CN117377257A - Circuit board module, preparation method and electronic equipment - Google Patents
Circuit board module, preparation method and electronic equipment Download PDFInfo
- Publication number
- CN117377257A CN117377257A CN202210762887.2A CN202210762887A CN117377257A CN 117377257 A CN117377257 A CN 117377257A CN 202210762887 A CN202210762887 A CN 202210762887A CN 117377257 A CN117377257 A CN 117377257A
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- circuit board
- radiator
- limiting
- piece
- positioning
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- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 238000009434 installation Methods 0.000 claims abstract description 3
- 238000005516 engineering process Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000004378 air conditioning Methods 0.000 claims description 2
- 230000003044 adaptive effect Effects 0.000 claims 1
- 210000001503 joint Anatomy 0.000 abstract 1
- 238000000034 method Methods 0.000 description 19
- 230000017525 heat dissipation Effects 0.000 description 11
- 238000001816 cooling Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The embodiment of the invention provides a circuit board module, a preparation method and electronic equipment, wherein the circuit board module comprises the following components: the radiator is provided with a positioning installation part; the circuit board is arranged at intervals with the radiator, and a first limiting part is arranged on one side, close to the radiator, of the circuit board; the lining plate is arranged on one side of the circuit board, which is far away from the radiator, and is provided with a connecting piece, and after the lining plate is fixedly matched with the circuit board, the connecting piece is propped against the circuit board so as to enable the lining plate and the circuit board to be spaced; the support piece comprises a first end and a second end which are opposite, the first end is provided with a support surface, the second end is provided with a second limiting part, the support piece is arranged between the circuit board and the radiator, and the support piece is in butt joint with the radiator through the support surface and forms limiting fit with the first limiting part formed on the circuit board through the second limiting part; and the fixing piece is used for fixing the radiator and the circuit board on the connecting piece of the lining board through the positioning and mounting part.
Description
Technical Field
The present invention relates to the field of communications technologies, and in particular, to a circuit board module, a manufacturing method, and an electronic device.
Background
At present, an IC chip is a core for performing operation of an electronic device, and is also one of main heating elements of the electronic device. With the development of 5G communication technology, high capacity and high performance are pursued in communication products. The integration level of some multifunctional IC chips on a circuit board is higher and higher, so that the power consumption and the heat flux density of the circuit board are continuously increased, and a serious challenge is presented to the heat dissipation technology.
The current liquid cooling technology is still immature, and the heat dissipation problem of circuit board mainly relies on air cooling heat dissipation technology to solve, and the radiator is the key technology of air cooling heat dissipation. The current radiator used in the industry is of a press-riveting structure, namely, the supporting piece is combined with the body of the radiator through a press-riveting process, so that the radiator is provided with the supporting structure, and then the radiator with the supporting structure is aligned with the circuit board and assembled to form the circuit board module. However, the whole rigidity of the press-riveting radiator is high, the mechanical stress generated in the assembly process is high, at least one of the radiator body and the contact part of the circuit board and the supporting piece is easy to crack when being influenced by the ambient temperature, the long-term reliability of the influenced circuit board module is influenced, and the service life of the electronic product is finally influenced.
Disclosure of Invention
The embodiment of the invention mainly aims to provide a circuit board module, a preparation method and electronic equipment, and aims to reduce stress risk of the circuit board module and prolong service life of the circuit board module.
In a first aspect, an embodiment of the present invention provides a circuit board module, including:
a radiator provided with a positioning and mounting part;
the circuit board is arranged at intervals with the radiator, and a first limiting part is arranged on one side, close to the radiator, of the circuit board;
the lining plate is arranged on one side, far away from the radiator, of the circuit board, and is provided with a connecting piece, and after the lining plate is fixedly matched with the circuit board, the connecting piece is propped against the circuit board so that the lining plate and the circuit board are spaced;
the support piece comprises a first end and a second end which are opposite, the first end is provided with a supporting surface, the second end is provided with a second limiting part, the support piece is arranged between the circuit board and the radiator, the support piece is abutted with the radiator through the supporting surface, and the support piece and the first limiting part formed on the circuit board form limiting fit through the second limiting part; a kind of electronic device with high-pressure air-conditioning system
The fixing piece is used for fixing the radiator and the circuit board on the connecting piece of the lining board through the positioning and mounting part.
