CN117457764A - Photovoltaic board production facility - Google Patents
Photovoltaic board production facility Download PDFInfo
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- CN117457764A CN117457764A CN202311405020.2A CN202311405020A CN117457764A CN 117457764 A CN117457764 A CN 117457764A CN 202311405020 A CN202311405020 A CN 202311405020A CN 117457764 A CN117457764 A CN 117457764A
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- photovoltaic panel
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000002210 silicon-based material Substances 0.000 claims abstract description 38
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 33
- 239000010703 silicon Substances 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 23
- 238000000576 coating method Methods 0.000 claims abstract description 23
- 238000005245 sintering Methods 0.000 claims abstract description 22
- 238000006243 chemical reaction Methods 0.000 claims abstract description 21
- 238000009792 diffusion process Methods 0.000 claims abstract description 21
- 238000007650 screen-printing Methods 0.000 claims abstract description 19
- 238000005530 etching Methods 0.000 claims abstract description 16
- 238000007639 printing Methods 0.000 claims abstract description 13
- 239000002313 adhesive film Substances 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims abstract description 8
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims description 35
- 238000010438 heat treatment Methods 0.000 claims description 21
- 239000007789 gas Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 claims description 12
- 238000009423 ventilation Methods 0.000 claims description 10
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 229910000077 silane Inorganic materials 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 210000002268 wool Anatomy 0.000 claims description 6
- 230000007306 turnover Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1864—Annealing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to the technical field of photovoltaics, in particular to photovoltaic panel production equipment. In the invention, by arranging the slicing device, the texturing device, the diffusion device, the etching device, the coating device, the screen printing device, the sintering device, the first film pasting device, the second film pasting device and the assembling device in sequence, the invention realizes the following steps: slicing the silicon material to obtain silicon material slices; the roughness of the front surface and the back surface of the silicon slice is increased; forming a silicon slice single-sided PN junction; removing PN junctions on the side surfaces of the silicon material slices; silicon nitride coating is carried out on one surface of the silicon material slice forming PN junction; carrying out circuit printing on the front side and the back side of the silicon slice; sintering circuits printed on the front side and the back side of the silicon slice; sticking a double-sided EVA adhesive film on the silicon slice; respectively sticking glass and a back film on the front side and the back side of the silicon slice; the silicon slice is subjected to frame embedding and junction box fixing; therefore, the photoelectric conversion rate of the photovoltaic panel can be further improved based on the device provided by the invention.
Description
Technical Field
The invention relates to the technical field of photovoltaics, in particular to photovoltaic panel production equipment.
Background
With the rapid development of technology, people pay more and more attention to the effective utilization of renewable clean energy sources such as solar energy, and in recent years, particularly in the photovoltaic field, great progress has been made. Although the existing photovoltaic panel production equipment can produce photovoltaic panels suitable for various occasions, the produced photovoltaic panels still have the technical problem of low photoelectric conversion rate. In view of the foregoing, there is a need for a photovoltaic panel production apparatus to solve the foregoing technical problems.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, the present invention provides a photovoltaic panel production apparatus which solves the following problems: based on the existing photovoltaic panel production equipment, the technical problem that the photovoltaic panel produced is low in photoelectric conversion rate is solved.
In order to achieve the above purpose, the main technical scheme adopted by the invention comprises the following steps:
the invention provides a photovoltaic panel production device, in particular to a photovoltaic panel production device, which comprises: the device comprises a slicing device, a texturing device, a diffusion device, an etching device, a coating device, a screen printing device, a sintering device, a first film pasting device, a second film pasting device and an assembling device which are sequentially connected;
the slicing device is used for slicing the silicon material to obtain silicon material slices; the texturing device is used for increasing the roughness of the front surface and the back surface of the silicon slice; the diffusion device is used for forming a single-sided PN junction of the silicon slice; the etching device is used for removing PN junctions on the side surfaces of the silicon material slices; the film plating device is used for carrying out silicon nitride film plating on one surface of the silicon material slice forming the PN junction; the screen printing device is used for conducting circuit printing on the front side and the back side of the silicon material slice; the sintering device is used for sintering the circuits printed on the front side and the back side of the silicon material slice; the first film pasting device is used for pasting the double-sided EVA adhesive film on the silicon slice; the second film pasting device is used for pasting glass and a back film on the front side and the back side of the silicon material slice respectively; the assembling device is used for carrying out frame embedding and junction box fixing on the silicon material slice.
