CN111900220A - Photovoltaic module laminating method and photovoltaic module - Google Patents
Photovoltaic module laminating method and photovoltaic module Download PDFInfo
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- CN111900220A CN111900220A CN202010732498.6A CN202010732498A CN111900220A CN 111900220 A CN111900220 A CN 111900220A CN 202010732498 A CN202010732498 A CN 202010732498A CN 111900220 A CN111900220 A CN 111900220A
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- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000010030 laminating Methods 0.000 title claims abstract description 26
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 11
- 238000002955 isolation Methods 0.000 claims description 28
- 238000003475 lamination Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 22
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 7
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 7
- 229920002492 poly(sulfone) Polymers 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 229920001893 acrylonitrile styrene Polymers 0.000 claims description 4
- 239000004800 polyvinyl chloride Substances 0.000 claims description 4
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 claims description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000002313 adhesive film Substances 0.000 abstract description 19
- 238000010248 power generation Methods 0.000 abstract description 17
- 238000002834 transmittance Methods 0.000 abstract description 11
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 27
- 239000004698 Polyethylene Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920002620 polyvinyl fluoride Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009432 framing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- -1 Polyethylene Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000005329 float glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention provides a photovoltaic module laminating method and a photovoltaic module, wherein the photovoltaic module laminating method comprises the following steps: laying a component cover plate, a battery string and a component back plate in sequence to obtain a component to be laminated, carrying out preset laminating operation on the component to be laminated to enable the melted component cover plate to be connected with the battery string and the component back plate in a sealing mode, and cooling the melted component cover plate to obtain the laminated component. The assembly cover plate is directly connected with the battery string in a sealing mode through the assembly cover plate, and a glue film layer is prevented from being arranged between the assembly cover plate and the battery string. Compared with the prior art, in the power generation process of the photovoltaic module, the absorption and reflection of the adhesive film layer to sunlight are avoided, the light transmittance of the photovoltaic module is improved, and therefore the power generation efficiency of the photovoltaic module is improved.
Description
Technical Field
The invention relates to the technical field of solar photovoltaics, in particular to a photovoltaic module laminating method and a photovoltaic module.
Background
Photovoltaic power generation is a green energy technology, can reduce environmental pollution, and protects the environment. The photovoltaic module is one of the main tools of photovoltaic power generation, improves the power generation efficiency of the photovoltaic module, and is beneficial to popularization and use of the photovoltaic power generation technology.
The light transmittance is one of the factors affecting the power generation efficiency of the photovoltaic module, and is mainly determined by the structure of the photovoltaic module. In the prior art, the light transmittance of the photovoltaic module is low, so that the power generation efficiency of the photovoltaic module is low.
Disclosure of Invention
The invention provides a photovoltaic module laminating method and a photovoltaic module, and aims to solve the problem that the photovoltaic module is low in light transmittance and low in power generation efficiency.
The embodiment of the invention also provides a photovoltaic module laminating method, which comprises the following steps:
laying a component cover plate, a battery string and a component back plate in sequence to obtain a component to be laminated; the component cover plate is made of a material which can be melted when subjected to a preset laminating operation;
and performing the preset laminating operation on the assembly to be laminated, enabling the melted assembly cover plate to be in sealing connection with the battery string and the assembly back plate, and cooling the melted assembly cover plate to obtain the laminated assembly.
Optionally, the assembly back plate is made of a material that can be melted when subjected to the preset lamination operation;
when the preset laminating operation is performed on the assembly to be laminated, the melted assembly cover plate is hermetically connected with the battery string and the assembly back plate, and the melted assembly cover plate is cooled, so that a laminated assembly is obtained, the method further includes:
and enabling the melted assembly back plate to be hermetically connected with the battery string and the melted assembly cover plate, and enabling the melted assembly back plate to be cooled.
Optionally, laying down subassembly apron, battery cluster and subassembly backplate in proper order, when obtaining the subassembly of treating the lamination, still include:
laying a first bearing plate on one side of the component cover plate, which is far away from the component back plate; the first bearing plate is used for enabling one side, away from the assembly back plate, of the assembly cover plate to form a smooth surface;
after the obtaining the laminated assembly, the method further comprises:
and removing the first bearing plate to obtain the photovoltaic module.