In a second aspect, an embodiment of the present invention further provides a method for preparing a circuit board module, including:
providing a circuit board, and arranging a first limiting part on the circuit board;
providing a support member, wherein the support member comprises a first end and a second end which are opposite, the first end forms a support surface, and the second end is provided with a second limiting part;
attaching the second limiting part of the supporting piece to the first limiting part of the circuit board through a surface mounting technology so as to enable the first limiting part and the second limiting part to be in limiting fit;
providing a lining plate, a radiator and a fixing piece, wherein the lining plate is provided with a connecting piece, and the radiator is provided with a positioning installation part;
the radiator and the circuit board are fixed on the connecting piece of the lining board through the positioning and mounting part by utilizing the fixing piece, after the radiator, the circuit board and the lining board are fixedly matched, the supporting surface of the supporting piece is abutted to the radiator, and the connecting piece is abutted to the circuit board, so that the radiator is spaced from the circuit board, and the circuit board is spaced from the lining board.
In a third aspect, an embodiment of the present invention further provides an electronic device, where the electronic device includes the foregoing circuit board module, or a circuit board module prepared by the foregoing method for preparing a circuit board module of the electronic device.
The embodiment of the invention provides a circuit board module, a preparation method and electronic equipment, wherein the circuit board module comprises a radiator, and the radiator is provided with a positioning and mounting part; the circuit board is arranged at intervals with the radiator, and a first limiting part is arranged on one side, close to the radiator, of the circuit board; the lining plate is arranged on one side, far away from the radiator, of the circuit board, and is provided with a connecting piece, and after the lining plate is fixedly matched with the circuit board, the connecting piece is propped against the circuit board so that the lining plate and the circuit board are spaced; the support piece comprises a first end and a second end which are opposite, the first end is provided with a supporting surface, the second end is provided with a second limiting part, the support piece is arranged between the circuit board and the radiator, the support piece is abutted with the radiator through the supporting surface, and the support piece and the first limiting part formed on the circuit board form limiting fit through the second limiting part; and the fixing piece is used for fixing the radiator and the circuit board to the connecting piece of the lining board through the positioning and mounting part. According to the embodiment of the invention, the support piece and the radiator are assembled in a split mode, the first limiting part is arranged on the circuit board, the second limiting part which is in limiting fit with the first limiting part is arranged on the support piece, when the circuit board is assembled, the support piece can be relatively fixed on the circuit board by utilizing the limiting fit of the first limiting part and the second limiting part, the support piece is provided with the support surface, and the support surface is abutted with the radiator, so that interference assembly of the support piece and the radiator is avoided, the overall rigidity of the radiator is effectively reduced, the mechanical stress in the assembly process is reduced, and the service life of the circuit board module is prolonged.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic plan view of a circuit board module according to an embodiment of the present invention;
fig. 2 is an exploded view of a circuit board module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of adapting a circuit board and a supporting member of a circuit board module according to an embodiment of the present invention;
fig. 4 is a flowchart illustrating steps of a method for manufacturing a circuit board module according to an embodiment of the present invention;
fig. 5 is a schematic diagram illustrating a state change of a circuit board module in a manufacturing process according to an embodiment of the present invention;
fig. 6 is a schematic block diagram of an electronic device according to an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The flow diagrams depicted in the figures are merely illustrative and not necessarily all of the elements and operations/steps are included or performed in the order described. For example, some operations/steps may be further divided, combined, or partially combined, so that the order of actual execution may be changed according to actual situations.
It is to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
At present, an IC chip is a core for performing operation of an electronic device, and is also one of main heating elements of the electronic device. With the development of 5G communication technology, high capacity and high performance are pursued in communication products. The integration level of some multifunctional IC chips on a circuit board is higher and higher, so that the power consumption and the heat flux density of the circuit board are continuously increased, and a serious challenge is presented to the heat dissipation technology.
The current liquid cooling technology is still immature, and the heat dissipation problem of circuit board mainly relies on air cooling heat dissipation technology to solve, and the radiator is the key technology of air cooling heat dissipation. The current radiator used in the industry is of a press-riveting structure, namely, the supporting piece is combined with the body of the radiator through a press-riveting process, so that the radiator is provided with the supporting structure, and then the radiator with the supporting structure is aligned with the circuit board and assembled to form the circuit board module. However, the whole rigidity of the press-riveting radiator is high, the mechanical stress generated in the assembly process is high, at least one of the radiator body and the contact part of the circuit board and the supporting piece is easy to crack when being influenced by the ambient temperature, the long-term reliability of the influenced circuit board module is influenced, and the service life of the electronic product is finally influenced.