Optionally, the slicing device comprises a slicing limiter, a horizontal cutting knife and a fixing frame; the slice limiter is fixed on the fixing frame based on the fixing rod, and the horizontal cutting knife is fixed on the fixing frame based on the telescopic rod;
the setting height of the horizontal cutting knife corresponds to the height of the opening at the lower end of the slice limiter; the bottom surface of the fixing frame is provided with a through hole, and the through hole is arranged right below the opening at the lower end of the slicing limiter.
Optionally, an acid storage tank and a containing plate are arranged in the wool making device, and the first containing plate is fixed at the bottom end of the acid storage tank based on the telescopic device; the acid storage tank is used for containing hydrofluoric acid;
the material feeding port of the wool making device is positioned right below the through hole arranged on the bottom surface of the fixing frame; the texturing device is communicated with the diffusion device based on the conveying device.
Optionally, a heating device, a storage tank and a first hollowed-out containing plate are arranged in the diffusion device; the first hollowed-out containing plate is fixed at the bottom end of the storage tank based on the telescopic device; the storage tank is used for storing phosphorus oxychloride, and the heating device is used for heating the phosphorus oxychloride in the storage tank;
the side wall of the diffusion device is provided with a discharge hole.
Optionally, two parallel limit edges with equal length are arranged at the edge of the first operation table corresponding to the etching device, and friction surfaces are arranged on the inner sides of the limit edges and used for removing PN junctions on the side surfaces of the silicon material slices; the first operation table corresponding to the etching device is positioned below a discharge hole arranged on the diffusion device;
the first movable support is of a structure that a first horizontal part and a first vertical part are connected into a whole, the bottom surface of the first vertical part is embedded in a slide way arranged on the upper surface of a limit rib, and the fixing piece is fixed on the lower end surface of the first horizontal part based on the telescopic device.
Optionally, a heating device, a gas reaction tank and a second hollowed-out containing plate are arranged in the coating device; the second hollowed-out containing plate is fixed at the bottom end of the gas reaction tank based on the telescopic device; the gas reaction tank is used for storing silane and oxygen, and the heating device is used for heating the silane and the oxygen in the gas reaction tank; the first vent pipe and the second vent pipe are communicated with the gas reaction tank; the first ventilation pipe is used for conveying silane, and the second ventilation pipe is used for conveying oxygen;
the feed inlet of the coating device is positioned below the tail end of the first operation table; the side wall of the coating device is provided with a discharge hole.
Optionally, two parallel limit edges with equal length are arranged at the edge of the second operation table corresponding to the screen printing device; the second operation table corresponding to the screen printing device is positioned below a discharge hole arranged in the coating device;
the second movable support is of a structure that a second horizontal part, a second vertical part and a printing template are connected into a whole, the bottom surface of the second vertical part is embedded in a slide way arranged on the upper surface of a limit rib, the painting brush is fixed on the lower end surface of the second horizontal part based on a telescopic device, and the printing template is horizontally and fixedly arranged at the bottom end of the second vertical part;
and a material containing turnover plate is arranged at the tail end of the second operation table corresponding to the screen printing device and used for turnover of the silicon material slice.
Optionally, the sintering device comprises: a third console, and a first sealing cover adapted to the third console; the third operation table is fixedly connected with the first sealing cover based on the first connecting rod;
the third operating platform and the first sealing cover are respectively provided with a heating device;
the third operation panel is arranged below the tail end of the material containing turnover plate.
Optionally, the first film pasting device includes: a fourth operation panel, and a second sealing cover adapted to the fourth operation panel; the fourth operation table is fixedly connected with the second sealing cover based on the second connecting rod;
the second film sticking device comprises: a fifth operation table, and a third sealing cover adapted to the fifth operation table; the fifth operation table is fixedly connected with a third sealing cover based on a third connecting rod;
the first film pasting device is communicated with the sintering device based on the conveying device, and the second film pasting device is communicated with the first film pasting device based on the conveying device.
