CN117528911A - Preparation method of heat dissipation type circuit board - Google Patents
Preparation method of heat dissipation type circuit board Download PDFInfo
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- CN117528911A CN117528911A CN202311696105.0A CN202311696105A CN117528911A CN 117528911 A CN117528911 A CN 117528911A CN 202311696105 A CN202311696105 A CN 202311696105A CN 117528911 A CN117528911 A CN 117528911A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 72
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000010931 gold Substances 0.000 claims abstract description 68
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910052737 gold Inorganic materials 0.000 claims abstract description 64
- 238000007650 screen-printing Methods 0.000 claims abstract description 40
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 18
- 238000001556 precipitation Methods 0.000 claims abstract description 15
- 230000008021 deposition Effects 0.000 claims abstract description 8
- 238000000059 patterning Methods 0.000 claims abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 46
- 238000000151 deposition Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 26
- 229910052759 nickel Inorganic materials 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 239000000126 substance Substances 0.000 claims description 16
- 238000003848 UV Light-Curing Methods 0.000 claims description 11
- 238000002791 soaking Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 9
- 230000003746 surface roughness Effects 0.000 claims description 9
- 230000003647 oxidation Effects 0.000 abstract description 11
- 238000007254 oxidation reaction Methods 0.000 abstract description 11
- 238000005406 washing Methods 0.000 description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 38
- 238000012360 testing method Methods 0.000 description 17
- 238000001514 detection method Methods 0.000 description 10
- 239000010949 copper Substances 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 238000005554 pickling Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000003213 activating effect Effects 0.000 description 3
- 238000000861 blow drying Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000010330 laser marking Methods 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 238000005488 sandblasting Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005422 blasting Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- -1 drilling Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The application relates to a preparation method of a heat dissipation type circuit board. The preparation method of the heat dissipation type circuit board comprises the following steps: silk screen printing heat dissipation ink on the surface of the prefabricated plate with the outer layer circuit to form a heat dissipation ink layer, and preparing a first prefabricated product; patterning the surface of the first preform to expose a gold deposition area, and preparing a second preform; carrying out gold precipitation treatment on the second preform to prepare a third preform; and performing antioxidation treatment on the third preform, and preparing an antioxidation layer on the surface of the third preform. In the preparation method of the heat-dissipation type circuit board, a relatively stable heat-dissipation ink layer can be formed in the circuit board through silk-screen heat-dissipation ink, gold precipitation treatment and oxidation resistance treatment, and the circuit board with relatively good heat dissipation performance is obtained.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a preparation method of a heat dissipation circuit board.
Background
With the continuous development of circuit board technology, the structure and function of the circuit board are more and more complex, and the heat generation amount is also continuously increased. In the use process of the circuit board, the heat dissipation performance is also becoming more important. The conventional circuit board has poor heat dissipation performance, and an additional heat dissipation component is generally required to dissipate heat of the circuit board.
Disclosure of Invention
Based on this, it is necessary to provide a method for manufacturing a heat dissipation circuit board, which can obtain a circuit board having a good heat dissipation performance.
A preparation method of a heat dissipation type circuit board comprises the following steps: silk screen printing heat dissipation ink on the surface of the prefabricated plate with the outer layer circuit to form a heat dissipation ink layer, and preparing a first prefabricated product; patterning the surface of the first preform to expose a gold deposition area, and preparing a second preform; carrying out gold precipitation treatment on the second preform to prepare a third preform; and performing antioxidation treatment on the third preform, and preparing an antioxidation layer on the surface of the third preform.
In the preparation method, the stable heat dissipation ink layer can be formed in the circuit board through silk-screen heat dissipation ink, gold precipitation treatment and antioxidation treatment, and the circuit board with good heat dissipation performance is obtained.
In some embodiments, the screen printing is performed by using a gauze screen, and the mesh density of the gauze screen printed by the gauze screen is 12 t-43 t.
In some embodiments, the doctor pressure of the screen printing is 5kg/cm 2 ~7kg/cm 2 。
In some embodiments, the doctor angle of the screen printing of the gauze is less than or equal to 30 °.
