WO2022021668A1

WO2022021668A1 - Photovoltaic module lamination method and photovoltaic module

Info

Publication number: WO2022021668A1
Application number: PCT/CN2020/128403
Authority: WO
Inventors: 涂中东; 曹国进; 涂会会; 余永林; 朱琛; 吕俊
Original assignee: 泰州隆基乐叶光伏科技有限公司
Priority date: 2020-07-27
Filing date: 2020-11-12
Publication date: 2022-02-03
Also published as: CN111900220A

Abstract

The present disclosure provides a photovoltaic module lamination method and a photovoltaic module, relating to the technical field of solar photovoltaics. The photovoltaic module lamination method comprises: sequentially laying a module cover plate (301), a battery string (302) and a module back plate (303) to obtain a module to be laminated (201); and carrying out a preset lamination operation on said module, enabling the melted module cover plate (301) to be hermetically connected to the battery string (302) and the module back plate (303), and cooling the melted module cover plate (301) to obtain a laminated module (202). The module cover plate (301) and the battery string (302) are directly connected in a sealed manner by means of the module cover plate (301), such that it is avoided that an adhesive film layer is arranged between the module cover plate (301) and the battery string (302). Compared with the prior art, in the power generation process of the photovoltaic module, the absorption and reflection of sunlight by an adhesive film layer is avoided, and the light transmittance of the photovoltaic module is improved, thereby improving the power generation efficiency of the photovoltaic module.

Description

A photovoltaic module lamination method and photovoltaic module

This application claims the priority of the Chinese patent application with the application number 202010732498.6 and titled "A PV Module Lamination Method and Photovoltaic Module" filed with the China Patent Office on July 27, 2020, the entire contents of which are incorporated herein by reference Applying.

technical field

The present disclosure relates to the field of solar photovoltaic technology, and in particular, to a photovoltaic assembly lamination method and photovoltaic assembly.

Background technique

Photovoltaic power generation is a green energy technology that can reduce environmental pollution and protect the environment. Photovoltaic modules are one of the main tools for photovoltaic power generation. Improving the power generation efficiency of photovoltaic modules is conducive to the promotion and use of photovoltaic power generation technology.

Light transmittance is one of the factors affecting the power generation efficiency of photovoltaic modules, and the light transmittance is mainly determined by the structure of photovoltaic modules. In the prior art, the transmittance of photovoltaic modules is low, resulting in low power generation efficiency of the photovoltaic modules.

Overview

The present disclosure provides a photovoltaic module lamination method and photovoltaic module, aiming at solving the problem of low light transmittance of the photovoltaic module, resulting in low power generation efficiency of the photovoltaic module.

Embodiments of the present disclosure also provide a photovoltaic module lamination method, including:

Lay the component cover plate, the battery string and the component back plate in sequence to obtain the component to be laminated; the material of the component cover plate is a material that can be melted when subjected to a preset lamination operation;

The preset lamination operation is performed on the component to be laminated, so that the melted component cover is sealed to connect the battery string and the component backplane, and the melted component cover is cooled, A laminated assembly is obtained.

Optionally, the material of the component backplane is a material that can be melted when subjected to the preset lamination operation;

The preset lamination operation is performed on the components to be laminated, so that the melted component cover is sealed to connect the battery string and the component backplane, and the melted component cover is sealed. Cooling, when the laminated assembly is obtained, also includes:

The melted component backplane is sealed to connect the battery string and the melted component cover, and the melted component backplane is cooled.

Optionally, when the component cover plate, the battery string and the component back plate are sequentially laid to obtain the component to be laminated, the method further includes:

A first bearing plate is laid on the side of the component cover plate away from the component back plate; the first bearing plate is used to form a smooth surface on the side of the component cover plate away from the component back plate;

After said obtaining the laminated assembly, the method further includes:

The first carrier plate is removed to obtain a photovoltaic module.

A second carrier plate is laid on the side of the component backplane facing away from the component cover plate; the second carrier plate is used to form a smooth surface on the side of the component backplane facing away from the component cover plate;

When the photovoltaic module is obtained by removing the first carrier plate, the method further includes:

The second carrier plate is removed.