Optionally, the assembling device comprises: a sixth operation table, and a fourth sealing cover adapted to the sixth operation table; the sixth operation table is fixedly connected with a fourth sealing cover based on a fourth connecting rod; the sixth operation table is provided with a discharge hole;
the assembling device is communicated with the second film pasting device based on the conveying device.
Advantageous effects
In this application, through setting up section device, wool making device, diffusion device, etching device, coating film device, screen printing device, sintering device, first pad pasting device, second pad pasting device and assembly device in order, realized: the roughness of the front surface and the back surface of the silicon slice is increased; forming a silicon slice single-sided PN junction; removing PN junctions on the side surfaces of the silicon material slices; silicon nitride coating is carried out on one surface of the silicon material slice forming PN junction; carrying out circuit printing on the front side and the back side of the silicon slice; sintering circuits printed on the front side and the back side of the silicon slice; sticking a double-sided EVA adhesive film on the silicon slice; respectively sticking glass and a back film on the front side and the back side of the silicon slice; and (5) performing frame embedding and junction box fixing on the silicon slice. In summary, the photoelectric conversion rate of the photovoltaic panel can be further improved.
Description of the drawings:
fig. 1 is a schematic view of the overall structure of a photovoltaic panel production apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a texturing apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic view of a diffusing device according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a coating device according to an embodiment of the present invention;
the components contained in the foregoing fig. 1 to 4 are specifically:
the slicing device-1, the slicing limiter-1-1, the horizontal cutting knife-1-2, the fixing frame-1-3, the texturing device-2, the acid storage tank-2-1, the containing plate-2-2, the diffusion device-3, the storage tank-3-1, the first hollowed containing plate-3-2, the etching device-4, the first operating platform-4-1, the limit rib-4-2, the first movable bracket-4-3, the first horizontal part-4-3-1, the second vertical part-4-3-2, the coating device-5, the gas reaction tank-5-1, the second hollowed containing plate-5-2, the first vent pipe-5-3, the second vent pipe-5-4 the screen printing device-6, the second operation table-6-1, the limit bar-6-2, the second movable bracket-6-3, the second horizontal part-6-3-1, the second vertical part-6-3-2, the printing template-6-3-4, the painting brush-6-4, the material-containing turning plate-6-5, the sintering device-7, the third operation table-7-1, the first sealing cover-7-2, the first connecting rod-7-3, the first film pasting device-8, the fourth operation table-8-1, the second sealing cover-8-2, the second connecting rod-8-3, the second film pasting device-9, the fifth operation table 9-1, the device comprises a third sealing cover-9-2, a third connecting rod-9-3, an assembling device-10, a sixth operating platform-10-1, a fourth sealing cover-10-2 and a fourth connecting rod-10-3.
Detailed Description
The invention will be better explained by the following detailed description of the embodiments with reference to the drawings.
In order that the above-described aspects may be better understood, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
Example 1
The present embodiment proposes a photovoltaic panel production apparatus, as shown in fig. 1, including: the slicing device 1, the texturing device 2, the diffusion device 3, the etching device 4, the coating device 5, the screen printing device 6, the sintering device 7, the first film pasting device 8, the second film pasting device 9 and the assembling device 10 are connected in sequence.
In this embodiment, it should be noted that: a slicing device 1 for slicing the silicon material to obtain silicon material slices; the texturing device 2 is used for increasing the roughness of the front surface and the back surface of the silicon slice; the diffusion device 3 is used for forming a single-sided PN junction of the silicon slice; the etching device 4 is used for removing PN junctions on the side surfaces of the silicon material slices; the film plating device 5 is used for plating a silicon nitride film on one surface of the silicon material slice forming the PN junction; the screen printing device 6 is used for conducting circuit printing on the front side and the back side of the silicon material slice; the sintering device 7 is used for sintering the circuits printed on the front side and the back side of the silicon slice; the first film pasting device 8 is used for pasting the double-sided EVA adhesive film on the silicon slice; the second film pasting device 9 is used for pasting glass and a back film on the front side and the back side of the silicon material slice respectively; the assembly device 10 is used for frame embedding and junction box fixing of silicon material slices.
