CN117580893A - 聚酰胺酸、聚酰胺酸组合物、聚酰亚胺、聚酰亚胺膜、层叠体、层叠体的制造方法和电子器件 - Google Patents

聚酰胺酸、聚酰胺酸组合物、聚酰亚胺、聚酰亚胺膜、层叠体、层叠体的制造方法和电子器件 Download PDF

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Publication number
CN117580893A
CN117580893A CN202280046631.XA CN202280046631A CN117580893A CN 117580893 A CN117580893 A CN 117580893A CN 202280046631 A CN202280046631 A CN 202280046631A CN 117580893 A CN117580893 A CN 117580893A
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CN
China
Prior art keywords
polyamic acid
polyimide
polyimide film
organic group
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280046631.XA
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English (en)
Chinese (zh)
Inventor
中山博文
白井友贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
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Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of CN117580893A publication Critical patent/CN117580893A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
CN202280046631.XA 2021-07-01 2022-06-24 聚酰胺酸、聚酰胺酸组合物、聚酰亚胺、聚酰亚胺膜、层叠体、层叠体的制造方法和电子器件 Pending CN117580893A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021110116 2021-07-01
JP2021-110116 2021-07-01
PCT/JP2022/025343 WO2023276888A1 (ja) 2021-07-01 2022-06-24 ポリアミド酸、ポリアミド酸組成物、ポリイミド、ポリイミド膜、積層体、積層体の製造方法及び電子デバイス

Publications (1)

Publication Number Publication Date
CN117580893A true CN117580893A (zh) 2024-02-20

Family

ID=84691422

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280046631.XA Pending CN117580893A (zh) 2021-07-01 2022-06-24 聚酰胺酸、聚酰胺酸组合物、聚酰亚胺、聚酰亚胺膜、层叠体、层叠体的制造方法和电子器件

Country Status (4)

Country Link
JP (1) JPWO2023276888A1 (https=)
KR (1) KR20240027771A (https=)
CN (1) CN117580893A (https=)
WO (1) WO2023276888A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024172112A1 (ja) * 2023-02-15 2024-08-22 株式会社カネカ ポリイミド前駆体組成物、ポリイミド膜、積層体、電子デバイス、積層体の製造方法、ポリイミド膜の製造方法及び電子デバイスの製造方法
KR20250156742A (ko) * 2023-03-14 2025-11-03 가부시키가이샤 가네카 폴리아미드산 조성물, 폴리이미드, 폴리이미드막, 적층체, 전자 디바이스, 폴리이미드의 제조 방법, 적층체의 제조 방법 및 전자 디바이스의 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5903789B2 (ja) 2010-07-22 2016-04-13 宇部興産株式会社 共重合ポリイミド前駆体及び共重合ポリイミド
KR102422752B1 (ko) * 2015-03-17 2022-07-18 타오카 케미컬 컴퍼니 리미티드 신규 테트라카르복시산 이무수물, 및 산이무수물로부터 얻어지는 폴리이미드 및 폴리이미드 공중합체
JP6086139B2 (ja) 2015-10-05 2017-03-01 宇部興産株式会社 ポリイミド前駆体及びポリイミド
TWI889648B (zh) * 2018-04-06 2025-07-11 美商杜邦電子股份有限公司 供使用於電子裝置之聚合物
JP2022061487A (ja) * 2020-10-06 2022-04-18 東レ株式会社 樹脂組成物、それを用いた表示デバイスまたは受光デバイスの製造方法、基板ならびにデバイス
CN117500880A (zh) * 2021-06-29 2024-02-02 普林科技有限公司 树脂组合物、清漆、层叠板、印刷配线基板以及成形品

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Publication number Publication date
KR20240027771A (ko) 2024-03-04
JPWO2023276888A1 (https=) 2023-01-05
TW202319445A (zh) 2023-05-16
WO2023276888A1 (ja) 2023-01-05

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