CN215872437U

CN215872437U - Heat dissipation module and electrical apparatus

Info

Publication number: CN215872437U
Application number: CN202121782377.9U
Authority: CN
Inventors: 李璇; 周杰
Original assignee: Sungrow Power Supply Co Ltd
Current assignee: Sungrow Power Supply Co Ltd
Priority date: 2021-08-02
Filing date: 2021-08-02
Publication date: 2022-02-18
Anticipated expiration: 2031-08-02

Abstract

The utility model discloses a heat dissipation module and an electrical device, wherein the heat dissipation module comprises a water cooling plate and a refrigeration piece, the refrigeration piece is used for transferring heat of a heating module to the water cooling plate, and the refrigeration piece is in insulated contact with the heating module. When the heat dissipation module is needed to dissipate heat of the heating module, the heating module is placed on the heat absorption surface of the refrigerating sheet, heat of the heating module is transmitted to the water cooling plate through the refrigerating sheet, and the heat is taken out through liquid in the water cooling plate. In the heat dissipation module that this application provided, through set up the refrigeration piece on the water-cooling board, and then in time the effluvium of the heat of the module that will generate heat, and then improved heat dissipation module's radiating efficiency.

Description

Heat dissipation module and electrical apparatus

Technical Field

The utility model relates to the technical field of heat dissipation of heating modules, in particular to a heat dissipation module. The utility model also relates to an electrical device comprising the heat dissipation module.

Background

In order to prolong the service life and the use safety of the electric appliance device, a heating module of the electric appliance device generally radiates heat through a heat radiation module, such as an electric vehicle motor controller, wherein the heat flux density of an inverter module is relatively high, the traditional heat radiation module is a water cooling plate radiating in a liquid cooling mode, the traditional water cooling plate is a box body integrated die-casting molding process, or the water cooling plate is manufactured by independently adopting a section bar process, and the distances between the tooth sheets and the teeth of the water cooling plate are thinner and thinner, so that the limit of a high-density tooth sheet manufacturing process is almost reached.

However, with the improvement of the customer requirements, especially with the continuous development of the electronic industry technology, the heating power of the power device is continuously increased, so that the heat flux density of the product is also increased, and even if the high-density tooth sheet water-cooling plate cannot meet the heat dissipation requirement, the heat dissipation efficiency of the heat dissipation module is low.

Therefore, how to improve the heat dissipation efficiency of the heat dissipation module is a technical problem to be solved urgently by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a heat dissipation module, which has improved heat dissipation efficiency. Another object of the present invention is to provide an electrical apparatus including the heat dissipation module.

To achieve the above object, the present invention provides a heat dissipation module, including:

a water-cooling plate;

and the refrigerating piece is used for transferring the heat of the heating module to the water cooling plate, and the refrigerating piece is in insulated contact with the heating module.

Preferably, the refrigerator further comprises an insulating piece which is arranged on the heat absorption surface of the refrigeration sheet and used for placing the heating module.

Preferably, the insulator is a ceramic spacer.

Preferably, the water-cooling plate is provided with a containing groove for containing the refrigerating sheet.

Preferably, the refrigerator further comprises an insulating piece arranged on the heat absorption surface of the refrigeration piece and used for placing the heating module, the insulating piece is arranged in the accommodating groove, and the outer surface of the insulating piece is flush with the notch of the accommodating groove.

Preferably, the refrigeration piece is used for corresponding to the heating modules one by one, or one refrigeration piece is correspondingly provided with at least two heating modules, or the refrigeration piece is paved on the surface of the water cooling plate, and the edge of the refrigeration piece extends to the edge of the heat absorption surface of the water cooling plate.

Preferably, the water-cooling plate comprises a water-cooling plate substrate and a water-cooling plate sealing plate, a water-cooling cavity is formed between the water-cooling plate substrate and the water-cooling plate sealing plate in a sealing mode, and the refrigerating sheet is installed on the water-cooling plate substrate.

Preferably, the refrigeration piece is a thermoelectric semiconductor refrigeration assembly, the surface of the refrigeration piece absorbing heat faces the heating module, and the surface of the refrigeration piece dissipating heat faces the water cooling plate.

Preferably, one or at least two of the refrigeration pieces are arranged on the same water cooling plate.

Preferably, when one refrigerating sheet is arranged on the same water-cooling plate, the edge of the refrigerating sheet is flush with the edge of the heat absorbing surface of the water-cooling plate.

Preferably, the refrigeration piece is arranged on the same side face of the water-cooling plate or two side faces of the water-cooling plate, which are arranged back to back, are provided with the refrigeration piece.

An electrical apparatus, including generating heat the module and being used for to the radiating heat module of generating heat module, the said heat module is the said heat module of any one.

Preferably, the electrical device is a motor controller.

In the technical scheme, the heat dissipation module comprises the water cooling plate and the refrigerating piece, wherein the refrigerating piece is used for transferring heat of the heating module to the water cooling plate, and the refrigerating piece is in insulated contact with the heating module. When the heat dissipation module is needed to dissipate heat of the heating module, the heating module is placed on the heat absorption surface of the refrigerating sheet, heat of the heating module is transmitted to the water cooling plate through the refrigerating sheet, and the heat is taken out through liquid in the water cooling plate.