In this embodiment, as shown in FIG. 1, a slicing device 1 includes a slicing stopper 1-1, a horizontal cutter 1-2, and a fixing frame 1-3; the slice limiter 1-1 is fixed on the fixing frame 1-3 based on a fixing rod, and the horizontal cutting knife 1-2 is fixed on the fixing frame 1-3 based on a telescopic rod; the setting height of the horizontal cutting knife 1-2 corresponds to the height of the opening at the lower end of the slice limiter 1-1; the bottom surface of the fixing frame 1-3 is provided with a through hole, and the through hole is arranged right below the opening at the lower end of the slicing limiter 1-1.
In this embodiment, referring to fig. 1 and 2, a storage tank 2-1 and a holding plate 2-2 are disposed in a texturing device 2, and a first holding plate 2-2 is fixed at the bottom end of the storage tank 2-1 based on a telescopic device; the acid storage tank 2-1 is used for containing hydrofluoric acid; the material inlet of the wool making device 2 is positioned right below the through hole arranged on the bottom surface of the fixing frame 1-3; the texturing device 2 is communicated with the diffusion device 3 based on a conveying device.
In this embodiment, referring to fig. 1 and 3, a heating device, a storage tank 3-1 and a first hollow accommodating plate 3-2 are arranged in the diffusion device 3; the first hollowed-out containing plate 3-2 is fixed at the bottom end of the storage tank 3-1 based on a telescopic device; the storage tank 3-1 is used for storing phosphorus oxychloride, and the heating device is used for heating the phosphorus oxychloride in the storage tank 3-1; the side wall of the diffusion device 3 is provided with a discharge hole.
In this embodiment, as shown in fig. 1, two parallel limit edges 4-2 with equal length are arranged at the edge of the first operation table 4-1 corresponding to the etching device 4, and a friction surface is arranged on the inner side of the limit edge 4-2 and is used for removing the PN junction on the side surface of the silicon slice; the first operation table 4-1 corresponding to the etching device 4 is positioned below a discharge hole arranged on the diffusion device 3; the first movable support 4-3 is of a structure that a first horizontal part 4-3-1 and a first vertical part 4-3-2 are connected into a whole, the bottom surface of the first vertical part 4-3-2 is embedded in a slide way arranged on the upper surface of the limit rib 4-2, and the fixing piece 4-4 is fixed on the lower end surface of the first horizontal part 4-3-1 based on a telescopic device.
In this embodiment, referring to fig. 1 and 4, a heating device, a gas reaction tank 5-1, and a second hollow accommodating plate 5-2 are disposed in the coating device 5; the second hollow accommodating plate 5-2 is fixed at the bottom end of the gas reaction tank 5-1 based on a telescopic device; the gas reaction tank 5-1 is used for storing silane and oxygen, and the heating device is used for heating the silane and the oxygen in the gas reaction tank 5-1; the first ventilation pipe 5-3 and the second ventilation pipe 5-4 are communicated with the gas reaction tank 5-1; the first ventilation pipe 5-3 is used for conveying silane, and the second ventilation pipe 5-4 is used for conveying oxygen; the feeding port of the coating device 5 is positioned below the tail end of the first operation table 4-1; the side wall of the coating device 5 is provided with a discharge hole.
In this embodiment, as shown in fig. 1, two parallel limit edges 6-2 with equal length are arranged at the edge of the second operation table 6-1 corresponding to the screen printing device 6; the second operation table 6-1 corresponding to the screen printing device 6 is positioned below a discharge hole arranged in the coating device 5; the second movable bracket 6-3 is of a structure that a second horizontal part 6-3-1, a second vertical part 6-3-2 and a printing template 6-3 are connected into a whole, the bottom surface of the second vertical part 6-3-2 is embedded in a slideway arranged on the upper surface of a limit rib 6-2, the smearing hairbrush 6-4 is fixed on the lower end surface of the second horizontal part 6-3-1 based on a telescopic device, and the printing template 6-3-3 is horizontally and fixedly arranged at the bottom end of the second vertical part 6-3-2; the tail end of a second operation table 6-1 corresponding to the screen printing device 6 is provided with a material containing turnover plate 6-5, and the material containing turnover plate 6-5 is used for turnover of silicon material slices.