Optionally, laying down subassembly apron, battery cluster and subassembly backplate in proper order, when obtaining the subassembly of treating the lamination, still include:
laying a second bearing plate on one side of the component back plate, which is far away from the component cover plate; the second bearing plate is used for enabling one side of the assembly back plate, which is far away from the assembly cover plate, to form a smooth surface;
when the first bearing plate is removed to obtain the photovoltaic module, the method further comprises the following steps:
and removing the second bearing plate.
Optionally, laying down subassembly apron, battery cluster and subassembly backplate in proper order, when obtaining the subassembly of treating the lamination, still include:
laying a first isolation film between the first bearing plate and the component cover plate; the first isolation film is used for preventing the assembly cover plate from being adhered to the first bearing plate;
when the first bearing plate is removed to obtain the photovoltaic module, the method further comprises the following steps:
and removing the first isolation film.
Optionally, laying down subassembly apron, battery cluster and subassembly backplate in proper order, when obtaining the subassembly of treating the lamination, still include:
laying a second isolation film between the second carrier plate and the component backplane; the second isolation film is used for preventing the assembly back plate from being adhered to the second bearing plate;
when the first bearing plate is removed to obtain the photovoltaic module, the method further comprises the following steps:
and removing the second isolation film.
An embodiment of the present invention provides a photovoltaic module, including: the battery pack comprises a pack cover plate, a battery string and a pack back plate;
the component cover plate and the component back plate are arranged oppositely;
the battery string is embedded on one side of the assembly cover plate close to the assembly back plate; the battery string is hermetically connected with the assembly cover plate through the assembly cover plate;
one side of the assembly back plate, which is close to the assembly cover plate, is respectively connected with the assembly cover plate and the battery string in a sealing manner.
Optionally, one side of the battery string close to the assembly backboard is embedded in the assembly backboard; the battery string is hermetically connected with the assembly back plate through the assembly back plate;
one side of the assembly back plate close to the assembly cover plate is directly connected with the assembly cover plate.
Optionally, the module cover plate and the module back plate are integrally formed.
Optionally, one side of the assembly back plate facing away from the assembly cover plate is a smooth surface.
Optionally, a light-transmitting support plate is arranged on one side of the assembly back plate, which faces away from the assembly cover plate.
Optionally, the module cover plate and/or the module back plate are made of any one or more materials selected from polycarbonate, polymethyl methacrylate, acrylonitrile-styrene copolymer, polysulfone and polyvinyl chloride.
In the embodiment of the invention, the component cover plate is made of a material which can be melted when subjected to a preset lamination operation, the component cover plate, the battery string and the component back plate are firstly laid in sequence in the lamination process of the photovoltaic component to obtain a component to be laminated, then the preset lamination operation is carried out on the component to be laminated, the melted component cover plate is hermetically connected with the battery string and the component back plate, and the melted component cover plate is cooled to obtain the laminated component. The assembly cover plate is directly connected with the battery string in a sealing mode through the assembly cover plate, and a glue film layer is prevented from being arranged between the assembly cover plate and the battery string. Compared with the prior art, in the power generation process of the photovoltaic module, the absorption and reflection of the adhesive film layer to sunlight are avoided, the light transmittance of the photovoltaic module is improved, and therefore the power generation efficiency of the photovoltaic module is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a schematic diagram of a photovoltaic module according to the prior art;
fig. 2 shows a flow chart of steps of a method of laminating a photovoltaic module in an embodiment of the present invention;
FIG. 3 shows a cross-sectional view of one component to be laminated in an embodiment of the invention;
FIG. 4 shows a cross-sectional view of a laminated assembly in an embodiment of the invention;
FIG. 5 shows a cross-sectional view of another component to be laminated in an embodiment of the invention;
fig. 6 shows a flow chart of steps of another photovoltaic module lamination process in an embodiment of the present invention;
FIG. 7 shows a cross-sectional view of yet another laminated assembly in an embodiment of the invention;
figure 8 shows a cross-sectional view of yet another laminated assembly in an embodiment of the invention.