In some embodiments, the screen is followed by resting the product for 20min to 60min.
In some embodiments, the number of screen prints of the gauze is two; the mesh density of the first-time screen-printed screen yarn is 36T, and the mesh density of the second-time screen-printed screen yarn is more than 36T and less than or equal to 43T; and carrying out plate baking treatment on the product after each screen printing.
In some embodiments, the heat dissipating ink layer has a thickness of 125 μm to 175 μm.
In some embodiments, the surface roughness of the heat dissipating ink layer is rz.ltoreq.12 μm, ra.ltoreq.3 μm, rz represents the maximum height roughness, and Ra represents the arithmetic average roughness.
In some embodiments, the patterning process includes: exposing the gold depositing area by adopting a mode of matching a dry film with UV curing at the position with the minimum distance less than 2 mu m between the gold depositing area and the non-gold depositing area; exposing the gold depositing area at the position with the minimum distance between the gold depositing area and the non-gold depositing area being more than or equal to 2 mu m in a mode of sticking green gummed paper.
In some embodiments, the gold precipitation treatment comprises a electroless nickel treatment and an electroless gold treatment performed sequentially; in the chemical nickel treatment, the parameters of the nickel cylinder are as follows: ni concentration is 4.3 g/L-5.1 g/L, pH value is 4.7-4.9, and soaking time is 10 min-50 min; in the chemical gold treatment, the parameters of the gold cylinder are as follows: the concentration of Au is 0.7g/L to 1.3g/L, the pH value is 5.0 to 5.4, and the soaking time is 15min to 30min.
In some embodiments, the thickness of the oxidation resistant layer is 0.15 μm to 0.6 μm.
In some embodiments, before the antioxidation treatment, the third preform is subjected to a plate treatment, where the temperature of the plate treatment is 145 ℃ to 150 ℃ and the time is 40min to 50min.
In some embodiments, the heat dissipating ink comprises a Peters type 4B heat dissipating ink.
Drawings
Fig. 1 is an external view of a heat dissipating ink face and Bond face of a circuit board obtained in example 1 of the present application.
Fig. 2 is an external view of a heat dissipation ink layer obtained in the circuit board manufacturing method of example 1 of the present application.
Fig. 3 is an external view before and after the adhesion test of the heat dissipation ink layer obtained in the circuit board manufacturing method of example 1 of the present application.
Fig. 4 is a thickness test chart of the heat dissipation ink layer obtained in the circuit board manufacturing method of example 1 of the present application.
Fig. 5 is a surface roughness test chart of the heat dissipation ink layer obtained in the circuit board manufacturing method of example 1 of the present application.
Fig. 6 is a nickel corrosion test chart of the circuit board obtained in example 1 of the present application.
Fig. 7 is a solderability test chart of the circuit board obtained in example 1 of the present application.
Fig. 8 is an external view of the circuit board after the gold plating treatment in the circuit board manufacturing method of embodiment 1 of the present application.
Fig. 9 is a test chart of the surface roughness of the Bonding pad of the wiring board obtained in example 1 of the present application.
Fig. 10 is an external view of the circuit board after the antioxidation treatment in the circuit board manufacturing method of embodiment 1 of the present application.
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with the present application are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.
In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
An embodiment of the application provides a preparation method of a heat dissipation type circuit board. The preparation method of the heat dissipation type circuit board comprises the following steps: and silk-screen printing heat dissipation ink on the surface of the prefabricated plate with the outer layer circuit to form a heat dissipation ink layer, so as to prepare a first prefabricated product. And patterning the surface of the first preform to expose the gold deposition area, and preparing a second preform. And carrying out gold precipitation treatment on the second preform to prepare a third preform. And performing antioxidation treatment on the third preform, and preparing an antioxidation layer on the surface of the third preform. In the embodiment, a stable heat dissipation ink layer can be formed in the circuit board through silk-screen heat dissipation ink, gold deposition treatment and oxidation resistance treatment, and the circuit board with good heat dissipation performance is obtained.