A first isolation film is laid between the first carrier plate and the component cover plate; the first isolation film is used to prevent the component cover plate from adhering to the first carrier plate;

The first isolation film is removed.

A second isolation film is laid between the second carrier board and the component backplane; the second isolation film is used to prevent the component backplane from adhering to the second carrier board;

The second isolation film is removed.

Embodiments of the present disclosure provide a photovoltaic module, including: a module cover plate, a battery string, and a module back plate;

The component cover plate is arranged opposite to the component back plate;

The battery string is embedded on the side of the component cover plate close to the component back plate; the battery string and the component cover plate are sealed and connected through the component cover plate;

One side of the module backplane close to the module cover plate is sealed with the module cover plate and the battery string, respectively.

Optionally, a side of the battery string close to the component backplane is inlaid on the component backplane; the battery string and the component backplane are sealed and connected through the component backplane;

The side of the component backplane close to the component cover is directly connected with the component cover.

Optionally, the component cover plate and the component back plate are integrally formed.

Optionally, a side of the component backplane facing away from the component cover is a smooth surface.

Optionally, a light-transmitting support plate is provided on the side of the component backplane facing away from the component cover plate.

Optionally, the component cover plate and/or the component back plate are made of any one or more of polycarbonate, polymethyl methacrylate, acrylonitrile-styrene copolymer, polysulfone and polyvinyl chloride. made of materials.

In the embodiment of the present disclosure, the material of the module cover plate is a material that can be melted when subjected to a preset lamination operation. During the lamination process of the photovoltaic module, the module cover plate, the battery string and the module back plate are firstly laid in sequence. The module to be laminated is obtained, and then a preset lamination operation is performed on the module to be laminated, so that the melted module cover is sealed to connect the battery string and the module backplane, and the melted module cover is cooled to obtain a laminated module . The module cover plate and the battery strings are directly sealed and connected through the module cover plate, which avoids setting an adhesive film layer between the module cover plate and the battery string. Compared with the prior art, in the power generation process of the photovoltaic module, the absorption and reflection of sunlight by the adhesive film layer are avoided, the light transmittance of the photovoltaic module is improved, and the power generation efficiency of the photovoltaic module is improved.

The above description is only an overview of the technical solutions of the present disclosure. In order to understand the technical means of the present disclosure more clearly, it can be implemented according to the contents of the description, and in order to make the above-mentioned and other purposes, features and advantages of the present disclosure more obvious and easy to understand , the following specific embodiments of the present disclosure are given.

Brief Description of Drawings

In order to illustrate the technical solutions of the embodiments of the present disclosure more clearly, the following briefly introduces the drawings that are used in the description of the embodiments of the present disclosure. Obviously, the drawings in the following description are only some embodiments of the present disclosure. , for those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative labor.

1 is a schematic structural diagram of a photovoltaic module in the prior art;

FIG. 2 shows a flow chart of steps of a photovoltaic module lamination method in an embodiment of the present disclosure;

3 shows a cross-sectional view of an assembly to be laminated in an embodiment of the present disclosure;

4 shows a cross-sectional view of a laminated assembly in an embodiment of the present disclosure;

5 shows a cross-sectional view of another component to be laminated in an embodiment of the present disclosure;

FIG. 6 shows a flow chart of steps of another photovoltaic module lamination method in an embodiment of the present disclosure;

7 shows a cross-sectional view of yet another laminated assembly in an embodiment of the present disclosure;

8 shows a cross-sectional view of yet another laminated assembly in an embodiment of the present disclosure.

Description of reference numbers:

101-module cover, 102-first film layer, 103-battery string, 104-second film layer, 105-module backplane, 301-module cover, 3011-first groove, 302-battery string , 303-component backplane, 3031-second groove, 304-adhesive film, 305-first carrier plate, 306-first isolation film.

A detailed description

In order to make the purposes, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the embodiments of the present disclosure will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments These are some, but not all, embodiments of the present disclosure. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present disclosure.

