CN212112376U

CN212112376U - Desktop case radiator

Info

Publication number: CN212112376U
Application number: CN202020692621.1U
Authority: CN
Inventors: 胡峻洁; 周友平
Original assignee: Beijing Jiuzhou Keyway Technology Co ltd
Current assignee: Beijing Jiuzhou Keyway Technology Co ltd
Priority date: 2020-04-29
Filing date: 2020-04-29
Publication date: 2020-12-08
Anticipated expiration: 2030-04-29

Abstract

The utility model discloses a desktop machine case radiator, desktop machine case radiator includes quick-witted case, heat dissipation mechanism, water-cooling mechanism and dustproof mechanism, machine incasement chamber fixed mounting has heat dissipation mechanism, heat dissipation mechanism bottom fixed mounting has water-cooling mechanism, the lateral wall demountable installation of machine case both sides has dustproof mechanism, heat dissipation mechanism comprises a section of thick bamboo, heat dissipation fan, radiating fin, division board and heat-conducting plate, protect a section of thick bamboo fixed welding in quick-witted incasement wall both sides, it all has the heat dissipation fan through support fixed mounting to protect a section of thick bamboo inner chamber, the equal fixed welding of a section of thick bamboo open end has radiating fin, radiating fin is aluminium system material, and radiating fin is half surrounding structure. The utility model discloses an air-cooled and water-cooling matched with mode dispels the heat to computer case, will effectively promote the radiating effect to computer case, makes the more stability of computer operation.

Description

Desktop case radiator

Technical Field

The utility model relates to a computer equipment technical field specifically is a desktop machine case radiator.

Background

The chassis typically includes a housing, brackets, various switches on the panel, indicator lights, etc. The case is used as a part of computer accessories and has the main function of placing and fixing the computer accessories, thereby having a supporting and protecting function. In addition, the computer case has an important role in shielding electromagnetic radiation. Although not a critical configuration in DIY, using a poor quality chassis tends to short the motherboard to the chassis, making the computer system very unstable.

However, the existing desktop case radiator has the following disadvantages in the use process:

the existing desktop case radiator has poor radiating effect in the using process, so that the stability of a computer in use is greatly reduced, and the damage to equipment such as a mainboard and the like can be caused due to overhigh case temperature, thereby greatly reducing the service life of the computer.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a desktop machine case radiator to solve current desktop machine case radiator among the above-mentioned background art and be not good at the in-process radiating effect, thereby greatly reduced the stability of computer when using, machine case high temperature can cause the damage of equipment such as mainboard simultaneously, greatly reduced the life's of computer problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a desktop machine case radiator, desktop machine case radiator includes quick-witted case, heat dissipation mechanism, water-cooling mechanism and dustproof mechanism, machine incasement chamber fixed mounting has heat dissipation mechanism, heat dissipation mechanism bottom fixed mounting has water-cooling mechanism, the lateral wall demountable installation of machine case both sides has dustproof mechanism.

Preferably, the heat dissipation mechanism consists of a protective cylinder, a heat dissipation fan, heat dissipation fins, a partition plate and a heat conduction plate, and the protective cylinder, the heat dissipation fan, the heat dissipation fins, the partition plate and the heat conduction plate form the heat dissipation mechanism.

Preferably, the protective cylinders are fixedly welded on two sides of the inner wall of the case, the inner cavities of the protective cylinders are fixedly provided with heat dissipation fans through brackets, radiating fins are fixedly welded at the opening end of the casing and are made of aluminum, the radiating fins are in a semi-enclosed structure, a heat conducting plate is fixedly connected with one side surface of each radiating fin, a partition plate is formed on one side of the inner cavity of each radiating fin, the equipment such as the mainboard and the like can be installed through the partition plate, the partition plate is connected with the radiating fins, the radiating fins and the partition plate are all supported by aluminum materials, the weight is light, the overall weight of the case can be effectively reduced, meanwhile, the heat-conducting plate can absorb the heat emitted by equipment such as the mainboard and the like during working and the heat is transferred to the radiating fins, through the mutual cooperation of radiating fin and heat dissipation fan, make the heat discharge from the thermovent, can effectively promote the radiating effect to quick-witted case.