In this embodiment, as shown in fig. 1, the sintering device 7 includes: a third operating table 7-1, and a first sealing cover 7-2 adapted to the third operating table 7-1; the third operation table 7-1 is fixedly connected with the first sealing cover 7-2 based on the first connecting rod 7-3; the third operation table 7-1 and the first sealing cover 7-2 are respectively provided with a heating device; the third operating platform 7-1 is arranged below the tail end of the material containing turnover plate 6-5.
In this embodiment, as shown in fig. 1, the first film sticking device 8 includes: a fourth operation table 8-1, and a second sealing cover 8-2 adapted to the fourth operation table 8-1; the fourth operation table 8-1 is fixedly connected with the second sealing cover 8-2 based on the second connecting rod 8-3; the first film pasting device 8 is communicated with the sintering device 7 based on a conveying device; it should be noted that: EVA adhesive film is laminated in fourth operation panel 8-1 and sealed lid 8-2 of second respectively, based on the cooperation of fourth operation panel 8-1 and sealed lid 8-2 of second, can realize carrying out two-sided EVA adhesive film to the silicon material section and paste.
In this embodiment, as shown in fig. 1, the second film sticking device 9 includes: a fifth operation table 9-1, and a third sealing cover 9-2 adapted to the fifth operation table 9-1; the fifth operation table 9-1 is fixedly connected with the third sealing cover 9-2 based on the third connecting rod 9-3; the second film pasting device 9 is communicated with the first film pasting device 8 based on a conveying device; it should be noted that: the glass and the back film are respectively attached to the fifth operation table 9-1 and the third sealing cover 9-2, and the glass and the back film can be respectively attached to the front side and the back side of the silicon material slice based on the cooperation of the fifth operation table 9-1 and the third sealing cover 9-2.
In this embodiment, as shown in fig. 1, the assembling apparatus 10 includes: a sixth operation table 10-1, and a fourth sealing cover 10-2 adapted to the sixth operation table 10-1; the sixth operating platform 10-1 is fixedly connected with the fourth sealing cover 10-2 based on the fourth connecting rod 10-3; the sixth operation table 10-1 is provided with a discharge port; the assembling device 10 is communicated with the second film pasting device 9 based on the conveying device; it should be noted that: the frame is arranged on the sixth operation table 10-1, the junction box is arranged on the fourth sealing cover 10-2, and frame embedding and junction box fixing of the silicon material slice can be realized based on the matching of the sixth operation table 10-1 and the fourth sealing cover 10-2.
For the photovoltaic panel production apparatus described in the first embodiment, by arranging the slicing device, the texturing device, the diffusing device, the etching device, the coating device, the screen printing device, the sintering device, the first film sticking device, the second film sticking device, and the assembling device in this order, it is achieved that: the roughness of the front surface and the back surface of the silicon slice is increased; forming a silicon slice single-sided PN junction; removing PN junctions on the side surfaces of the silicon material slices; silicon nitride coating is carried out on one surface of the silicon material slice forming PN junction; carrying out circuit printing on the front side and the back side of the silicon slice; sintering circuits printed on the front side and the back side of the silicon slice; sticking a double-sided EVA adhesive film on the silicon slice; respectively sticking glass and a back film on the front side and the back side of the silicon slice; and (5) performing frame embedding and junction box fixing on the silicon slice. In summary, the photoelectric conversion rate of the photovoltaic panel can be further improved.
It should be noted that in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The use of the terms first, second, third, etc. are for convenience of description only and do not denote any order. These terms may be understood as part of the component name.
Furthermore, it should be noted that in the description of the present specification, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with the embodiment or example being included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art upon learning the basic inventive concepts. Therefore, the appended claims should be construed to include preferred embodiments and all such variations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, the present invention should also include such modifications and variations provided that they come within the scope of the following claims and their equivalents.