In order to introduce the present disclosure more clearly, the structure of the photovoltaic module in the prior art is briefly introduced first. As shown in FIG. 1, FIG. 1 is a schematic structural diagram of a photovoltaic module in the prior art. The photovoltaic module mainly includes a module cover 101, a first adhesive film layer 102, a battery string 103, a second adhesive film layer 104 and components. Backplane 105 . After the sunlight passes through the module cover 101 and the first adhesive film layer 102 in sequence, it enters the cells in the battery string 103 and generates current through the cells. Among them, among the sunlight irradiating the surface of the photovoltaic module, part of the sunlight is reflected by the module cover plate 101 and the first adhesive film layer 102, part of the sunlight is absorbed by the module cover plate 101 and the first adhesive film layer 102, and only part of the sunlight is Entering the cell, the transmittance of the photovoltaic module decreases greatly, resulting in a lower power generation efficiency of the photovoltaic module

In order to solve the above technical problems, the present embodiment provides a photovoltaic module lamination method and a photovoltaic module. The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, but not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present disclosure.

Referring to FIG. 2, FIG. 2 shows a flow chart of steps of a photovoltaic module lamination method in an embodiment of the present disclosure, and the method may include:

Step 201: Lay the module cover plate, the battery string and the module back plate in sequence to obtain the module to be laminated.

The material of the component cover is a material that can be melted when subjected to a preset lamination operation. The preset lamination operation can be, for example, a certain lamination temperature. For example, the material of the component cover plate may be polymethyl methacrylate (PMMA), and the preset lamination operation may be a lamination temperature of 130°C-140°C. The module backplane can be made of conventional materials, such as polyvinyl fluoride composite film (Tedlar/PET/Tedlar, TPT).

In this embodiment, the module cover plate is a cover plate covering the upper surface of the photovoltaic module, and is used to receive sunlight and protect the battery strings in the photovoltaic module. The module backplane is a cover plate covering the backside of the photovoltaic module to protect the backside of the photovoltaic module. The battery string can be formed by connecting one or more cells in series, and the cells are used to receive sunlight through the cover plate of the module, and generate electricity under the action of sunlight. Illustratively, as shown in FIG. 3 , FIG. 3 shows a cross-sectional view of a component to be laminated in an embodiment of the present disclosure. During the manufacturing process of the photovoltaic component, the battery sheets are first welded into battery strings 302 and cut to obtain Assemble cover plate 301 and assembly back plate 303, and then lay down assembly cover plate 301, battery string 302 and assembly back plate 303 in sequence from bottom to top or from top to bottom to obtain assembly cover plate 301, battery string 302 and assembly back plate 303 components to be laminated. In the module to be laminated, the module cover plate 301 and the module back plate 303 are oppositely arranged flat plate structures, and the battery strings 302 are located between the module cover plate 301 and the module back plate 303 . For the specific laying method of the component to be laminated, reference may be made to the prior art, which is not limited in this embodiment.

Step 202 , performing a preset lamination operation on the module to be laminated, so that the melted module cover is sealed to connect the battery string and the module backplane, and the melted module cover is cooled to obtain a laminated module.

In this embodiment, after the component to be laminated is obtained by laying, a preset lamination operation may be performed on the component to be laminated to obtain a laminated component. Illustratively, as shown in FIG. 4, FIG. 4 shows a cross-sectional view of a laminated assembly in an embodiment of the present disclosure. The components to be laminated can be put into the laminator, the air in the laminator can be drawn out through a vacuum device, and then the components to be laminated can be heated so that the lamination temperature is between 130°C and 140°C (preset lamination operation). During this time, the module cover 301 is melted. In a vacuum state, pressure is applied to the components to be laminated, so that the melted component cover 301 fills the gap between the component cover 301, the battery strings 302 and the component backplane 303, and the melted component cover 301 seals and connects the battery strings 302, and sealingly connect the assembly backplane 303, and can realize the sealing connection of the battery string 302 and the assembly backplane 303. At the same time, under the action of pressure, the side of the module cover plate 301 close to the module back plate 303 forms a first groove 3011 for accommodating the battery strings 302. After cooling down, the module cover plate 301 solidifies, so that the battery strings 302 are embedded in the module cover plate. The side of 301 close to the module backplane 303 (ie, in the first groove 3011 ) forms a sealed connection of the module cover plate 301 , the battery string 302 and the module backplane 303 , that is, the laminated module. After trimming and framing the laminated modules, photovoltaic modules that can be used to generate electricity are obtained.

