CN117519438A - Reinforced immersed liquid cooling server - Google Patents
Reinforced immersed liquid cooling server Download PDFInfo
- Publication number
- CN117519438A CN117519438A CN202311568515.7A CN202311568515A CN117519438A CN 117519438 A CN117519438 A CN 117519438A CN 202311568515 A CN202311568515 A CN 202311568515A CN 117519438 A CN117519438 A CN 117519438A
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- Prior art keywords
- server
- liquid cooling
- liquid
- radiator
- structural member
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000007788 liquid Substances 0.000 title claims abstract description 87
- 238000001816 cooling Methods 0.000 title claims abstract description 86
- 238000007789 sealing Methods 0.000 claims description 15
- 230000003287 optical effect Effects 0.000 claims description 12
- 238000005538 encapsulation Methods 0.000 claims description 5
- 239000002826 coolant Substances 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 2
- 239000000110 cooling liquid Substances 0.000 abstract description 23
- 230000017525 heat dissipation Effects 0.000 abstract description 14
- 238000013021 overheating Methods 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000004807 localization Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
- G06F1/182—Enclosures with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a reinforced immersed liquid cooling server, which comprises a server frame and a server main board, wherein the server frame comprises a box structural member, liquid cooling pipelines and liquid cooling joints, a plurality of independent cavities are arranged in the box structural member, the server main board is correspondingly arranged in the independent cavities, the number of the liquid cooling pipelines corresponds to that of the independent cavities and is fixedly arranged on the inner walls of the independent cavities, two liquid cooling joints communicated with the independent cavities are arranged on the outer walls of the box structural member corresponding to the independent cavities, one liquid cooling joint is communicated with the liquid cooling pipeline, and a plurality of interfaces for connecting the server main board with external signals are arranged on the outer walls of the box structural member corresponding to the independent cavities. According to the invention, through reasonable structural layout, the flow of the cooling liquid is forced, heat generated by each chip in the server is taken away, the structure is compact, the problems of high power density, local overheating of devices, low energy utilization rate and the like in a limited space are solved, and the overall heat dissipation efficiency and the overall space utilization rate of the computer are improved.
Description
Technical Field
The invention relates to a reinforced immersed liquid cooling server, and belongs to the technical field of servers.
Background
Along with the gradual deepening of integrated circuit localization in various fields, the application of autonomous and controllable localization chips is more and more, and meanwhile, in a limited space, the requirements of a novel high-technology computer with higher safety, reliability, higher efficiency and lower carbon are more and more obvious due to high-density chip layout and high-strength calculation speed. Under the background, the traditional natural heat dissipation and air cooling heat dissipation modes have low cost and easy maintenance, but the requirements of high-density calculation and high energy utilization rate are gradually not met.
The immersion liquid cooling technology has the advantages of high heat dissipation efficiency, high safety and reliability, high space utilization rate, high energy utilization rate, low noise and the like. Thus, the novel immersion liquid cooling technology of exchanging heat with liquid instead of air is becoming a new hot spot. In recent years, some commercial submerged liquid cooling servers are applied to the market, but the reinforced submerged liquid cooling servers based on autonomous controllable domestic chips are fewer, and the existing submerged liquid cooling servers have low space utilization rate and poor energy utilization rate and heat dissipation effect, so that how the liquid cooling servers perform reasonable structure and runner layout, and the problem of high-power consumption chip heat dissipation is solved, and the problem of energy utilization rate improvement is needed to be solved urgently.
Disclosure of Invention
The invention aims to solve the technical problems of reasonable structure and runner layout of a liquid cooling server, solving the problem of heat dissipation of a high-power chip and improving the energy utilization rate.
In order to solve the technical problems, the invention provides a reinforced submerged liquid cooling server, which solves the problems of low space utilization rate, low energy utilization rate and poor heat dissipation effect of the existing submerged liquid cooling server.