It will be understood that the prefabricated panel having the outer layer wiring means a wiring board subjected to the outer layer treatment. Alternatively, the prefabricated panel with the outer layer lines may be obtained from the base panel by conventional pretreatment. For example, a prefabricated panel with an outer layer of wiring can be obtained by the following process: the substrate is sequentially subjected to plate edge cutting treatment, drilling treatment, copper deposition treatment, plate surface electroplating treatment, outer layer dry film treatment, line electroplating treatment, outer etching plate treatment, outer AOI detection, hole sealing treatment, wet green oil treatment, panel electric test and ET pickling.
Alternatively, the board thickness of the circuit board may be 2.131mm to 2.531mm. The minimum aperture of the pore canal on the circuit board is 0.25mm plus or minus 0.1mm.
Optionally, the heat dissipating ink comprises a Peters type 4B heat dissipating ink. Peters 4B type heat dissipating ink represents Heatsink paste HSP B ink from Peters corporation. Further alternatively, the heat dissipating ink is a Peters type 4B heat dissipating ink.
In some embodiments, the screen printing is a screen printing screen, and the mesh density of the screen printed screen is 12T-43T. The heat dissipating ink can be uniformly transferred to the surface of the prefabricated plate having the outer layer lines by screen printing. Alternatively, the mesh density of the screen printed gauze may be 12T, 15T, 18T, 20T, 22T, 25T, 28T, 30T, 32T, 35T, 36T, 38T, 40T, 42T, 43T, etc. It will be appreciated that T represents the number of meshes in a 1cm gauze. The larger the number of T, the greater the number of meshes per unit length of the gauze, i.e., the greater the mesh density of the gauze. The smaller the number of T, the smaller the number of meshes per unit length of the gauze, i.e. the smaller the mesh density of the gauze. It will be appreciated that the mesh density of the screen printed gauze may be chosen within the range of 12t to 43t.
In some embodiments, the doctor pressure of the screen printing is 5kg/cm 2 ~7kg/cm 2 . Alternatively, the doctor pressure of the screen printing may be 5kg/cm 2 、5.2kg/cm 2 、5.5kg/cm 2 、5.8kg/cm 2 、6kg/cm 2 、6.2kg/cm 2 、6.5kg/cm 2 、6.8kg/cm 2 、7kg/cm 2 Etc. It will be appreciated that the doctor pressure of the screen printing may also be at 5kg/cm 2 ~7kg/cm 2 Other options are within the scope.
In some embodiments, the doctor angle of the screen printing is less than or equal to 30 °. Alternatively, the doctor angle of the screen printing may be 30 °, 28 °, 25 °, 22 °, 20 °, 18 °, 15 °, 12 °, 10 °, etc. It will be appreciated that the doctor angle of the screen printing can be chosen in other ways within a range of 30 deg..
In some embodiments, the product is left to stand for 20min to 60min after screen printing. Optionally, after screen printing, the product may be left to stand for 20min, 30min, 40min, 50min, 60min, etc. It can be appreciated that the time for which the product is allowed to stand after screen printing of the gauze can be selected within the range of 20min to 60min.
In some embodiments, the number of screen impressions is two. The mesh density of the first screen printed screen was 36T. The mesh density of the second screen printed screen is greater than 36T and less than or equal to 43T. And the screen printing of the gauze further comprises the step of carrying out plate baking treatment on the product. It can be appreciated that after the second screen printing, the product is left to stand for 20min to 60min.
In some embodiments, the thickness of the heat dissipating ink layer is 125 μm to 175 μm. Alternatively, the thickness of the heat dissipating ink layer may be 125 μm, 130 μm, 135 μm, 140 μm, 145 μm, 150 μm, 155 μm, 160 μm, 165 μm, 170 μm, 175 μm, etc.
In some embodiments, the surface roughness of the heat dissipating ink layer is rz.ltoreq.12 μm, ra.ltoreq.3 μm, rz represents the maximum height roughness, and Ra represents the arithmetic mean roughness.
In some embodiments, the patterning process includes: and exposing the gold-depositing area by adopting a mode of combining a dry film with UV curing for the position with the minimum distance less than 2 mu m between the gold-depositing area and the non-gold-depositing area. Exposing the gold depositing area by adopting a green gummed paper pasting mode at the position with the minimum distance between the gold depositing area and the non-gold depositing area being more than or equal to 2 mu m.