Preferably, the water cooling mechanism consists of a water tank, a semiconductor refrigeration piece, a micro water pump, a flow guide hole, a conduit, a water filling port and a sealing cap, and the water tank, the semiconductor refrigeration piece, the micro water pump, the flow guide hole, the conduit, the water filling port and the sealing cap form the water cooling mechanism.

Preferably, the bottom of the inner cavity of the water tank is fixedly embedded with a semiconductor refrigerating sheet, the top of the water tank is fixedly connected with a micro water pump, the inner cavity of the radiating fin is provided with a plurality of groups of guide holes, the middle of each guide hole is connected through a guide pipe, the guide pipes, the guide holes and the water tank form a circulating structure, one end of the water tank is fixedly connected with a water filling port, the top of the water filling port is in threaded connection with a sealing cap, cooling water in the water tank is extracted through the micro water pump and is injected into the guide holes through the guide pipes, and the cooling water circulates, so that heat in the radiating fin can be taken away through the cooling water, meanwhile, the Peltier effect of the semiconductor material is utilized through the semiconductor refrigerating sheet, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and emitted at the two ends of the galvanic, thereby can cool down the cooling water, through continuous cycle cooling water to with the further radiating effect of promotion to quick-witted case, can pour into the cooling water into to the water tank through the water filling port, and water filling port and water tank constitution linker structure, can in time replenish the cooling water when lack of water in the water tank, the water tank is in high water level state all the time simultaneously, can effectively reduce the rivers sound when cooling water circulates, uses more silence.

Preferably, dustproof mechanism comprises thermovent, collar and dust screen, the thermovent is fixed to be seted up on quick-witted case both sides surface, thermovent inner chamber threaded connection has the collar, collar inner chamber fixed mounting has the dust screen, can carry out the separation to the dust through the dust screen, avoids the dust to enter into quick-witted case inner chamber, can effectively avoid the dust to cause the loss to equipment such as heat dissipation mechanism and mainboard, and the dust screen passes through the collar and is connected with the thermovent to can dismantle the dust screen fast, so that wash the dust screen.

The utility model provides a desktop machine case radiator possesses following beneficial effect:

(1) the utility model discloses a division board can be installed equipment such as mainboard, and the division board is connected with radiating fin, radiating fin and division board all adopt aluminium system material to support, and the quality is lighter, can effectively reduce the whole quality of quick-witted case, can absorb the heat that equipment during operation such as mainboard gave out through the heat-conducting plate simultaneously, and on heat transfer arrived radiating fin, mutually support through radiating fin and radiator fan, make the heat discharge from the thermovent, can effectively promote the radiating effect to quick-witted case.

(2) The utility model utilizes the Peltier effect of the semiconductor material through the semiconductor refrigeration sheet, when the direct current passes through the galvanic couple formed by connecting two different semiconductor materials in series, the two ends of the galvanic couple can respectively absorb heat and emit heat, thereby realizing the refrigeration purpose, thereby cooling the cooling water, further improving the heat dissipation effect of the case through the continuous circulation cooling water, the cooling water can be injected into the water tank through the water filling port, and the water filling port and the water tank form a communicating vessel structure, when the water in the water tank is short of water, the cooling water can be timely supplemented, and simultaneously the water tank is always in a high water level state, thereby effectively reducing the flow sound when the cooling water circulates, more muting is used.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural view of the heat dissipation fin of the present invention;

fig. 3 is a schematic structural diagram of the dustproof mechanism of the present invention.

In the figure: 1. a chassis; 2. a heat dissipation mechanism; 201. protecting the cylinder; 202. a heat dissipation fan; 203. a heat dissipating fin; 204. a partition plate; 205. a heat conducting plate; 3. a water cooling mechanism; 301. a water tank; 302. a semiconductor refrigeration sheet; 303. a micro water pump; 304. a flow guide hole; 305. a conduit; 306. a water injection port; 307. a sealing cap; 4. a dust-proof mechanism; 401. a heat dissipation port; 402. a mounting ring; 403. a dust screen.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

As shown in fig. 1-3, the utility model provides a technical solution: the utility model provides a desktop machine case radiator, desktop machine case radiator includes quick-witted case 1, heat dissipation mechanism 2, water-cooling mechanism 3 and

dustproof mechanism

4, 1 inner chamber fixed mounting of machine case has

heat dissipation mechanism

2, 2 bottom fixed mounting of heat dissipation mechanism have water-cooling mechanism 3, the lateral wall demountable installation of 1 both sides of machine case has dustproof mechanism 4.