In order to achieve the technical purpose and achieve the technical effect, the application is realized through the following technical scheme:
the utility model provides a reinforcement formula immersion liquid cooling server, includes server frame, encapsulation lid, server mainboard, coolant liquid and guide rail, the server mainboard sets up in the server frame and be provided with a plurality ofly, be provided with in the server frame with the independent cavity that the server mainboard set up corresponds, adjacent two independent cavities are each other not circulate, the coolant liquid is filled in independent cavity, the encapsulation lid sets up realize on the server frame to the holistic seal of server frame, the guide rail is provided with a plurality ofly, and a plurality of the guide rail symmetry sets up realize the holistic cartridge of liquid cooling server on the server frame outer wall;
the server frame comprises a box structural member, liquid cooling pipelines, liquid cooling joints, optical signal connectors, electric signal connectors, power connectors and fastening clamps, wherein the box structural member is provided with independent cavities at intervals, the number of the liquid cooling pipelines corresponds to that of the independent cavities and is connected to the inner wall of the independent cavities through the fastening clamps, the liquid cooling joints are arranged on the outer wall of the box structural member and are provided with a plurality of liquid cooling joints, each independent cavity is correspondingly provided with two liquid cooling joints communicated with the independent cavities, the two liquid cooling joints corresponding to the independent cavities are communicated through an external circulating pump, one liquid cooling joint corresponding to the independent cavities is communicated with the liquid cooling pipelines, and the outer wall of the box structural member corresponding to the independent cavities is provided with at least one optical signal connector, electric signal connector and power connector.
Preferably, the server main board comprises a circuit board, a CPU radiator, a PCIE exchange chip radiator, a PCIE bridge radiator, a tera network card radiator and chips, wherein the circuit board is arranged in the independent cavity, the CPU radiator, the PCIE exchange chip radiator, the PCIE bridge radiator, the tera network card radiator and the chips are respectively arranged on the upper surface of the circuit board, the CPU radiator is positioned on one side, deviating from the liquid cooling joint, of the circuit board, and the CPU radiator is communicated with the liquid cooling pipeline.
Further, the box structure is of a 19in upper frame type structure, and the height of the box structure is 1U.
Preferably, the packaging cover comprises an upper cover plate and a plurality of sealing strips, and the sealing strips are arranged corresponding to the independent cavities.
Further, the upper cover plate is a transparent acrylic plate.
Preferably, the liquid cooling joint, the optical signal connector, the electric signal connector and the power connector are all arranged on the same side on the side wall of the box structural member, and a plurality of handles are arranged on the side wall of the box structural member different from one side of the liquid cooling joint.
Preferably, the box structural member is a reinforced metal material structural member.
Further, a label is arranged on the side wall, away from the server frame, of the upper cover plate.
The reinforced immersed liquid cooling server provided by the invention has the following advantages:
1. when the intelligent cooling system is used, the cooling liquid is forced to flow through reasonable structural layout, heat generated by each chip in the server is taken away, the intelligent cooling system is compact in structure, the inner part is divided into a plurality of independent cavities, the cooling liquid does not circulate mutually, the space utilization rate is high, the sealing performance is good, the disassembly and assembly are convenient, the problems of high power density, local overheating of devices, low energy utilization rate and the like in a limited space are effectively solved, and compared with the traditional natural heat dissipation and air cooling heat dissipation, the overall heat dissipation efficiency and the space utilization rate of a computer are greatly improved.
2. The standard 19in on-rack server has the height of 1U, can be installed in a standard cabinet, all external interfaces are distributed on one side of the cabinet, the external interfaces are neat and clear, and electric signals and optical signals are not mutually interfered, so that the operation is convenient.
3. The box structural member made of the reinforced metal material can meet the requirements of severe environment, and has good vibration and impact resistance and high and low temperature performance.
Drawings
FIG. 1 is a schematic axial view of an overall structure of a reinforced submerged liquid cooling server according to the present invention;
FIG. 2 is an isometric view of an overall structure of a server frame embodying the present invention;
FIG. 3 is an axial schematic diagram of the overall structure of a main board of a server according to the present invention;
FIG. 4 is an isometric view of an overall structure of a main embodiment of a package cover according to the present invention;
in the figure:
1-a server framework; 11-a box structural member; 12-liquid cooling pipeline; 13-liquid cooling joint; 14-an optical signal connector; 15-an electrical signal connector; a 16-power connector; 17-a fastening clip; 2-independent cavity; 3-a handle; 4-packaging the cover; 41-upper cover plate; 42-sealing strips; 5-a server motherboard; 51-a circuit board; 52-a CPU heatsink; 53-PCIE exchanging chip radiator; 54-PCIE bridge heat sink; 55-ten thousand megabyte network card radiator; 6, a guide rail; 7-caulking groove; 8-sealing the groove; 9-sign.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by a worker of ordinary skill in the art without creative efforts, are within the scope of protection of the present invention based on the embodiments in this application.