In practical applications, the component cover can also be made of polycarbonate (Polycarbonate, PC), acrylonitrile-styrene copolymer (AC), polysulfone (PSU) and polyvinylchloride (PVC). ) of one or more materials. The specific material of the component cover can be set as required. The preset lamination operation may be specifically set according to the material of the component cover, which is not limited in this embodiment.

To sum up, in this embodiment, the material of the module cover plate is a material that can be melted when subjected to a preset lamination operation. During the lamination process of the photovoltaic module, it is preferred to sequentially lay the module cover plate, the battery string and the module back. board to obtain the component to be laminated, and then perform a preset lamination operation on the component to be laminated, so that the melted component cover is sealed to connect the battery string and the component backplane, and the melted component cover is cooled to obtain a laminated s component. The module cover plate and the battery strings are directly sealed and connected through the module cover plate, which avoids setting an adhesive film layer between the module cover plate and the battery string. Compared with the prior art, in the power generation process of the photovoltaic module, the absorption and reflection of sunlight by the adhesive film layer are avoided, the light transmittance of the photovoltaic module is improved, and the power generation efficiency of the photovoltaic module is improved.

Optionally, in the process of laying the module cover plate, the battery string and the module back plate in sequence, an adhesive film may be laid between the battery string and the module back plate.

For example, as shown in FIG. 5 , FIG. 5 shows a cross-sectional view of another component to be laminated in an embodiment of the present disclosure. During the laying process of the component to be laminated, the component cover 301 and the battery string may be sequentially laid 302 , an adhesive film 304 (Polyethylene vinylacetate, EVA) and a component backplane 303 to obtain a to-be-laminated component including the component cover plate 301 , the battery strings 302 , the adhesive film 304 and the component backplane 303 .

Correspondingly, in the process of laminating the module to be laminated, the module cover 301 and the adhesive film 304 are melted at the same time, and the melted module cover 301 and the adhesive film 304 fill the module cover 301, the battery strings 302 and the module backplane In the gap between 303, the battery string 302 is sealed and connected to the module cover 301 through the melted module cover 301, and is sealed and connected to the module back plate 303 through the melted adhesive film 304. The module cover 301 and the module back plate 303 The connection is sealed by the melted adhesive film. After cooling down, the melted module cover plate 301 and the adhesive film 304 are solidified to form the module cover plate 301 , the battery string 302 and the module back plate 303 which are hermetically connected.

Referring to FIG. 6, FIG. 6 shows a flow chart of steps of another photovoltaic module lamination method in an embodiment of the present disclosure, and the method may include:

Step 601: Lay the first carrier plate, the module cover plate, the battery string and the module back plate in sequence to obtain the module to be laminated.

Wherein, the first carrier plate is used to form a smooth surface on the side of the component cover plate away from the component back plate.

By way of example, as shown in FIG. 7 , FIG. 7 shows a cross-sectional view of yet another laminated assembly in an embodiment of the present disclosure. During the process of laying the assembly to be laminated, the assembly cover 301 may be away from the assembly back. A first carrier board 305 is laid on one side of the board 303 , and the side of the first carrier board 305 close to the assembly cover 301 is a smooth surface. During the lamination process of the module to be laminated, the melted module cover plate 301 can form a smooth surface under the action of the first carrier plate 305, that is, the side of the module cover plate 301 away from the module back plate 303 (photovoltaic The upper surface of the module) forms a smooth surface, which can improve the light transmittance of the module cover 301 .

It should be noted that, the first carrier plate 305 may be made of a material with an isolation function, such as polyethylene (PE), so as to prevent the melted component cover plate 301 from adhering to the first carrier plate 305 .

Step 602 , perform a preset lamination operation on the components to be laminated, so that the melted component cover 301 is sealed to connect the battery strings 302 and the component backplane 303 , and the melted component cover 301 is cooled to obtain a laminated component .