Description of reference numerals:
101-component cover plate, 102-first adhesive film layer, 103-battery string, 104-second adhesive film layer, 105-component back plate, 301-component cover plate, 3011-first groove, 302-battery string, 303-component back plate, 3031-second groove, 304-adhesive film, 305-first bearing plate and 306-first isolation film.
Detailed Description
In order to more clearly describe the present invention, a brief description of the structure of a photovoltaic module in the prior art is provided first. As shown in fig. 1, fig. 1 is a schematic structural diagram of a photovoltaic module in the prior art, and the photovoltaic module mainly includes a module cover plate 101, a first adhesive film layer 102, a battery string 103, a second adhesive film layer 104, and a module back plate 105. Sunlight sequentially passes through the module cover plate 101 and the first adhesive film layer 102 and then enters the battery pieces in the battery string 103, and current is generated through the battery pieces. Among the sunlight irradiating the surface of the photovoltaic module, part of the sunlight is reflected by the module cover plate 101 and the first adhesive film layer 102, and part of the sunlight is absorbed by the module cover plate 101 and the first adhesive film layer 102, only part of the sunlight enters the cell, so that the light transmittance of the photovoltaic module is greatly reduced, and the generation efficiency of the photovoltaic module is low
In order to solve the above technical problem, the present embodiment provides a photovoltaic module laminating method and a photovoltaic module. The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 2, fig. 2 shows a flow chart of steps of a photovoltaic module lamination method in an embodiment of the invention, which may include:
The component cover plate is made of a material which can be melted when subjected to a preset laminating operation. The preset lamination operation may be, for example, a certain lamination temperature. For example, the cover plate may be made of polymethyl methacrylate (PMMA), and the predetermined lamination operation may be at a lamination temperature of 130 ℃ to 140 ℃. The module back sheet may be made of conventional materials, such as polyvinyl fluoride composite film (Tedlar/PET/Tedlar, TPT).
In this embodiment, the module cover plate is a cover plate covering the upper surface of the photovoltaic module, and is used for receiving sunlight irradiation and protecting a battery string in the photovoltaic module. The assembly back plate is a cover plate covering the back of the photovoltaic assembly and used for protecting the back of the photovoltaic assembly. The battery string can be formed by connecting one or more battery pieces in series, and the battery pieces are used for receiving sunlight penetrating through the assembly cover plate and generating electricity under the action of the sunlight. Illustratively, as shown in fig. 3, fig. 3 shows a cross-sectional view of a module to be laminated according to an embodiment of the present invention, in a manufacturing process of a photovoltaic module, firstly, a battery sheet is welded into a battery string 302, and is cut to obtain a module cover plate 301 and a module back plate 303, and then the module cover plate 301, the battery string 302 and the module back plate 303 are sequentially laid from bottom to top or from top to bottom to obtain the module to be laminated including the module cover plate 301, the battery string 302 and the module back plate 303. In the component to be laminated, the component cover plate 301 and the component back plate 303 are flat plate structures arranged oppositely, and the battery string 302 is located between the component cover plate 301 and the component back plate 303. The specific laying method of the component to be laminated can refer to the prior art, and the embodiment does not limit the method.
In this embodiment, after the assembly to be laminated is laid, a preset laminating operation may be performed on the assembly to be laminated to obtain a laminated assembly. Illustratively, as shown in fig. 4, fig. 4 shows a cross-sectional view of a laminated assembly in an embodiment of the invention. The assembly to be laminated may be placed in a laminator, air in the laminator may be drawn out by a vacuum drawing device, and then the assembly to be laminated may be heated to a laminating temperature of 130 ℃ to 140 ℃ (preset laminating operation), and the assembly cover plate 301 may be melted. In a vacuum state, pressure is applied to the assembly to be laminated, the melted assembly cover plate 301 fills gaps among the assembly cover plate 301, the battery string 302 and the assembly back plate 303, the melted assembly cover plate 301 is connected with the battery string 302 in a sealing mode, the assembly back plate 303 is connected with the assembly back plate 303 in a sealing mode, and the battery string 302 and the assembly back plate 303 can be connected in a sealing mode. Meanwhile, under the action of pressure, a first groove 3011 for accommodating the battery string 302 is formed on one side of the assembly cover plate 301 close to the assembly back plate 303, and after cooling down, the assembly cover plate 301 is solidified, so that the battery string 302 is embedded on one side of the assembly cover plate 301 close to the assembly back plate 303 (i.e. in the first groove 3011), and the assembly cover plate 301, the battery string 302 and the assembly back plate 303 which are connected in a sealing manner are formed, i.e. the laminated assembly. After trimming and framing the laminated assembly, a photovoltaic assembly which can be used for power generation is obtained.