According to the heat dissipation module, the refrigeration piece is arranged on the water cooling plate, so that heat of the heating module is dissipated timely, and the heat dissipation efficiency of the heat dissipation module is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is an external view of an electrical apparatus according to an embodiment of the present invention;

FIG. 2 is an exploded view of a first electrical device according to an embodiment of the present invention;

FIG. 3 is an exploded view of a second electrical device according to an embodiment of the present invention;

FIG. 4 is an exploded view of a third electrical device according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a water cooling plate substrate according to an embodiment of the present invention.

Wherein in FIGS. 1-5: 10-heating module, 20-water cooling plate, 21-water cooling plate substrate, 22-water cooling plate sealing plate, 30-insulating part and 40-refrigerating piece.

Detailed Description

The core of the utility model is to provide a heat radiation module, which improves the heat radiation efficiency. The other core of the utility model is to provide an electrical device comprising the heat dissipation module.

In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings and embodiments.

Please refer to fig. 1 to 5.

In one embodiment, the heat dissipation module according to an embodiment of the present invention includes a water cooling plate 20 and a cooling fin 40, wherein the cooling fin 40 is used for transferring heat of the heat generation module 10 to the water cooling plate 20. The cooling plate 40 is in insulated contact with the heat generating module 10, wherein the heat generating module 10 is a device to be cooled. Specifically, the surface of the refrigeration piece 40, which is attached to the heating module 10, is provided with an insulating layer, and the insulating layer can also wrap the surface of the refrigeration piece 40. Specifically, the refrigeration sheet 40 may be adhered to the surface of the water cooling plate 20, and in order to improve the heat dissipation effect, the refrigeration sheet 40 is adhered to the water cooling plate 20 through a heat conducting adhesive.

Specifically, the refrigeration piece 40 is a thermoelectric semiconductor refrigeration assembly, one side of the refrigeration piece 40 absorbing heat faces the heating module 10, and one side of the refrigeration piece 40 dissipating heat faces the water cooling plate 20.

When the heat dissipation module is needed to dissipate heat of the heating module 10, the heating module 10 is placed on the heat absorption surface of the cooling plate 40, heat of the heating module 10 is transferred to the water cooling plate 20 through the cooling plate 40, and the heat is taken out through liquid in the water cooling plate 20.

Because thereby the rivers dispel the heat through the fin of different size shapes in water-cooling board 20, but along with the heat flux density increase of the module 10 that generates heat, the shape of fin or intensive degree have reached the limit of processing technology, through set up refrigeration piece 40 on water-cooling board 20, and then in time effluvium the heat of the module 10 that generates heat, and then improved heat radiation module's radiating efficiency.

In one embodiment, the heat dissipation module further includes an insulating member 30 disposed on the heat absorbing surface of the cooling fin 40 and used for placing the heat generating module 10. In order to prolong the service life of the insulator 30, it is preferable that the insulator 30 is a ceramic gasket. The heat generating module 10 is provided with an insulating function by a ceramic gasket.

Specifically, one insulating member 30 may cover the entire upper surface of the water-cooling plate 20 on which the refrigeration fins 40 are placed, or the same row of refrigeration fins 40 may be covered by one insulating member 30, or the insulating members 30 and the refrigeration fins 40 correspond to each other one by one.

In one embodiment, the water cooling plate 20 is provided with a receiving groove for receiving the cooling fins 40. Through placing refrigeration piece 40 in the storage tank, reduce refrigeration piece 40 evagination setting, improve refrigeration piece 40 installation stability, and be convenient for install the module 10 that generates heat. Specifically, when processing, the surface of the water cooling plate 20 is grooved, and the refrigeration piece 40 is embedded into the accommodating groove of the base plate of the water cooling plate 20, so that the upper surfaces of the refrigeration piece 40 and the base plate of the water cooling plate 20 are kept flat, and at the moment, the outer surface of the refrigeration piece 40 is flush with the notch of the accommodating groove. Specifically, the refrigeration sheets 40 may be placed in one accommodating groove, or the refrigeration sheets 40 correspond to the accommodating grooves one to one.

When the insulating member 30 is disposed on the refrigerating sheet 40, preferably, the insulating member 30 is installed in the accommodating groove, and the outer surface of the insulating member 30 is flush with the notch of the accommodating groove.

As shown in fig. 2, the cooling fins 40 are used to correspond to the heat generating modules 10 one by one, and one cooling fin 40 is disposed below each heat generating module 10.

As shown in fig. 3, the cooling fins 40 are preferably located below the heat generating modules 10 having a large amount of heat generation. That is, the refrigeration sheet 40 may be disposed for the heating module 10 with a large heating value, and the other heating modules 10 with a temperature meeting the requirement may not be disposed with the refrigeration sheet 40, so that the flexibility of the scheme is stronger, the installation steps may be simplified, and a certain cost may be saved.

As shown in fig. 4, at least two heating modules 10 are correspondingly disposed on one cooling plate 40, and the number of the cooling plates 40 is smaller than the number of the heating modules 10.