Step 603 , removing the first carrier plate to obtain a photovoltaic module.

In this embodiment, after the module cover plate 301 is cooled, the module cover plate 301 and the first carrier plate 305 can be separated to remove the first carrier plate 305 to obtain a photovoltaic module. After trimming and framing the photovoltaic modules, photovoltaic modules that can be used to generate electricity are obtained.

In practical applications, the first carrier plate 305 can also be set in the laminator. After the module cover plate 301, the battery string 302 and the module back plate 303 are laid, the modules to be laminated are placed on the first plate in the laminator. on the carrier board 305, and make the component cover board 301 contact the first carrier board 305, so as to pass the first carrier board 305 on the side of the component cover board 301 away from the component back board 303 during the lamination process of the component to be laminated form a smooth surface.

Optionally, the material of the component backplane is a material that can be melted when subjected to a preset lamination operation;

Step 602 may further include: sealing the melted component backplane to connect the battery strings and the melted component cover, and cooling the melted component backplane.

In this embodiment, the component backplane 303 may be made of the same or similar material as the component cover 301 (eg, PMMA). During the lamination process of the module to be laminated, the module cover plate 301 and the module back plate 303 are melted at the same time, and the melted module cover plate 301 and the module back plate 303 fill the gap between the module cover plate 301 , the battery strings 302 and the module back plate 303 . The battery string 302 is directly sealed and connected to the module cover 301 through the melted module cover 301, and is directly sealed to the module back plate 303 through the melted module back plate 303, and the module cover 301 is directly connected to the module back. The plate 303 is directly sealed. At the same time, under the action of pressure, the melted component cover plate 301 forms a first groove 3011 on the side close to the component back plate 303 , and the melted component back plate 303 forms a second groove on the side close to the component cover plate 301 The groove 3031 , the first groove 3011 and the second groove 3031 are opposite to each other, forming a space for accommodating the battery string 302 . After cooling down, the module cover plate 301 and the module back plate 303 are solidified, and the battery strings 302 are embedded in the first groove 3011 and the second groove 3031 at the same time, forming a sealed connection of the module cover plate 301 , the battery string 302 and the module back plate 303.

In practical applications, the same or similar materials are selected for the module cover plate 301 and the module back plate 303. During the preset lamination operation, the module cover plate 301 and the module back plate 303 are fused to form a photovoltaic module with a compact structure, which can improve the performance of photovoltaic modules. Strength of PV modules. Moreover, the material of the component cover plate 301 and the component back plate 303 may be the same, for example, both are PMMA. During the lamination process of the module to be laminated, the melted module cover plate 301 and the module back plate 303 are fused to form an integrally formed structure, which can improve the strength and sealing performance of the photovoltaic module. At the same time, the module backplane 303 can transmit part of the sunlight, which can further improve the power generation efficiency of the photovoltaic module.

Optionally, step 601 may further include: laying a second carrier plate on the side of the component backplane facing away from the component cover plate; the second carrier plate is used to form a smooth surface on the side of the component backplane facing away from the component cover plate;

Correspondingly, step 603 may further include: removing the second carrier board.

In this embodiment, during the laying process of the component to be laminated, the second carrier plate may be laid on the side of the component backplane 303 away from the component cover plate 301 . During the lamination process of the module to be laminated, the melted module backsheet 303 can form a smooth surface under the action of the second carrier plate, that is, the side of the module backsheet 303 away from the module cover 301 (photovoltaic module the back surface) to form a smooth surface, which can improve the light transmittance of the component backplane 303. For understanding of the second carrier board, reference may be made to the first carrier board, which will not be repeated in this embodiment.

Optionally, step 601 may further include: laying a first isolation film between the first carrier board and the component cover board; the first isolation film is used to prevent the component cover board from adhering to the first carrier board.

Correspondingly, step 603 may further include: removing the first isolation film.