The mode of matching the dry film with UV curing has higher precision, and when the distance between the gold depositing area and the non-gold depositing area is smaller, the mode of matching the dry film with UV curing can improve the precision of subsequent gold depositing treatment. Alternatively, the dry film is DuPont w-250. Alternatively, the UV curing energy is 300mJ/cm 2 ~500mJ/cm 2 . For example, the energy of UV curing may be 300mJ/cm 2 、350mJ/cm 2 、400mJ/cm 2 、450mJ/cm 2 、500mJ/cm 2 Etc. The green gummed paper pasting mode has lower cost, and when the distance between the gold depositing area and the non-gold depositing area is larger, the green gummed paper pasting mode can reduce the manufacturing cost of the circuit board.
In some embodiments, the gold precipitation treatment includes a electroless nickel treatment and a electroless gold treatment that are performed sequentially. In the chemical nickel treatment, the parameters of the nickel cylinder are as follows: ni concentration is 4.3 g/L-5.1 g/L, pH value is 4.7-4.9, and soaking time is 10 min-50 min; the thickness of the nickel layer obtained by chemical nickel treatment is 5-9 mu m. In the chemical gold treatment, the parameters of the gold cylinder are as follows: the concentration of Au is 0.7g/L to 1.3g/L, the pH value is 5.0 to 5.4, and the soaking time is 15min to 30min; the thickness of the gold layer obtained by the chemical gold treatment is 0.05-0.1 mu m.
It is understood that the gold precipitation treatment further includes: and performing first microetching treatment on the second preform. Optionally, the microetching rate of the first microetching treatment is 60 μm to 90 μm. Further alternatively, the microetching rate of the first microetching treatment may be 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, or the like. It is understood that the first microetching process is located before the electroless nickel process.
In some embodiments, the thickness of the oxidation resistant layer is 0.15 μm to 0.6 μm. Alternatively, the thickness of the oxidation resistant layer may be 0.15 μm, 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, 0.45 μm, 0.5 μm, 0.55 μm, 0.6 μm, etc. Further alternatively, the thickness of the antioxidation layer is 0.15 μm to 0.3 μm.
It will be appreciated that the antioxidation treatment is preceded by: and performing a second microetching treatment on the third preform. Optionally, the microetching rate of the second microetching treatment is less than or equal to 0.6 μm. Optionally, the Cu concentration in the microetching cylinder is less than 3g/L during the second microetching treatment.
In some embodiments, the third preform is subjected to a plate treatment at a temperature of 145 ℃ to 150 ℃ for 40min to 50min prior to the oxidation resistant treatment. Alternatively, the temperature of the treatment of the baked plate may be 145 ℃, 146 ℃, 147 ℃, 148 ℃, 149 ℃, 150 ℃, etc. The treatment time of the baked plate can be 40min, 41min, 42min, 43min, 44min, 45min, 46min, 47min, 48min, 49min, 50min, etc. It will be appreciated that the treatment of the plate is prior to the second microetching treatment. It is understood that the temperature of the treatment of the baked plate can be selected from 145-150 ℃. The treatment time of the baking plate can be selected from 40min to 50min.
In some embodiments, the method for manufacturing the heat dissipation type circuit board includes the steps of: the method comprises the steps of sequentially carrying out plate cutting edge treatment, drilling treatment, copper deposition treatment, plate surface electroplating treatment, outer layer dry film treatment, line electroplating treatment, outer corrosion plate treatment, outer AOI detection, hole sealing treatment, wet green oil treatment, panel electric test, ET pickling, gauze silk-screen heat dissipation ink, heat dissipation ink inspection, sand blasting treatment, dry film treatment, UV curing treatment, green glue paper pasting treatment, gold deposition treatment, glue tearing paper treatment, film stripping treatment, laser marking treatment, gong plate treatment, ET washing, AVI detection, plate baking treatment, antioxidation treatment, FQC detection and packaging on a substrate.
It will be appreciated that the milling process requires ET washing after which it is not possible to do.