In one embodiment, one cooling plate 40 is provided for the same water cooling plate 20. Specifically, the cooling plate 40 may be laid right under the heat generating module 10. In order to improve the heat dissipation efficiency, preferably, the edge of the refrigeration sheet 40 is flush with the edge of the heat absorption surface of the water cooling plate 20, and specifically, the refrigeration sheet 40 is laid on the whole surface of the heat absorption surface of the water cooling plate 20.

Or the same water cooling plate 20 is provided with at least two refrigeration sheets 40, specifically, when the water cooling plate 20 only has one heat absorbing surface, all the refrigeration sheets 40 are located on the heat absorbing surface, the arrangement of the refrigeration sheets 40 is preferably arranged according to the position of the heating module 10, and preferably, the refrigeration sheets 40 are opposite to the heating module 10. When the water cooling plate 20 has a plurality of heating surfaces, preferably, each heating surface is provided with a cooling plate 40, and preferably, the cooling plate 40 is opposite to the heating module 10, so that heat can be dissipated as soon as possible.

Of course, during the specific manufacturing process, the refrigeration sheet 40 is laid on the surface of the water cooling plate 20, and the edge of the refrigeration sheet 40 extends to the edge of the heat absorbing surface of the water cooling plate 20.

Of course, the size and number of the cooling fins 40 can be adjusted according to the requirement during the specific processing, and the application is not limited specifically.

In one embodiment, the water cooling plate 20 includes a water cooling plate base 21 and a water cooling plate closing plate 22, a water cooling cavity is formed between the water cooling plate base 21 and the water cooling plate closing plate 22 in a sealed manner, and the cooling fins 40 are mounted on the water cooling plate base 21. Specifically, a radiating fin is arranged in the water cooling cavity.

The application provides an electrical apparatus, including module 10 and the radiating module who is used for the radiating to module 10 that generates heat, wherein radiating module is any kind of radiating module above-mentioned. The foregoing describes a specific structure of a heat dissipation module, and the present application includes the heat dissipation module, which also has the above technical effects.

Specifically, the electrical device is a motor controller, and specifically, the electrical device may be an inverter module or an energy storage module.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation module, comprising:

a water-cooling plate (20);

and the refrigerating sheet (40) is used for transferring the heat of the heating module (10) to the water cooling plate (20), and the refrigerating sheet (40) is in insulated contact with the heating module (10).

2. The heat dissipation module according to claim 1, further comprising an insulating member (30) disposed on a heat absorption surface of the cooling fin (40) and used for placing the heat generation module (10).

3. The thermal module of claim 2 wherein the insulator (30) is a ceramic spacer.

4. The heat dissipation module according to claim 1, wherein the water cooling plate (20) is provided with a receiving groove for receiving the refrigeration sheet (40).

5. The heat dissipation module according to claim 4, further comprising an insulating member (30) disposed on the heat absorption surface of the cooling plate (40) and used for placing the heat generation module (10), wherein the insulating member (30) is installed in the accommodating groove, and the outer surface of the insulating member (30) is flush with the notch of the accommodating groove.

6. The heat dissipation module according to claim 1, wherein the cooling fins (40) are used to correspond to heat generating modules (10) one by one, or at least two heat generating modules (10) are correspondingly disposed on one cooling fin (40), or the cooling fins (40) are laid on the surface of the water cooling plate (20), and the edge of the cooling fin (40) extends to the edge of the heat absorbing surface of the water cooling plate (20).

7. The heat dissipation module according to claim 1, wherein the water cooling plate (20) comprises a water cooling plate substrate (21) and a water cooling plate closing plate (22), a water cooling cavity is formed between the water cooling plate substrate (21) and the water cooling plate closing plate (22) in a sealed manner, and the refrigeration sheet (40) is mounted on the water cooling plate substrate (21).

8. The heat dissipation module according to claim 1, wherein the cooling sheet (40) is a thermoelectric semiconductor cooling assembly, the side of the cooling sheet (40) absorbing heat faces the heat generation module (10), and the side of the cooling sheet (40) dissipating heat faces the water cooling plate (20).

9. -heat dissipation module according to claim 1, characterized in that one and the same water-cooled plate (20) is provided with one of said chilling plates (40) or that one and the same water-cooled plate (20) is provided with at least two of said chilling plates (40).

10. The heat dissipation module according to claim 9, characterized in that, when one and the same water-cooled plate (20) is provided with one of said refrigeration fins (40), the edge of said refrigeration fin (40) is flush with the edge of the heat absorption surface of said water-cooled plate (20).

11. The heat dissipation module according to any one of claims 1 to 10, characterized in that the cooling fins (40) are arranged on the same side of the water-cooled plate (20) or on both sides of the water-cooled plate (20) facing away from each other, and are provided with cooling fins (40).

12. An electrical apparatus comprising a heat generating module (10) and a heat dissipating module for dissipating heat from the heat generating module (10), wherein the heat dissipating module is the heat dissipating module of any one of claims 1 to 11.

13. The electrical device of claim 12, wherein the electrical device is a motor controller.