As shown in FIG. 8 , FIG. 8 shows a cross-sectional view of yet another laminated assembly in an embodiment of the present disclosure. During the laying process of the assembly to be laminated, the first carrier plate 305 and the assembly cover plate 301 A first isolation film 306 is laid therebetween. For example, the first carrier plate 305 may be made of float glass, and the first isolation film 306 may be a PE film. During the lamination process of the components to be laminated, the first isolation film 306 can prevent the component cover plate 301 and the first carrier plate 305 from sticking together. Correspondingly, after cooling, the assembly cover plate 301 and the first carrier plate 305 can be separated by the first isolation film 306 , and after the first isolation film 306 and the first support plate 305 are removed, the assembly cover plate 301 and the battery in a sealed connection are obtained. String 302 and assembly backplane 303.

Optionally, step 601 may further include: laying a second isolation film between the second carrier board and the component backplane; the second isolation film is used to prevent the component backplane from adhering to the second carrier board;

Correspondingly, step 603 may further include: removing the second isolation film.

In this embodiment, when the component backplane 303 is made of the same or similar material as the component cover 301, and a smooth surface is formed on the side of the component backplane 303 away from the component cover 301 through the second carrier plate, the component to be laminated is formed. During the laying process, a second isolation film may be laid between the second carrier board and the component backplane 303 . During the lamination process of the module to be laminated, the second isolation film can prevent the module backplane 303 from sticking to the second carrier plate. Correspondingly, after cooling, the module backplane 303 and the second carrier plate can be separated by the second isolation film, and after the second isolation film and the second carrier plate are removed, the module cover plate 301 , the battery strings 302 and the modules are obtained which are hermetically connected. Backplane 303 . For understanding of the second isolation film, reference may be made to the first isolation film, which will not be repeated in this embodiment.

Optionally, step 601 may further include: laying a light-transmitting support plate on the side of the component backplane away from the component cover plate.

In this embodiment, when the component backplane 303 is made of the same or similar material as the component cover 301 , a light-transmitting support plate can be laid on the side of the component backplane 303 away from the component cover 301 . Correspondingly, during the lamination process, the light-transmitting support plate can be sealed and connected by the melted component back plate 303 to obtain a photovoltaic module including the light-transmitting support plate. The light-transmitting support plate can be made of materials with higher hardness, better chemical stability, and higher light transmittance, such as tempered glass, polycarbonate, and transparent polyester. The light-transmitting cover plate is used to protect the photovoltaic module, and can increase the light transmittance on the back of the photovoltaic module and improve the power generation efficiency of the photovoltaic module.

This embodiment also provides a photovoltaic module, including: a module cover plate, a battery string, and a module back plate. The component cover is arranged opposite to the component backplane. The battery string is inlaid on the side of the component cover plate close to the component back plate, and the battery string and the component cover plate are sealedly connected through the component cover plate. The side of the component backplane close to the component cover is sealed with the component cover and the battery string respectively.

Optionally, the side of the battery string close to the component backplane is inlaid on the component backplane, and the battery string and the component backplane are sealed and connected through the component backplane. The side of the component backplane close to the component cover is directly connected with the component cover.

Optionally, the side of the component backplane facing away from the component cover is a smooth surface.

Optionally, the module cover plate and/or the module back plate is made of any one or several materials of polycarbonate, polymethyl methacrylate, acrylonitrile-styrene copolymer, polysulfone and polyvinyl chloride .

For understanding of the photovoltaic module, reference may be made to the above-mentioned embodiments, which will not be repeated in this embodiment.

It is to be noted that, herein, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device comprising a series of elements includes not only those elements, It also includes other elements not expressly listed or inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in a process, method, article or apparatus that includes the element.

The embodiments of the present disclosure have been described above in conjunction with the accompanying drawings, but the present disclosure is not limited to the above-mentioned specific embodiments, which are merely illustrative rather than restrictive. Under the inspiration of the present disclosure, many forms can be made without departing from the scope of the present disclosure and the protection scope of the claims, which all fall within the protection of the present disclosure.

The device embodiments described above are only illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in One place, or it can be distributed over multiple network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution in this embodiment. Those of ordinary skill in the art can understand and implement it without creative effort.