Based on the above, the embodiment of the invention provides a circuit board module, a preparation method and electronic equipment, which aim to reduce the stress risk of the circuit board module and improve the service life of the circuit board module.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic plan view of a circuit board module according to an embodiment of the present invention, and fig. 2 is a schematic exploded view of a circuit board module according to an embodiment of the present invention.
As shown in fig. 1 and 2, the circuit board module 100 includes a heat sink 10, a circuit board 20, a liner 30, a supporting member 40 and a fixing member 50. The heat sink 10 is provided with a positioning and mounting portion 103, and the fixing member 50 fixes the heat sink 10 to other devices, such as the circuit board 20 and the liner 30, through the positioning and mounting portion 103. The circuit board 20 is arranged at intervals with the radiator 10, and a first limit part 201 is arranged on one side of the circuit board 20 close to the radiator 10; the lining board 30 is arranged on one side of the circuit board 20 far away from the radiator 10, the lining board 30 is provided with a connecting piece 301, and after the lining board 30 is fixedly matched with the circuit board 20, the connecting piece 301 is abutted against the circuit board 20 so as to enable the lining board 30 and the circuit board 20 to be spaced; the supporting piece 40 comprises a first end and a second end which are opposite, the first end is provided with a supporting surface 401, the second end is provided with a second limiting part 402, the supporting piece 40 is arranged between the circuit board 20 and the radiator 10, is abutted with the radiator 10 through the supporting surface 401, and forms limiting fit with the first limiting part 201 formed on the circuit board 20 through the second limiting part 402; and a fixing member 50, wherein the fixing member 50 fixes the heat sink 10 and the circuit board 20 to the connection member 301 of the backing plate 30 by positioning the mounting portion 103.
In the embodiment of the invention, the supporting piece 40 and the radiator 10 are assembled in a split mode, namely, the first limiting part 201 is arranged on the circuit board 20, the second limiting part 402 which is in limiting fit with the first limiting part 201 is arranged on the supporting piece 40, when the circuit board module 100 is assembled, the supporting piece 40 can be relatively fixed on the circuit board 20 by utilizing the limiting fit of the first limiting part 201 and the second limiting part 402, so that the supporting piece 40 and the circuit board 20 are convenient to be welded and fixed, for example, the supporting piece 40 is fixed on the circuit board 20 by a surface mounting technology, for example, after the supporting piece 40 and the circuit board 20 are assembled, the radiator 10 and the supporting piece 40 are matched, the heat radiator 10 is ensured to be firmly connected with the circuit board 20 through the supporting piece 40, meanwhile, the interference fit of the supporting piece 40 and the radiator 10 is avoided, the integral rigidity of the radiator 10 is effectively reduced, and the mechanical stress generated by the interference fit of the supporting piece and the radiator 10 in the assembling process is reduced, so that the service life of the circuit board module 100 is prolonged.
In addition, the supporting member 40 is provided with the supporting surface 401, and when the heat sink 10 is assembled with the circuit board 20, the supporting surface 401 is in contact with the surface of the heat sink 10, so that the supporting member 40 is in surface contact with the heat sink 10, the local stress applied to the heat sink 10 by the supporting member 40 can be effectively reduced, and the service life of the heat sink 10 can be prolonged.
Meanwhile, the heat dissipation of the circuit board 20 is facilitated based on the interval arrangement of the lining board 30 and the circuit board 20, and the heat dissipation effect of the circuit board module 100 can be effectively improved.
As shown in fig. 2, in some embodiments, the heat spreader 10 includes a base plate 101 and fins 102 disposed on a side of the base plate 101 away from the supporting member 40 and connected to the base plate 101, wherein a plurality of positioning and mounting portions 103 are disposed on the base plate 101 at intervals. The heat sink 10 can increase the contact area with air by providing a plurality of fins 102, thereby enhancing the heat dissipation effect, and the positioning and mounting portions 103 are arranged on the bottom plate 101 at intervals, so that the positioning effect of the heat sink 10 can be improved.
As shown in fig. 2, in some embodiments, the first limiting portion 201 is a plurality of limiting grooves arranged at intervals, and the second limiting portion 402 is a limiting protrusion adapted to the limiting grooves, where the limiting grooves may be circular, polygonal or shaped, and are not limited herein, and only the first limiting portion 201 and the second limiting portion 402 may form a limiting fit to ensure accurate alignment assembly of the supporting member 40 and the circuit board 20, for example, the limiting grooves may be triangular, quadrangular, hexagonal, or other polygonal structures.