In practical applications, the module cover plate may be made of one or more of Polycarbonate (PC), acrylonitrile-styrene copolymer (AC), Polysulfone (PSU), and polyvinyl chloride (PVC). The specific material of subassembly apron can set up as required. The predetermined laminating operation may be specifically configured according to the material of the module cover, which is not limited in this embodiment.
In summary, in this embodiment, the component cover plate is made of a material that can be melted when subjected to a predetermined lamination operation, and in the lamination process of the photovoltaic component, the component cover plate, the battery string and the component back plate are first laid in sequence to obtain a component to be laminated, and then the predetermined lamination operation is performed on the component to be laminated, so that the melted component cover plate is hermetically connected with the battery string and the component back plate, and the melted component cover plate is cooled to obtain the laminated component. The assembly cover plate is directly connected with the battery string in a sealing mode through the assembly cover plate, and a glue film layer is prevented from being arranged between the assembly cover plate and the battery string. Compared with the prior art, in the power generation process of the photovoltaic module, the absorption and reflection of the adhesive film layer to sunlight are avoided, the light transmittance of the photovoltaic module is improved, and therefore the power generation efficiency of the photovoltaic module is improved.
Optionally, in the process of sequentially laying the module cover plate, the battery string and the module back plate, an adhesive film may be laid between the battery string and the module back plate.
For example, as shown in fig. 5, fig. 5 shows a cross-sectional view of another component to be laminated in the embodiment of the present invention, during the laying process of the component to be laminated, a component cover plate 301, a battery string 302, an adhesive film 304 (EVA) and a component back plate 303 may be laid in sequence, so as to obtain the component to be laminated including the component cover plate 301, the battery string 302, the adhesive film 304 and the component back plate 303.
Correspondingly, in the process of laminating the assembly to be laminated, the assembly cover plate 301 and the adhesive film 304 are simultaneously melted, the melted assembly cover plate 301 and the melted adhesive film 304 fill gaps among the assembly cover plate 301, the battery string 302 and the assembly back plate 303, the battery string 302 is hermetically connected with the assembly cover plate 301 through the melted assembly cover plate 301 and is hermetically connected with the assembly back plate 303 through the melted adhesive film 304, and the assembly cover plate 301 and the assembly back plate 303 are hermetically connected through the melted adhesive film. After cooling down, the melted module cover plate 301 and the adhesive film 304 are solidified, and a hermetically connected module cover plate 301, a battery string 302 and a module back plate 303 are formed.
Referring to fig. 6, fig. 6 shows a flow chart of steps of another photovoltaic module lamination method in an embodiment of the present disclosure, which may include:
The first bearing plate is used for enabling one side, away from the assembly back plate, of the assembly cover plate to form a smooth surface.
By way of example, as shown in fig. 7, fig. 7 shows a cross-sectional view of a laminated assembly in another embodiment of the present invention, during laying of the assembly to be laminated, a first loading plate 305 may be laid on a side of the assembly cover plate 301 facing away from the assembly back plate 303, and a side of the first loading plate 305 adjacent to the assembly cover plate 301 is a smooth surface. In the laminating process of the module to be laminated, the melted module cover plate 301 can form a smooth surface under the action of the first carrier plate 305, that is, a smooth surface is formed on the side (the upper surface of the photovoltaic module) of the module cover plate 301 departing from the module back plate 303, so that the light transmittance of the module cover plate 301 can be improved.
It should be noted that the first carrier plate 305 may be made of a material with an isolation function, such as Polyethylene (PE), so as to prevent the melted assembly cover plate 301 from being adhered to the first carrier plate 305.