Referring to fig. 1, a reinforced submerged liquid cooling server comprises a server frame 1, a packaging cover 4, a server main board 5, cooling liquid and guide rails 6, wherein the server main board 5 is fixedly installed in the server frame 1 and is provided with a plurality of cooling liquid flows in the server frame 1 to cool and dissipate heat of the server main board 5, the packaging cover 4 is used for sealing and installing the server main board 5 and the cooling liquid in the server frame 1, the guide rails 6 are fixedly installed with two guide rails 6 symmetrically arranged on the side wall of the server frame 1 through bolts, and the guide rails 6 can facilitate the integral insertion and installation of a server into a case, so that the convenience of disassembly and assembly is improved.
Referring to fig. 1 and 2, in a further embodiment, the server frame 1 includes a box structural member 11, a liquid cooling pipeline 12, a liquid cooling joint 13, an optical signal connector 14, an electrical signal connector 15, a power connector 16 and a fastening clip 17, wherein a plurality of independent cavities 2 spaced from each other are formed in the box structural member 11, the plurality of independent cavities 2 are not communicated with each other, and the number of the server mainboards 5 is equal to the number of the independent cavities 2 and are correspondingly arranged in the independent cavities 2, in this embodiment, the number of the independent cavities 2 and the number of the server mainboards 5 are preferably two; the number of the liquid cooling pipelines 12 is the same as that of the independent cavities 2, and the liquid cooling pipelines are fixedly arranged on the inner walls of the independent cavities 2 through the matching of a plurality of fastening clips 17 and bolts respectively; the outer wall of the box body structural member 11 corresponding to the independent cavity 2 is connected with two liquid cooling joints 13 in a threaded manner, when the box body structural member is used, the two liquid cooling joints 13 are communicated through an external circulating pump, one liquid cooling joint 13 is communicated with a liquid cooling pipeline 12 in the independent cavity 2, so that the circulating flow of cooling liquid in the independent cavity 2 can be realized, or directly circularly flowing through the cooling liquid, wherein the server main board 5, the liquid cooling pipeline 12 and the fastening clamp 17 are all directly immersed in the cooling liquid, heat is taken away by convection heat exchange, finally the hot cooling liquid flows out through the liquid outlet liquid cooling joint 13 of the server, and then the cooling liquid is cooled by an external cooling system, so that the whole system can normally and stably run in a circulating way;
the optical signal connectors 14, the electrical signal connectors 15, and the power supply connectors 16 are all disposed on the same side as the liquid cooling connectors 13, in this embodiment, one optical signal connector 14, two electrical signal connectors 15, and one power supply connector 16 are correspondingly mounted on the outer wall of the box structural member 11 corresponding to each independent cavity 2, and the plurality of optical signal connectors 14, electrical signal connectors 15, and power supply connectors 16 are all located between the two liquid cooling connectors 13 for signal connection with the electrical components on the server motherboard 5 in the independent cavity 2, while the circuit signals and the optical signals do not interfere with each other.
In a further embodiment, a plurality of handles 3 are welded and fixed on the side wall of the box structural member 11 different from the side wall of the liquid cooling joint 13, in this embodiment, the number of the handles 3 is preferably two, and the whole disassembly and insertion of the server can be more convenient and quicker through the handles 3.
In a further embodiment, the box structure 11 is a 19in overhead structure, the height of the box structure 11 is 1U, the box structure can be installed in a standard cabinet, a 4mm panel is uniformly adopted, the basic size of the immersed server is wide x high x deep (box depth, without the handle 3 and the connector) is 482.6mm x 43.6 (1U) mm x 800mm, the tolerance is +/-1 mm, and meanwhile, the box structure 11 is a reinforced metal material structure, so that the vibration impact resistance under severe environments is met, and the reliability is high.