Preferably, the heat dissipation mechanism 2 is composed of a casing 201, a heat dissipation fan 202, a heat dissipation fin 203, a separation plate 204 and a heat conduction plate 205, and the casing 201, the heat dissipation fan 202, the heat dissipation fin 203, the separation plate 204 and the heat conduction plate 205 constitute the heat dissipation mechanism 2.

Preferably, the casing 201 is fixedly welded on two sides of the inner wall of the case 1, the inner cavity of the casing 201 is fixedly provided with the heat dissipation fan 202 through a bracket, the opening end of the casing 201 is fixedly welded with the heat dissipation fins 203, the heat dissipation fins 203 are made of aluminum materials, the heat dissipation fins 203 are in a semi-surrounding structure, one side of the heat dissipation fins 203 is fixedly connected with the heat conduction plate 205, one side of the inner cavity of the heat dissipation fins 203 is formed with a separation plate 204, equipment such as a mainboard can be installed through the separation plate 204, the separation plate 204 is connected with the heat dissipation fins 203, the heat dissipation fins 203 and the separation plate 204 are supported by the aluminum materials, the overall quality is light, the overall quality of the case 1 can be effectively reduced, meanwhile, heat emitted by the equipment such as the mainboard during working can be absorbed through the heat conduction plate 205, the heat is transmitted to the heat dissipation, the heat is discharged from the heat-dissipating port 401, so that the heat-dissipating effect on the case 1 can be effectively improved.

Preferably, the water cooling mechanism 3 is composed of a water tank 301, a semiconductor refrigeration piece 302, a micro water pump 303, a diversion hole 304, a conduit 305, a water filling port 306 and a sealing cap 307, and the water tank 301, the semiconductor refrigeration piece 302, the micro water pump 303, the diversion hole 304, the conduit 305, the water filling port 306 and the sealing cap 307 constitute the water cooling mechanism 3.

Preferably, the semiconductor refrigeration sheet 302 is fixedly embedded at the bottom of the inner cavity of the water tank 301, the micro water pump 303 is fixedly connected to the top of the water tank 301, the inner cavity of the heat dissipation fin 203 is provided with a plurality of groups of flow guide holes 304, the flow guide holes 304 are connected through a guide pipe 305, the flow guide holes 304 and the water tank 301 form a circulation structure, one end of the water tank 301 is fixedly connected with a water filling port 306, the top of the water filling port 306 is in threaded connection with a sealing cap 307, cooling water in the water tank 301 is extracted through the micro water pump 303 and is injected into the flow guide holes 304 through the guide pipe, and the cooling water is circulated, so that heat in the heat dissipation fin 203 can be taken away through the cooling water, meanwhile, the semiconductor refrigeration sheet 302 utilizes the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two, can realize refrigerated purpose, thereby can cool down the cooling water, through continuous recirculated cooling water, thereby with the further radiating effect of promotion to quick-witted case 1, can inject the cooling water into in to water tank 301 through water filling port 306, and water filling port 306 and water tank 301 constitute the linker structure, can in time supply the cooling water when lack of water in water tank 301, water tank 301 is in high water level state all the time simultaneously, can effectively reduce the rivers sound when cooling water circulates, use more silence.

Preferably, dustproof mechanism 4 comprises thermovent 401, collar 402 and dust screen 403, the fixed surface of seting up in quick-witted case 1 both sides of thermovent 401, thermovent 401 inner chamber threaded connection has collar 402, collar 402 inner chamber fixed mounting has dust screen 403, can carry out the separation to the dust through dust screen 403, avoids the dust to enter into quick-witted case 1 inner chamber, can effectively avoid the dust to cause the loss to equipment such as heat dissipation mechanism 2 and mainboard, and dust screen 403 is connected with thermovent 401 through collar 402 to can dismantle dust screen 403 fast, so that wash dust screen 403.