It will be appreciated that the grit blasting process can clean the copper surface in preparation for subsequent dry film treatment. Optionally, during the grit blasting, the mill rolls are closed to reduce the effect on the roughness of the heat dissipating ink layer.
In some embodiments, the screen printing heat dissipation ink comprises the following steps performed in sequence: the first screen printing heat dissipation ink, the treatment of the baking plate, the second screen printing heat dissipation ink and the treatment of the baking plate.
In some embodiments, the gold precipitation process comprises the following steps, performed in sequence: the method comprises the following steps of upper plate treatment, oil removal treatment, water washing treatment, first microetching treatment, water washing treatment, acid washing treatment, water washing treatment, presoaking treatment, activating treatment, water washing treatment, post-leaching treatment, water washing treatment, chemical nickel treatment, water washing treatment, chemical gold treatment, gold recovery treatment, water washing treatment, hot water washing treatment and lower plate treatment.
In some embodiments, the following steps are performed sequentially on the third preform: the method comprises the following steps of plate loading treatment, plate grinding treatment, water washing treatment, oil removal treatment, water washing treatment, second microetching treatment, water washing treatment, blow-drying treatment, antioxidation treatment, water washing treatment, cooling treatment and plate unloading treatment.
In some embodiments, the preparation process of the heat dissipation type circuit board is as follows: the method comprises the steps of cutting edges of a substrate, drilling, copper precipitation, plate surface electroplating, outer layer dry film treatment, line electroplating, outer etching plate treatment, outer AOI detection, hole sealing, wet green oil treatment, panel electric test, ET pickling, first-time screen printing heat-dissipating ink, baking plate treatment, second-time screen printing heat-dissipating ink, baking plate treatment, heat-dissipating ink inspection, sand blasting, dry film treatment, UV curing treatment, green paper pasting, degreasing treatment, water washing treatment, first microetching treatment, water washing treatment, pickling treatment, water washing treatment, presoaking treatment, activating treatment, water washing treatment, post-soaking treatment, water washing treatment, chemical nickel treatment, water washing treatment, chemical gold treatment, gold recovery treatment, water washing treatment, hot water washing treatment, adhesive paper tearing treatment, film removing treatment, laser marking treatment, gong plate treatment, ET water washing, AVI detection, baking plate treatment, water washing treatment, degreasing treatment, water washing treatment, second microetching treatment, water washing treatment, blow drying treatment, oxidation resistance treatment, water washing treatment, cooling treatment and FQC detection.
Example 1
The preparation flow of the heat dissipation type circuit board in this embodiment is as follows: the method comprises the steps of cutting edges of a substrate, drilling, copper precipitation, plate surface electroplating, outer layer dry film treatment, line electroplating, outer etching plate treatment, outer AOI detection, hole sealing, wet green oil treatment, panel electric test, ET pickling, first-time screen printing heat-dissipating ink, baking plate treatment, second-time screen printing heat-dissipating ink, baking plate treatment, heat-dissipating ink inspection, sand blasting, dry film treatment, UV curing treatment, green paper pasting, degreasing treatment, water washing treatment, first microetching treatment, water washing treatment, pickling treatment, water washing treatment, presoaking treatment, activating treatment, water washing treatment, post-soaking treatment, water washing treatment, chemical nickel treatment, water washing treatment, chemical gold treatment, gold recovery treatment, water washing treatment, hot water washing treatment, adhesive paper tearing treatment, film removing treatment, laser marking treatment, gong plate treatment, ET water washing, AVI detection, baking plate treatment, water washing treatment, degreasing treatment, water washing treatment, second microetching treatment, water washing treatment, blow drying treatment, oxidation resistance treatment, water washing treatment, cooling treatment and FQC detection.
