a connection piece 52, the connection piece 52 is located on the surface of the bus bar 242 facing the battery cell 70, and is used to electrically connect the bus bar 242 to the battery. Core 70.

The fuse 342 is located on the surface of the second dielectric layer 32 away from the bus bar 242 , and in the same area, the position of the fuse 342 is set corresponding to the position of the bus bar 242 .

The surface of the second dielectric layer 32 located in the heat dissipation area I away from the fuse 342 is not provided with the second heat conducting sheet 36, which can prevent the heat from being transferred to the fuse 342 and cause the fuse 342 to overheat.

The first heat dissipation copper block 245 is connected to the surface of the electric core 70 so as to transfer heat quickly. In some embodiments, a colloid 57 may also be provided between the first heat dissipation copper block 245 and the battery cell 70, and the colloid 57 is used to connect the first heat dissipation copper block 245 and the battery cell 70, The colloid 57 also has elasticity and can play a buffering role.

The second heat dissipation copper block 345 is located on the surface of the second dielectric layer 32 away from the electric core 70 , and the heat generated by the electric core 70 passes through the first heat dissipation copper block 245 and the cavity 45 in turn. Finally, it is dissipated through the second heat dissipation copper block 345 ; the second heat dissipation module is also used to connect with the surface of another adjacent battery cell 70 , and is used to dissipate the heat generated by the other battery cell 70 .

The first heat dissipation copper block 245 and the first heat conduction sheet 26 may be bonded by a first heat conduction glue 25 . The second heat dissipation copper block 345 and the second heat conduction sheet 36 can be bonded by a second heat conduction glue 35 .

In some embodiments, the battery assembly 100 further includes a first heat conduction sheet 26 and a second heat conduction sheet 36, the first heat conduction sheet 26 is located on the surface of the first dielectric layer 22 facing the cavity 45a, so The second heat conducting sheet 36 is located on the surface of the second dielectric layer 32 facing the cavity 45a.

The thickness of the first heat conduction sheet 26 and the second heat conduction sheet 36 can be 25 μm-50 μm, so that the

cavities

45 a, 45 b have certain flexibility, and facilitate the process of the circuit board 10 in the manufacturing process. bent.

In some embodiments, the battery assembly 100 further includes a monitoring element 55, the monitoring element 55 and the fuse 342 are located on the same surface of the second dielectric layer 32, and the monitoring element 55 is connected to the fuse 342 .

Please refer to FIG. 15 and FIG. 16 , the present application also provides a battery module 200 , the battery assembly 100 includes at least two battery assemblies 100 , and two adjacent battery cells 70 are arranged at intervals through the circuit board 10 , wherein the second heat dissipation copper block 345 of one battery assembly 100 is connected to the surface of the battery cell 70 of the adjacent battery assembly 100 .

In some implementations, the battery module 200 further includes a bracket 210 for fixing a plurality of battery assemblies 100 .

The battery assembly 100 provided by the present application can avoid the additional space required for the bus bar 242 and the fuse 342 by arranging the components such as the bus bar 242 and the fuse 342 on the same circuit board 10; The battery cell 70 can quickly dissipate the heat generated by the battery cell 70; at the same time, a first heat dissipation module, a second heat dissipation module, and a cavity 45a are arranged on the circuit board 10 to further improve the heat dissipation efficiency of the circuit board 10, so as to ensure that the battery pack 100 working status.

The above embodiments are only used to illustrate the technical solutions of the present application without limitation. Although the present application has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced All should not deviate from the spirit and scope of the technical solution of the present application.

Claims

A battery pack, characterized in that it comprises:

circuit board, including:

first medium layer;

second medium layer;

a film, located between the first medium layer and the second medium layer and having a plurality of spaced cavities;

Bus bar;

a first heat dissipation copper block, and the bus bar are located on the surface of the first dielectric layer away from the second dielectric layer;

fuses; and

The second heat dissipation copper block, and the fuse are located on the surface of the second dielectric layer away from the first dielectric layer;

Wherein, the circuit board includes a heat dissipation area and a bending area arranged successively and at intervals in sequence, the heat dissipation area and the bending area are surrounded to form a receiving groove, the bus bar, the first heat dissipation copper block , the fuse and the second heat dissipation copper block are located in the heat dissipation area, and the bus bar and the first heat dissipation copper block are arranged towards the accommodating groove; and

An electric core, the electric core is located in the accommodating groove and is electrically connected to the circuit board through the bus bar.
The battery assembly according to claim 1, wherein the battery assembly further comprises a first heat conduction sheet and a second heat conduction sheet, the first heat conduction sheet is located on the surface of the first dielectric layer facing the cavity , the second heat conducting sheet is located on the surface of the second dielectric layer facing the cavity.
The battery pack according to claim 1, further comprising a monitoring element connected to the fuse.
The battery assembly according to claim 1, wherein the bus bar and the connecting piece are arranged correspondingly in the same heat dissipation area.
The battery assembly according to claim 1, wherein the cavity is also filled with liquid.
A battery module, characterized in that it includes the battery assembly according to any one of claims 1-4, the number of the battery assemblies is at least two, and the second heat dissipation copper block of one of the battery assemblies It is connected with the surface of the cell of the adjacent battery assembly.
A method for manufacturing a battery pack, comprising the following steps:

A first substrate is provided, the first substrate includes a first copper layer, a first dielectric layer, and a plurality of first thermally conductive adhesives, the first dielectric layer is located on the surface of the first copper layer, and the plurality of first thermally conductive glue respectively penetrates through the first dielectric layer and connects with the first copper layer;

A second substrate is provided, the second substrate includes a second copper layer, a second dielectric layer, and at least one second thermally conductive adhesive, the second dielectric layer is located on the surface of the second copper layer, and the second thermally conductive adhesive penetrating through the second dielectric layer and connected to the second copper layer;

A film is provided, the film includes a plurality of through holes, the positions of the through holes correspond to the positions of the first thermal conductive adhesive;

Pressing the first substrate and the second substrate to the opposite sides of the film and sealing the through hole, so that the through hole forms a cavity, forming heat dissipation areas arranged at intervals in sequence and bending Area;

Etching the first copper layer to form a bus bar and a first heat dissipation copper block, etching the second copper layer to form a fuse and a second heat dissipation copper block, thereby forming a circuit board; and

Bending the circuit board at the bending area to form a receiving groove, placing an electric core in the receiving groove, the electric core is electrically connected to the bus bar, thereby forming the battery pack.
The method for manufacturing a battery assembly according to claim 7, wherein the step of forming the first substrate comprises:

A single-sided copper-clad board is provided, including the first dielectric layer and the first copper layer on the surface of the first dielectric layer;

removing a portion of the first dielectric layer and exposing a surface of the first copper layer to form a slot; and

Fill the first thermal conductive glue in the slot.
The method for manufacturing a battery assembly according to claim 8, wherein the first substrate further comprises a first heat conducting sheet, and the step of forming the first substrate further comprises:

Attaching the first heat conduction sheet on the surface of the first heat conduction adhesive.
The manufacturing method of the battery assembly according to claim 7, characterized in that, "bending the circuit board in the bending area to form an accommodating groove, and placing an electric core in the accommodating groove In the present invention, the battery cell is electrically connected to the bus bar, so as to form the battery assembly" step includes:

connecting a connecting piece on the surface of the bus bar;

adhering colloid on the surface of the first heat dissipation copper block and the second heat dissipation copper block;

bending both ends of the circuit board toward the side where the connecting piece is located to form the receiving groove; and

The electric core is accommodated in the accommodating groove, and the electric core is connected to the circuit board through the connecting piece, thereby forming the battery assembly.