Claims (10)
1. A photovoltaic panel production apparatus, characterized in that the photovoltaic production apparatus comprises: the device comprises a slicing device (1), a texturing device (2), a diffusion device (3), an etching device (4), a coating device (5), a screen printing device (6), a sintering device (7), a first film pasting device (8), a second film pasting device (9) and an assembling device (10) which are sequentially connected;
the slicing device (1) is used for slicing the silicon material to obtain silicon material slices; the texturing device (2) is used for increasing the roughness of the front surface and the back surface of the silicon slice; the diffusion device (3) is used for forming a single-sided PN junction of the silicon slice; the etching device (4) is used for removing PN junctions on the side surfaces of the silicon material slices; the film plating device (5) is used for carrying out silicon nitride film plating on one surface of the silicon material slice forming the PN junction; the screen printing device (6) is used for conducting circuit printing on the front side and the back side of the silicon material slice; the sintering device (7) is used for sintering the circuits printed on the front side and the back side of the silicon material slice; the first film pasting device (8) is used for pasting the double-sided EVA adhesive film on the silicon slice; the second film pasting device (9) is used for pasting glass and a back film on the front side and the back side of the silicon material slice respectively; the assembling device (10) is used for carrying out frame embedding and junction box fixing on the silicon material slice.
2. The photovoltaic panel production apparatus according to claim 1, wherein,
the slicing device (1) comprises a slicing limiter (1-1), a horizontal cutting knife (1-2) and a fixing frame (1-3); the slicing limiter (1-1) is fixed on the fixing frame (1-3) based on a fixing rod, and the horizontal cutting knife (1-2) is fixed on the fixing frame (1-3) based on a telescopic rod;
the setting height of the horizontal cutting knife (1-2) corresponds to the height of the lower end opening of the slice limiter (1-1); the bottom surface of the fixing frame (1-3) is provided with a through hole, and the through hole is arranged right below the opening at the lower end of the slicing limiter (1-1).
3. The photovoltaic panel production apparatus according to claim 2, wherein,
the wool making device (2) is internally provided with an acid storage tank (2-1) and a containing plate (2-2), and the first containing plate (2-2) is fixed at the bottom end of the acid storage tank (2-1) based on a telescopic device; the acid storage tank (2-1) is used for containing hydrofluoric acid;
the material inlet of the wool making device (2) is positioned right below the through hole arranged on the bottom surface of the fixing frame (1-3); the texturing device (2) is communicated with the diffusion device (3) based on the conveying device.
4. The photovoltaic panel production apparatus according to claim 3, wherein,
a heating device, a storage tank (3-1) and a first hollowed-out containing plate (3-2) are arranged in the diffusion device (3); the first hollowed-out containing plate (3-2) is fixed at the bottom end of the storage tank (3-1) based on the telescopic device; the storage tank (3-1) is used for storing phosphorus oxychloride, and the heating device is used for heating the phosphorus oxychloride in the storage tank (3-1);
the side wall of the diffusion device (3) is provided with a discharge hole.
5. The photovoltaic panel production apparatus according to claim 4, wherein,
two parallel limit edges (4-2) with equal length are arranged at the edges of the first operation table (4-1) corresponding to the etching device (4), friction surfaces are arranged on the inner sides of the limit edges (4-2), and the friction surfaces are used for removing PN junctions on the side surfaces of the silicon slices; the first operation table (4-1) corresponding to the etching device (4) is positioned below a discharge hole arranged on the diffusion device (3);
the first movable support (4-3) is of a structure that a first horizontal part (4-3-1) and a first vertical part (4-3-2) are connected into a whole, the bottom surface of the first vertical part (4-3-2) is embedded in a slide way arranged on the upper surface of a limit rib (4-2), and the fixing piece (4-4) is fixed on the lower end surface of the first horizontal part (4-3-1) based on the telescopic device.
6. The photovoltaic panel production apparatus according to claim 5, wherein,
a heating device, a gas reaction tank (5-1) and a second hollowed-out containing plate (5-2) are arranged in the coating device (5); the second hollowed-out containing plate (5-2) is fixed at the bottom end of the gas reaction tank (5-1) based on the telescopic device; the gas reaction tank (5-1) is used for storing silane and oxygen, and the heating device is used for heating the silane and the oxygen in the gas reaction tank (5-1); the first ventilation pipe (5-3) and the second ventilation pipe (5-4) are communicated with the gas reaction tank (5-1); the first ventilation pipe (5-3) is used for conveying silane, and the second ventilation pipe (5-4) is used for conveying oxygen;
the feed inlet of the coating device (5) is positioned below the tail end of the first operation table (4-1); the side wall of the coating device (5) is provided with a discharge hole.