Reference herein to "one embodiment," "an embodiment," or "one or more embodiments" means that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the present disclosure. Also, please note that instances of the phrase "in one embodiment" herein are not necessarily all referring to the same embodiment.

In the description provided herein, numerous specific details are set forth. It is to be understood, however, that embodiments of the present disclosure may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present disclosure can be implemented by means of hardware comprising several different elements, as well as by means of a suitably programmed computer. In a unit claim enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, and third, etc. do not denote any order. These words can be interpreted as names.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, but not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

A method for laminating photovoltaic modules, comprising:

Lay the component cover plate, the battery string and the component back plate in sequence to obtain the component to be laminated; the material of the component cover plate is a material that can be melted when subjected to a preset lamination operation;

The preset lamination operation is performed on the component to be laminated, so that the melted component cover is sealed to connect the battery string and the component backplane, and the melted component cover is cooled, A laminated assembly is obtained.
The method of claim 1, wherein the material of the component backplane is a material that can be melted when subjected to the preset lamination operation;

The preset lamination operation is performed on the component to be laminated, so that the melted component cover is sealed to connect the battery string and the component backplane, and the melted component cover is sealed. Cooling, when the laminated assembly is obtained, also includes:

The melted component backplane is sealed to connect the battery string and the melted component cover, and the melted component backplane is cooled.
The method according to claim 1 or 2, wherein the step of sequentially laying the module cover plate, the battery string and the module back plate to obtain the module to be laminated further comprises:

A first bearing plate is laid on the side of the component cover plate away from the component back plate; the first bearing plate is used to form a smooth surface on the side of the component cover plate away from the component back plate;

After said obtaining the laminated assembly, the method further includes:

The first carrier plate is removed to obtain a photovoltaic module.
The method according to claim 3, wherein the step of sequentially laying the module cover plate, the battery string and the module back plate to obtain the module to be laminated further comprises:

A second carrier plate is laid on the side of the component backplane facing away from the component cover plate; the second carrier plate is used to form a smooth surface on the side of the component backplane facing away from the component cover plate;

When the photovoltaic module is obtained by removing the first carrier plate, the method further includes:

The second carrier plate is removed.
The method according to claim 3, wherein the step of sequentially laying the module cover plate, the battery string and the module back plate to obtain the module to be laminated further comprises:

A first isolation film is laid between the first carrier plate and the component cover plate; the first isolation film is used to prevent the component cover plate from adhering to the first carrier plate;

When the photovoltaic module is obtained by removing the first carrier plate, the method further includes:

The first isolation film is removed.
The method according to claim 4, wherein the step of sequentially laying the module cover plate, the battery string and the module back plate to obtain the module to be laminated further comprises:

A second isolation film is laid between the second carrier board and the component backplane; the second isolation film is used to prevent the component backplane from adhering to the second carrier board;

When the photovoltaic module is obtained by removing the first carrier plate, the method further includes:

The second isolation film is removed.
A photovoltaic module is characterized in that, comprising: a module cover plate, a battery string and a module back plate;

The component cover plate is arranged opposite to the component back plate;

The battery string is embedded on the side of the component cover plate close to the component back plate; the battery string and the component cover plate are sealed and connected through the component cover plate;

One side of the module backplane close to the module cover plate is sealed with the module cover plate and the battery string, respectively.
The photovoltaic module according to claim 7, wherein,

The side of the battery string close to the component backplane is inlaid on the component backplane; the battery string and the component backplane are sealed and connected through the component backplane;

The side of the component backplane close to the component cover is directly connected with the component cover.
The photovoltaic module according to claim 8, wherein the module cover plate and the module back plate are integrally formed.
The photovoltaic module according to claim 8, wherein a side of the module back plate facing away from the module cover plate is a smooth surface.
The photovoltaic module according to claim 8, wherein a light-transmitting support plate is provided on the side of the module back plate facing away from the module cover plate.
The photovoltaic module according to any one of claims 7-11, wherein the module cover plate and/or the module back plate are made of polycarbonate, polymethyl methacrylate, acrylonitrile-styrene copolymer It is made of any one or several materials of polysulfone, polyvinyl chloride and polyvinyl chloride.