Referring to fig. 1 and 3, in a further embodiment, the server motherboard 5 includes a circuit board 51, a CPU radiator 52, a PCIE switch chip radiator 53, a PCIE bridge radiator 54, a trillion network card radiator 55, and chips, in this embodiment, the circuit board 51, the CPU radiator 52, the PCIE switch chip radiator 53, the PCIE bridge radiator 54, the trillion network card radiator 55, and the chips are all of the prior art, which is not described in detail, the circuit board 51 is fixedly installed on the bottom wall of the independent cavity 2 through bolts, the CPU radiator 52, the PCIE switch chip radiator 53, the PCIE bridge radiator 54, the trillion network card radiator 55, and the chips are separately disposed on the upper surface of the circuit board 51, wherein the CPU radiator 52 is located on a side of the circuit board 51 facing away from the liquid cooling joint 13, and a joint communicating with the liquid cooling pipe 12 is sleeved on a side of the CPU radiator 52 so as to realize communication with the liquid cooling pipe 12;
when the server is used, under the action of an external circulating pump, cold cooling liquid enters the liquid cooling pipeline 12 in the corresponding independent cavity 2 through the liquid inlet liquid cooling joint 13 outside the box structural member 11, preferentially flows to the CPU radiator 52 and then sequentially flows to the PCIE exchange chip radiator 53, the PCIE bridge radiator 54, the trillion network card radiator 55 and the surfaces of other chips, heat generated by the heating chip is firstly conducted to the fins of the radiator, then the cooling liquid circularly flows, or directly flows through the cooling liquid circularly, heat is taken away through convection heat exchange, finally the hot cooling liquid flows out through the liquid outlet liquid cooling joint 13 of the server, and then the external cooling system cools the cooling liquid, so that the whole system is circularly and normally and stably operated.
Referring to fig. 1 and fig. 4, in a further embodiment, the packaging cover 4 includes an upper cover plate 41 and a plurality of sealing strips 42, the box structural member 11 is provided with a caulking groove 7 for embedding and installing the upper cover plate 41, the upper cover plate 41 is fixedly installed on the inner wall of the caulking groove 7 through a plurality of bolts, the plurality of sealing strips 42 are adhered and fixed on the side wall of the upper cover plate 41 facing the independent cavity 2, in this embodiment, the sealing strips 42 are correspondingly arranged with the independent cavity 2, two sealing grooves 8 which are embedded and matched with the sealing strips 42 are arranged on the caulking groove 7, and the two sealing grooves 8 are not communicated with each other and are also not communicated with the independent cavity 2, thereby ensuring the non-circulation between the adjacent two independent cavities 2 as much as possible and improving the energy utilization rate.
In a further embodiment, the upper cover 41 is preferably a transparent acrylic plate, so as to facilitate the observation of the working conditions of the cooling liquid and each chip connector in the server without affecting the sealing performance and the safety.
Referring to fig. 1, in a further embodiment, a label 9 is adhered and fixed on a side wall of the upper cover 41 facing away from the server frame 1, and the type of processing of the liquid cooling server can be noted through the label 9, so that a user can conveniently and quickly select and use the liquid cooling server.
The application method of the reinforced immersed liquid cooling server comprises the following steps:
when the server is used, under the action of an external circulating pump, cold cooling liquid enters the liquid cooling pipeline 12 in the corresponding independent cavity 2 through the liquid inlet liquid cooling joint 13 outside the box structural member 11, preferentially flows to the CPU radiator 52 and then sequentially flows to the PCIE exchange chip radiator 53, the PCIE bridge radiator 54, the trillion network card radiator 55 and the surfaces of other chips, heat generated by the heating chip is firstly conducted to the fins of the radiator and then flows circularly through the cooling liquid, or directly flows circularly through the cooling liquid, heat is taken away by convection heat exchange, finally, the hot cooling liquid flows out through the liquid cooling joint 13 of the server, and then the external cooling system cools the cooling liquid to realize the normal and stable circulation operation of the whole system;
meanwhile, through reasonable structural layout, the server frame 1 is internally divided into two independent cavities, the flow of cooling liquid is forced, heat generated by each chip in the server is taken away, the structure is compact, the server is convenient to disassemble and assemble, the problems of high power density, local overheating of devices, low energy utilization rate and the like in a limited space are effectively solved, and compared with the traditional natural heat dissipation and air cooling heat dissipation, the integral heat dissipation efficiency and the space utilization rate of a computer are greatly improved.
While the invention has been described with respect to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Equivalent embodiments of the present invention will be apparent to those skilled in the art having the benefit of the teachings disclosed herein, when considered in the light of the foregoing disclosure, and without departing from the spirit and scope of the invention; meanwhile, any equivalent changes, modifications and evolution of the above embodiments according to the essential technology of the present invention still fall within the scope of the technical solution of the present invention.