Wherein the heat dissipation ink is Peters 4B type heat dissipation ink. When the heat dissipation ink is screened by the first gauze, the mesh density of the gauze is 36T. When the second gauze is used for screen printing the heat dissipation ink, the mesh density of the gauze is 43T. The doctor pressure of the screen printing was 6kg/cm 2 . The doctor angle of the screen printing was 30 °. After the second screen printing of the heat dissipation ink, the product was allowed to stand for 30min. The dry film was DuPont w-250 when dry film was processed. The energy of UV curing is 400mJ/cm 2 . The microetching rate of the first microetching treatment was 60. Mu.m. In the chemical nickel treatment, the parameters of the nickel cylinder are as follows: ni concentration is 4.3 g/L-5.1 g/L, pH value is 4.7-4.9, and soaking time is 30min. In the chemical gold treatment, the parameters of the gold cylinder are as follows: the concentration of Au is 0.7g/L to 1.3g/L,the pH value is 5.0-5.4, and the soaking time is 20min. The microetching rate of the second microetching treatment is less than or equal to 0.6 mu m. And the Cu concentration in the microetching cylinder is less than 3g/L during the second microetching treatment. The temperature of the plate baking treatment is 150 ℃, and the plate baking treatment time is 45min. The antioxidant liquid medicine is GlicoatSMDF2LX (SHIKOKU).
Test case
(1) The appearance of the wiring board obtained in example 1 was tested, and the results are shown in fig. 1. In fig. 1, (a) is a heat dissipating ink surface, and (b) is a Bond surface. As can be seen from fig. 1, both sides of the circuit board have good appearance.
(2) The appearance of the heat dissipating ink layer obtained in example 1 was tested and the results are shown in fig. 2. In fig. 2, (b) is a partial enlarged view of the square frame in (a). As can be seen from fig. 2, the surface of the heat dissipation ink layer is compact, free of voids and qualified in appearance.
(3) The adhesion of the heat dissipating ink layer obtained in example 1 was tested and the results are shown in fig. 3. In fig. 3, (a) is an appearance diagram before the test, and (b) is an appearance diagram after the test. As can be seen from fig. 3, the heat dissipating ink layer did not discolor or fall off, and the test was acceptable. The heat dissipation ink layer can be stably attached to the surface of the circuit board to play a role in heat dissipation.
(4) The thickness of the heat dissipation ink layer obtained in example 1 was measured, and the results are shown in fig. 4 and table 1. In fig. 4, (a) and (b) show thickness test charts of different positions of the heat dissipation ink layer, respectively. As can be seen from FIG. 4 and Table 1, the heat dissipation ink layer has good thickness uniformity and meets the design range requirements of 125 μm to 175 μm.
TABLE 1
(5) The surface roughness of the heat dissipating ink layer obtained in example 1 was measured, and the results are shown in fig. 5 and table 2. As can be seen from FIG. 5 and Table 2, the heat dissipating ink layer has a small surface roughness and meets the design requirements of rz.ltoreq.12 μm and Ra.ltoreq.3 μm.
TABLE 2
(6) The circuit board obtained in example 1 was subjected to a nickel corrosion performance test, and the results are shown in fig. 6. As can be seen from fig. 6, the circuit board has no nickel corrosion, and meets IPC4552B 1 level requirements. The introduction of the heat dissipation ink does not affect the normal gold precipitation treatment of the circuit board.
(7) The circuit board obtained in example 1 was tested for solderability and the results are shown in fig. 7. As can be seen from fig. 7, the circuit board is good in solderability. Indicating that the introduction of the heat dissipation ink does not affect the normal solderability of the circuit board.
(8) The appearance of the product after the immersion gold treatment in example 1 was tested and the result is shown in fig. 8. In fig. 8, (b) is an enlarged view at the rightmost block in (a). As can be seen from FIG. 8, the gold surface has no pollution, no exposed copper and no exposed nickel, and has uniform color and qualified appearance. Indicating that the introduction of the heat dissipation ink does not affect the gold surface appearance of the circuit board.
(9) The nickel layer thickness and the gold layer thickness of the product after the gold precipitation treatment in example 1 were tested, and the results are shown in table 3. As can be seen from Table 3, the nickel layer and the gold layer both have good thickness uniformity and meet the corresponding design thickness requirements.
TABLE 3 Table 3
(10) The surface roughness of the Bonding pad of the wiring board obtained in example 1 was measured, and the results are shown in fig. 9 and table 4. As can be seen from fig. 9 and table 4, the surface roughness of the Bonding pad satisfies the design requirements.
