CN117510794A - 组合物 - Google Patents

组合物 Download PDF

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Publication number
CN117510794A
CN117510794A CN202311534288.6A CN202311534288A CN117510794A CN 117510794 A CN117510794 A CN 117510794A CN 202311534288 A CN202311534288 A CN 202311534288A CN 117510794 A CN117510794 A CN 117510794A
Authority
CN
China
Prior art keywords
composition according
group
organic electroluminescent
electroluminescent display
cured body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311534288.6A
Other languages
English (en)
Chinese (zh)
Inventor
石田泰则
栗村启之
山下幸彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN117510794A publication Critical patent/CN117510794A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/36—Epoxy compounds containing three or more epoxy groups together with mono-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/22—Esters containing halogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C09J133/16—Homopolymers or copolymers of esters containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN202311534288.6A 2019-03-27 2020-03-25 组合物 Pending CN117510794A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019-060958 2019-03-27
JP2019060958 2019-03-27
CN202080007209.4A CN113227159B (zh) 2019-03-27 2020-03-25 组合物
PCT/JP2020/013459 WO2020196669A1 (ja) 2019-03-27 2020-03-25 組成物

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202080007209.4A Division CN113227159B (zh) 2019-03-27 2020-03-25 组合物

Publications (1)

Publication Number Publication Date
CN117510794A true CN117510794A (zh) 2024-02-06

Family

ID=72612008

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202311534288.6A Pending CN117510794A (zh) 2019-03-27 2020-03-25 组合物
CN202080007209.4A Active CN113227159B (zh) 2019-03-27 2020-03-25 组合物

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202080007209.4A Active CN113227159B (zh) 2019-03-27 2020-03-25 组合物

Country Status (5)

Country Link
JP (2) JP7269323B2 (https=)
KR (1) KR102922565B1 (https=)
CN (2) CN117510794A (https=)
TW (1) TWI828891B (https=)
WO (1) WO2020196669A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020196669A1 (ja) * 2019-03-27 2020-10-01 デンカ株式会社 組成物
JP7440498B2 (ja) * 2019-04-23 2024-02-28 デンカ株式会社 組成物
JP7648666B2 (ja) * 2023-02-21 2025-03-18 Jsr株式会社 有機ｅｌ素子用封止剤、硬化膜、有機ｅｌ素子及び有機ｅｌ素子の製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59204676A (ja) * 1983-05-09 1984-11-20 Mitsubishi Rayon Co Ltd 高屈折率感光性接着剤
JPH08109231A (ja) * 1994-10-13 1996-04-30 Nippon Kayaku Co Ltd モータ類回転子のバランス用活性エネルギー線硬化性樹脂組成物及びそれらを用いてバランス修正された回転子
JPH09110909A (ja) * 1995-10-23 1997-04-28 Dainippon Printing Co Ltd 高分子微粒子の製造方法
JPH1074583A (ja) 1996-08-30 1998-03-17 Sanyo Electric Co Ltd 有機ｅｌディスプレイ及び有機ｅｌディスプレイの 製造方法
JP2001357973A (ja) 2000-06-15 2001-12-26 Sony Corp 表示装置
JP4850231B2 (ja) * 2005-01-26 2012-01-11 積水化学工業株式会社 有機エレクトロルミネッセンス素子用封止剤
JP2006236987A (ja) * 2005-01-26 2006-09-07 Sekisui Chem Co Ltd 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス素子の封止方法及び有機エレクトロルミネッセンス素子
JP5570275B2 (ja) * 2010-03-31 2014-08-13 旭化成イーマテリアルズ株式会社 ドライフィルムレジストロール
JP5840574B2 (ja) * 2012-07-11 2016-01-06 富士フイルム株式会社 二酸化炭素分離用複合体の製造方法、二酸化炭素分離用複合体、及び二酸化炭素分離用モジュール
KR102091871B1 (ko) * 2012-07-26 2020-03-20 덴카 주식회사 수지 조성물
WO2014175169A1 (ja) * 2013-04-23 2014-10-30 三菱瓦斯化学株式会社 ポリアミド樹脂組成物、及び成形体
JP2015042487A (ja) 2013-07-25 2015-03-05 東洋紡株式会社 透明バリアフィルム
US10683414B2 (en) * 2014-01-23 2020-06-16 Denka Company Limited Resin composition
JP5914778B2 (ja) * 2014-01-23 2016-05-11 株式会社ダイセル 封止用組成物
WO2016098659A1 (ja) * 2014-12-15 2016-06-23 東レ株式会社 ポリマーイオン透過膜、複合イオン透過膜、電池用電解質膜および電極複合体
JP2019162565A (ja) * 2016-07-25 2019-09-26 富士フイルム株式会社 ガス分離膜、ガス分離膜モジュールおよびガス分離装置
KR102537249B1 (ko) * 2017-03-30 2023-05-26 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 가용성 다관능 비닐 방향족 공중합체, 그 제조 방법, 경화성 수지 조성물 및 그 경화물
WO2019039587A1 (ja) * 2017-08-24 2019-02-28 デンカ株式会社 有機エレクトロルミネッセンス素子用封止剤
CN112204438B (zh) * 2018-06-01 2022-08-09 住友化学株式会社 偏光膜及其制造方法、偏光板以及显示装置
WO2020149384A1 (ja) * 2019-01-17 2020-07-23 デンカ株式会社 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び装置の製造方法
WO2020196669A1 (ja) 2019-03-27 2020-10-01 デンカ株式会社 組成物

Also Published As

Publication number Publication date
CN113227159B (zh) 2024-04-19
KR102922565B1 (ko) 2026-02-03
TWI828891B (zh) 2024-01-11
CN113227159A (zh) 2021-08-06
JP7269323B2 (ja) 2023-05-08
JP7514285B2 (ja) 2024-07-10
KR20210148073A (ko) 2021-12-07
JP2023012530A (ja) 2023-01-25
TW202102601A (zh) 2021-01-16
JPWO2020196669A1 (https=) 2020-10-01
WO2020196669A1 (ja) 2020-10-01

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