Claims (8)
1. The utility model provides a reinforcement formula immersion liquid cooling server, its characterized in that includes server frame (1), encapsulation lid (4), server mainboard (5), coolant liquid and guide rail (6), server mainboard (5) set up in server frame (1) and be provided with a plurality ofly, be provided with in server frame (1) with independent cavity (2) that server mainboard (5) set up correspondingly, adjacent two independent cavity (2) are not circulated each other, the coolant liquid is filled in independent cavity (2), encapsulation lid (4) set up on server frame (1) realize to the whole seal of server frame (1), guide rail (6) are provided with a plurality ofly, and a plurality of guide rail (6) symmetry set up realize the holistic cartridge of liquid cooling server on the outer wall of server frame (1);
the server frame (1) comprises a box structural member (11), liquid cooling pipelines (12), liquid cooling joints (13), optical signal connectors (14), electric signal connectors (15), power connectors (16) and fastening clips (17), wherein the box structural member (11) is arranged at intervals in an independent cavity (2), the number of the liquid cooling pipelines (12) corresponds to the number of the independent cavities (2) and is connected to the inner wall of the independent cavities (2) through a plurality of fastening clips (17), the liquid cooling joints (13) are arranged on the outer wall of the box structural member (11) and are provided with a plurality of liquid cooling joints (13), each independent cavity (2) is correspondingly provided with two liquid cooling joints (13) communicated with the liquid cooling joints, one of the liquid cooling joints (13) corresponding to the independent cavity (2) is communicated with the liquid cooling pipelines (12) through an external circulation pump, and the electric signal connectors (14) corresponding to the independent cavity (2) are arranged on the outer wall of the box structural member (11), and at least one electric signal connector (16) is connected to the electric signal connectors (5) and the external signal connectors (5).
2. The reinforced submerged liquid cooling server of claim 1, wherein the server motherboard (5) comprises a circuit board (51), a CPU radiator (52), a PCIE switching chip radiator (53), a PCIE bridge radiator (54), a trillion network card radiator (55) and chips, the circuit board (51) is disposed in the independent cavity (2), the CPU radiator (52), the PCIE switching chip radiator (53), the PCIE bridge radiator (54), the trillion network card radiator (55) and the chips are separately disposed on the upper surface of the circuit board (51), the CPU radiator (52) is disposed on a side of the circuit board (51) away from the liquid cooling joint (13), and the CPU radiator (52) is communicated with the liquid cooling pipeline (12).
3. A reinforced submerged liquid-cooled server as claimed in claim 2, wherein the tank structure (11) is of a 19 in-frame type structure, and the height of the tank structure (11) is 1U.
4. A reinforced submerged liquid-cooled server as claimed in claim 1, characterised in that the encapsulation cover (4) comprises an upper cover plate (41) and a plurality of sealing strips (42), the sealing strips (42) being arranged in correspondence with the independent cavities (2).
5. The reinforced submerged liquid-cooled server of claim 4, wherein said upper cover plate (41) is a transparent acrylic plate.
6. The reinforced submerged liquid-cooled server of claim 1, wherein the liquid-cooled connector (13), the optical signal connector (14), the electrical signal connector (15) and the power connector (16) are all arranged on the same side of the side wall of the box structural member (11), and a plurality of handles (3) are arranged on the side wall of the box structural member (11) different from the side of the liquid-cooled connector (13).
7. A reinforced submerged liquid-cooled server as claimed in claim 1, characterised in that the tank structure (11) is a reinforced metallic structure.
8. A reinforced submerged liquid-cooled server as claimed in claim 4, characterised in that the side wall of the upper cover plate (41) facing away from the server frame (1) is provided with a sign (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311568515.7A CN117519438A (en) | 2023-11-22 | 2023-11-22 | Reinforced immersed liquid cooling server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311568515.7A CN117519438A (en) | 2023-11-22 | 2023-11-22 | Reinforced immersed liquid cooling server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117519438A true CN117519438A (en) | 2024-02-06 |
Family
ID=89741671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311568515.7A Pending CN117519438A (en) | 2023-11-22 | 2023-11-22 | Reinforced immersed liquid cooling server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117519438A (en) |
-
2023
- 2023-11-22 CN CN202311568515.7A patent/CN117519438A/en active Pending
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