Optionally, a height difference h1 is formed between the bottom of the limiting groove and the surface of the circuit board 20 near the side of the heat sink 10, and the height difference h1 and the thickness T of the circuit board 20 satisfy: in order to ensure the positioning strength of the circuit board 20 to the supporting piece 40 and the self strength of the circuit board 20, the depth of the limit groove formed on the circuit board 20 must meet the corresponding depth requirement, wherein h1 is more than or equal to 1/4*T and h1 is less than or equal to 1/3*T.
In some embodiments, after the support member 40 is in a spacing fit with the circuit board 20, the support member is fixed to the circuit board 20 by welding, optionally, a metal coating is disposed on an outer surface of the first spacing portion 201 and an outer surface of the second spacing portion 402, and the support member 40 is welded to the first spacing portion 201 of the circuit board 20 by the second spacing portion 402. The support member 40 is conveniently and firmly mounted to the circuit board 20 by soldering by providing the surfaces of the first and second stopper portions 201 and 402 with a metal coating, for example, including but not limited to a chromium coating or a nickel coating.
As shown in fig. 1 and 2, in some embodiments, the positioning mounting portion 103 includes a positioning hole 1031, the circuit board 20 is provided with a first through hole 202 penetrating the circuit board 20, the supporting member 40 is provided with a second through hole 403 penetrating the supporting member 40, the first limiting portion 201 is disposed on a peripheral side of the first through hole 202, and the second limiting portion 402 is disposed on a peripheral side of the second through hole 403, wherein the fixing member 50 is connected with the connecting member 301 disposed on the backing plate 30 through the positioning hole 1031, the first through hole 202 and the second through hole 403, so as to fix the heat sink 10 and the circuit board 20 to the backing plate 30.
Referring to fig. 3, in some embodiments, the diameter of the first through hole 202 is D, the diameter of the first limiting portion 201 is D1, and the diameter of the metal coating provided on the outer surface of the second limiting portion 402 is D3, and preferably, D3 is greater than 5mm to ensure the welding quality between the support member 40 and the circuit board 20.
Optionally, d1= (d+0.6) -1/2 (d1+d2), where D1 is the outer diameter of the support 40 and D2 is the diameter of the second through hole 403.
To ensure stability of the fit of the support 40 and the circuit board 20, preferably D1+.d1+2, d3+.d1+3, D1 is at least 0.6mm greater than D and D1 is at least 2mm greater than D1.
In some embodiments, the fixing member 50 may be connected to the connection member 301 in such a manner that the connection member 301 is provided with a first thread, the fixing member 50 is provided with a second thread, and the fixing member 50 is connected to the first thread of the connection member 301 by the second thread.
It should be understood that the connection manner between the fixing member 50 and the connecting member 301 may be welding, or the connecting member 301 may be provided with a locking structure, and the connection may be achieved by locking the locking structure with the fixing member 50, which is not limited herein.
In some embodiments, the positioning mounting portion 103 further includes a positioning slot (not shown), where the positioning slot is disposed on a side of the heat sink 10 near the circuit board 20; the positioning groove is disposed at a peripheral side of the positioning hole, and the first end of the supporting member 40 is received in the positioning groove and abuts against the heat sink 10. By providing the positioning groove, the precise alignment of the radiator 10 and the supporting member 40 is facilitated.
Referring to fig. 4, fig. 4 is a schematic diagram of a method for preparing a circuit board module 20 according to an embodiment of the present invention, where the method includes:
step S1: providing a circuit board 20, and forming a first limit part 201 on the circuit board 20;
step S2: providing a support member 40, wherein the support member 40 comprises a first end and a second end which are opposite, the first end forms a support surface 401, and the second end is provided with a second limiting part 402;
step S3: attaching the second limiting portion 402 of the supporting member 40 to the first limiting portion 201 of the circuit board 20 by a surface mounting technology, so that the first limiting portion 201 and the second limiting portion 402 are in limiting fit;
step S4: providing a lining plate 30, a radiator 10 and a fixing member 40, wherein the lining plate 30 is provided with a connecting member 301, and the radiator 10 is provided with a positioning mounting portion 103;
step S5: the heat sink 10 and the circuit board 20 are fixed to the connection member 301 of the backing plate 30 by the fixing member 40 through the positioning mounting portion 103, and after the heat sink 10, the circuit board 20 and the backing plate 30 are fixedly fitted, the support surface 401 of the support member 40 abuts against the heat sink 10, and the connection member 301 abuts against the circuit board 20, so that the heat sink 10 and the circuit board 20 are spaced apart, and the circuit board 20 and the backing plate 30 are spaced apart.