And 603, removing the first bearing plate to obtain the photovoltaic module.
In this embodiment, after the assembly cover plate 301 is cooled, the assembly cover plate 301 and the first carrier plate 305 may be separated to remove the first carrier plate 305, so as to obtain the photovoltaic assembly. After trimming and framing the photovoltaic module, the photovoltaic module which can be used for power generation is obtained.
In practical application, the first carrier plate 305 may also be disposed in the laminator, after the component cover plate 301, the battery string 302 and the component back plate 303 are laid, the component to be laminated is placed on the first carrier plate 305 in the laminator, and the component cover plate 301 is contacted with the first carrier plate 305, so that a smooth surface is formed on the side of the component cover plate 301 away from the component back plate 303 through the first carrier plate 305 during the lamination process of the component to be laminated.
Optionally, the material of the assembly back plate is a material which can be melted when subjected to a preset lamination operation;
step 602 may further include: and enabling the melted assembly back plate to be hermetically connected with the battery string and the melted assembly cover plate, and cooling the melted assembly back plate.
In this embodiment, the device back plate 303 may be made of a material (e.g., PMMA) similar to or the same as that of the device cover plate 301. In the lamination process of the components to be laminated, the component cover plate 301 and the component back plate 303 are melted simultaneously, gaps among the component cover plate 301, the battery string 302 and the component back plate 303 are filled with the melted component cover plate 301 and the melted component back plate 303, the battery string 302 is directly and hermetically connected with the component cover plate 301 through the melted component cover plate 301 and directly and hermetically connected with the component back plate 303 through the melted component back plate 303, and the component cover plate 301 is directly and hermetically connected with the component back plate 303. Meanwhile, under the action of pressure, a first groove 3011 is formed on one side of the melted assembly cover plate 301 close to the assembly back plate 303, a second groove 3031 is formed on one side of the melted assembly back plate 303 close to the assembly cover plate 301, and the first groove 3011 and the second groove 3031 are opposite to each other to form a space for accommodating the battery string 302. After cooling down, the assembly cover plate 301 and the assembly back plate 303 solidify, and the battery string 302 is embedded in the first groove 3011 and the second groove 3031 at the same time, so that the assembly cover plate 301, the battery string 302 and the assembly back plate 303 are hermetically connected.
In practical application, the component cover plate 301 and the component back plate 303 are made of the same or similar materials, and when lamination operation is preset, the component cover plate 301 and the component back plate 303 are fused to form a photovoltaic component with a compact structure, so that the strength of the photovoltaic component can be improved. The material of the module cover plate 301 and the module back plate 303 may be the same, for example, PMMA. In the laminating process of the assembly to be laminated, the melted assembly cover plate 301 and the melted assembly back plate 303 are fused to form an integrally formed structure, so that the strength and the sealing property of the photovoltaic assembly can be improved. Meanwhile, the module back plate 303 can transmit partial sunlight, so that the power generation efficiency of the photovoltaic module can be further improved.
Optionally, step 601 may further include: laying a second bearing plate on one side of the assembly back plate, which is far away from the assembly cover plate; the second bearing plate is used for enabling one side of the assembly back plate, which is far away from the assembly cover plate, to form a smooth surface;
correspondingly, step 603 may further include: and removing the second bearing plate.
In this embodiment, during the laying process of the components to be laminated, the second carrier plate may be laid on the side of the component backplane 303 facing away from the component cover plate 301. In the laminating process of the module to be laminated, the melted module back plate 303 can form a smooth surface under the action of the second bearing plate, that is, a smooth surface is formed on the side (the back side of the photovoltaic module) of the module back plate 303, which is away from the module cover plate 301, so that the light transmittance of the module back plate 303 can be improved. The understanding of the second carrier plate can refer to the first carrier plate, which is not described in detail in this embodiment.
Optionally, step 601 may further include: laying a first isolation film between the first bearing plate and the component cover plate; the first isolation film is used for preventing the assembly cover plate from being adhered to the first bearing plate.
Correspondingly, step 603 may further include: and removing the first isolation film.