TABLE 4 Table 4
(11) The appearance of the circuit board after the oxidation-resistant treatment in the circuit board manufacturing method of example 1 was tested, and the results are shown in fig. 10. In fig. 10, (a) and (b) show test charts of different positions on the surface of the circuit board, respectively. As can be seen from fig. 10, the surface of the oxidation-resistant layer is free from contamination, uniform in color and qualified in appearance.
(12) The thickness of the antioxidation layer of the wiring board in example 1 was tested, and the results are shown in table 5. As can be seen from table 5, the oxidation resistant layer has a relatively uniform thickness, and the thickness meets the design requirements.
TABLE 5
From the above test results, it can be seen that the performance of the circuit board can be better maintained after the heat dissipation ink is introduced into the circuit board in embodiment 1. Therefore, by introducing the heat dissipating ink in embodiment 1, the circuit board itself can be made to have a good heat dissipating performance while maintaining a good performance.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application.
Claims (10)
1. The preparation method of the heat dissipation type circuit board is characterized by comprising the following steps of:
silk screen printing heat dissipation ink on the surface of the prefabricated plate with the outer layer circuit to form a heat dissipation ink layer, and preparing a first prefabricated product;
patterning the surface of the first preform to expose a gold deposition area, and preparing a second preform;
carrying out gold precipitation treatment on the second preform to prepare a third preform;
and performing antioxidation treatment on the third preform, and preparing an antioxidation layer on the surface of the third preform.
2. The method for manufacturing a heat dissipation type circuit board according to claim 1, wherein the screen printing is screen printing with a mesh density of 12 t-43 t.
3. The method for manufacturing a heat dissipation type wiring board according to claim 2, wherein the doctor pressure of the gauze screen printing is 5kg/cm 2 ~7kg/cm 2 The method comprises the steps of carrying out a first treatment on the surface of the And/or the scraper angle of the screen printing is less than or equal to 30 degrees; and/or standing the product for 20-60 min after screen printing of the gauze.
4. The method for manufacturing a heat dissipation type wiring board according to claim 3, wherein the number of times of screen printing is two; the mesh density of the first-time screen-printed screen yarn is 36T, and the mesh density of the second-time screen-printed screen yarn is more than 36T and less than or equal to 43T; and carrying out plate baking treatment on the product after each screen printing.
5. The method for manufacturing a heat dissipation type circuit board according to claim 1, wherein the thickness of the heat dissipation ink layer is 125 μm to 175 μm; and/or the number of the groups of groups,
the surface roughness of the heat dissipation ink layer is Rz which is less than or equal to 12 mu m, ra which is less than or equal to 3 mu m, and Rz represents maximum height roughness, and Ra represents arithmetic average roughness.
6. The method for manufacturing a heat dissipation type wiring board according to claim 1, wherein the patterning process comprises: exposing the gold depositing area by adopting a mode of matching a dry film with UV curing at the position with the minimum distance less than 2 mu m between the gold depositing area and the non-gold depositing area;
exposing the gold depositing area at the position with the minimum distance between the gold depositing area and the non-gold depositing area being more than or equal to 2 mu m in a mode of sticking green gummed paper.
7. The method for manufacturing a heat dissipation type wiring board according to any one of claims 1 to 6, wherein the gold precipitation treatment includes a electroless nickel treatment and an electroless gold treatment performed sequentially;
in the chemical nickel treatment, the parameters of the nickel cylinder are as follows: ni concentration is 4.3 g/L-5.1 g/L, pH value is 4.7-4.9, and soaking time is 10 min-50 min;
in the chemical gold treatment, the parameters of the gold cylinder are as follows: the concentration of Au is 0.7g/L to 1.3g/L, the pH value is 5.0 to 5.4, and the soaking time is 15min to 30min.
8. The method for manufacturing a heat dissipation type wiring board according to any one of claims 1 to 6, wherein the thickness of the antioxidation layer is 0.15 μm to 0.6 μm.