In some embodiments, the method further comprises: after the first limiting portion 201 and the second limiting portion 402 are in limiting fit, the supporting member 40 after being in limiting fit with the circuit board 20 is welded, so that the supporting member 40 is fixed on the circuit board 20.
In some embodiments, the method further comprises: before the first limiting part 201 and the second limiting part 402 are in limiting fit, metal layers are coated on the surfaces of the first limiting part 201 and the second limiting part 402.
Referring to fig. 5, illustratively, a circuit board 20 is provided, and a first limiting portion 201 is formed on the circuit board 20, where the shape and the depth of the first limiting portion 201 may be set as required. Optionally, the first limiting portions 201 are plural and are disposed on the circuit board 20 at intervals.
A support member 40 is provided, the support member 40 comprising opposite first and second ends, the first end forming a support surface 401, the second end being provided with a second stop 402. At least one of the first limiting portion 201 and the second limiting portion 402 is coated with solder paste, and the second limiting portion 402 of the supporting member 40 is attached to the first limiting portion 201 of the circuit board 20 through SMT (Surface Mount Technology ), so that the first limiting portion 201 and the second limiting portion 402 are in limiting fit, and the supporting member 40 after being in limiting fit with the circuit board 20 is welded, so that the supporting member 40 is fixed on the circuit board 20, and the subsequent radiator is conveniently and fixedly connected with the circuit board 20 relatively through the supporting member 40.
The heat sink 10 is provided with a positioning mounting part 103, the heat sink 10 and the circuit board 20 are fixed to the connecting piece 301 of the backing plate 30 by the fixing piece 40 through the positioning mounting part 103, after the heat sink 10, the circuit board 20 and the backing plate 30 are fixedly matched, the supporting surface 401 of the supporting piece 40 is abutted to the heat sink 10, and the connecting piece 301 is abutted to the circuit board 20, so that the heat sink 10 and the circuit board 20 are spaced apart, and the circuit board 20 and the backing plate 30 are spaced apart.
Referring to fig. 6, fig. 6 is a schematic block diagram illustrating a structure of an electronic device 200 according to an embodiment of the invention.
As shown in fig. 6, the electronic device 200 includes a processor 201, a memory 202, and a circuit board module 100, where the processor 201 and the memory 202 are connected by a bus 203, such as an I2C (Inter-integrated Circuit) bus, and the memory 202 may be mounted on the circuit board 20 of the circuit board module 100.
In particular, the processor 201 is configured to provide computing and control capabilities, supporting the operation of the overall routing device. The processor 201 may be a central processing unit (Central Processing Unit, CPU), and the processor 201 may also be other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), field-programmable gate arrays (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, or the like. Wherein the general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The Memory 202 may be a Flash chip, a Read-Only Memory (ROM) disk, an optical disk, a U-disk, a removable hard disk, or the like.
The electronic device 200 includes, but is not limited to, a base station, a server, a mobile phone, a tablet computer, a notebook computer, a desktop computer, a personal digital assistant, a wearable device, and the like.
It should be understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations. It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The foregoing embodiment numbers of the present invention are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments. While the invention has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the invention is subject to the protection scope of the claims.
Claims (10)
1. A circuit board module, comprising:
a radiator provided with a positioning and mounting part;
the circuit board is arranged at intervals with the radiator, and a first limiting part is arranged on one side, close to the radiator, of the circuit board;
the lining plate is arranged on one side, far away from the radiator, of the circuit board, and is provided with a connecting piece, and after the lining plate is fixedly matched with the circuit board, the connecting piece is propped against the circuit board so that the lining plate and the circuit board are spaced;
the support piece comprises a first end and a second end which are opposite, the first end is provided with a supporting surface, the second end is provided with a second limiting part, the support piece is arranged between the circuit board and the radiator, the support piece is abutted with the radiator through the supporting surface, and the support piece and the first limiting part formed on the circuit board form limiting fit through the second limiting part; a kind of electronic device with high-pressure air-conditioning system
The fixing piece is used for fixing the radiator and the circuit board on the connecting piece of the lining board through the positioning and mounting part.
2. The circuit board module according to claim 1, wherein the first limiting portion is a plurality of limiting grooves arranged at intervals, and the second limiting portion is a limiting protrusion adapted to the limiting grooves.