As shown in fig. 8, fig. 8 shows a cross-sectional view of a further laminated assembly according to an embodiment of the invention, during the laying-up of the assembly to be laminated, a first isolating film 306 can be laid between the first carrier plate 305 and the assembly cover plate 301. For example, the first carrying plate 305 may be made of float glass, and the first separation film 306 may be a PE thin film. The first separation film 306 can prevent the module cover plate 301 and the first carrier plate 305 from being adhered during the lamination of the module to be laminated. Accordingly, after cooling, the module cover 301 and the first carrier plate 305 can be separated by the first isolation film 306, and after removing the first isolation film 306 and the first carrier plate 305, the hermetically connected module cover 301, battery string 302 and module backplane 303 are obtained.
Optionally, step 601 may further include: laying a second isolation film between the second bearing plate and the assembly backboard; the second isolation film is used for preventing the assembly back plate from being adhered to the second bearing plate;
correspondingly, step 603 may further include: and removing the second isolation film.
In this embodiment, when the component backplane 303 is made of a material the same as or similar to that of the component cover board 301 and a smooth surface is formed on the side of the component backplane 303 away from the component cover board 301 through the second bearing board, a second isolation film may be laid between the second bearing board and the component backplane 303 during the laying process of the component to be laminated. The second isolation film can prevent the component back plate 303 and the second carrier plate from being adhered during the lamination process of the component to be laminated. Accordingly, after cooling, the module backplane 303 and the second carrier board can be separated by the second isolation film, and after removing the second isolation film and the second carrier board, the hermetically connected module cover board 301, battery string 302 and module backplane 303 are obtained. For understanding the second isolation film, reference may be made to the first isolation film, which is not described in detail in this embodiment.
Optionally, step 601 may further include: and laying a light-transmitting support plate on one side of the assembly back plate, which is far away from the assembly cover plate.
In this embodiment, when the component back plate 303 is made of the same or similar material as the component cover plate 301, a transparent supporting plate may be laid on a side of the component back plate 303 away from the component cover plate 301. Accordingly, during the lamination process, the light-transmitting support plate can be hermetically connected through the melted module back plate 303, so that the photovoltaic module including the light-transmitting support plate is obtained. The light-transmitting support plate can be made of materials with high hardness, good chemical stability and high light transmittance, such as toughened glass, polycarbonate, transparent polyester and the like. The light-transmitting cover plate is used for protecting the photovoltaic module, the light transmittance of the back of the photovoltaic module can be increased, and the power generation efficiency of the photovoltaic module is improved.
The present embodiment also provides a photovoltaic module, including: subassembly apron, battery cluster and subassembly backplate. The assembly cover plate and the assembly back plate are arranged oppositely. The battery string is embedded in one side of the assembly cover plate close to the assembly back plate and is in sealing connection with the assembly cover plate. One side of the assembly back plate close to the assembly cover plate is respectively connected with the assembly cover plate and the battery string in a sealing mode.
Optionally, one side of the battery string close to the assembly backboard is embedded in the assembly backboard, and the battery string is connected with the assembly backboard in a sealing manner through the assembly backboard. One side of the assembly back plate close to the assembly cover plate is directly connected with the assembly cover plate.
Optionally, the module cover plate and the module back plate are integrally formed.
Optionally, one side of the module back plate facing away from the module cover plate is a smooth surface.
Optionally, a light-transmitting support plate is arranged on one side of the assembly back plate, which faces away from the assembly cover plate.
Optionally, the module cover plate and/or the module back plate are made of any one or more materials selected from polycarbonate, polymethyl methacrylate, acrylonitrile-styrene copolymer, polysulfone and polyvinyl chloride.
For understanding the photovoltaic module, reference may be made to the above embodiments, which are not described in detail in this embodiment.
It is to be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (12)
1. A method of laminating a photovoltaic module, comprising:
laying a component cover plate, a battery string and a component back plate in sequence to obtain a component to be laminated; the component cover plate is made of a material which can be melted when subjected to a preset laminating operation;
and performing the preset laminating operation on the assembly to be laminated, enabling the melted assembly cover plate to be in sealing connection with the battery string and the assembly back plate, and cooling the melted assembly cover plate to obtain the laminated assembly.