7. The photovoltaic panel production apparatus according to claim 6, wherein,
two parallel limit edges (6-2) with equal length are arranged at the edge of a second operation table (6-1) corresponding to the screen printing device (6); the second operation table (6-1) corresponding to the screen printing device (6) is positioned below a discharge hole arranged on the coating device (5);
the second movable support (6-3) is of a structure that a second horizontal part (6-3-1), a second vertical part (6-3-2) and a printing template (6-3-3) are connected into a whole, the bottom surface of the second vertical part (6-3-2) is embedded in a slide way arranged on the upper surface of a limit rib (6-2), the smearing hairbrush (6-4) is fixed on the lower end surface of the second horizontal part (6-3-1) based on a telescopic device, and the printing template (6-3-3) is horizontally fixed at the bottom end of the second vertical part (6-3-2);
the tail end of a second operation table (6-1) corresponding to the screen printing device (6) is provided with a material containing and turning plate (6-5), and the material containing and turning plate (6-5) is used for turning over silicon material slices.
8. The photovoltaic panel production apparatus according to claim 7, wherein,
the sintering device (7) comprises: a third operating table (7-1), a first sealing cover (7-2) adapted to the third operating table (7-1); the third operation table (7-1) is fixedly connected with the first sealing cover (7-2) based on the first connecting rod (7-3);
the third operation table (7-1) and the first sealing cover (7-2) are respectively provided with a heating device;
the third operating platform (7-1) is arranged below the tail end of the material holding and turning plate (6-5).
9. The photovoltaic panel production apparatus according to claim 8, wherein,
the first film sticking device (8) comprises: a fourth operating table (8-1), a second sealing cover (8-2) adapted to the fourth operating table (8-1); the fourth operation table (8-1) is fixedly connected with the second sealing cover (8-2) based on the second connecting rod (8-3);
the second film sticking device (9) comprises: a fifth operating table (9-1), a third sealing cover (9-2) adapted to the fifth operating table (9-1); the fifth operation table (9-1) is fixedly connected with the third sealing cover (9-2) based on the third connecting rod (9-3);
the first film pasting device (8) is communicated with the sintering device (7) based on the conveying device, and the second film pasting device (9) is communicated with the first film pasting device (8) based on the conveying device.
10. The photovoltaic panel production apparatus according to claim 9, wherein,
the assembly device (10) comprises: a sixth operating table (10-1), a fourth sealing cover (10-2) adapted to the sixth operating table (10-1); the sixth operation table (10-1) is fixedly connected with the fourth sealing cover (10-2) based on the fourth connecting rod (10-3); the sixth operation table (10-1) is provided with a discharge hole;
the assembly device (10) is communicated with the second film pasting device (9) based on the conveying device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311405020.2A CN117457764A (en) | 2023-10-26 | 2023-10-26 | Photovoltaic board production facility |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311405020.2A CN117457764A (en) | 2023-10-26 | 2023-10-26 | Photovoltaic board production facility |
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| CN202311405020.2A Pending CN117457764A (en) | 2023-10-26 | 2023-10-26 | Photovoltaic board production facility |
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| US20090221217A1 (en) * | 2008-01-24 | 2009-09-03 | Applied Materials, Inc. | Solar panel edge deletion module |
| CN102437241A (en) * | 2011-12-02 | 2012-05-02 | 百力达太阳能股份有限公司 | Preparation method of solar cell with elimination of printing wave line |
| CN106449867A (en) * | 2016-08-30 | 2017-02-22 | 嘉兴奥力弗光伏科技有限公司 | Production method of photovoltaic assembly |
| CN112736160A (en) * | 2020-12-31 | 2021-04-30 | 三江学院 | Preparation method and application of battery piece |
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2023
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|---|---|---|---|---|
| US20090221217A1 (en) * | 2008-01-24 | 2009-09-03 | Applied Materials, Inc. | Solar panel edge deletion module |
| CN102437241A (en) * | 2011-12-02 | 2012-05-02 | 百力达太阳能股份有限公司 | Preparation method of solar cell with elimination of printing wave line |
| CN106449867A (en) * | 2016-08-30 | 2017-02-22 | 嘉兴奥力弗光伏科技有限公司 | Production method of photovoltaic assembly |
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