3. The circuit board module according to claim 2, wherein a height difference h1 is formed between the bottom of the limiting groove and the surface of the circuit board, which is close to the side of the heat sink, and the height difference h1 and the thickness T of the circuit board satisfy: h1 is more than or equal to 1/4*T and is more than or equal to 1/3*T.
4. The circuit board module according to claim 1, wherein the outer surface of the first limiting portion and the outer surface of the second limiting portion are both provided with a metal coating, and the supporting member is welded to the first limiting portion of the circuit board through the second limiting portion.
5. The circuit board module according to any one of claims 1 to 4, wherein the positioning and mounting portion includes a positioning hole, the circuit board is provided with a first through hole penetrating the circuit board, the supporting member is provided with a second through hole penetrating the supporting member, the first limiting portion is disposed on a peripheral side of the first through hole, the second limiting portion is disposed on a peripheral side of the second through hole,
the fixing piece penetrates through the positioning hole, the first through hole and the second through hole to be connected with the connecting piece arranged on the lining board, so that the radiator and the circuit board are fixed on the lining board.
6. The circuit board module according to claim 5, wherein the connecting member is provided with a first thread, the fixing member is provided with a second thread, and the fixing member is connected with the first thread of the connecting member in an adaptive manner through the second thread.
7. The circuit board module according to claim 5, wherein the positioning mounting portion further comprises a positioning groove, and the positioning groove is disposed on a side of the heat sink close to the circuit board;
the positioning groove is arranged on the periphery of the positioning hole, and the first end of the supporting piece is accommodated in the positioning groove and is abutted with the radiator.
8. The circuit board module according to any one of claims 1-4, wherein the heat sink comprises a bottom plate and fins arranged on a side of the bottom plate away from the supporting member and connected to the bottom plate, and wherein the positioning and mounting portions are arranged on the bottom plate at intervals.
9. The preparation method of the circuit board module is characterized by comprising the following steps:
providing a circuit board, and arranging a first limiting part on the circuit board;
providing a support member, wherein the support member comprises a first end and a second end which are opposite, the first end forms a support surface, and the second end is provided with a second limiting part;
attaching the second limiting part of the supporting piece to the first limiting part of the circuit board through a surface mounting technology so as to enable the first limiting part and the second limiting part to be in limiting fit;
providing a lining plate, a radiator and a fixing piece, wherein the lining plate is provided with a connecting piece, and the radiator is provided with a positioning installation part;
the radiator and the circuit board are fixed on the connecting piece of the lining board through the positioning and mounting part by utilizing the fixing piece, after the radiator, the circuit board and the lining board are fixedly matched, the supporting surface of the supporting piece is abutted to the radiator, and the connecting piece is abutted to the circuit board, so that the radiator is spaced from the circuit board, and the circuit board is spaced from the lining board.
10. An electronic device comprising the circuit board module according to any one of claims 1 to 8, or the electronic device comprising the circuit board module produced by the production method of the circuit board module according to claim 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210762887.2A CN117377257A (en) | 2022-06-30 | 2022-06-30 | Circuit board module, preparation method and electronic equipment |
| PCT/CN2023/072943 WO2024001173A1 (en) | 2022-06-30 | 2023-01-18 | Circuit board module, preparation method and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210762887.2A CN117377257A (en) | 2022-06-30 | 2022-06-30 | Circuit board module, preparation method and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117377257A true CN117377257A (en) | 2024-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210762887.2A Pending CN117377257A (en) | 2022-06-30 | 2022-06-30 | Circuit board module, preparation method and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN117377257A (en) |
| WO (1) | WO2024001173A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9554488B2 (en) * | 2014-04-18 | 2017-01-24 | Raytheon Company | Method to align surface mount packages for thermal enhancement |
| CN205356796U (en) * | 2016-02-03 | 2016-06-29 | 美的集团武汉制冷设备有限公司 | Circuit board components |
| CN109600915A (en) * | 2019-01-30 | 2019-04-09 | 上海剑桥科技股份有限公司 | Can SMT assembly Clip Reed connection structure and its assembly method |
| CN214046461U (en) * | 2020-11-26 | 2021-08-24 | 深圳市菲菱科思通信技术股份有限公司 | Heat conduction gasket mounting structure without causing deformation of circuit board |
-
2022
- 2022-06-30 CN CN202210762887.2A patent/CN117377257A/en active Pending
-
2023
- 2023-01-18 WO PCT/CN2023/072943 patent/WO2024001173A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024001173A1 (en) | 2024-01-04 |
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