9. The method for manufacturing a heat dissipation type circuit board according to any one of claims 1 to 6, wherein the third preform is subjected to a board treatment at 145 ℃ to 150 ℃ for 40min to 50min before the antioxidation treatment.
10. The method for manufacturing a heat dissipation type circuit board according to any one of claims 1 to 6, wherein the heat dissipation ink comprises Peters 4B type heat dissipation ink.
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050096311A (en) * | 2004-03-30 | 2005-10-06 | 주식회사 영은전자 | The manufacturing method of the solder resist coated pcb for heat resisting |
| US20100132982A1 (en) * | 2008-12-02 | 2010-06-03 | Samsung Electro-Mechanics Co., Ltd. | Package substrate including solder resist layer having pattern parts and method of fabricating the same |
| KR101257789B1 (en) * | 2011-11-18 | 2013-04-24 | 배영수 | High heat conductive pcb, heat emission module using the high heat conductive pcb, led lighting module using the heat emission module |
| JP2014236140A (en) * | 2013-06-04 | 2014-12-15 | 株式会社京写 | Ink for solder resist and hardened material thereof, and printed wiring board arranged by using the hardened material |
| CN104994688A (en) * | 2015-07-01 | 2015-10-21 | 江门崇达电路技术有限公司 | Manufacturing method of PCB integrated with multiple surface processing |
| KR101751374B1 (en) * | 2016-07-15 | 2017-07-11 | 정찬붕 | Method of manufacturing body control module printed circuit board for vehicle |
| CN108617079A (en) * | 2018-05-02 | 2018-10-02 | 皆利士多层线路版(中山)有限公司 | Thick copper circuit board and preparation method thereof |
| CN109788631A (en) * | 2019-02-25 | 2019-05-21 | 皆利士多层线路版(中山)有限公司 | Circuit board and preparation method thereof |
| CN113141723A (en) * | 2021-03-18 | 2021-07-20 | 深圳市景旺电子股份有限公司 | Surface treatment method of printed circuit board and printed circuit board |
| CN113873762A (en) * | 2021-09-24 | 2021-12-31 | 江门崇达电路技术有限公司 | PCB with nickel-gold immersion and oxidation resistance surface treatments and manufacturing method thereof |
-
2023
- 2023-12-12 CN CN202311696105.0A patent/CN117528911A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050096311A (en) * | 2004-03-30 | 2005-10-06 | 주식회사 영은전자 | The manufacturing method of the solder resist coated pcb for heat resisting |
| US20100132982A1 (en) * | 2008-12-02 | 2010-06-03 | Samsung Electro-Mechanics Co., Ltd. | Package substrate including solder resist layer having pattern parts and method of fabricating the same |
| KR101257789B1 (en) * | 2011-11-18 | 2013-04-24 | 배영수 | High heat conductive pcb, heat emission module using the high heat conductive pcb, led lighting module using the heat emission module |
| JP2014236140A (en) * | 2013-06-04 | 2014-12-15 | 株式会社京写 | Ink for solder resist and hardened material thereof, and printed wiring board arranged by using the hardened material |
| CN104994688A (en) * | 2015-07-01 | 2015-10-21 | 江门崇达电路技术有限公司 | Manufacturing method of PCB integrated with multiple surface processing |
| KR101751374B1 (en) * | 2016-07-15 | 2017-07-11 | 정찬붕 | Method of manufacturing body control module printed circuit board for vehicle |
| CN108617079A (en) * | 2018-05-02 | 2018-10-02 | 皆利士多层线路版(中山)有限公司 | Thick copper circuit board and preparation method thereof |
| CN109788631A (en) * | 2019-02-25 | 2019-05-21 | 皆利士多层线路版(中山)有限公司 | Circuit board and preparation method thereof |
| CN113141723A (en) * | 2021-03-18 | 2021-07-20 | 深圳市景旺电子股份有限公司 | Surface treatment method of printed circuit board and printed circuit board |
| CN113873762A (en) * | 2021-09-24 | 2021-12-31 | 江门崇达电路技术有限公司 | PCB with nickel-gold immersion and oxidation resistance surface treatments and manufacturing method thereof |
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