KR20240027771A - 폴리아미드산, 폴리아미드산 조성물, 폴리이미드, 폴리이미드막, 적층체, 적층체의 제조 방법 및 전자 디바이스 - Google Patents

폴리아미드산, 폴리아미드산 조성물, 폴리이미드, 폴리이미드막, 적층체, 적층체의 제조 방법 및 전자 디바이스 Download PDF

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Publication number
KR20240027771A
KR20240027771A KR1020247003339A KR20247003339A KR20240027771A KR 20240027771 A KR20240027771 A KR 20240027771A KR 1020247003339 A KR1020247003339 A KR 1020247003339A KR 20247003339 A KR20247003339 A KR 20247003339A KR 20240027771 A KR20240027771 A KR 20240027771A
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KR
South Korea
Prior art keywords
polyamic acid
polyimide
polyimide film
weight
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247003339A
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English (en)
Korean (ko)
Inventor
히로후미 나카야마
유키 시라이
Original Assignee
가부시키가이샤 가네카
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Publication date
Application filed by 가부시키가이샤 가네카 filed Critical 가부시키가이샤 가네카
Publication of KR20240027771A publication Critical patent/KR20240027771A/ko
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020247003339A 2021-07-01 2022-06-24 폴리아미드산, 폴리아미드산 조성물, 폴리이미드, 폴리이미드막, 적층체, 적층체의 제조 방법 및 전자 디바이스 Pending KR20240027771A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-110116 2021-07-01
JP2021110116 2021-07-01
PCT/JP2022/025343 WO2023276888A1 (ja) 2021-07-01 2022-06-24 ポリアミド酸、ポリアミド酸組成物、ポリイミド、ポリイミド膜、積層体、積層体の製造方法及び電子デバイス

Publications (1)

Publication Number Publication Date
KR20240027771A true KR20240027771A (ko) 2024-03-04

Family

ID=84691422

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247003339A Pending KR20240027771A (ko) 2021-07-01 2022-06-24 폴리아미드산, 폴리아미드산 조성물, 폴리이미드, 폴리이미드막, 적층체, 적층체의 제조 방법 및 전자 디바이스

Country Status (4)

Country Link
JP (1) JPWO2023276888A1 (https=)
KR (1) KR20240027771A (https=)
CN (1) CN117580893A (https=)
WO (1) WO2023276888A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024172112A1 (ja) * 2023-02-15 2024-08-22 株式会社カネカ ポリイミド前駆体組成物、ポリイミド膜、積層体、電子デバイス、積層体の製造方法、ポリイミド膜の製造方法及び電子デバイスの製造方法
KR20250156742A (ko) * 2023-03-14 2025-11-03 가부시키가이샤 가네카 폴리아미드산 조성물, 폴리이미드, 폴리이미드막, 적층체, 전자 디바이스, 폴리이미드의 제조 방법, 적층체의 제조 방법 및 전자 디바이스의 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012041530A (ja) 2010-07-22 2012-03-01 Ube Industries Ltd 共重合ポリイミド前駆体及び共重合ポリイミド
JP2016029177A (ja) 2015-10-05 2016-03-03 宇部興産株式会社 ポリイミド前駆体及びポリイミド
WO2019195148A1 (en) 2018-04-06 2019-10-10 E. I. Du Pont De Nemours And Company Polymers for use in electronic devices

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102422752B1 (ko) * 2015-03-17 2022-07-18 타오카 케미컬 컴퍼니 리미티드 신규 테트라카르복시산 이무수물, 및 산이무수물로부터 얻어지는 폴리이미드 및 폴리이미드 공중합체
JP2022061487A (ja) * 2020-10-06 2022-04-18 東レ株式会社 樹脂組成物、それを用いた表示デバイスまたは受光デバイスの製造方法、基板ならびにデバイス
CN117500880A (zh) * 2021-06-29 2024-02-02 普林科技有限公司 树脂组合物、清漆、层叠板、印刷配线基板以及成形品

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012041530A (ja) 2010-07-22 2012-03-01 Ube Industries Ltd 共重合ポリイミド前駆体及び共重合ポリイミド
JP2016029177A (ja) 2015-10-05 2016-03-03 宇部興産株式会社 ポリイミド前駆体及びポリイミド
WO2019195148A1 (en) 2018-04-06 2019-10-10 E. I. Du Pont De Nemours And Company Polymers for use in electronic devices

Also Published As

Publication number Publication date
CN117580893A (zh) 2024-02-20
JPWO2023276888A1 (https=) 2023-01-05
TW202319445A (zh) 2023-05-16
WO2023276888A1 (ja) 2023-01-05

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Patent event code: PA02012R01D

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