2. The method of claim 1, wherein the component backplane is of a material that is meltable when subjected to the predetermined lamination operation;
when the preset laminating operation is performed on the assembly to be laminated, the melted assembly cover plate is hermetically connected with the battery string and the assembly back plate, and the melted assembly cover plate is cooled, so that a laminated assembly is obtained, the method further includes:
and enabling the melted assembly back plate to be hermetically connected with the battery string and the melted assembly cover plate, and enabling the melted assembly back plate to be cooled.
3. The method according to claim 1 or 2, wherein the sequentially laying down the module cover plate, the battery string and the module back plate to obtain the module to be laminated further comprises:
laying a first bearing plate on one side of the component cover plate, which is far away from the component back plate; the first bearing plate is used for enabling one side, away from the assembly back plate, of the assembly cover plate to form a smooth surface;
after the obtaining the laminated assembly, the method further comprises:
and removing the first bearing plate to obtain the photovoltaic module.
4. The method of claim 3, wherein the sequentially laying down the module cover plate, the battery string and the module back plate to obtain the module to be laminated further comprises:
laying a second bearing plate on one side of the component back plate, which is far away from the component cover plate; the second bearing plate is used for enabling one side of the assembly back plate, which is far away from the assembly cover plate, to form a smooth surface;
when the first bearing plate is removed to obtain the photovoltaic module, the method further comprises the following steps:
and removing the second bearing plate.
5. The method of claim 3, wherein the sequentially laying down the module cover plate, the battery string and the module back plate to obtain the module to be laminated further comprises:
laying a first isolation film between the first bearing plate and the component cover plate; the first isolation film is used for preventing the assembly cover plate from being adhered to the first bearing plate;
when the first bearing plate is removed to obtain the photovoltaic module, the method further comprises the following steps:
and removing the first isolation film.
6. The method of claim 4, wherein the sequentially laying down the module cover plate, the battery string and the module back plate to obtain the module to be laminated further comprises:
laying a second isolation film between the second carrier plate and the component backplane; the second isolation film is used for preventing the assembly back plate from being adhered to the second bearing plate;
when the first bearing plate is removed to obtain the photovoltaic module, the method further comprises the following steps:
and removing the second isolation film.
7. A photovoltaic module, comprising: the battery pack comprises a pack cover plate, a battery string and a pack back plate;
the component cover plate and the component back plate are arranged oppositely;
the battery string is embedded on one side of the assembly cover plate close to the assembly back plate; the battery string is hermetically connected with the assembly cover plate through the assembly cover plate;
one side of the assembly back plate, which is close to the assembly cover plate, is respectively connected with the assembly cover plate and the battery string in a sealing manner.
8. The photovoltaic module of claim 7,
one side of the battery string close to the assembly backboard is embedded in the assembly backboard; the battery string is hermetically connected with the assembly back plate through the assembly back plate;
one side of the assembly back plate close to the assembly cover plate is directly connected with the assembly cover plate.
9. The photovoltaic module of claim 8, wherein the module cover sheet and the module backsheet are integrally formed.
10. The photovoltaic module of claim 8, wherein a side of the module back sheet facing away from the module cover sheet is a smooth surface.
11. The photovoltaic module according to claim 8, characterized in that a side of the module backsheet facing away from the module cover sheet is provided with a light-transmitting support sheet.
12. The photovoltaic module according to any of claims 7 to 11, wherein the module cover sheet and/or the module back sheet are made of any one or more materials selected from the group consisting of polycarbonate, polymethyl methacrylate, acrylonitrile-styrene copolymer, polysulfone, and polyvinyl chloride.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010732498.6A CN111900220A (en) | 2020-07-27 | 2020-07-27 | Photovoltaic module laminating method and photovoltaic module |
| PCT/CN2020/128403 WO2022021668A1 (en) | 2020-07-27 | 2020-11-12 | Photovoltaic module lamination method and photovoltaic module |
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| CN202010732498.6A CN111900220A (en) | 2020-07-27 | 2020-07-27 | Photovoltaic module laminating method and photovoltaic module |
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Cited By (1)
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| WO2022021668A1 (en) | 2022-02-03 |
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