It should be noted that, when the desktop case radiator works, the equipments such as the motherboard and the like can be installed through the partition plate 204, and the partition plate 204 is connected with the radiating fins 203, the radiating fins 203 and the partition plate 204 are all supported by aluminum material, the weight is light, the overall quality of the case 1 can be effectively reduced, meanwhile, the heat emitted by the equipments such as the motherboard and the like during working can be absorbed through the heat conducting plate 205, the heat is transferred to the radiating fins 203, the heat is discharged from the radiating port 401 through the mutual matching of the radiating fins 203 and the radiating fan 202, the radiating effect on the case 1 can be effectively improved, the cooling water in the water tank 301 is extracted through the micro-water pump 303, the cooling water is injected into the flow guide holes 304 through the conduit, the heat in the radiating fins 203 can be taken away through the cooling water by circulating the cooling water, meanwhile, the Peltier effect of the semiconductor material is utilized through the semiconductor refrigeration sheet 302, when direct current passes through a couple formed by connecting two different semiconductor materials in series, the two ends of the couple can respectively absorb heat and emit heat, the refrigeration purpose can be realized, cooling water can be cooled, the heat dissipation effect on the case 1 can be further improved by continuously circulating the cooling water, the cooling water can be injected into the water tank 301 through the water injection port 306, the water injection port 306 and the water tank 301 form a communicating vessel structure, the cooling water can be timely supplemented when the water tank 301 is short of water, meanwhile, the water tank 301 is always in a high water level state, the water flow sound during the circulation of the cooling water can be effectively reduced, more silence can be used, dust can be blocked through the dust screen 403, the dust is prevented from entering the inner cavity of the case 1, the loss of the dust on the heat dissipation mechanism 2, a mainboard and other devices can be effectively avoided, and the dust screen 403 is connected with the heat dissipation port 401 through the mounting ring 402, so that the dust screen 403 can be quickly removed to clean the dust screen 403.

The 5V-DRGB type heat dissipation fan 202, the TEC1-12706 type semiconductor refrigeration piece 302 and the PH-101E type micro water pump 303 are all products of the prior art, and detailed description is omitted.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a desktop machine case radiator which characterized in that: desktop machine case radiator includes quick-witted case (1), heat dissipation mechanism (2), water-cooling mechanism (3) and dustproof mechanism (4), quick-witted case (1) inner chamber fixed mounting has heat dissipation mechanism (2), heat dissipation mechanism (2) bottom fixed mounting has water-cooling mechanism (3), the lateral wall demountable installation of quick-witted case (1) both sides has dustproof mechanism (4).

2. The desktop chassis heat sink of claim 1, wherein: the heat dissipation mechanism (2) is composed of a protective cylinder (201), a heat dissipation fan (202), heat dissipation fins (203), a separation plate (204) and a heat conduction plate (205).

3. The desktop chassis heat sink of claim 2, wherein: protect a section of thick bamboo (201) fixed welding in quick-witted case (1) inner wall both sides, it all has heat dissipation fan (202) to protect a section of thick bamboo (201) inner chamber through support fixed mounting, the equal fixed welding of a section of thick bamboo (201) open end has radiating fin (203), radiating fin (203) are aluminium material, and radiating fin (203) are half surround structure, radiating fin (203) one side fixed surface is connected with heat-conducting plate (205), radiating fin (203) inner chamber one side shaping has division board (204).

4. The desktop chassis heat sink of claim 3, wherein: the water cooling mechanism (3) is composed of a water tank (301), a semiconductor refrigerating sheet (302), a micro water pump (303), a flow guide hole (304), a guide pipe (305), a water injection port (306) and a sealing cap (307).

5. The desktop chassis heat sink of claim 4, wherein: fixed the inlaying in water tank (301) inner chamber bottom has semiconductor refrigeration piece (302), water tank (301) top fixedly connected with micro-water pump (303), water conservancy diversion hole (304) have been seted up to radiating fin (203) inner chamber, and water conservancy diversion hole (304) are provided with the multiunit altogether, connect through pipe (305) in the middle of water conservancy diversion hole (304), and pipe (305), water conservancy diversion hole (304) and water tank (301) constitute circulation structure, water tank (301) one end fixedly connected with water filling port (306), water filling port (306) top threaded connection has sealed cap (307).

6. The desktop chassis heat sink of claim 1, wherein: dustproof mechanism (4) comprise thermovent (401), collar (402) and dust screen (403), thermovent (401) are fixed to be seted up on quick-witted case (1) both sides surface, thermovent (401) inner chamber threaded connection has collar (402), collar (402) inner chamber fixed mounting has dust screen (403).